CN105965667A - 一种梯级砖的生产工艺 - Google Patents

一种梯级砖的生产工艺 Download PDF

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CN105965667A
CN105965667A CN201610299583.1A CN201610299583A CN105965667A CN 105965667 A CN105965667 A CN 105965667A CN 201610299583 A CN201610299583 A CN 201610299583A CN 105965667 A CN105965667 A CN 105965667A
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苏绍恒
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Enping Xiangda Ceramic Co Ltd
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Abstract

本发明公开了一种梯级砖的生产工艺,包括以下步骤:A、粉料制备;B、压塑成型,制得砖坯;C、砖坯表面加工处理;D、抛光;E、开介圆弧倒角;F开槽:在砖面开设至少3条防滑槽;本发明旨在提供一种梯级砖的生产工艺,通过该生产工艺可直接制作出整块拼花图案梯级砖,安装不需要拼接,安装平整、美观,大大增加装饰的美观度。

Description

一种梯级砖的生产工艺
技术领域
本发明涉及陶瓷生产工艺技术领域,具体地说,尤其是一种梯级砖的生产工艺。
背景技术
梯级砖,是用于楼梯梯级表面的铺设,不仅需要防滑,还能起到装饰作用。现有的梯级砖中分成左中右三部分,而且三部分均开设相对应的槽,其中左右两部分的制作工艺不同于中间部分,增加了工艺步骤,同样的增加了成本,而且在安装时通过拼接安装,但由于传统的梯级砖在制作时是将三部分分开制作,淋釉、抛光、开槽等均不相同,拼接安装时出现对角不平或者开槽部分不对应,装饰美观度大大降低。
发明内容
本发明针对上述的情况,提供一种梯级砖的生产工艺,通过该生产工艺可直接制作出整块梯级砖,安装不需要拼接,安装平整、美观,大大增加装饰的美观度。
本发明的技术方案是这样实现的:一种梯级砖的生产工艺,其特征在于,包括以下步骤:
A、粉料制备:包括以下步骤:
A1、配料配方:包括如下的化学成分:
SiO2:66-67%、TiO2:0.2-0.4%、Al2O3: 18-20%、Fe2O3:1-2%、MgO:1-2%、CaO:0.3-0.5%、Na2O:2-2.5%、K2O:3-4%,其中烧失率为3.5-4.0%;
A2、球磨成浆料;
A3、喷雾干燥塔喷料制粉料:得到符合要求颗粒级配和水分要求的粉料:经陈腐后要求的粉料水份为7.0-7.4%,该粉料中含有颗粒要求为:20目的低于0.2%、30目的低于4.5%、40目的为36-42%、60目的为45-55%、100目以上的低于4.3%;
B、压塑成型,制得砖坯:使用5500吨大吨位液压机干压成形;
C、砖坯表面加工处理,包括以下步骤:
C1、干燥;
C2、磨坯;
C3、淋水;
C4、淋面釉;
C5、印花;
C6、淋抛釉;
C7、入窑烧成后制得半成品砖坯;
D、抛光;
E、开介加圆弧倒角,按一定的标准尺寸要求开介加工;
F、开槽:在砖面开设至少3条防滑槽。
上述的一种梯级砖的生产工艺中,所述的步骤C5中印花包括先丝网印花再喷墨印花:先通过一台或多台丝网花机印砖坯两边较深色的图案,再通过喷墨打印机印中间浅色图案。
上述的一种梯级砖的生产工艺中,所述的丝网印花和喷墨印花之间的交接位由喷墨图案重叠在丝网图案上层,重叠位宽为1~8mm。
上述的一种梯级砖的生产工艺中,所述的步骤B中压塑用的压机的最大压力为55000KN,频率为6.28~6.30Hz。
上述的一种梯级砖的生产工艺中,所述的步骤C4中通过钟罩或直线淋釉器在砖坯体表面淋面釉,其中淋釉量为440.24g/件,比重为:1.81~1.86g/cm3,釉料含水量为28.5%,流速为26-36S。
上述的一种梯级砖的生产工艺中,步骤C6中通过钟罩或直线淋釉器在砖坯体表面淋抛釉,其中淋釉量为440.24g/件,比重为:1.81~1.86g/cm3,釉料含水量为28.5%,流速为26-36S。
上述的一种梯级砖的生产工艺中,步骤C7中烧成时面温为1195-1205℃,底温为1200-1220℃。
上述的一种梯级砖的生产工艺中,所述的步骤C1中干燥后的砖坯强度为0.8~1.5MPa、水分为0.45%~0.6%、出干燥温度为60~80℃。
本发明的有益效果在于:本发明的梯级砖的生产工艺,实现在同一块梯级砖中进行二次不同印花,不需要传统梯级砖分开三部分工艺制作,降低工艺成本,而且安装过程不需要拼接,安装方便,防止出现安装不平整现象,提高梯级砖的表面光滑度而又具有防滑效果,装饰效果大大提高,同时梯级砖致密度高、强度高。
附图说明
图1是本发明制作的梯级砖效果图。
具体实施方式
下面结合实施例对本发明作进一步的详细说明。
一种梯级砖的生产工艺,包括:先制备粉料,将坭、砂、石粉、添加剂等按一定比例混合,其中配方化学成分如下:SiO2:66.77%、TiO2:0.30%、Al2O3:18.99%、Fe2O3:1.30%、MgO:1.26%、CaO:0.40%、Na2O:2.38%、K2O:3.53%,其中烧失率为3.5-4.0%
将以上配料用球磨机球磨成到工艺要求细度的浆料,得到的浆料放入浆池进行陈腐,而陈腐好的浆料通过喷雾干燥塔制得符合要求颗粒级配和水分要求的粉料,如下表:
粉料水分 20目 30目 40目 60目 100目以上
7.0~7.4% <0.2% <4.5% 36~42% 45~55% <4.3%
得到粉料后,通过压机压塑成型,制得砖坯,压塑时使用5500吨大吨位液压机干压成形,该压塑用的压机的最大压力为55000KN,频率为6.28~6.30Hz,通过以上粉料、压力和工作频率,得到的砖坯密度高、强度高。
制得砖坯后,将砖坯通过干燥窑干燥,使得砖坯具有工艺要求的强度、水分及出干燥温度,如下表:
强度 水分 出干燥温度
0.8~1.5MPa 0.45%~0.6% 60~80℃
干燥后的砖坯出来后,通过磨坯除去坯体表面的粉尘、落脏等污染物,可减少下一工序带来的缺陷;磨坯后的砖坯进行淋水,在坯体表面均匀淋水,淋水量为52 ~ 80克/件砖,可减小下一工序淋釉的缺陷。
淋水后的砖坯通过钟罩或直线淋釉器在坯体表面先淋面釉,其中淋面釉参数如下表:
淋釉量 比重 流速 备注
440.24g/件 1.81~1.86g/cm3 26~36s 釉料含水28.5%
完成淋面釉后,确认好印花位置、图案大小、颜色深浅和印花效果后进行印花工序,该印花工序先通过一台或多台丝网花机印砖坯两边较深色的图案,再通过喷墨打印机印中间浅色图案,在这过程中,砖坯的丝网印花和喷墨印花之间的交接位由喷墨图案重叠在丝网图案上层,重叠位宽为1~8mm。
印花工序结束后,将印花后的砖坯通过钟罩或直线淋釉器在坯体表面淋抛釉,其中淋抛釉参数如下表:
淋釉量 比重 流速 备注
440.24g/件 1.81~1.86g/cm3 26~36s 釉料含水28.5%
淋抛釉后,将砖坯通过烧成窑烧成梯级砖,使坯体及釉面充分烧结,在烧成窑内烧成时,对砖坯的面温为1200℃,砖坯底温为1210℃,;然后对烧成后的梯级砖进行砖面抛光、打蜡,最后将梯级砖开介加圆弧倒角,按一定的标准尺寸要求开介加工,介开后的梯级砖在表面开设至少3条防滑槽,最后将开槽后的梯级砖进行打包包装。
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的宗旨和范围,其均应涵盖在本发明的权利要求范围当中。

Claims (8)

1.一种梯级砖的生产工艺,其特征在于,包括以下步骤:
A、粉料制备:包括以下步骤:
A1、配料配方:包括如下的化学成分:
SiO2:66-67%、TiO2:0.2-0.4%、Al2O3: 18-20%、Fe2O3:1-2%、MgO:1-2%、
CaO:0.3-0.5%、Na2O:2-2.5%、K2O:3-4%,其中烧失率为3.5-4.0%;
A2、球磨成浆料;
A3、喷雾干燥塔喷料制粉料:得到符合要求颗粒级配和水分要求的粉料:经陈腐后要求的粉料水份为7.0-7.4%,该粉料中含有颗粒要求为:20目的低于0.2%、30目的低于4.5%、40目的为36-42%、60目的为45-55%、100目以上的低于4.3%;
B、压塑成型,制得砖坯:使用5500吨大吨位液压机干压成形;
C、砖坯表面加工处理,包括以下步骤:
C1、干燥;
C2、磨坯;
C3、淋水;
C4、淋面釉;
C5、印花;
C6、淋抛釉;
C7、入窑烧成后制得半成品砖坯;
D、抛光;
E、开介加圆弧倒角,按一定的标准尺寸要求开介加工;
F、开槽:在砖面开设至少3条防滑槽。
2.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,所述的步骤C5中印花包括先丝网印花再喷墨印花:先通过一台或多台丝网花机印砖坯两边较深色的图案,再通过喷墨打印机印中间浅色图案。
3.根据权利要求2所述的一种梯级砖的生产工艺,其特征在于,所述的丝网印花和喷墨印花之间的交接位由喷墨图案重叠在丝网图案上层,重叠位宽为1~8mm。
4.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,所述的步骤B中压塑用的压机的最大压力为55000KN,频率为6.28~6.30Hz。
5.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,所述的步骤C4中通过钟罩或直线淋釉器在砖坯体表面淋面釉,其中淋釉量为440.24g/件,比重为:1.81~1.86g/cm3,釉料含水量为28.5%,流速为26-36S。
6.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,步骤C6中通过钟罩或直线淋釉器在砖坯体表面淋抛釉,其中淋釉量为440.24g/件,比重为:1.81~1.86g/cm3,釉料含水量为28.5%,流速为26-36S。
7.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,步骤C7中烧成时面温为1160-1180℃,底温为1150-1200℃。
8.根据权利要求1所述的一种梯级砖的生产工艺,其特征在于,所述的步骤C1中干燥后的砖坯强度为0.8~1.5MPa、水分为0.45%~0.6%、出干燥温度为60~80℃。
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