CN105959069B - It is a kind of based on the multifactor test device for being used to contact passive inter-modulation performance - Google Patents
It is a kind of based on the multifactor test device for being used to contact passive inter-modulation performance Download PDFInfo
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- CN105959069B CN105959069B CN201610247524.XA CN201610247524A CN105959069B CN 105959069 B CN105959069 B CN 105959069B CN 201610247524 A CN201610247524 A CN 201610247524A CN 105959069 B CN105959069 B CN 105959069B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of based on the multifactor test device for being used to contact passive inter-modulation performance, including metal backing, connecting rod, augmentor, open microstrip structure, PIM test system, heater, Temperature Humidity Sensor, humidifier and the vibrational system for vibration rod；The open microstrip structure includes ground connection bottom plate, separate type dielectric layer and the conductor layer set gradually from bottom to top.The present invention can realize cooperative evaluation between coating passive intermodulation value to be measured and more outdoor environment factors.
Description
Technical field
The present invention relates to a kind of test device for being used to contact passive inter-modulation performance, and in particular to a kind of based on multifactor
For contacting the test device of passive inter-modulation performance.
Background technology
When two or more carrier signals pass through the component with nonlinear response, it can produce different from carrier frequency
The new signal of rate, this phenomenon are known as passive intermodulation.Passive intermodulation (passive intermodulation PIM) refer to two or
The spurious signal that the transmitting carrier wave of two or more frequency is blended to produce in passive non-linear device, it is to modern big work(
Rate, multi-channel communication systems interfere.
At present, the test on passive intermodulation, is based primarily upon laboratory specific environment, can not realize to it is outdoor it is multi-environment because
The simulation of element.Its scheme on material and the passive cross modulation test of coating, substantially in existing coaxial or waveguide, passes through
Change assessment of material and the coating realization of internal and external conductor or metal contact surface to passive intermodulation index, but due to existing coaxial
Or waveguide is used as known standard component in itself, its electromagnetic field radiation form and intensity are single, and are enclosed construction so that test
Passive intermodulation index in include due to limitation caused by test structure, such as electric current and electric field distribution can not be adjusted, extraneous
Factor influences, and pressure, temperature, vibration etc., can only act on part to be measured by outer wall by indirect mode, can not exclude it
Stop of the accessory structure to additional environmental factor and the influence to intermodulation testing result non-singularity, at the same time, encourage electromagnetism
The change of field intensity can only be realized by varying incident carrier power value.Contact force control for contact face can only also pass through
Control torsional moment realizes indirectly, and reinforces accuracy and depend critically upon the machine of test block and add precision and personal experience, these aspects
All so that passive cross modulation test is of a high price and accuracy is in urgent need to be improved, in addition, tending to occur the microwave of Intermodulation Interference
The occasion of device outdoor utility, can be to the intermodulation index of material and coating on more outdoor environments there is presently no solution
The cooperative evaluation of the change performance of factor.
The content of the invention
The shortcomings that it is an object of the invention to overcome the above-mentioned prior art, there is provided a kind of to be used to contact based on multifactor
The test device of passive inter-modulation performance, which can realize assists between coating passive intermodulation value to be measured and more outdoor environment factors
With assessment.
It is of the present invention based on the multifactor test device for being used to contact passive inter-modulation performance to reach above-mentioned purpose
Including metal backing, connecting rod, augmentor, open microstrip structure, PIM test system, heater, Temperature Humidity Sensor, plus
Wet device and the vibrational system for vibration rod；
The open microstrip structure includes ground connection bottom plate, separate type dielectric layer and the conductor set gradually from bottom to top
Layer, the upper surface of wherein conductor layer, which opens up, to be had the gap, and augmentor is connected with the upper end of connecting rod, and lower end and the metal of connecting rod are carried on the back
The top of plate is connected, and coating to be measured is located at the bottom surface of metal backing, and the upper table with conductor layer is pressed in the lower surface of coating to be measured
Face, and the middle part of gap face coating to be measured, heat the contact surface of coating to be measured and conductor layer by heater, pass through
Humidifier humidifies the contact surface between coating to be measured and conductor layer, and Temperature Humidity Sensor detects coating to be measured and conductor layer
Between contact surface temperature and humidity information, the both ends of conductor layer pass through low PIM microstrip to coaxial adapters and test system with PIM
It is connected, PIM tests system is connected with Temperature Humidity Sensor and vibrational system, augmentor and Temperature Humidity Sensor.
The separate type dielectric layer is air dielectric layer or low PIM dielectric layers.
The resistance at conductor layer both ends is 50 Ω.
The vibrational system includes circular vibrating motor and sleeve, and sleeve and vibrating motor are socketed on connecting rod, shake
Dynamic motor is between sleeve and connecting rod.
Coating to be measured is prepared in the lower surface of metal backing by sputtering or chemical plating method.
Some reflective back planes are further included, each reflective back plane is circumferentially distributed around connecting rod.
The invention has the advantages that：
The present invention when in use, passes through heater pair based on the multifactor test device for being used to contact passive inter-modulation performance
Coating to be measured and the contact surface of conductor layer are heated, and the contact surface of coating to be measured and conductor layer is added by humidifier
It is wet, the temperature and humidity information of coating to be measured and the contact surface of conductor layer are detected by Temperature Humidity Sensor, while pass through reinforcing
Device and connecting rod apply pressure to coating to be measured, and coating to be measured is applied by vibrational system and is vibrated, so as to fulfill more than outdoor because
The simulation in prime ring border, then tests one end input carrier signal of the system to conductor layer, then according to the PIM of feedback by PIM
The vibration frequency and intensity and warm and humid that pressure that the power of data and carrier signal, augmentor apply, vibrational system apply
Spend the temperature of sensor detection and humidity information is realized and the passive intermodulation index of coating to be measured is joined on the variable of multiple physical field
The test of the response characteristic of number and variation pattern, draws activation threshold value of the coating to be measured on different passive intermodulation indexs, instructs real
The design of low intermodulation products and intermodulation Damage control on border.
Brief description of the drawings
Fig. 1 is the structure diagram of coating 1 to be measured in the present invention；
Fig. 2 is front view of the present invention；
Fig. 3 is the top view of the present invention；
Fig. 4 is the location diagram of heater 8, humidifier 9 and Temperature Humidity Sensor 10 in the present invention；
Fig. 5 is the location diagram of vibrational system 11 in the present invention；
Fig. 6 is the enlarged drawing at A in Fig. 5；
Fig. 7 is the mutual tone pitch performance plot for the different materials that the present invention actually measures；
Fig. 8 is the principle of the present invention frame diagram；
Fig. 9 (a) is schematic diagram of the pim data on temperature change；
Fig. 9 (b) is schematic diagram of the pim data on pressure change.
Wherein, 1 for coating to be measured, 2 be metal backing, 3 be separate type dielectric layer, 4 be conductor layer, 5 be ground connection bottom plate, 6
It is reflective back plane for connecting rod, 7,8 be heater, 9 be humidifier, 10 be Temperature Humidity Sensor, 11 be vibrational system, 12 is vibration
Motor, 13 are sleeve.
Embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings：
It is of the present invention that gold is included based on the multifactor test device for being used to contact passive inter-modulation performance with reference to figure 1
Belong to backboard 2, connecting rod 6, augmentor, open microstrip structure, PIM tests system, heater 8, Temperature Humidity Sensor 10, humidification
Device 9 and the vibrational system 11 for vibration rod 6；What the open microstrip structure included setting gradually from bottom to top connects
Ground bottom plate 5, separate type dielectric layer 3 and conductor layer 4, the upper surface of wherein conductor layer 4, which opens up, to be had the gap, augmentor and connecting rod 6
Upper end be connected, the lower end of connecting rod 6 is connected with the top of metal backing 2, and coating 1 to be measured is located at the bottom surface of metal backing 2,
The upper surface with conductor layer 4, and the middle part of gap face coating 1 to be measured are pressed in the lower surface of coating 1 to be measured, pass through heater 8
Coating 1 to be measured and the contact surface of conductor layer 4 are heated, by humidifier 9 to connecing between coating 1 to be measured and conductor layer 4
Contacting surface is humidified, and Temperature Humidity Sensor 10 detects the temperature and humidity letter of the contact surface between coating 1 to be measured and conductor layer 4
Breath, the both ends of conductor layer 4 test system by low PIM microstrip to coaxial adapters and PIM and are connected, PIM test systems with it is warm and humid
Degree sensor 10 and vibrational system 11, augmentor and Temperature Humidity Sensor 10 are connected.
It should be noted that the separate type dielectric layer 3 is air dielectric layer or low PIM dielectric layers；4 both ends of conductor layer
Resistance is 50 Ω；Vibrational system 11 includes circular vibrating motor 12 and sleeve 13, and sleeve 13 and vibrating motor 12 are socketed on
On connecting rod 6, vibrating motor 12 is between sleeve 13 and connecting rod 6；Coating 1 to be measured is prepared in by sputtering or chemical plating method
The lower surface of metal backing 2.Present invention additionally comprises some reflective back planes 7, each circumferentially distributed week in connecting rod 6 of reflective back plane 7
Enclose.
With reference to figure 2 and Fig. 3, the open microstrip structure in the present invention is by ground connection bottom plate 5, separate type dielectric layer 3 and conductor
Layer 4 is formed, and the both ends of conductor layer 4 are transferred by low PIM microstrip to coaxial adapters in PIM test systems, and coating 1 to be measured is bonded
In the lower surface of metal backing 2, it is crimped on the impedance calculated according to being actually needed and converts on the gap of corresponding field strength；Conductor layer
The characteristic impedance at 4 both ends saves as 50 ohm, and the interlude of conductor layer 4 is transformer section, and transformer section width foundation is treated
The carrier power that the field strength combination PIM tests system that testing coating needs is provided determines.
By controlling the vibration frequency and intensity of voltage and current regulation vibrating motor 12, realize reinforcing with vibration in the lump
Loading.With reference to figure 7, in the case of fixation pressure, by replacing the metal material of different coating to be measured 1, same test-strips
Under part, its mutual tone pitch difference is obvious.
With reference to figure 8, by heater 8, humidifier 9, augmentor, vibrational system 11 respectively to coating 1 to be measured and conductor
The contact surface of layer 4 applies hot, wet, pressure and vibration, while tests system by PIM and apply carrier frequency to the contact surface, then
The pim data of feedback is obtained, realizes temperature, humidity, pressure and vibration fusion, realizes the extraneous multiple physical field parameter of the contact surface
With the joint assessment of intermodulation testing index, that is, determine some or multiple extraneous factor parameter testing PIM indexs, or pass through restriction
PIM indexs realize that the Adaptive matching of some or multiple extraneous factor parameters, or above two process combine, and draw passive mutual
Tonality can be on the activation threshold value and variation tendency of more physical parameters, it tests effect diagram can be such as Fig. 9 (a) and Fig. 9 (a) institutes
Show.
The present invention realizes reinforcement or the decrease of test field strength in area's to be contacted, field strength after the conversion using impedance transform method
Conductor layer is blocked in area, by the way that coating 1 to be measured is made on metal backing 2, and by making vibrational system on metal backing 2
11 and augmentor pressure and vibration are applied to contact interface so that whole test process is meeting test standing wave and loss, so
Contact zone contact material passive intermodulation characteristic index is tested again afterwards.
Claims (6)
- It is 1. a kind of based on the multifactor test device for being used to contact passive inter-modulation performance, it is characterised in that including metal backing (2), connecting rod (6), augmentor, open microstrip structure, passive intermodulation PIM tests system, heater (8), temperature and humidity sensing Device (10), humidifier (9) and the vibrational system (11) for vibration rod (6)；The open microstrip structure includes ground connection bottom plate (5), separate type dielectric layer (3) and the conductor set gradually from bottom to top Layer (4), the upper surface of wherein conductor layer (4), which opens up, to be had the gap, and augmentor is connected with the upper end of connecting rod (6), connecting rod (6) Lower end is connected with the top of metal backing (2), and coating (1) to be measured is located at the bottom surface of metal backing (2), coating (1) to be measured Lower surface is pressed and the upper surface of conductor layer (4), and the middle part of gap face coating to be measured (1), by heater (8) to be measured Coating (1) and the contact surface of conductor layer (4) are heated, by humidifier (9) between coating to be measured (1) and conductor layer (4) Contact surface humidified, Temperature Humidity Sensor (10) detects the temperature of the contact surface between coating (1) to be measured and conductor layer (4) And humidity information, the both ends of conductor layer (4) test system with PIM by low PIM microstrip to coaxial adapters and are connected, PIM tests System is connected with Temperature Humidity Sensor (10), vibrational system (11), augmentor and Temperature Humidity Sensor (10).
- 2. according to claim 1 existed based on the multifactor test device for being used to contact passive inter-modulation performance, its feature In the separate type dielectric layer (3) is air dielectric layer or low PIM dielectric layers.
- 3. according to claim 1 existed based on the multifactor test device for being used to contact passive inter-modulation performance, its feature In the resistance at conductor layer (4) both ends is 50 Ω.
- 4. according to claim 1 existed based on the multifactor test device for being used to contact passive inter-modulation performance, its feature In the vibrational system (11) includes circular vibrating motor (12) and sleeve (13), and sleeve (13) and vibrating motor (12) are equal It is socketed on connecting rod (6), vibrating motor (12) is located between sleeve (13) and connecting rod (6).
- 5. according to claim 1 existed based on the multifactor test device for being used to contact passive inter-modulation performance, its feature In coating (1) to be measured is prepared in the lower surface of metal backing (2) by sputtering or chemical plating method.
- 6. according to claim 1 existed based on the multifactor test device for being used to contact passive inter-modulation performance, its feature In further including some reflective back planes (7), each reflective back plane (7) is circumferentially distributed around connecting rod (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610247524.XA CN105959069B (en) | 2016-04-20 | 2016-04-20 | It is a kind of based on the multifactor test device for being used to contact passive inter-modulation performance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610247524.XA CN105959069B (en) | 2016-04-20 | 2016-04-20 | It is a kind of based on the multifactor test device for being used to contact passive inter-modulation performance |
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| Publication Number | Publication Date |
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| CN105959069A CN105959069A (en) | 2016-09-21 |
| CN105959069B true CN105959069B (en) | 2018-04-17 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102732931A (en) * | 2012-06-27 | 2012-10-17 | 西安交通大学 | Method for inhibiting secondary electron emission of microwave component surface by adopting nanostructure plating layer |
| CN105069206A (en) * | 2015-07-24 | 2015-11-18 | 西安空间无线电技术研究所 | Method for determining passive inter-modulation product of microwave part |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101067316B1 (en) * | 2009-06-22 | 2011-09-23 | 주식회사 아이노바 | Dome shaped piezoelectric linear motor |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102732931A (en) * | 2012-06-27 | 2012-10-17 | 西安交通大学 | Method for inhibiting secondary electron emission of microwave component surface by adopting nanostructure plating layer |
| CN105069206A (en) * | 2015-07-24 | 2015-11-18 | 西安空间无线电技术研究所 | Method for determining passive inter-modulation product of microwave part |
Non-Patent Citations (1)
| Title |
|---|
| S波段波导同轴转换器的无源互调特性实验研究;叶鸣等;《电波科学学报》;20150228;第30卷(第1期);全文 * |
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