CN105959069A - Multifactor-based test device for contact passive inter-modulation performance - Google Patents

Multifactor-based test device for contact passive inter-modulation performance Download PDF

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Publication number
CN105959069A
CN105959069A CN201610247524.XA CN201610247524A CN105959069A CN 105959069 A CN105959069 A CN 105959069A CN 201610247524 A CN201610247524 A CN 201610247524A CN 105959069 A CN105959069 A CN 105959069A
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CN
China
Prior art keywords
coating
conductor layer
measured
connecting rod
pim
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Application number
CN201610247524.XA
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Chinese (zh)
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CN105959069B (en
Inventor
贺永宁
陈雄
崔万照
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Xian Jiaotong University
Xian Institute of Space Radio Technology
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Xian Jiaotong University
Xian Institute of Space Radio Technology
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Priority to CN201610247524.XA priority Critical patent/CN105959069B/en
Publication of CN105959069A publication Critical patent/CN105959069A/en
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Publication of CN105959069B publication Critical patent/CN105959069B/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B17/00Monitoring; Testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass

Abstract

The invention discloses a multifactor-based test device for contact passive inter-modulation performance. The multifactor-based test device comprises a metal back plate, a connecting rod, a force applying unit, an open-type micro-strip structure, a PIM test system, a heater, a temperature and humidity sensor, a humidifier, and a vibration system for vibrating the connecting rod. The open-type micro-strip structure comprises, from bottom to top, a grounded bottom plate, a separated dielectric layer and a conductor layer which are arranged in order. The invention can realize collaborative assessment between a passive inter-modulation value of a to-be-tested coating and multiple outdoor environmental factors.

Description

A kind of based on the multifactorial test device for contacting passive inter-modulation performance
Technical field
The present invention relates to a kind of test device for contacting passive inter-modulation performance, be specifically related to a kind of based on the multifactorial test device for contacting passive inter-modulation performance.
Background technology
Two or more carrier signals, through having the parts of nonlinear response, can produce the new signal being different from carrier frequency, and this phenomenon is referred to as passive intermodulation.Passive intermodulation (passive intermodulation PIM) refers to the spurious signal that the transmitting carrier wave of two or more frequencies is blended to produce in passive non-linear device, and modern high power, multi-channel communication systems are interfered by it.
Currently, with respect to the test of passive intermodulation, it is based primarily upon laboratory specific environment, it is impossible to realize the simulation to outdoor multi-environment factor.It is about material and the scheme of the passive cross modulation test of coating, it is substantially in existing coaxial or waveguide, the assessment to passive intermodulation index is realized by changing internal and external conductor or the material of metal contact surface and coating, but owing to existing coaxial or waveguide itself is as known standard component, its electromagnetic field radiation form and intensity are single, and be enclosed construction, make the passive intermodulation index of test comprises the limitation caused due to test structure, such as electric current and Electric Field Distribution cannot regulate, extraneous factor affects, such as pressure, temperature, vibration etc., part to be measured can only be acted on by outer wall by indirect mode, its accessory structure cannot be got rid of on the stop of additional environmental factors and the impact on intermodulation testing result non-singularity, meanwhile, the change of excitation electromagnetic field intensity can only realize by changing incident carrier power value.Contact force for contact end face controls also indirectly to realize by controlling torsional moment, and the machine that afterburning degree of accuracy depends critically upon test block adds precision and personal experience, these aspects all make passive cross modulation test of a high price and accuracy is in urgent need to be improved, more additionally, in the occasion of the microwave device outdoor utility tending to occur Intermodulation Interference, there is presently no solution can be to the intermodulation index of material and coating about the cooperative evaluation of the change performance of many outdoor environments factor.
Summary of the invention
It is an object of the invention to the shortcoming overcoming above-mentioned prior art, it is provided that a kind of based on the multifactorial test device for contacting passive inter-modulation performance, this device is capable of cooperative evaluation between coating passive intermodulation value to be measured and many outdoor environments factor.
For reaching above-mentioned purpose, of the present invention include metal backing, connecting rod, augmentor, open microstrip structure, PIM test system, heater, Temperature Humidity Sensor, humidifier and the vibrational system for vibration rod based on the multifactorial test device for contacting passive inter-modulation performance;
nullDescribed open microstrip structure includes the ground connection base plate set gradually from bottom to top、Separate type dielectric layer and conductor layer,Wherein the upper surface of conductor layer offers gap,Augmentor is connected with the upper end of connecting rod,The lower end of connecting rod is connected with the top of metal backing,Coating to be measured is positioned at the bottom surface of metal backing,The lower surface of coating to be measured presses and the upper surface of conductor layer,And just middle part to coating to be measured, gap,By heater, the contact surface of coating to be measured with conductor layer is heated,By humidifier, the contact surface between coating to be measured and conductor layer is humidified,Temperature Humidity Sensor detects temperature and the humidity information of the contact surface between coating to be measured and conductor layer,The two ends of conductor layer are connected with PIM test system by low PIM microstrip to coaxial adapter,PIM test system and Temperature Humidity Sensor and vibrational system、Augmentor and Temperature Humidity Sensor are connected.
Described separate type dielectric layer is air dielectric layer or low PIM dielectric layer.
The resistance at conductor layer two ends is 50 Ω.
Described vibrational system includes that the vibrating motor of circle and sleeve, sleeve and vibrating motor are all socketed on connecting rod, and vibrating motor is between sleeve and connecting rod.
Coating to be measured is prepared in the lower surface of metal backing by sputtering or chemical plating method.
Also including some reflective back plane, each reflective back plane is circumferentially distributed around connecting rod.
The method have the advantages that
nullThe present invention is based on the multifactorial test device for contacting passive inter-modulation performance in use,By heater, the contact surface of coating to be measured with conductor layer is heated,By humidifier, the contact surface of coating to be measured with conductor layer is humidified,Temperature and the humidity information of the contact surface of coating to be measured and conductor layer is detected by Temperature Humidity Sensor,By augmentor and connecting rod, coating to be measured is applied pressure simultaneously,By vibrational system, coating to be measured is applied vibration,Thus realize the simulation of outdoor multifactor environment,Then system one end input carrier signal to conductor layer is tested by PIM,Then according to pim data and the power of carrier signal of feedback、The pressure that augmentor applies、The frequency of vibration of vibrational system applying and intensity、And the temperature of Temperature Humidity Sensor detection and humidity information realize the variable parameter about multiple physical field of the passive intermodulation index to coating to be measured and the response characteristic test of variation pattern,Draw the coating to be measured activation threshold value about different passive intermodulation indexs,Instruct actual low intermodulation products design and intermodulation Damage control.
Accompanying drawing explanation
Fig. 1 is the structural representation of coating 1 to be measured in the present invention;
Fig. 2 is front view of the present invention;
Fig. 3 is the top view of the present invention;
Fig. 4 is heater 8 in the present invention, humidifier 9 and the location diagram of Temperature Humidity Sensor 10;
Fig. 5 is the location diagram of vibrational system 11 in the present invention;
Fig. 6 is the enlarged drawing in Fig. 5 at A;
Fig. 7 is the mutual tone pitch performance plot of the actual different materials measured of the present invention;
Fig. 8 is the principle framework figure of the present invention;
Fig. 9 (a) is the pim data schematic diagram about variations in temperature;
Fig. 9 (b) is the schematic diagram that pim data changes about pressure.
Wherein, 1 be coating to be measured, 2 be metal backing, 3 be separate type dielectric layer, 4 be conductor layer, 5 be ground connection base plate, 6 be connecting rod, 7 be reflective back plane, 8 be heater, 9 be humidifier, 10 be Temperature Humidity Sensor, 11 be vibrational system, 12 be vibrating motor, 13 for sleeve.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is described in further detail:
With reference to Fig. 1, of the present invention include metal backing 2, connecting rod 6, augmentor, open microstrip structure, PIM test system, heater 8, Temperature Humidity Sensor 10, humidifier 9 and the vibrational system 11 for vibration rod 6 based on the multifactorial test device for contacting passive inter-modulation performance;nullDescribed open microstrip structure includes the ground connection base plate 5 set gradually from bottom to top、Separate type dielectric layer 3 and conductor layer 4,Wherein the upper surface of conductor layer 4 offers gap,Augmentor is connected with the upper end of connecting rod 6,The lower end of connecting rod 6 is connected with the top of metal backing 2,Coating 1 to be measured is positioned at the bottom surface of metal backing 2,The lower surface of coating 1 to be measured presses and the upper surface of conductor layer 4,And just middle part to coating 1 to be measured, gap,By heater 8, the contact surface of coating 1 to be measured with conductor layer 4 is heated,By humidifier 9, the contact surface between coating 1 to be measured and conductor layer 4 is humidified,Temperature Humidity Sensor 10 detects temperature and the humidity information of the contact surface between coating 1 to be measured and conductor layer 4,The two ends of conductor layer 4 are connected with PIM test system by low PIM microstrip to coaxial adapter,PIM test system and Temperature Humidity Sensor 10 and vibrational system 11、Augmentor and Temperature Humidity Sensor 10 are connected.
It should be noted that described separate type dielectric layer 3 is air dielectric layer or low PIM dielectric layer;The resistance at conductor layer 4 two ends is 50 Ω;Vibrational system 11 includes that the vibrating motor 12 of circle and sleeve 13, sleeve 13 and vibrating motor 12 are all socketed on connecting rod 6, and vibrating motor 12 is between sleeve 13 and connecting rod 6;Coating 1 to be measured is prepared in the lower surface of metal backing 2 by sputtering or chemical plating method.Present invention additionally comprises some reflective back plane 7, each reflective back plane 7 is circumferentially distributed in connecting rod 6 around.
With reference to Fig. 2 and Fig. 3, open microstrip structure in the present invention is made up of ground connection base plate 5, separate type dielectric layer 3 and conductor layer 4, the two ends of conductor layer 4 are transferred in PIM test system by low PIM microstrip to coaxial adapter, coating 1 to be measured fits in the lower surface of metal backing 2, is crimped on the gap of the corresponding field intensity of the impedance transformation calculated according to actual needs;The characteristic impedance at conductor layer 4 two ends saves as 50 ohm, and the interlude of conductor layer 4 is transformer section, and the carrier power that transformer section width combines PIM test system according to the field intensity that coating to be tested needs and provided determines.
By controlling voltage and the frequency of vibration of electric current regulation vibrating motor 12 and intensity, it is achieved the afterburning loading in the lump with vibration.With reference to Fig. 7, in the case of fixation pressure, by changing the metal material of different coating to be measured 1, under same test condition, the difference of its mutual tone pitch is substantially.
With reference to Fig. 8, by heater 8, humidifier 9, augmentor, vibrational system 11 applies heat to the contact surface of coating 1 to be measured with conductor layer 4 respectively, wet, pressure and vibration, by PIM test system, this contact surface is applied carrier frequency simultaneously, obtain the pim data of feedback again, realize temperature, humidity, pressure and vibration are merged, realize the extraneous multiple physical field parameter of this contact surface and the joint assessment of intermodulation testing index, i.e. determine certain or multiple extraneous factor parameter testing PIM index, or realize certain or the Adaptive matching of multiple extraneous factor parameter by limiting PIM index, or above two process combines, show that passive inter-modulation performance is about the activation threshold value of many physical parameters and variation tendency, its test effect schematic diagram can be as shown in Fig. 9 (a) and Fig. 9 (a).
The present invention uses impedance transformation method realize the reinforcement of district to be contacted test field intensity or weaken, conductor floor is blocked in field intensity district after the conversion, by coating 1 to be measured is made on metal backing 2, and by making vibrational system 11 and augmentor on metal backing 2, contact interface is applied pressure and vibration, make whole test process in satisfied test standing wave and loss, the most again contact area contact material passive intermodulation characteristic index is tested.

Claims (6)

1., based on a multifactorial test device for contacting passive inter-modulation performance, its feature exists In, survey including metal backing (2), connecting rod (6), augmentor, open microstrip structure, PIM Test system, heater (8), Temperature Humidity Sensor (10), humidifier (9) and be used for vibrating The vibrational system (11) of connecting rod (6);
Described open microstrip structure includes ground connection base plate (5), the separate type set gradually from bottom to top Dielectric layer (3) and conductor layer (4), wherein the upper surface of conductor layer (4) offers gap, afterburning Device is connected with the upper end of connecting rod (6), and the lower end of connecting rod (6) is upper with metal backing (2) Portion is connected, and coating to be measured (1) is positioned at the bottom surface of metal backing (2), coating to be measured (1) Lower surface presses and the upper surface of conductor layer (4), and just middle part to coating to be measured (1), gap, By heater (8), the contact surface of coating to be measured (1) with conductor layer (4) is heated, logical Cross humidifier (9) contact surface between coating to be measured (1) and conductor layer (4) is humidified, Temperature Humidity Sensor (10) detects the temperature of the contact surface between coating to be measured (1) and conductor layer (4) Degree and humidity information, the two ends of conductor layer (4) are surveyed with PIM by low PIM microstrip to coaxial adapter Test system is connected, PIM test system and Temperature Humidity Sensor (10) and vibrational system (11), Augmentor and Temperature Humidity Sensor (10) are connected.
The most according to claim 1 based on the multifactorial survey for contacting passive inter-modulation performance Electricity testing device, it is characterised in that described separate type dielectric layer (3) is air dielectric layer or low PIM Jie Matter layer.
The most according to claim 1 based on the multifactorial survey for contacting passive inter-modulation performance Electricity testing device, it is characterised in that the resistance at conductor layer (4) two ends is 50 Ω.
The most according to claim 1 based on the multifactorial survey for contacting passive inter-modulation performance Electricity testing device, it is characterised in that described vibrational system (11) include circle vibrating motor (12) and Sleeve (13), sleeve (13) and vibrating motor (12) are all socketed on connecting rod (6), vibration electricity Machine (12) is positioned between sleeve (13) and connecting rod (6).
The most according to claim 1 based on the multifactorial survey for contacting passive inter-modulation performance Electricity testing device, it is characterised in that coating to be measured (1) is prepared in gold by sputtering or chemical plating method Belong to the lower surface of backboard (2).
The most according to claim 1 based on the multifactorial survey for contacting passive inter-modulation performance Electricity testing device, it is characterised in that also include some reflective back plane (7), each reflective back plane (7) is along week To being distributed in connecting rod (6) around.
CN201610247524.XA 2016-04-20 2016-04-20 It is a kind of based on the multifactor test device for being used to contact passive inter-modulation performance Expired - Fee Related CN105959069B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120098388A1 (en) * 2009-06-22 2012-04-26 Inova, Inc. Dome-shaped piezoelectric linear motor
CN102732931A (en) * 2012-06-27 2012-10-17 西安交通大学 Method for inhibiting secondary electron emission of microwave component surface by adopting nanostructure plating layer
CN105069206A (en) * 2015-07-24 2015-11-18 西安空间无线电技术研究所 Method for determining passive inter-modulation product of microwave part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120098388A1 (en) * 2009-06-22 2012-04-26 Inova, Inc. Dome-shaped piezoelectric linear motor
CN102732931A (en) * 2012-06-27 2012-10-17 西安交通大学 Method for inhibiting secondary electron emission of microwave component surface by adopting nanostructure plating layer
CN105069206A (en) * 2015-07-24 2015-11-18 西安空间无线电技术研究所 Method for determining passive inter-modulation product of microwave part

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
叶鸣等: "S波段波导同轴转换器的无源互调特性实验研究", 《电波科学学报》 *

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