CN105953524B - A kind of quick cooling device of fluid - Google Patents

A kind of quick cooling device of fluid Download PDF

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Publication number
CN105953524B
CN105953524B CN201610327692.XA CN201610327692A CN105953524B CN 105953524 B CN105953524 B CN 105953524B CN 201610327692 A CN201610327692 A CN 201610327692A CN 105953524 B CN105953524 B CN 105953524B
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China
Prior art keywords
fluid
face
radiator
cooling device
quick cooling
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CN201610327692.XA
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Chinese (zh)
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CN105953524A (en
Inventor
尹善章
陈克勇
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Shenzhen koala mom Technology Co.,Ltd.
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Shenzhen Mom Technology Co Ltd
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Priority to CN201610327692.XA priority Critical patent/CN105953524B/en
Priority to PCT/CN2016/092711 priority patent/WO2017197767A1/en
Publication of CN105953524A publication Critical patent/CN105953524A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/38Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)

Abstract

The present invention is suitable for fluid refrigeration technical field, provides a kind of quick cooling device of fluid, including reservoir for holding a fluid, semiconductor refrigerating part, radiator and radiator fan.Container has entrance and outlet, and semiconductor refrigerating part is electrically connected with external power supply, and with cold end face and hot end face, container outer surface, hot end face held against heat sink are close in cold end face;Radiator fan is installed on radiator.Quick cooling device of the invention, semiconductor refrigerating part use electric energy fast-refrigerating, and thermal energy exchange is realized in the heat of fluid and the cold end face of semiconductor refrigerating part, thus temperature rapid decrease.And the heat that semiconductor refrigerating part is absorbed into is then by cold end face fast transfer to hot end face, heat on the face of hot end is transferred on radiator, radiator dissipates the heat to the air, and radiator fan can accelerate the speed of air flowing, to accelerate the radiating rate of radiator.Therefore, the temperature of fluid can be quickly cooled down by quick cooling device of the invention.

Description

A kind of quick cooling device of fluid
Technical field
The invention belongs to fluid refrigeration technical field more particularly to a kind of quick cooling devices of fluid.
Background technique
Fast-refrigerating is carried out to fluid currently, generalling use Technology of Compressor Refrigeration;The disadvantage is that at high cost, refrigerating efficiency It is low, refrigeration system shape is huge etc..
In addition, for some special drinking-fluids, the milk such as brewed to baby also requires the potable temperature of warm water Degree.The optimum temperature of solubilization temperature (within the scope of 40-60 degree) that the boiled water that boiler boils cools to various brand milk powder is brewed, to reach The purpose not being lost to milk powder dissolution optimum efficiency and milk powder nutrition.But the milk coolant-temperature gage of 40-60 degree, time in sight can not also be straight It connects and is given to baby and drinks, also need to handle by long-time cooling.
Therefore, it is necessary to research and develop a kind of technology with can be with the temperature of fluid being dropped in a short time required temperature.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of quick cooling device of fluid, it is intended to solve existing skill Use Technology of Compressor Refrigeration low at high cost present in fluid progress fast-refrigerating, refrigerating efficiency in art and refrigeration system The huge problem of shape.
The invention is realized in this way a kind of quick cooling device of fluid, including reservoir for holding a fluid, it is described Container has entrance and outlet, and the quick cooling device further includes semiconductor refrigerating part, radiator and radiator fan;Institute It states semiconductor refrigerating part to be electrically connected with external power supply, with cold end face and hot end face, the container is close in the cold end face The radiator is close in outer surface, the hot end face, and the radiator fan is installed on the radiator.
Further, the quick cooling device further includes heat-barrier material, and the heat-barrier material and semiconductor refrigerating part are total With the outer peripheral edge for coating the container, the heat-barrier material, which corresponds to the entrance of the container and the position of outlet, has opening.
Further, the semiconductor refrigerating part is in the form of sheets.
Further, the thickness of the heat-barrier material is greater than or equal to the thickness of the semiconductor refrigerating part.
Further, the radiator is metallic heat dissipating part.
Further, the cold end face is bonded by conduction cooling glue and the container outer surface, and the hot end face passes through thermally conductive Glue and the radiator bond.
Further, conduit is provided in the container, the arrival end of the conduit connects with the entrance of the container, Outlet end is close to the bottom of the container.
Further, the conduit is L-shaped.
Further, the container is fabricated by thermally conductive good metal material.
Compared with prior art, the present invention beneficial effect is: quick cooling device of the invention accommodates the appearance of fluid The outer surface of device is close to the cold end face of semiconductor refrigerating part, and semiconductor refrigerating part uses electric energy fast-refrigerating, and degree of freezing, Speed can realize control by external circuit, and the heat of fluid is real by the cold end face of wall of a container body and semiconductor refrigerating part Existing thermal energy exchange, so that the temperature of fluid can rapid decrease.And the heat that semiconductor refrigerating part is absorbed into is then quick by cold end face It is transferred to hot end face, the heat on the face of hot end is transferred on radiator, and radiator is distributed heat by the heat dissipation characteristics of itself Into air, radiator fan can accelerate the speed of air flowing, to accelerate the radiating rate of radiator.Therefore, of the invention The temperature of fluid can be quickly cooled down by quick cooling device.
Detailed description of the invention
Fig. 1 is a kind of longitudinal schematic cross-sectional view of the quick cooling device of fluid provided in an embodiment of the present invention.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only To explain the present invention, it is not intended to limit the present invention.
As shown in Figure 1, for a preferred embodiment of the invention, a kind of quick cooling device of fluid, including for accommodating Container 1, semiconductor refrigerating part 2, radiator 3 and the radiator fan 4 of fluid.
Container 1 has entrance 11 and outlet 12, and container 1 is fabricated by thermally conductive good metal material.Semiconductor system Cold part 2 is electrically connected with external power supply 200, and with cold end face 21 and hot end face 22,1 outer surface of container is close in cold end face 21, 22 held against heat sink 3 of hot end face;Radiator 3 is the metallic heat dissipating part of well conducting;Radiator fan 4 is installed on radiator 3.
Specifically, in order to realize close, stable fitting, while the transfer of thermal energy is not influenced again, above-mentioned cold end face 21 is logical It crosses conduction cooling glue and 1 outer surface of container bonds, hot end face 22 is bonded by heat-conducting glue and radiator 3.
In order to avoid the temperature of extraneous spacial influence fluid, above-mentioned quick cooling device further includes heat-barrier material 5, heat-insulated Material 5 and semiconductor refrigerating part 2 coat the outer peripheral edge of container 1 jointly, and heat-barrier material 5 corresponds to entrance 11 and the outlet of container 1 12 position is respectively provided with opening 51 and opening 52.
Above-mentioned semiconductor refrigerating part 2 is in the form of sheets;The thickness of heat-barrier material 5 is greater than or equal to the thickness of semiconductor refrigerating part 2, So that the heat in 2 hot end face of radiator 3 or semiconductor refrigerating part is flow backwards and keep 2 cold end face of semiconductor refrigerating part or container 1 quick Cooling is affected.
Conduit 13 is provided in container 1, conduit 13 is L-shaped;The arrival end 131 of conduit 13 connects with the entrance 11 of container 1, Its outlet end 132 under the effect of gravity, rapidly flow to container 1 from the entrance 11 of container 1 close to the bottom of container 1, fluid Bottom, thus make fluid formed a closed loop, fluid can the inner wall in multiple times with container 1 close to cold end face 21 contact, add The fast speed of thermal energy exchange, enables fluid to be quickly cooled down.As it can be seen that the quick cooling device in the present embodiment, accommodates fluid The outer surface of container 1 be close to the cold end face 21 of semiconductor refrigerating part 2, semiconductor refrigerating part 2 use electric energy fast-refrigerating, and Refrigeration degree, speed can realize control, the wall body and semiconductor refrigerating part that the heat of fluid passes through container 1 by external circuit Thermal energy exchange is realized in 2 cold end face 21, so that the temperature of fluid can rapid decrease.And the heat that semiconductor refrigerating part 2 is absorbed into Then by 21 fast transfer of cold end face to hot end face 22, the heat on hot end face 22 is transferred on radiator 3, radiator 3 pass through from The heat dissipation characteristics of body dissipate the heat to the air, and radiator fan 4 can accelerate the speed of air flowing, to accelerate radiator 3 Radiating rate.Therefore, the temperature of fluid can be quickly cooled down by the quick cooling device of the present embodiment.
In order to further embody the technical effect of the present embodiment, below by by taking the milk that baby brews as an example, specifically The process that bright milk is quickly cooled down: the warm water boiled (40-60 degree) is mixed with milk powder and brews into milk, utilizes this implementation The quick cooling device of example is by the cold water of the boiled water fast cooling to 15 degree or so boiled, by the milk of cold water and 40-60 degree It neutralizes, synthesizes 37.5 degree required for baby of milk.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.

Claims (8)

1. a kind of quick cooling device of fluid, including reservoir for holding a fluid, the container has entrance and outlet, It is characterized in that, the quick cooling device further includes semiconductor refrigerating part, radiator and radiator fan;The semiconductor system Cold part is electrically connected with external power supply, and with cold end face and hot end face, the container outer surface is close in the cold end face, described The radiator is close in hot end face, and the radiator fan is installed on the radiator, and conduit is provided in the container, described The arrival end of conduit connects with the entrance of the container, and outlet end is close to the bottom of the container.
2. the quick cooling device of fluid as described in claim 1, which is characterized in that the quick cooling device further include every Hot material, the heat-barrier material and semiconductor refrigerating part coat the outer peripheral edge of the container jointly, and the heat-barrier material corresponds to The entrance of the container and the position of outlet have opening.
3. the quick cooling device of fluid as described in claim 1, which is characterized in that the semiconductor refrigerating part is in the form of sheets.
4. the quick cooling device of fluid as claimed in claim 2, which is characterized in that the thickness of the heat-barrier material be greater than or Equal to the thickness of the semiconductor refrigerating part.
5. the quick cooling device of fluid as described in claim 1, which is characterized in that the radiator is metallic heat dissipating part.
6. the quick cooling device of the fluid as described in any one of claim 1 to 5, which is characterized in that the cold end face It is bonded by conduction cooling glue and the container outer surface, the hot end face is bonded by heat-conducting glue and the radiator.
7. the quick cooling device of fluid as described in claim 1, which is characterized in that the conduit is L-shaped.
8. the quick cooling device of the fluid as described in any one of claim 1 to 5, which is characterized in that the container by Thermally conductive good metal material is fabricated.
CN201610327692.XA 2016-05-17 2016-05-17 A kind of quick cooling device of fluid Active CN105953524B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610327692.XA CN105953524B (en) 2016-05-17 2016-05-17 A kind of quick cooling device of fluid
PCT/CN2016/092711 WO2017197767A1 (en) 2016-05-17 2016-08-01 Fast refrigerating device for fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610327692.XA CN105953524B (en) 2016-05-17 2016-05-17 A kind of quick cooling device of fluid

Publications (2)

Publication Number Publication Date
CN105953524A CN105953524A (en) 2016-09-21
CN105953524B true CN105953524B (en) 2019-01-15

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Country Status (2)

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CN (1) CN105953524B (en)
WO (1) WO2017197767A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112240678B (en) * 2020-10-20 2022-04-05 苏州模方包装容器有限公司 Automatic packaging bottle bottom cooling device and cooling method thereof
CN112432085A (en) * 2020-11-25 2021-03-02 浙江北光科技股份有限公司 Surface-mounted down lamp with efficient heat dissipation function

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273081A (en) * 1985-09-25 1987-04-03 今永 栄輔 Hot and cold storage device
CN1093456A (en) * 1993-03-03 1994-10-12 修国胜 Portable type semiconductor self-circulation cold drinking machine
CN2249749Y (en) * 1996-03-12 1997-03-19 朱复新 Water treating apparatus for drinking
CN2336292Y (en) * 1998-08-06 1999-09-01 吴鸿平 Compound heat-transfer dish type semiconductor refrigeration container
JP2003072897A (en) * 2001-09-03 2003-03-12 Ja Kk Cooling/heating tank
CN2706721Y (en) * 2004-04-28 2005-06-29 莫胜林 Semiconductor refrigerating/heating apparatus
US8820094B1 (en) * 2007-01-22 2014-09-02 Calvin Casher Thermoelectric wine bag cooler/dispenser
CN201293520Y (en) * 2008-10-22 2009-08-19 于乔治 Semiconductor refrigeration drinking machine
CN201340158Y (en) * 2008-12-17 2009-11-04 叶永丰 Semi-conductor cold storage large-capacity cold tank
CN101865557A (en) * 2009-04-17 2010-10-20 陈齐武 Refrigerating and heating device and cup provided with same
CN201772674U (en) * 2010-09-01 2011-03-23 龚燕臣 Inner tank of electronic refrigerating machine
BR102014021495A2 (en) * 2014-08-29 2016-03-22 Felipe Osmar Berwanger Brochier thermal device for solid and liquid products

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Publication number Publication date
CN105953524A (en) 2016-09-21
WO2017197767A1 (en) 2017-11-23

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Effective date of registration: 20200529

Address after: 303a, building 3, COFCO Chuangzhi plant area, zone 67, Xingdong community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen koala mom Technology Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province Nanshan District Guangdong streets south park of Zhongshan University research base 13 floor West Wing

Patentee before: SHENZHEN MAMA TECHNOLOGY Co.,Ltd.

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