CN105957869B - Bearing substrate and preparation method thereof - Google Patents
Bearing substrate and preparation method thereof Download PDFInfo
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- CN105957869B CN105957869B CN201610459080.6A CN201610459080A CN105957869B CN 105957869 B CN105957869 B CN 105957869B CN 201610459080 A CN201610459080 A CN 201610459080A CN 105957869 B CN105957869 B CN 105957869B
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- driven comb
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
Abstract
The present invention provides a kind of bearing substrate, for carrying array substrate, the bearing substrate includes underlay substrate, the underlay substrate includes middle area corresponding with the viewing area of the array substrate and the marginal zone around the middle area, the bearing substrate further includes the electrostatic dispersion layer being arranged on the underlay substrate, and the electrostatic dispersion layer is used at least by the electrostatic dispersion of the middle area to the marginal zone.Correspondingly, the present invention also provides a kind of production methods of bearing substrate.The present invention can reduce the electrostatic damage being subject in array substrate manufacturing process.
Description
Technical field
The present invention relates to the production fields of display device, and in particular to a kind of bearing substrate and preparation method thereof.
Background technology
The substrate of flexible array substrate is usually organic material film laye flexible, e.g., polyimides (PI) film, in flexible battle array
In the manufacturing process of row substrate, in order to fix flexible substrate, as shown in Figure 1, flexible substrate 1 is usually produced on bearing substrate
On 2 (being usually glass substrate), the knots such as thin film transistor (TFT) array, signal wire, pixel electrode are formed in flexible substrate 1 later
Structure finally again detaches flexible substrate 1 with bearing substrate.In the production process, due to bearing substrate 2 and the support carrying base
The friction of the base station of plate 2 or other reasons, easy to produce electrostatic, when buildup of static electricity to a certain extent when, it is existing that electric discharge will occur
As and make dielectric breakdown, and electric discharge phenomena typically take place in signal wire intersection place, to be easy to cause the short of signal wire
Road or short circuit, to influence product quality.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art, it is proposed that a kind of bearing substrate and its
Production method, to reduce damage of the Electro-static Driven Comb to product in array substrate manufacturing process.
One of in order to solve the above-mentioned technical problem, the present invention provides a kind of bearing substrate, described for carrying array substrate
Bearing substrate includes underlay substrate, and the underlay substrate includes middle area corresponding with the viewing area of the array substrate and surround
The marginal zone of the middle area, the bearing substrate further includes the electrostatic dispersion layer being arranged on the underlay substrate, described quiet
Electrodispersion layer is used at least by the electrostatic dispersion of the middle area to the marginal zone.
Preferably, the electrostatic dispersion layer is the transparent conductive film layer for covering the underlay substrate.
Preferably, the bearing substrate further includes the insulating layer being arranged on the electrostatic dispersion layer and setting described exhausted
Static realsing layer in edge layer, the static realsing layer are used for the Electro-static Driven Comb of the middle area to the marginal zone.
Preferably, the thickness of the insulating layer existsBetween.
Preferably, the static realsing layer includes the first Electro-static Driven Comb portion and the second Electro-static Driven Comb positioned at the marginal zone
Portion, first Electro-static Driven Comb portion include multiple electric discharge tips for release electrostatic, and multiple electric discharge tips are around the centre
Area is arranged, and the one end in direction second Electro-static Driven Comb portion of the electric discharge tip is acute angle.
Preferably, first Electro-static Driven Comb portion further includes annular body, and the electric discharge tip is formed in the ring-type originally
On body, second Electro-static Driven Comb portion is ring-type.
Preferably, the bearing substrate further includes the protective layer being arranged in the static realsing layer, the protective layer by
Insulating materials is made.
Preferably, the thickness of the protective layer existsBetween.
Correspondingly, the present invention also provides a kind of production methods of bearing substrate, and the bearing substrate is for carrying array base
Plate, the production method include：
Underlay substrate is provided, the underlay substrate includes middle area corresponding with the viewing area of the array substrate and surround
The marginal zone of the middle area；
Electrostatic dispersion layer is formed on the underlay substrate, the electrostatic dispersion layer is used at least by the quiet of the middle area
Electrodispersion is to the marginal zone.
Preferably, the electrostatic dispersion layer is the transparent conductive film layer for covering the underlay substrate.
Preferably, the production method further includes the steps that being carried out after forming electrostatic dispersion layer：
Form insulating layer；
Static realsing layer is formed, the static realsing layer is used for the Electro-static Driven Comb of the middle area to the marginal zone.
Preferably, the thickness of the insulating layer existsBetween.
Preferably, the step of formation static realsing layer includes：
Form conductive material layer；
Technique is patterned to the conductive material layer, includes the first Electro-static Driven Comb portion and positioned at the marginal zone to be formed
The second Electro-static Driven Comb portion figure, first Electro-static Driven Comb portion includes multiple electric discharge tips for release electrostatic, multiple
Tip discharge around middle area setting, and the one end in direction second Electro-static Driven Comb portion of the electric discharge tip is sharp
Angle.
Preferably, first Electro-static Driven Comb portion further includes annular body, and the electric discharge tip is formed in the ring-type originally
On body, second Electro-static Driven Comb portion is ring-type.
Preferably, the production method further includes the steps that being carried out after forming static realsing layer：
Protective layer is formed, the protective layer is made of insulating materials.
Preferably, the thickness of the protective layer existsBetween.
Due to being provided with electrostatic dispersion layer on the underlay substrate of bearing substrate provided by the invention, which can
Electrostatic dispersion on underlay substrate is opened, breakdown probability occurs for the viewing area to reduce array substrate；Also, Electro-static Driven Comb
Layer on be additionally provided with static realsing layer, can accumulation of static electricity to a certain extent when, discharge in the marginal zone of bearing substrate,
With release can, to reduce array substrate viewing area damage.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of the existing bearing substrate for carrying flexible substrate；
Fig. 2 is the structural schematic diagram of the bearing substrate provided in the embodiment of the present invention；
Fig. 3 is status diagram when being partially formed with electrostatic on underlay substrate in the embodiment of the present invention；
Fig. 4 is the dispersity schematic diagram of electrostatic after electrostatic dispersion layer is arranged in the embodiment of the present invention；
Fig. 5 is the vertical view of static realsing layer in the embodiment of the present invention；
Fig. 6 be the present invention bearing substrate manufacturing process in formed electrostatic dispersion layer after structural schematic diagram；
Fig. 7 is the structural schematic diagram that insulating layer is formed on the electrostatic dispersion layer of Fig. 6；
Fig. 8 is that the vertical view after static realsing layer is formed on the insulating layer of Fig. 7；
Fig. 9 is the AA sectional views of Fig. 8.
Wherein, reference numeral is：
1, flexible substrate；2, bearing substrate in the prior art；10, underlay substrate；20, electrostatic dispersion layer；30, it insulate
Layer；40, static realsing layer；41, the first Electro-static Driven Comb portion；41a, electric discharge tip；41b, annular body；42, the second Electro-static Driven Comb
Portion；50, protective layer.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As an aspect of of the present present invention, a kind of bearing substrate is provided, for carrying array substrate, as shown in Fig. 2, described hold
Carried base board includes underlay substrate 10 and the electrostatic dispersion layer 20 that is arranged on underlay substrate 10, and underlay substrate 10 includes and the battle array
The corresponding middle area in viewing area of row substrate and the marginal zone for surrounding the middle area, electrostatic dispersion layer 20 is used at least will be described
The electrostatic dispersion of middle area is to the marginal zone.
The bearing substrate is particularly suitable for carrying flexible array substrate in the manufacturing process of flexible array substrate, that is,
When making flexible array substrate, flexible substrate is formed on bearing substrate, then makes film crystal on flexible substrates
The structures such as pipe array, signal wire detach flexible substrates and bearing substrate when array substrate making finishes.
In the manufacturing process of array substrate, when bearing substrate is due to friction and when middle area accumulates electrostatic, these are quiet
Electricity is easy to so that the dielectric of the viewing area of corresponding array substrate punctures, to influence product quality.And this hair
In bright, electrostatic dispersion layer 20 at least can be by the electrostatic dispersion of middle area to marginal zone, to reduce middle area and marginal zone
Potential difference lowers the probability of middle area electric discharge, and then reduces the thin film transistor (TFT) due to electrostatic breakdown array substrate viewing area
The influence of array improves product quality.
Wherein, transparent material may be used in underlay substrate 10 and electrostatic dispersion layer 20, in order to subsequently by flexible base
Bottom is separated with bearing substrate.Specifically, underlay substrate 10 is glass substrate, and electrostatic dispersion layer 20 is to cover the underlay substrate
Transparent conductive film layer, e.g., tin indium oxide film layer.Making work can be simplified by setting electrostatic dispersion layer 20 to the film layer of flood
Skill, and when a certain position accumulation has electrostatic (stain in such as Fig. 3) on bearing substrate, electrostatic dispersion layer 20 uses the film of flood
The electrostatic of the position can more uniformly scatter (as shown in Figure 4) by layer.Certainly, electrostatic dispersion layer 20 can also use it
His structure, for example, using netted structure.
Further, as shown in Fig. 2, the bearing substrate further includes 30 He of insulating layer being arranged on electrostatic dispersion layer 20
The static realsing layer 40 being arranged on insulating layer 30, static realsing layer 40 are used for the electrostatic of middle area in release to marginal zone.
Therefore, when the buildup of static electricity on underlay substrate 10 to a certain extent when, static realsing layer 40 discharges electrostatic in the marginal zone,
To prevent the thin film transistor (TFT) array of array substrate viewing area from being destroyed.
Wherein, the material of insulating layer 30 may include the nitride of silicon, and the thickness of insulating layer 30 existsIt
Between, to reduce the breakdown strength between insulating layer 30, so that when Electro-static Driven Comb occurs, preferentially hit in insulating layer 30
It wears, punctures without the insulating layer in array substrate.
Specifically, as shown in figure 5, static realsing layer 40 include the first Electro-static Driven Comb portion 41 and positioned at the marginal zone the
Two Electro-static Driven Comb portions 42, the first Electro-static Driven Comb portion 41 include multiple electric discharge tip 41a for release electrostatic, multiple electric discharge tips
41a is arranged around the middle area, and the one end in the second Electro-static Driven Comb of the direction portion 42 for the tip 41a that discharges is acute angle.Therefore, when
Buildup of static electricity on underlay substrate 10 to a certain extent when, electric discharge tip 41a can towards the second Electro-static Driven Comb portion 42 electric discharge (that is,
Point discharge), energy release is carried out, the damage of the viewing area of array substrate is reduced.Wherein, the material of static realsing layer 40 can
Can also include transparent conductive film layer to include metal.
Wherein, the first Electro-static Driven Comb portion 41 further includes annular body 41b, and electric discharge tip 41a is formed in annular body 41b
On, the second Electro-static Driven Comb portion 42 is ring-type, to which when the electrostatic of accumulation is more, the first Electro-static Driven Comb portion 41 can be equal by electrostatic
It is discharged evenly to the marginal zone.
Further, as shown in Fig. 2, the bearing substrate further includes the protective layer 50 being arranged in static realsing layer 40,
Protective layer 50 is made of insulating materials, for example, the material of protective layer 50 may include the nitride of silicon, wherein protective layer 50
Thickness existsBetween, to form even curface.When making flexible array substrate, flexible array substrate
Flexible substrate can be formed on protective layer 50, shell flexible substrate from bearing substrate after completing on flexible array substrate
From when, protective layer 50 play protection static realsing layer it is used, and be convenient for subsequent cleaning.
As another aspect of the present invention, a kind of production method of bearing substrate is provided, the bearing substrate is for carrying
Array substrate, the production method include：
S1, provide underlay substrate 10, underlay substrate 10 include middle area corresponding with the viewing area of the array substrate and
Marginal zone around the middle area.
S2, electrostatic dispersion layer 20 is formed on underlay substrate 10, electrostatic dispersion layer 20 is used at least by the middle area
Electrostatic dispersion is to the marginal zone, as shown in Figure 6.Preferably, electrostatic dispersion layer 20 is the electrically conducting transparent for covering underlay substrate 10
Film layer, so as to which electrostatic more uniformly scatter.
The production method further includes carrying out upon step s 2：
S3, insulating layer 30 is formed, as shown in Figure 7.Wherein, the material of insulating layer 30 may include the nitride of silicon, thick
Degree can beBetween.
S4, static realsing layer 40 is formed, as shown in figure 8, static realsing layer 40 is used for the release of middle area to the side
Edge area.When buildup of static electricity to a certain extent when, static realsing layer 40 can discharge to marginal zone, to release energy, minimizing electrostatic
The influence of array substrate viewing area.
Specifically, step S4 includes：
S41, conductive material layer is formed.
S42, technique is patterned to the conductive material layer, with formed include the first Electro-static Driven Comb portion 41 and positioned at described in
The figure in the second Electro-static Driven Comb portion 42 of marginal zone, as shown in figure 9, the first Electro-static Driven Comb portion 41 is used for release electrostatic including multiple
Electric discharge tip 41a, multiple electric discharge tip 41a around the middle area be arranged, and discharge tip 41a the second electrostatic of direction release
The one end for putting portion 42 is acute angle.Wherein, the first Electro-static Driven Comb portion 41 further includes annular body 41b, and electric discharge tip 41a is formed in ring
On shape ontology 41b, the second Electro-static Driven Comb portion 42 is ring-type.
Further, the production method further includes carrying out after step s4：
S5, protective layer 50 is formed, obtains bearing substrate shown in Fig. 2.Protective layer 50 is made of insulating materials, protective layer 50
Thickness can beBetween, so that the surface of bearing substrate is more smooth, and making
When removing flexible substrate from bearing substrate after complete array substrate, protective layer 50 can play the work of protection static realsing layer 40
With.
As can be seen that due to being provided with electrostatic dispersion layer on the underlay substrate of bearing substrate provided by the invention, the electrostatic
Dispersion layer can open the electrostatic dispersion on underlay substrate, to reduce the potential difference on underlay substrate between different zones, subtract
The probability of few Electro-static Driven Comb；Also, static realsing layer is additionally provided in static realsing layer, can accumulation of static electricity to a certain extent
When, discharge in the marginal zone of bearing substrate, with release can, to reduce array substrate viewing area damage.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (14)
1. a kind of bearing substrate, for carrying array substrate, the bearing substrate includes underlay substrate, and the underlay substrate includes
Middle area corresponding with the viewing area of the array substrate and the marginal zone for surrounding the middle area, which is characterized in that described to hold
Carried base board further includes the electrostatic dispersion layer being arranged on the underlay substrate, and the electrostatic dispersion layer is used at least by the centre
The electrostatic dispersion in area is to the marginal zone；
The bearing substrate further includes the insulating layer being arranged on the electrostatic dispersion layer and is arranged quiet on the insulating layer
Electric releasing layer, the static realsing layer are used for the Electro-static Driven Comb of the middle area to the marginal zone.
2. bearing substrate according to claim 1, which is characterized in that the electrostatic dispersion layer is to cover the underlay substrate
Transparent conductive film layer.
3. bearing substrate according to claim 1, which is characterized in that the thickness of the insulating layer exists
Between.
4. bearing substrate according to claim 1, which is characterized in that the static realsing layer includes the first Electro-static Driven Comb portion
With the second Electro-static Driven Comb portion positioned at the marginal zone, first Electro-static Driven Comb portion includes multiple electric discharges for release electrostatic
Tip, multiple electric discharge tips are arranged around the middle area, and direction second Electro-static Driven Comb portion of the electric discharge tip
One end is acute angle.
5. bearing substrate according to claim 4, which is characterized in that first Electro-static Driven Comb portion further includes cyclic annular sheet
Body, the electric discharge tip are formed in the annular body, and second Electro-static Driven Comb portion is ring-type.
6. bearing substrate according to claim 1, which is characterized in that the bearing substrate further includes being arranged in the electrostatic
Protective layer on releasing layer, the protective layer are made of insulating materials.
7. bearing substrate according to claim 6, which is characterized in that the thickness of the protective layer exists
Between.
8. a kind of production method of bearing substrate, the bearing substrate is for carrying array substrate, which is characterized in that the making
Method includes：
Underlay substrate is provided, the underlay substrate includes middle area corresponding with the viewing area of the array substrate and surround described
The marginal zone of middle area；
Electrostatic dispersion layer is formed on the underlay substrate, the electrostatic dispersion layer is at least by the electrostatic of the middle area point
It is dissipated to the marginal zone；
The production method further includes the steps that being carried out after forming electrostatic dispersion layer：
Form insulating layer；
Static realsing layer is formed, the static realsing layer is used for the Electro-static Driven Comb of the middle area to the marginal zone.
9. production method according to claim 8, which is characterized in that the electrostatic dispersion layer is to cover the underlay substrate
Transparent conductive film layer.
10. production method according to claim 8, which is characterized in that the thickness of the insulating layer exists
Between.
11. production method according to claim 8, which is characterized in that the step of formation static realsing layer includes：
Form conductive material layer；
Technique is patterned to the conductive material layer, with formed include the first Electro-static Driven Comb portion and positioned at the marginal zone the
The figure in two Electro-static Driven Comb portions, first Electro-static Driven Comb portion include multiple electric discharge tips for release electrostatic, multiple electric discharges
Tip is arranged around the middle area, and the one end in direction second Electro-static Driven Comb portion of the electric discharge tip is acute angle.
12. production method according to claim 11, which is characterized in that first Electro-static Driven Comb portion further includes cyclic annular sheet
Body, the electric discharge tip are formed in the annular body, and second Electro-static Driven Comb portion is ring-type.
13. production method according to claim 8, which is characterized in that the production method further includes being released in formation electrostatic
It is carried out after the step of putting layer：
Protective layer is formed, the protective layer is made of insulating materials.
14. production method according to claim 13, which is characterized in that the thickness of the protective layer exists
Between.
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| CN201610459080.6A CN105957869B (en) | 2016-06-22 | 2016-06-22 | Bearing substrate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610459080.6A CN105957869B (en) | 2016-06-22 | 2016-06-22 | Bearing substrate and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105957869A CN105957869A (en) | 2016-09-21 |
| CN105957869B true CN105957869B (en) | 2018-09-04 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103513459A (en) * | 2013-10-14 | 2014-01-15 | 北京京东方光电科技有限公司 | Array substrate and preparing method thereof, display device and preparing method thereof |
| CN103682148A (en) * | 2012-08-31 | 2014-03-26 | 三星显示有限公司 | Organic light emitting device and manufacturing method thereof |
| CN104656293A (en) * | 2015-03-18 | 2015-05-27 | 合肥京东方光电科技有限公司 | Liquid crystal display panel, manufacturing method of liquid crystal display panel, as well as display device |
| CN105070712A (en) * | 2015-07-10 | 2015-11-18 | 合肥鑫晟光电科技有限公司 | Display substrate, manufacturing method thereof, display panel and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9346195B2 (en) * | 2013-07-18 | 2016-05-24 | Samsung Display Co., Ltd. | Flexible substrate, method of manufacturing flexible substrate, flexible display device, and method of flexible display device |
-
2016
- 2016-06-22 CN CN201610459080.6A patent/CN105957869B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682148A (en) * | 2012-08-31 | 2014-03-26 | 三星显示有限公司 | Organic light emitting device and manufacturing method thereof |
| CN103513459A (en) * | 2013-10-14 | 2014-01-15 | 北京京东方光电科技有限公司 | Array substrate and preparing method thereof, display device and preparing method thereof |
| CN104656293A (en) * | 2015-03-18 | 2015-05-27 | 合肥京东方光电科技有限公司 | Liquid crystal display panel, manufacturing method of liquid crystal display panel, as well as display device |
| CN105070712A (en) * | 2015-07-10 | 2015-11-18 | 合肥鑫晟光电科技有限公司 | Display substrate, manufacturing method thereof, display panel and display device |
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