CN212081510U - Semiconductor refrigeration fan - Google Patents
Semiconductor refrigeration fan Download PDFInfo
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- CN212081510U CN212081510U CN201920795632.XU CN201920795632U CN212081510U CN 212081510 U CN212081510 U CN 212081510U CN 201920795632 U CN201920795632 U CN 201920795632U CN 212081510 U CN212081510 U CN 212081510U
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Abstract
The utility model relates to a semiconductor refrigeration fan, include: the device comprises a mesh enclosure, fan blades, a rotor, a motor, a semiconductor refrigerating sheet, a heat conducting pipe, a hot bin cover, an upright post, a circuit board, a switch, a balancing weight and a base. The heat pipe is connected to one end of the semiconductor refrigeration piece to conduct heat quickly, and the conducted heat is fully utilized, so that the working efficiency of the semiconductor refrigeration piece is improved, and the using efficiency of energy is improved.
Description
Technical Field
The utility model relates to a semiconductor refrigeration fan.
Background
The traditional electric fan generates air flow through electric drive, blades rotate to accelerate air circulation, and the electric fan mainly comprises a fan head, the blades, a mesh enclosure, a control device and the like. The fan head comprises a motor, front and rear end covers, a head-shaking air supply mechanism and the like. The main components of the electric fan are: an AC motor. The working principle is as follows: the electrified coil is forced to rotate in the magnetic field. The electric energy of the traditional electric fan is converted into mechanical energy, and meanwhile, because of the resistance of the coil, a part of the electric energy is inevitably converted into heat energy. When the traditional electric fan works, because current passes through a coil of the electric fan and a lead is provided with resistance, heat is inevitably generated and is radiated outwards, the temperature is increased, and the air temperature cannot be reduced. Therefore, it is necessary to provide a semiconductor fan capable of cooling.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's is not enough, provide a neotype can refrigerate, the efficiency is high, convenient to use safety's multi-functional semiconductor refrigeration fan.
In order to solve the above problem, the utility model discloses a technical scheme be: a semiconductor refrigeration fan, comprising: the device comprises a mesh enclosure, fan blades, a rotor, a motor, a semiconductor refrigerating sheet, a heat conducting pipe, a hot bin cover, an upright post, a circuit board, a switch, a balancing weight and a base.
The mesh enclosure is formed by bending and combining single heat pipes, one end of each single heat pipe is connected to the upper part of the semiconductor refrigerating sheet, the other end of each single heat pipe is connected to the lower part of the semiconductor refrigerating sheet after being bent, and all the heat pipes are crossed at the position of the center of a circle in the front of the mesh enclosure; the heat pipe is a heat transfer element with extremely high heat conduction performance, heat is transferred through evaporation and condensation of liquid in the totally-enclosed vacuum pipe, and the heat quantity and the speed of the heat pipe can be hundreds times of those of metals such as silver, copper and the like.
The rotation of the fan blades forms airflow to realize the cold energy transmission between air and the heat exchange mesh enclosure, so that cool air is blown out.
The rotor is connected with one end and the fan blade, the other end is connected with the motor, and the rotation of the rotor drives the fan blade to rotate.
The motor shaft faces left and is connected with the rotor, and the rotation speed per minute is 1000 to 10000 revolutions.
The semiconductor refrigerating sheet is fixed above the rear part of the mesh enclosure, the semiconductor refrigerating sheet is formed by mutually arranging a plurality of N-type and P-type semiconductor particles, NPs are connected with each other by common conductors to form a complete circuit, usually copper, aluminum or other metal conductors, and finally two ceramic sheets are clamped together like a sandwich biscuit, and are insulated and have good heat conduction. When the current passes through, heat transfer can be generated between the two ceramic plates of the semiconductor refrigerating plate, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor refrigeration fan contains one or more semiconductor refrigeration piece, and when the refrigeration piece is a plurality of, its cold and hot end direction keeps unanimous.
The heat conducting pipe is a closed metal shell, the interior of the heat conducting pipe is pumped into negative pressure and then filled with a proper amount of refrigerant, one end of the pipe is an evaporation section, the other end of the pipe is a condensation section, when one end of the heat conducting pipe is heated, the refrigerant is evaporated and vaporized, gaseous refrigerant flows to the other end under small pressure difference to emit heat and is condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity, and the circulation is carried out, so that the heat is transferred from one end of the heat conducting pipe to the other. One end of the heat conduction pipe is thermally connected with the lower end of the semiconductor refrigeration piece, the other end of the heat conduction pipe is bent and extends to the hot bin, and the semiconductor refrigeration fan comprises a plurality of heat conduction pipes.
The inner wall of the hot bin is made of aluminum, copper or other metal with good heat conductivity.
The hot bin top is provided with a hot bin cover, and when heating is needed, articles can be put in from the hot bin cover.
The upright post is formed by combining double cylinders, and the bottom of the upright post is connected with the base.
The circuit board is located in an area where the air inlet holes are distributed, and the circuit board is used for electrically connecting the power supply with the motor and the semiconductor refrigerating sheet.
The switch is located an area that the fresh air inlet distributes and its toggle button is located the shell, and the switch is used for selecting to semiconductor refrigeration fan's operating condition: and closing and working. When the switch is turned to the off state, the power supply is cut off, and the semiconductor refrigeration fan does not work; when the switch is switched to a working state, the positive pole of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating piece, the negative pole of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating piece, the left end of the semiconductor refrigerating piece is used for refrigerating, and air blown out by the semiconductor refrigerating fan is cold air.
The balancing weight is made of high-density metal and is positioned at the bottom of the upright column and used for lowering the gravity center of the semiconductor refrigeration fan.
The base is in a short cylindrical shape and is connected with the stand column and used for keeping the semiconductor cooling fan vertical.
The utility model adopts the beneficial effect that above technical scheme compares with prior art is: the semiconductor refrigeration fan can refrigerate, and can conduct heat on the other side to the hot bin by the heat conduction pipe for use, so that energy can be fully utilized.
Drawings
Fig. 1 is a structural diagram of the semiconductor cooling fan of the present invention.
Wherein, 1-mesh enclosure, 2-fan blade, 3-rotor, 4-motor, 5-semiconductor refrigeration piece, 6-heat pipe, 7-hot bin, 8-hot bin cover, 9-upright post, 10-circuit board, 11-switch, 12-counterweight block, 13-base.
Detailed Description
As shown in fig. 1, a semiconductor cooling fan includes: the device comprises a mesh enclosure 1, fan blades 2, a rotor 3, a motor 4, a semiconductor refrigerating sheet 5, a heat conduction pipe 6, a hot bin 7, a hot bin cover 8, an upright column 9, a circuit board 10, a switch 11, a balancing weight 12 and a base 13.
The mesh enclosure 1 is formed by bending and combining single heat pipes, one end of each single heat pipe is connected to the upper part of the semiconductor refrigerating sheet 5, the other end of each single heat pipe is connected to the lower part of the semiconductor refrigerating sheet 5 after being bent, and all the heat pipes are crossed at the position of the center of a circle in the front part of the mesh enclosure 1; the heat pipe is a heat transfer element with extremely high heat conduction performance, heat is transferred through evaporation and condensation of liquid in the totally-enclosed vacuum pipe, and the heat quantity and the speed of the heat pipe can be hundreds times of those of metals such as silver, copper and the like.
The rotation of the fan blade 2 forms airflow to realize the cold energy transmission between the air and the heat exchange mesh enclosure 1, thereby blowing out cool air.
The rotor 3 is connected with the fan blade 2 with one end, and the other end is connected with the motor 4, drives the rotation of fan blade 2 through the rotation of rotor 3.
The rotating shaft of the motor 4 faces to the left and is connected with the rotor 3, and the rotating speed per minute is 1000-10000 revolutions.
The semiconductor refrigeration piece 5 is fixed on the rear upper part of the mesh enclosure 1, the semiconductor refrigeration piece 5 is formed by mutually arranging a plurality of N-type and P-type semiconductor particles, NP is connected with a common conductor to form a complete circuit, usually copper, aluminum or other metal conductors, and finally two ceramic pieces are clamped like a sandwich biscuit, and the ceramic pieces are insulated and have good heat conduction. When the current passes through, heat transfer can be generated between the two ceramic plates of the semiconductor refrigerating plate 5, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor refrigeration fan comprises one or more semiconductor refrigeration pieces 5, and when the refrigeration pieces are multiple, the directions of the cold end and the hot end of the refrigeration pieces are kept consistent.
The heat conducting pipe 6 is a closed metal shell, the interior of the heat conducting pipe is pumped into negative pressure and then filled with a proper amount of refrigerant, one end of the pipe is an evaporation section, the other end of the pipe is a condensation section, when one end of the heat conducting pipe 6 is heated, the refrigerant is evaporated and vaporized, gaseous refrigerant flows to the other end under a small pressure difference to emit heat and is condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity, and the circulation is carried out, so that the heat is transferred from one end of the heat conducting pipe 6 to. One end of the heat conduction pipe 6 is thermally connected with the lower end of the semiconductor refrigeration sheet 5, the other end of the heat conduction pipe is bent and extends to the hot bin 7, and the semiconductor refrigeration fan comprises a plurality of heat conduction pipes 6.
The inner wall of the hot bin 7 is made of aluminum, copper or other metal with good thermal conductivity. The hot bin 7 is positioned at the top, and the height of the bottom of the hot bin 7 is greater than that of the semiconductor refrigerating sheet 5. Therefore, when one end of the heat conduction pipe 6, which is connected with the semiconductor refrigerating sheet 5, is heated, the refrigerant is evaporated and vaporized, the gaseous refrigerant flows to one end of the heat bin 7 under a small pressure difference, the heat is released and condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity and returns to one end of the bottom of the heat bin 7, and then the heat absorption, evaporation, condensation and backflow are continuously performed. Thereby completing the heating of the hot bin 7. Since the hot gas has a low density and moves upward, the transfer of heat can be accelerated, and the temperature of the hot bin 7 can be rapidly increased.
The top of the hot bin 7 is provided with a hot bin cover 8, and when heating is needed, articles can be put in from the hot bin cover 8.
The upright post 9 is formed by combining double cylinders, and the bottom of the upright post is connected with a base 13.
The circuit board 10 is located in an area where the air inlet holes are distributed, and the circuit board 10 is used for electrically connecting a power supply with the motor 4 and the semiconductor refrigerating sheet 5.
Switch 11 is located an area that the fresh air inlet distributes and its toggle button is located the shell, and switch 11 is used for selecting the operating condition of semiconductor refrigeration fan: and closing and working. When the switch 11 is turned off, the power supply is cut off, and the semiconductor refrigeration fan does not work; when the switch 11 is turned to the working state, the positive pole of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating sheet 5, the negative pole of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating sheet 5, the left end of the semiconductor refrigerating sheet 5 refrigerates, and air blown out by the semiconductor refrigerating fan is cold air.
The balancing weight 12 is made of high-density metal and is positioned at the bottom of the upright post 9 for lowering the gravity center of the semiconductor refrigeration fan.
The base 13 is in a short cylindrical shape, and the base 13 is connected with the upright post 9 and used for keeping the semiconductor cooling fan upright.
When the switch 11 is turned off, the power supply is cut off, the semiconductor refrigeration fan does not work, and the hot bin 7 does not work; when the switch 11 is switched to the cooling state, the air blown out by the semiconductor cooling fan is cold air, and the hot bin 7 starts to work.
The critical problem of semiconductor refrigeration piece lies in making the cold volume or the abundant conduction of heat at its both ends, just can improve the work efficiency of semiconductor refrigeration piece, the utility model discloses a connect the heat pipe at its one end and conduct the heat fast to will derive heat make full use of, improved the work efficiency of semiconductor refrigeration piece promptly, improved the availability factor of the energy again.
The above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
Claims (7)
1. A semiconductor refrigeration fan, comprising: the device comprises a mesh enclosure, fan blades, a rotor, a motor, a semiconductor refrigerating sheet, a heat conducting pipe, a hot bin cover, an upright post, a circuit board, a switch, a balancing weight and a base; the mesh enclosure is formed by bending and combining single heat pipes, one end of each single heat pipe is connected to the upper part of the semiconductor refrigerating sheet, the other end of each single heat pipe is connected to the lower part of the semiconductor refrigerating sheet after being bent, and all the heat pipes are crossed at the position of the center of a circle in the front of the mesh enclosure; the rotation of the fan blades forms airflow to realize the cold energy transmission between air and the heat exchange mesh enclosure, so that cool air is blown out; the rotor is connected with one end of the fan blade, the other end of the rotor is connected with the motor, and the fan blade is driven to rotate through the rotation of the rotor; the rotating shaft of the motor faces the left and is connected with the rotor, and the rotating speed per minute is 1000-10000 revolutions; the semiconductor refrigeration piece is fixed on the rear upper part of the mesh enclosure, the semiconductor refrigeration piece is formed by mutually arranging a plurality of N-type and P-type semiconductor particles, the semiconductor refrigeration fan comprises one or more semiconductor refrigeration pieces, and when the number of the refrigeration pieces is multiple, the directions of the cold end and the hot end of the refrigeration piece are kept consistent.
2. The semiconductor refrigeration fan as claimed in claim 1, wherein the heat pipe is a closed metal casing, the inside of the heat pipe is pumped to a negative pressure and then filled with a proper amount of refrigerant, one end of the heat pipe is thermally connected to the lower end of the semiconductor refrigeration sheet, the other end of the heat pipe is bent and extended to the heat chamber, and the semiconductor refrigeration fan comprises a plurality of heat pipes.
3. A semiconductor cooling fan according to claim 2, wherein the inner wall of the hot box is made of aluminum, copper or other metal with good thermal conductivity; the hot bin top is provided with a hot bin cover, and when heating is needed, articles can be put in from the hot bin cover.
4. The semiconductor refrigeration fan as claimed in claim 3, wherein the column is formed by combining double cylinders, and the bottom of the column is connected with the base; the circuit board is located in an area of the upright post and electrically connects the power supply with the motor and the semiconductor refrigerating sheet.
5. A semiconductor cooling fan according to claim 4, wherein the switch is located in a region of the column and the toggle button thereof is located on the housing, the switch being adapted to select an operating state of the semiconductor cooling fan: and closing and working.
6. The semiconductor cooling fan of claim 5, wherein the weight block is made of high-density metal and is located at the bottom of the column to lower the center of gravity of the semiconductor cooling fan.
7. The semiconductor cooling fan according to claim 6, wherein the base is in a shape of a short cylinder, and the base is connected with a pillar for keeping the semiconductor cooling fan upright.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920795632.XU CN212081510U (en) | 2019-05-29 | 2019-05-29 | Semiconductor refrigeration fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920795632.XU CN212081510U (en) | 2019-05-29 | 2019-05-29 | Semiconductor refrigeration fan |
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| Publication Number | Publication Date |
|---|---|
| CN212081510U true CN212081510U (en) | 2020-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920795632.XU Active CN212081510U (en) | 2019-05-29 | 2019-05-29 | Semiconductor refrigeration fan |
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| CN (1) | CN212081510U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110094816A (en) * | 2019-05-29 | 2019-08-06 | 湖北经济学院 | A kind of semiconductor refrigerating fan |
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2019
- 2019-05-29 CN CN201920795632.XU patent/CN212081510U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110094816A (en) * | 2019-05-29 | 2019-08-06 | 湖北经济学院 | A kind of semiconductor refrigerating fan |
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