CN110068090A - A kind of novel semi-conductor air cooler - Google Patents
A kind of novel semi-conductor air cooler Download PDFInfo
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- CN110068090A CN110068090A CN201910479170.5A CN201910479170A CN110068090A CN 110068090 A CN110068090 A CN 110068090A CN 201910479170 A CN201910479170 A CN 201910479170A CN 110068090 A CN110068090 A CN 110068090A
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- semiconductor
- air
- chilling plate
- heat
- storehouse
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 109
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000005192 partition Methods 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 238000005253 cladding Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000004411 aluminium Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 238000005057 refrigeration Methods 0.000 claims description 9
- 239000003507 refrigerant Substances 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 125000001475 halogen functional group Chemical group 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 238000010792 warming Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 235000014612 sandwich biscuits Nutrition 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
Abstract
The present invention relates to a kind of novel semi-conductor air coolers, comprising: includes: vane, pedestal, motor, impeller, partition, semiconductor chilling plate, heat conduction fin, air inlet hole, circuit board, switch, heat pipe, refrigerated medium hot tank, refrigerated medium hot tank insulation cladding, heat exchange chamber, cold storehouse, hot storehouse, cold door, hot warehouse lid, clump weight.Perhaps heat and derived cooling capacity or heat are made full use of by connecting heat pipe in semiconductor chilling plate one end and quickly conducting cooling capacity, has not only improved the working efficiency of semiconductor chilling plate, but also improve the service efficiency of the energy.
Description
Technical field
The present invention relates to a kind of novel semi-conductor air coolers.
Background technique
Traditional electric fan by electric drive generate air-flow, blade rotation make air accelerate circulation, electric fan mainly by fan head,
The components such as blade, mesh enclosure and control device composition.Fanning head includes motor, front and rear cover and wind pushing mechanism of shaking the head etc..Electric fan
Main component be: ac motor.Its working principle is that: hot-wire coil in magnetic field stress and rotate.Traditional electric fan electricity
It can be converted into mechanical energy, simultaneously because coil resistance, therefore inevitably some electric energy will be converted into thermal energy.Traditional electricity
When fan work, due to there is coil of the electric current by electric fan, conducting wire has resistance, so heat can be generated inevitably
Outside heat release, temperature can increase, and can not reduce air themperature.In addition, conventional fan is brought by blade " cutting " air
Flowing allows people to feel to impact and stimulate that comfort is poor；In addition, blade is easy covering dust, cleaning is inconvenient.
In recent years, bladeless fan was rapidly developed, but it can only be such that air flows, and cannot be provided significantly lasting
Lower than the cold wind of room temperature or the significantly lasting hot wind higher than room temperature, in addition, its energy cannot make full use of, efficiency compared with
It is low.Therefore, it is necessary to which providing one kind is able to carry out cooling and warming, efficiency is high, the Multifucntional air-conditioning being used conveniently and safely
Fan.
Summary of the invention
Novel cooling and warming, energy are able to carry out it is an object of the invention to overcome the deficiencies of the prior art and provide a kind of
Effect is high, the Multifunctional semiconductor air condition fan being used conveniently and safely.
To solve the above problems, a kind of technical solution that the present invention uses is: a kind of semiconductor air conditioner fan, comprising: vane,
Pedestal, motor, impeller, partition, semiconductor chilling plate, heat conduction fin, air inlet hole, circuit board, switch, heat pipe, cooling and warming
Case, refrigerated medium hot tank insulation cladding, heat exchange chamber, cold storehouse, hot storehouse, cold door, hot warehouse lid, clump weight.
The vane is annular comprising air outlet ring front cover and air outlet ring rear cover, air outlet ring front cover and air outlet ring rear cover connect
It connects to form vane inner cavity, vane inner cavity is connected to pedestal, and width of the vane inner cavity close to air outlet side is greater than far from air outlet
Side width, air outlet ring front cover is made of interior outlet air piece and outer outlet air piece, and interior outlet air piece and outer outlet air piece form air outlet,
Air outlet extends along the intersection of interior outlet air piece and outer outlet air piece and width is 0.5 to 3 millimeter.
The pedestal is cylinder, is connected to vane inner cavity and bottom is provided with the clump weight for increasing pedestal weight.
The motor is brushless motor, and shaft is connect downward and with impeller, and revolving speed per minute is 1000 to 10000 turns.
The impeller is drum-type impeller, and driven by the motor, external air is sucked bottom by impeller high-speed rotation
Seat, enters vane by pedestal.
The partition is made of heat-barrier material, is located at below impeller, and apart from 10 centimetres to 50 centimetres of impeller, partition is the bottom of by
Seat is divided into two parts up and down, and thickness is identical as the height of the semiconductor grain of semiconductor chilling plate and has one or more
Rectangular aperture is for fixing semiconductor chilling plate.
The semiconductor chilling plate is fixed in the opening of partition, and semiconductor chilling plate is by many N-types and P-type semiconductor
Grain arranges mutually, and is connected with general conductor into a complete line, usually copper, aluminium or other metals between NP
Conductor is finally picked up as sandwich biscuits by two panels potsherd Lai, potsherd insulation and thermally conductive good.When electric current passes through, half
Heat transfer will be generated between two blocks of potsherds of conductor cooling piece, heat will be transferred to the other end from one end, to produce
The raw temperature difference forms hot and cold side.Semiconductor air conditioner fan includes one or more semiconductor chilling plates, cold when cooling piece is multiple
Hot end direction is consistent.
The upper end of the heat conduction fin and semiconductor chilling plate is thermally connected, and copper or aluminum metallic material is used to be made, and is wrapped
The cooling fin for including cylindrical body and connecting with cylinder, cylinder diameter size is identical as semiconductor chilling plate side length, and height is upwards
Wheel rotation is extended to below impeller and is not influenced, cooling fin is erect and is uniformly distributed on the cylinder.
The air inlet hole is circle, is evenly distributed on the base shell between impeller and partition.When impeller high-speed rotation,
Outside air enters pedestal by air inlet hole.
The circuit board is located in a region of air inlet pore size distribution, and circuit board is by power supply and motor, semiconductor chilling plate
It is electrically connected.
The switch is located in a region of air inlet pore size distribution and it is stirred button and is located on the shell, and switch is for half-and-half
The working condition of conductor air cooler is selected: being closed, refrigeration, heating.When switch is allocated to closed state, cut off the power, half
Conductor air cooler does not work；When switch is allocated to refrigerating state, the N-type semiconductor of positive pole and semiconductor chilling plate is connected,
The connection of the P-type semiconductor of power cathode and semiconductor chilling plate, the upper end refrigeration of semiconductor chilling plate, lower end heating, semiconductor
The wind of air cooler blowout is cold wind；When switch is allocated to heating state, power positive cathode direction changes, positive pole and semiconductor
The P-type semiconductor of cooling piece connects, and the N-type semiconductor of power cathode and semiconductor chilling plate connects, semiconductor chilling plate it is upper
The wind of end heating, lower end refrigeration, semiconductor air conditioner fan blowout is hot wind.
The heat pipe is closed metal shell, is filled with suitable refrigerant for being pumped into after negative pressure inside it, one end of pipe is
Evaporator section, the other end are condensation segment, and when one end of heat pipe is heated, refrigerant evaporation vaporization, gaseous coolant is flow under a slight pressure difference
Heat is released to the other end, regelation flows back to evaporator section by gravity at liquid, liquid, so recycles, heat is by heat pipe
One end reach the other end.One end of heat pipe and the lower end of semiconductor chilling plate are thermally connected, and other end bending extends to refrigerated medium
Hot tank, semiconductor air conditioner fan include multiple heat pipes.
The refrigerated medium hot tank is cylindrical cabinet, and external to coat insulation cladding, internal cavity is by aluminium sheet or copper sheet point
For three spaces: heat exchange chamber, cold storehouse, hot storehouse, cold position in storehouse is in bottom, and the height of cold the top of the warehouse is less than semiconductor chilling plate
Height, heat exchange chamber is located at centre, and hot position in storehouse is in the top, and the height in hot orlop portion is greater than the height of semiconductor chilling plate
Degree.A part of heat pipe one end and the lower end of semiconductor chilling plate are thermally connected, and the other end extends to the bottom in hot storehouse；A part of heat pipe
One end and the lower end of semiconductor chilling plate connect, and the other end extends to the top in cold storehouse.
The refrigerated medium hot tank insulation cladding is made of thermal insulation material, coats the outer surface of refrigerated medium hot tank.
The heat exchange chamber extends to the part of refrigerated medium hot tank to accommodate heat pipe.
The cold storehouse inner wall is made of aluminium, copper or the good metal of other thermal conductivity.
The hot storehouse inner wall is made of aluminium, copper or the good metal of other thermal conductivity.
There is the hot the top of the warehouse warehouse lid can place an article within from hot warehouse lid when needing to heat.
The beneficial effect that the invention adopts the above technical scheme compared with prior art is: semiconductor air conditioner fan can be made
It is cold, and can heat；The heat of the other side or cryogenic energy utilization hot pipe conducting to refrigerated medium hot tank are used, the energy can be sufficiently sharp
With.
Detailed description of the invention
Fig. 1 is the structure chart of semiconductor air conditioner fan of the present invention.
Wherein, 1- vane, 2- pedestal, 3- motor, 4- impeller, 5- partition, 6- semiconductor chilling plate, 7- heat conduction fin,
8- air inlet hole, 9- circuit board, 10- switch, 11- heat pipe, 12- refrigerated medium hot tank, 13- refrigerated medium hot tank insulation cladding, 14- heat exchange
The cold storehouse chamber, 15-, the hot storehouse 16-, the cold door of 17-, the hot warehouse lid of 18-, 19- clump weight.
Specific embodiment
As shown in Figure 1, a kind of semiconductor air conditioner fan, comprising: vane 1, pedestal 2, motor 3, impeller 4, partition 5, semiconductor
Cooling piece 6, heat conduction fin 7, air inlet hole 8, circuit board 9, switch 10, heat pipe 11, refrigerated medium hot tank 12, the heat preservation of refrigerated medium hot tank
Shell 13, heat exchange chamber 14, cold storehouse 15, hot storehouse 16, cold door 17, hot warehouse lid 18, clump weight 19.
Vane 1 is annular, and vane 1 includes air outlet ring front cover and air outlet ring rear cover, and air outlet ring front cover and air outlet ring rear cover connect
It connects to form 1 inner cavity of vane, 1 inner cavity of vane is connected to pedestal 2, and width of 1 inner cavity of vane close to air outlet side is greater than far from out
The width of the side in air port, air outlet ring front cover are made of interior outlet air piece and outer outlet air piece, and interior outlet air piece and outer outlet air piece are formed out
Air port, air outlet extends along the intersection of interior outlet air piece and outer outlet air piece and width is 0.5 to 3 millimeter.Motor in pedestal will
Air sucks air cooler chassis interior, and after accelerating via cyclone accelerator, air passage rates are increased, via lip ring in vane
Around circular power drives the air near vane to enter vane therewith, and at a high speed blowout outward.
Pedestal 2 is cylinder, and pedestal 2 is connected to 1 inner cavity of vane, and bottom is provided with the clump weight for increasing by 2 weight of pedestal
19, air cooler gravity center instability is prevented, is toppled over.
Motor 3 is brushless motor, and shaft is connect downward and with impeller 4, and revolving speed per minute is 1000 to 10000 turns.
Impeller 4 is drum-type impeller 4, under the drive of motor 3,4 high-speed rotation of impeller, by external air from air inlet hole
Pedestal 2 is sucked, vane 1 is entered by pedestal 2, is then blown out from the air outlet of vane 1.
Partition 5 is made of heat-barrier material, and 4 lower section of impeller is located at, and apart from 10 centimetres to 50 centimetres of impeller, partition 5 is the bottom of by
2 points of seat are upper and lower two parts, and thickness is identical as the height of the semiconductor grain of semiconductor chilling plate 6 and has one or more
A rectangular aperture is for fixing semiconductor chilling plate 6.
Semiconductor chilling plate 6 is fixed in the opening of partition 5, and semiconductor chilling plate 6 is by many N-types and P-type semiconductor
Grain arranges mutually, and is connected with general conductor into a complete line, usually copper, aluminium or other metals between NP
Conductor is finally picked up as sandwich biscuits by two panels potsherd Lai, potsherd insulation and thermally conductive good.When electric current passes through, half
Heat transfer will be generated between two blocks of potsherds of conductor cooling piece 6, heat will be transferred to the other end from one end, to produce
The raw temperature difference forms hot and cold side.Semiconductor air conditioner fan includes one or more semiconductor chilling plates, when semiconductor chilling plate is multiple
When, cold and hot extreme direction is consistent.
The upper end of heat conduction fin 7 and semiconductor chilling plate 6 is thermally connected, and copper or aluminum metallic material is used to be made, including
Cylindrical body and the cooling fin connecting with cylindrical body, cylinder diameter size is identical as 6 side length of semiconductor chilling plate, and height is upwards
It extends to 4 lower section of impeller and does not influence the rotation of impeller 4, cooling fin is erect and is uniformly distributed on the cylinder.
Air inlet hole 8 is circle, is evenly distributed on 2 shell of pedestal between impeller 4 and partition 5.4 high-speed rotation of impeller
When, outside air enters pedestal 2 by air inlet hole 8 and carries out heat exchange with the cooling fin of heat conduction fin 7, reaches refrigeration or system
Then the purpose of hot-air passes through the effect of impeller 4, reach the entrance of vane 1.
Circuit board 9 is located in a region of air inlet pore size distribution, and circuit board 9 is by power supply and motor 3, semiconductor chilling plate 6
It is electrically connected.
Switch 10 is located in a region of air inlet pore size distribution and it is stirred button and is located on the shell, and switch 10 is for half-and-half
The working condition of conductor air cooler is selected: being closed, refrigeration, heating.When switch 10 is allocated to closed state, cut off the power,
Semiconductor air conditioner fan does not work；When switch 10 is allocated to refrigerating state, the N-type semiconductor of positive pole and semiconductor chilling plate 6
Connection, power cathode are connect with the P-type semiconductor of semiconductor chilling plate 6, the upper end refrigeration of semiconductor chilling plate 6, lower end heating,
The wind of semiconductor air conditioner fan blowout is cold wind；When switch 10 is allocated to heating state, power positive cathode direction changes, positive pole
It is connect with the P-type semiconductor of semiconductor chilling plate 6, power cathode is connect with the N-type semiconductor of semiconductor chilling plate 6, semiconductor
The upper end of cooling piece 6 heats, lower end refrigeration, and the wind of semiconductor air conditioner fan blowout is hot wind.
Heat pipe 11 is closed metal shell, is filled with suitable refrigerant for being pumped into after negative pressure inside it, and one end of pipe is to steam
Section is sent out, the other end is condensation segment, and when one end of heat pipe 11 is heated, refrigerant evaporation vaporization, gaseous coolant is flow under a slight pressure difference
Heat is released to the other end, regelation flows back to evaporator section by gravity at liquid, liquid, so recycles, heat is by heat pipe
11 one end reaches the other end.One end of heat pipe 11 and the lower end of semiconductor chilling plate 6 are thermally connected, and other end bending extends to system
Cold heating case 12, semiconductor air conditioner fan include multiple heat pipes 11.A part of 11 one end of heat pipe and the lower end of semiconductor chilling plate 6 heat
Connection, the other end extend to the bottom in hot storehouse 16；A part of 11 one end of heat pipe is connect with the lower end of semiconductor chilling plate 6, another
End extends to the top in cold storehouse 15.
Refrigerated medium hot tank 12 is cylindrical cabinet, external to coat insulation cladding, and internal cavity is divided by aluminium sheet or copper sheet
Three spaces: heat exchange chamber 14, cold storehouse 15, hot storehouse 16.Cold storehouse 15 is located at bottom, and the height at 15 top of cold storehouse is less than and partly leads
The height of body cooling piece 6, thus when one end of the cold the top of the warehouse 15 of connection of heat pipe 11 is heated, refrigerant evaporation is vaporized, gaseous coolant
One end to connection semiconductor chilling plate 6 is flow under a slight pressure difference, heat is released, regelation leans on gravity at liquid, liquid
Effect flows back to evaporator section and is back to the one end for connecting cold 15 top of storehouse, then proceedes to absorb heat, evaporate, condenses, reflux.Thus it completes
The refrigeration in cold storehouse 15.Since the density of cold air is high, it can deposit downwards, the transmitting of cooling capacity can be accelerated, make cold storehouse 15 rapidly
Temperature reduces.Heat exchange chamber 14 is located at centre, and hot storehouse 16 is located at the top, and the height of 16 bottom of hot storehouse is greater than semiconductor refrigerating
The height of piece 6.Thus when one end of the connection semiconductor chilling plate 6 of heat pipe 11 is heated, refrigerant evaporation vaporization, gaseous coolant is micro-
Flow direction connects the one end in hot storehouse 16 under small pressure difference, releases heat, and regelation flows back to evaporation by gravity at liquid, liquid
Section is back to the one end for connecting hot 16 bottom of storehouse, then proceedes to absorb heat, and evaporates, and condenses, reflux.Thus the system in hot storehouse 16 is completed
Heat.It since the density of hot gas is low, can be moved upward, hot 16 temperature of storehouse can be made rapidly to increase with the transmitting of accelerated heat.
Refrigerated medium hot tank insulation cladding 13 is made of thermal insulation material, coats the outer surface of refrigerated medium hot tank 13.
Heat exchange chamber 14 extends to the part of refrigerated medium hot tank 12 to accommodate heat pipe 11.Cold 15 inner wall of storehouse be aluminium, copper or
The good metal of other thermal conductivity of person is made.Hot 16 inner wall of storehouse is made of aluminium, copper or the good metal of other thermal conductivity.Cold storehouse
There is door can place an article within from cold door 17 when needing to freeze for 15 sides.There is warehouse lid, when need at the top of hot storehouse 16
When heating, it can be placed an article within from hot warehouse lid 18.
It when switch 10 is allocated to closed state, cuts off the power, semiconductor air conditioner fan does not work, the also not work of refrigerated medium hot tank 12
Make；When switch 10 is allocated to refrigerating state, the wind of semiconductor air conditioner fan blowout is cold wind, and the hot storehouse of refrigerated medium hot tank 12 starts work
Make；When switch 10 is allocated to heating state, the wind of semiconductor air conditioner fan blowout is hot wind, and the cold storehouse of refrigerated medium hot tank 12 starts work
Make.
The crucial problem of semiconductor chilling plate 6 is to conduct the cooling capacity at its both ends or heat sufficiently, could improve partly
The working efficiency of conductor cooling piece 6, the present invention quickly conducts cooling capacity or heat by connecting heat pipe in one end, and will lead
Cooling capacity or heat out makes full use of, and has not only improved the working efficiency of semiconductor chilling plate 6, but also improves the use effect of the energy
Rate.
The above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof；Although referring to preferred embodiment pair
The present invention is described in detail, it should be understood by those ordinary skilled in the art that: still can be to of the invention specific
Embodiment is modified or some technical features can be equivalently replaced；Without departing from the spirit of the technical scheme of the invention,
It should all cover within the scope of the technical scheme claimed by the invention.
Claims (10)
1. a kind of semiconductor air conditioner fan, comprising: vane, pedestal, motor, impeller, partition, semiconductor chilling plate, heat conduction fin,
Air inlet hole, circuit board, switch, heat pipe, refrigerated medium hot tank, refrigerated medium hot tank insulation cladding, heat exchange chamber, cold storehouse, hot storehouse, cold storehouse
Door, hot warehouse lid, clump weight；The heat pipe is closed metal shell, is filled with suitable refrigerant for being pumped into after negative pressure inside it, is managed
One end be evaporator section, the other end is condensation segment, and when one end of heat pipe is heated, refrigerant evaporation vaporization, gaseous coolant is small
The other end is flowed under pressure difference and releases heat, and regelation flows back to evaporator section by gravity at liquid, liquid, so recycles, heat
Amount is from one end of the heat pipe to the other end；One end of heat pipe and the lower end of semiconductor chilling plate are thermally connected, and other end bending extends
To refrigerated medium hot tank, semiconductor air conditioner fan includes multiple heat pipes；The refrigerated medium hot tank is cylindrical cabinet, external cladding
Insulation cladding, internal cavity are divided into three spaces: heat exchange chamber by aluminium sheet or copper sheet, cold storehouse, hot storehouse, cold position in storehouse in bottom, and
The height of cold the top of the warehouse is less than the height of semiconductor chilling plate, and heat exchange chamber is located at centre, and hot position in storehouse is in the top, and hot orlop
The height in portion is greater than the height of semiconductor chilling plate；A part of heat pipe one end and the lower end of semiconductor chilling plate are thermally connected, another
End extends to the bottom in hot storehouse；A part of heat pipe one end and the lower end of semiconductor chilling plate connect, and the other end extends to cold storehouse
Top；The refrigerated medium hot tank insulation cladding is made of thermal insulation material, coats the outer surface of refrigerated medium hot tank.
2. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the vane is annular comprising is gone out
Solar or lunar halo front cover and air outlet ring rear cover, air outlet ring front cover connect to form vane inner cavity with air outlet ring rear cover, and vane inner cavity and pedestal connect
Logical, vane inner cavity is greater than the width of the side far from air outlet close to the width of air outlet side, and air outlet ring front cover is by interior outlet air
Piece and outer outlet air piece composition, interior outlet air piece and outer outlet air piece form air outlet, friendship of the air outlet along interior outlet air piece and outer outlet air piece
Extend at boundary and width is 0.5 to 3 millimeter.
3. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the pedestal is cylinder, with wind
The connection of ring inner cavity and bottom are provided with the clump weight for increasing pedestal weight, and the motor is brushless motor, and shaft is downward and and leaf
Wheel connection, revolving speed per minute are 1000 to 10000 turns.
4. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the impeller is drum-type impeller,
Under the drive of motor, external air is sucked pedestal, enters vane by pedestal by impeller high-speed rotation.
5. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the partition uses heat-barrier material system
At below impeller, apart from 10 centimetres to 50 centimetres of impeller, pedestal is divided into two parts up and down, thickness and half by partition
The height of the semiconductor grain of conductor cooling piece is identical and has one or more rectangular apertures for fixing semiconductor chilling plate.
6. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the semiconductor chilling plate be fixed on every
In the opening of plate, semiconductor chilling plate is arranged mutually by multiple N-types and P-type semiconductor particle.
7. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the heat conduction fin and semiconductor system
Cold upper end is thermally connected, and copper or aluminum metallic material is used to be made, including cylindrical body and the cooling fin connecting with cylinder, circle
Column diameter size is identical as semiconductor chilling plate side length, highly extends upwardly to below impeller and does not influence wheel rotation, dissipates
Backing is erect and is uniformly distributed on the cylinder；The air inlet hole is circle, the pedestal being evenly distributed between impeller and partition
On shell.
8. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the circuit board is located at air inlet pore size distribution
A region in, power supply and motor, semiconductor chilling plate are electrically connected by circuit board；The switch is located at air inlet pore size distribution
A region in and its stir button and be located on the shell, switch selected for the working condition to semiconductor air cooler:
It closes, refrigeration, heating.
9. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the heat conduction fin and semiconductor system
Cold upper end is thermally connected, and copper or aluminum metallic material is used to be made, including cylindrical body and the cooling fin connecting with cylinder, circle
Column diameter size is identical as semiconductor chilling plate side length, highly extends upwardly to below impeller and does not influence wheel rotation, dissipates
Backing is erect and is uniformly distributed on the cylinder；The air inlet hole is circle, the pedestal being evenly distributed between impeller and partition
On shell.
10. a kind of semiconductor air conditioner fan according to claim 1, which is characterized in that the heat exchange chamber is to accommodate heat
Pipe extends to the part of refrigerated medium hot tank, and the cold storehouse inner wall is made of aluminium, copper or the good metal of other thermal conductivity, described
Hot storehouse inner wall is made of aluminium, copper or the good metal of other thermal conductivity, and the hot the top of the warehouse has warehouse lid, when needing to heat
When, it can be placed an article within from hot warehouse lid, the side Leng Cang has door, can be from cold door by object when needing to freeze
Product are put into.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910479170.5A CN110068090A (en) | 2019-06-03 | 2019-06-03 | A kind of novel semi-conductor air cooler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910479170.5A CN110068090A (en) | 2019-06-03 | 2019-06-03 | A kind of novel semi-conductor air cooler |
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| CN110068090A true CN110068090A (en) | 2019-07-30 |
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| CN201910479170.5A Pending CN110068090A (en) | 2019-06-03 | 2019-06-03 | A kind of novel semi-conductor air cooler |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110645657A (en) * | 2019-10-21 | 2020-01-03 | 大同新成新材料股份有限公司 | Adjustable semiconductor intelligent refrigeration equipment and use method thereof |
| CN111766928A (en) * | 2020-07-06 | 2020-10-13 | 惠州市五荣五金电子有限公司 | Bladeless computer radiator |
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| CN111766928A (en) * | 2020-07-06 | 2020-10-13 | 惠州市五荣五金电子有限公司 | Bladeless computer radiator |
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