CN210179814U - Novel semiconductor air-conditioning fan - Google Patents
Novel semiconductor air-conditioning fan Download PDFInfo
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- CN210179814U CN210179814U CN201920828391.4U CN201920828391U CN210179814U CN 210179814 U CN210179814 U CN 210179814U CN 201920828391 U CN201920828391 U CN 201920828391U CN 210179814 U CN210179814 U CN 210179814U
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Abstract
The utility model relates to a novel semiconductor air conditioner fan, include: the method comprises the following steps: the air ring, the base, the motor, the impeller, the baffle, the semiconductor refrigeration piece, heat-conduction fin, the fresh air inlet, the circuit board, the switch, the heat pipe, the case that heats refrigerates, the case heat preservation shell that heats refrigerates, the heat exchange chamber, cold storehouse, hot storehouse, cold storehouse door, hot storehouse lid, the balancing weight. The heat pipe is connected to one end of the semiconductor refrigeration piece to conduct cold or heat quickly, and the conducted cold or heat is fully utilized, so that the working efficiency of the semiconductor refrigeration piece is improved, and the use efficiency of energy is improved.
Description
Technical Field
The utility model relates to a novel semiconductor air cooler.
Background
The traditional electric fan generates air flow through electric drive, blades rotate to accelerate air circulation, and the electric fan mainly comprises a fan head, the blades, a mesh enclosure, a control device and the like. The fan head comprises a motor, front and rear end covers, a head-shaking air supply mechanism and the like. The main components of the electric fan are: an AC motor. The working principle is as follows: the electrified coil is forced to rotate in the magnetic field. The electric energy of the traditional electric fan is converted into mechanical energy, and meanwhile, because of the resistance of the coil, a part of the electric energy is inevitably converted into heat energy. When the traditional electric fan works, because current passes through a coil of the electric fan and a lead is provided with resistance, heat is inevitably generated and is radiated outwards, the temperature is increased, and the air temperature cannot be reduced. In addition, the traditional fan is caused to flow by cutting air by the blades, so that people feel impact and stimulation, and the comfort is poor; in addition, the blades are easily covered with dust and are inconvenient to clean.
In recent years, bladeless fans have been developed rapidly, but they can only flow air, and cannot provide significant and continuous cold air below room temperature or significant and continuous hot air above room temperature, and in addition, their energy sources are not fully utilized, and their energy efficiency is low. Therefore, it is necessary to provide a novel multifunctional air conditioning fan which can perform cooling and heating, has high energy efficiency, and is convenient and safe to use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's not enough, provide a neotype can refrigerate and heat, the efficiency is high, convenient to use safety's multi-functional semiconductor air cooler.
In order to solve the above problem, the utility model discloses a technical scheme be: a semiconductor air conditioning fan, comprising: the air ring, the base, the motor, the impeller, the baffle, the semiconductor refrigeration piece, heat-conduction fin, the fresh air inlet, the circuit board, the switch, the heat pipe, the case that heats refrigerates, the case heat preservation shell that heats refrigerates, the heat exchange chamber, cold storehouse, hot storehouse, cold storehouse door, hot storehouse lid, the balancing weight.
The wind ring is the annular, and it includes lid behind wind ring protecgulum and the wind ring, and wind ring inner chamber is formed in the lid connection behind wind ring protecgulum and the wind ring, wind ring inner chamber and base intercommunication, and the width that the wind ring inner chamber is close to air outlet one side is greater than the width of keeping away from one side of air outlet, and wind ring protecgulum comprises interior wind piece and the wind piece of going out, and interior wind piece forms the air outlet with the wind piece of going out, and the air outlet extends and the width is 0.5 to 3 millimeters along interior wind piece and the juncture of the wind piece of going out.
The base is cylindrical, and it is provided with the balancing weight that increases base weight with wind ring inner chamber intercommunication and bottom.
The motor is brushless motor, and the pivot is down and be connected with the impeller, and the per minute rotational speed is 1000 to 10000 commentaries on classics.
The impeller is a drum-type impeller, and under the driving of the motor, the impeller rotates at a high speed to suck external air into the base and enter the wind ring from the base.
The base is divided into an upper part and a lower part by the partition board, the thickness of the base is the same as the height of semiconductor particles of the semiconductor refrigerating piece, and the base is provided with one or more rectangular openings for fixing the semiconductor refrigerating piece.
The semiconductor refrigerating plate is fixed in the opening of the partition plate, the semiconductor refrigerating plate is formed by mutually arranging a plurality of N-type and P-type semiconductor particles, NPs are connected with each other by a common conductor to form a complete circuit, usually copper, aluminum or other metal conductors, and finally two ceramic plates are clamped together like a sandwich biscuit, and are insulated and have good heat conduction. When the current passes through, heat transfer can be generated between the two ceramic plates of the semiconductor refrigerating plate, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor air-conditioning fan comprises one or more semiconductor refrigerating pieces, and when the number of the refrigerating pieces is multiple, the directions of the cold end and the hot end of the refrigerating pieces are kept consistent.
The heat conduction fins are thermally connected with the upper ends of the semiconductor refrigeration pieces and are made of copper or aluminum metal materials, the heat conduction fins comprise cylinders and heat radiating fins connected with the cylinders, the diameter of each cylinder is as large as the side length of each semiconductor refrigeration piece, the height of each cylinder extends upwards to the position below the corresponding impeller without influencing the rotation of the corresponding impeller, and the heat radiating fins are vertically and uniformly distributed on the cylinders.
The air inlet is circular and is uniformly distributed on the base shell between the impeller and the partition plate. When the impeller rotates at a high speed, external air enters the base through the air inlet hole.
The circuit board is located in an area where the air inlet holes are distributed, and the circuit board is used for electrically connecting the power supply with the motor and the semiconductor refrigerating sheet.
The switch is located an area that the fresh air inlet distributes and its toggle button is located the shell, and the switch is used for selecting to the operating condition of semiconductor air conditioner fan: closing, refrigerating and heating. When the switch is turned off, the power supply is cut off, and the semiconductor air-conditioning fan does not work; when the switch is switched to a refrigerating state, the positive pole of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating piece, the negative pole of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating piece, the upper end of the semiconductor refrigerating piece refrigerates, the lower end of the semiconductor refrigerating piece heats, and air blown out by the semiconductor air conditioning fan is cold air; when the switch is switched to a heating state, the directions of the anode and the cathode of the power supply are changed, the anode of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating sheet, the cathode of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating sheet, the upper end of the semiconductor refrigerating sheet heats, the lower end of the semiconductor refrigerating sheet refrigerates, and air blown out by the semiconductor air conditioning fan is hot air.
The heat pipe is a closed metal shell, the interior of the heat pipe is pumped into negative pressure and then filled with a proper amount of refrigerant, one end of the heat pipe is an evaporation section, the other end of the heat pipe is a condensation section, when one end of the heat pipe is heated, the refrigerant is evaporated and vaporized, gaseous refrigerant flows to the other end under a small pressure difference to release heat and is condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity, and the circulation is carried out, so that the heat is transferred from one end of the heat pipe to the other end. One end of the heat pipe is thermally connected with the lower end of the semiconductor refrigerating piece, the other end of the heat pipe is bent and extends to the refrigerating and heating box, and the semiconductor air-conditioning fan comprises a plurality of heat pipes.
The refrigeration and heating box is a cylindrical box body, the outer part of the box body is coated with a heat preservation shell, and the inner cavity is divided into three spaces by an aluminum plate or a copper plate: the heat exchange chamber, cold storehouse, hot storehouse, cold storehouse are located the below, and the height that highly is less than the semiconductor refrigeration piece at cold storehouse top, and the heat exchange chamber is located the centre, and hot storehouse is located the top, and the height that highly is greater than the semiconductor refrigeration piece of hot storehouse bottom. One end of one part of heat pipe is thermally connected with the lower end of the semiconductor refrigerating sheet, and the other end of the heat pipe extends to the bottom of the hot bin; one end of a part of heat pipes is connected with the lower end of the semiconductor refrigerating sheet, and the other end of the heat pipes extends to the top of the cold bin.
The heat preservation shell of the refrigerating and heating box is made of heat preservation materials and covers the outer surface of the refrigerating and heating box.
The heat exchange cavity is used for accommodating the part of the heat pipe extending to the refrigerating and heating box.
The inner wall of the cold bin is made of aluminum, copper or other metal with good heat conductivity.
The inner wall of the hot bin is made of aluminum, copper or other metal with good heat conductivity.
The top of the hot bin is provided with a bin cover, and when heating is needed, articles can be put in from the hot bin cover.
The utility model adopts the beneficial effect that above technical scheme compares with prior art is: the semiconductor air-conditioning fan can refrigerate and heat; the heat or the cold on the other side is conducted to the refrigerating and heating box by the heat pipe, so that the energy can be fully utilized.
Drawings
Fig. 1 is a structural diagram of the semiconductor air conditioner fan of the present invention.
The device comprises an air ring 1, a base 2, a motor 3, an impeller 4, a partition plate 5, a semiconductor refrigerating sheet 6, a heat conduction fin 7, an air inlet 8, a circuit board 9, a switch 10, a heat pipe 11, a refrigerating and heating box 12, a refrigerating and heating box heat preservation shell 13, a heat exchange cavity 14, a cold bin 15, a hot bin 16, a cold bin door 17, a hot bin cover 18 and a balancing weight 19.
Detailed Description
As shown in fig. 1, a semiconductor air conditioner fan includes: the air ring comprises an air ring 1, a base 2, a motor 3, an impeller 4, a partition plate 5, a semiconductor refrigerating sheet 6, a heat conduction fin 7, an air inlet 8, a circuit board 9, a switch 10, a heat pipe 11, a refrigerating and heating box 12, a refrigerating and heating box heat preservation shell 13, a heat exchange cavity 14, a cold bin 15, a hot bin 16, a cold bin door 17, a hot bin cover 18 and a balancing weight 19.
The base 2 is cylindrical, and base 2 and the intercommunication of 1 inner chamber of wind ring, and its bottom is provided with the balancing weight 19 that increases base 2 weight, prevents that air cooler focus is unstable, takes place to empty.
The motor 3 is a brushless motor, the rotating shaft faces downwards and is connected with the impeller 4, and the rotating speed per minute is 1000-10000 revolutions.
The impeller 4 is a drum-type impeller 4, and under the driving of the motor 3, the impeller 4 rotates at a high speed, so that external air is sucked into the base 2 from the air inlet hole, enters the air ring 1 from the base 2, and is blown out from the air outlet of the air ring 1.
The partition plate 5 is made of heat insulating materials and is located below the impeller 4 and 10 cm-50 cm away from the impeller, the base 2 is divided into an upper part and a lower part by the partition plate 5, the thickness of the partition plate is the same as the height of semiconductor particles of the semiconductor chilling plate 6, and one or more rectangular openings are formed in the partition plate for fixing the semiconductor chilling plate 6.
The semiconductor refrigerating plate 6 is fixed in the opening of the clapboard 5, the semiconductor refrigerating plate 6 is formed by arranging a plurality of N-type and P-type semiconductor particles, NP is connected with a common conductor to form a complete circuit, usually copper, aluminum or other metal conductors, and finally two ceramic plates are clamped like sandwich biscuits and are insulated and have good heat conduction. When the current passes through, heat transfer can be generated between the two ceramic plates of the semiconductor refrigerating plate 6, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor air-conditioning fan comprises one or more semiconductor refrigerating sheets, and when the number of the semiconductor refrigerating sheets is multiple, the directions of the cold end and the hot end of the semiconductor refrigerating sheets are kept consistent.
The heat conduction fins 7 are thermally connected with the upper ends of the semiconductor refrigeration pieces 6, are made of copper or aluminum metal materials, and comprise cylinders and radiating fins connected with the cylinders, the diameter of each cylinder is as large as the side length of each semiconductor refrigeration piece 6, the height of each cylinder extends upwards to the position below the impeller 4 without influencing the rotation of the impeller 4, and the radiating fins are vertically and uniformly distributed on the cylinders.
The air inlet holes 8 are circular and are uniformly distributed on the shell of the base 2 between the impeller 4 and the partition plate 5. When the impeller 4 rotates at a high speed, external air enters the base 2 through the air inlet 8 and exchanges heat with the radiating fins of the heat conduction fins 7 to achieve the purpose of refrigerating or heating the air, and then reaches the inlet of the air ring 1 through the action of the impeller 4.
The circuit board 9 is located in an area where the air inlet holes are distributed, and the circuit board 9 is used for electrically connecting a power supply with the motor 3 and the semiconductor refrigerating sheet 6.
Switch 10 is located an area that the fresh air inlet distributes and its toggle button is located the shell, and switch 10 is used for selecting the operating condition of semiconductor air conditioner fan: closing, refrigerating and heating. When the switch 10 is turned off, the power supply is cut off, and the semiconductor air-conditioning fan does not work; when the switch 10 is switched to a refrigerating state, the positive pole of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating sheet 6, the negative pole of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating sheet 6, the upper end of the semiconductor refrigerating sheet 6 refrigerates, the lower end of the semiconductor refrigerating sheet 6 heats, and air blown out by the semiconductor air conditioning fan is cold air; when the switch 10 is switched to a heating state, the directions of the anode and the cathode of the power supply are changed, the anode of the power supply is connected with the P-type semiconductor of the semiconductor refrigerating sheet 6, the cathode of the power supply is connected with the N-type semiconductor of the semiconductor refrigerating sheet 6, the upper end of the semiconductor refrigerating sheet 6 heats, the lower end of the semiconductor refrigerating sheet refrigerates, and air blown out by the semiconductor air conditioning fan is hot air.
The heat pipe 11 is a closed metal shell, the interior of the heat pipe is pumped into negative pressure and then filled with a proper amount of refrigerant, one end of the pipe is an evaporation section, the other end of the pipe is a condensation section, when one end of the heat pipe 11 is heated, the refrigerant evaporates and vaporizes, gaseous refrigerant flows to the other end under a small pressure difference to release heat and condenses into liquid again, the liquid flows back to the evaporation section under the action of gravity, and the circulation is carried out, so that the heat is transferred from one end of the heat pipe 11 to the other end. One end of the heat pipe 11 is thermally connected with the lower end of the semiconductor refrigerating sheet 6, the other end of the heat pipe is bent and extends to the refrigerating and heating box 12, and the semiconductor air-conditioning fan comprises a plurality of heat pipes 11. One end of one part of the heat pipe 11 is thermally connected with the lower end of the semiconductor refrigerating sheet 6, and the other end extends to the bottom of the hot bin 16; one end of a part of heat pipes 11 is connected with the lower end of the semiconductor refrigeration sheet 6, and the other end extends to the top of the cold bin 15.
The refrigeration and heating box 12 is a cylindrical box body, an external cladding heat preservation shell of the box body, and an internal cavity is divided into three spaces by an aluminum plate or a copper plate: a heat exchange cavity 14, a cold bin 15 and a hot bin 16. The cold bin 15 is located at the lowest part, and the height of the top of the cold bin 15 is smaller than that of the semiconductor refrigerating sheet 6, so that when one end of the heat pipe 11 connected with the top of the cold bin 15 is heated, the refrigerant is evaporated and vaporized, the gaseous refrigerant flows to one end connected with the semiconductor refrigerating sheet 6 under a small pressure difference, heat is released and is condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity and returns to one end connected with the top of the cold bin 15, and then the liquid continuously absorbs heat, is evaporated, is condensed and flows back. Thereby completing the refrigeration of the cold bin 15. Because the density of the cold gas is high, the cold gas can be deposited downwards, the transmission of cold energy can be accelerated, and the temperature of the cold bin 15 can be rapidly reduced. The heat exchange cavity 14 is positioned in the middle, the hot bin 16 is positioned at the top, and the height of the bottom of the hot bin 16 is greater than that of the semiconductor chilling plate 6. Therefore, when one end of the heat pipe 11 connected with the semiconductor refrigerating sheet 6 is heated, the refrigerant is evaporated and vaporized, the gaseous refrigerant flows to one end connected with the hot bin 16 under a small pressure difference, the heat is released and condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity and returns to one end connected with the bottom of the hot bin 16, and then the liquid continuously absorbs heat, evaporates, condenses and flows back. Thereby completing the heating of the hot bin 16. Since the hot gas has a low density and moves upward, the transfer of heat is accelerated, and the temperature of the hot box 16 is rapidly increased.
The refrigeration and heating box heat preservation shell 13 is made of heat preservation materials and covers the outer surface of the refrigeration and heating box 13.
The heat exchange cavity 14 is used for accommodating the part of the heat pipe 11 extending to the refrigerating and heating box 12. The inner wall of the cold bin 15 is made of aluminum, copper or other metal with good thermal conductivity. The inner wall of the hot bin 16 is made of aluminum, copper or other metal with good thermal conductivity. The cold chamber 15 has a chamber door on its side, and when cooling is required, the articles can be put in through the cold chamber door 17. The hot box 16 has a top cover that allows items to be placed from the hot box cover 18 when heating is desired.
When the switch 10 is turned off, the power supply is cut off, the semiconductor air conditioning fan does not work, and the refrigerating and heating box 12 does not work; when the switch 10 is switched to the cooling state, the air blown out by the semiconductor air conditioning fan is cold air, and the hot bin of the cooling and heating box 12 starts to work; when the switch 10 is turned to the heating state, the air blown out by the semiconductor air conditioning fan is hot air, and the cold chamber of the cooling and heating box 12 starts to work.
The above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
Claims (10)
1. A semiconductor air conditioning fan, comprising: the device comprises an air ring, a base, a motor, an impeller, a partition plate, a semiconductor refrigerating sheet, a heat conduction fin, an air inlet hole, a circuit board, a switch, a heat pipe, a refrigerating and heating box heat preservation shell, a heat exchange cavity, a cold bin, a hot bin, a cold bin door, a hot bin cover and a balancing weight; the heat pipe is a closed metal shell, the interior of the heat pipe is pumped into negative pressure and then filled with a proper amount of refrigerant, one end of the heat pipe is an evaporation section, the other end of the heat pipe is a condensation section, when one end of the heat pipe is heated, the refrigerant is evaporated and vaporized, gaseous refrigerant flows to the other end under a small pressure difference to release heat and is condensed into liquid again, the liquid flows back to the evaporation section under the action of gravity, and the circulation is carried out, so that the heat is transferred from one end of the heat pipe to the other end; one end of the heat pipe is thermally connected with the lower end of the semiconductor refrigerating sheet, the other end of the heat pipe is bent and extends to the refrigerating and heating box, and the semiconductor air-conditioning fan comprises a plurality of heat pipes; the refrigeration and heating box is a cylindrical box body, the outer part of the box body is coated with a heat preservation shell, and the inner cavity is divided into three spaces by an aluminum plate or a copper plate: the heat exchange cavity is positioned in the middle, the hot bin is positioned at the top, and the height of the bottom of the hot bin is greater than that of the semiconductor refrigerating sheet; one end of one part of heat pipe is thermally connected with the lower end of the semiconductor refrigerating sheet, and the other end of the heat pipe extends to the bottom of the hot bin; one end of one part of the heat pipe is connected with the lower end of the semiconductor refrigeration piece, and the other end of the heat pipe extends to the top of the cold bin; the heat preservation shell of the refrigerating and heating box is made of heat preservation materials and covers the outer surface of the refrigerating and heating box.
2. The semiconductor air conditioner fan as claimed in claim 1, wherein the air ring is annular and includes an air outlet ring front cover and an air outlet ring rear cover, the air outlet ring front cover and the air outlet ring rear cover are connected to form an air ring inner cavity, the air ring inner cavity is communicated with the base, the width of one side of the air ring inner cavity close to the air outlet is greater than the width of one side far away from the air outlet, the air outlet ring front cover is composed of an inner air outlet sheet and an outer air outlet sheet, the inner air outlet sheet and the outer air outlet sheet form an air outlet, and the air outlet extends along the junction of the inner air outlet sheet and the outer air outlet sheet and has a width of 0.5-3 mm.
3. The semiconductor air conditioner fan as claimed in claim 1, wherein the base is cylindrical, and is connected to the inner cavity of the wind ring, and a weight block is disposed at the bottom of the base for increasing the weight of the base, the motor is a brushless motor, the rotating shaft faces downward and is connected to the impeller, and the rotating speed per minute is 1000 to 10000 revolutions.
4. The semiconductor air conditioner fan as claimed in claim 1, wherein the impeller is a drum-type impeller, and the impeller is rotated at a high speed by the motor to suck external air into the base and to enter the wind ring from the base.
5. The semiconductor air conditioner fan as claimed in claim 1, wherein the partition is made of a heat insulating material and is located below the impeller and 10 cm to 50 cm away from the impeller, the partition divides the base into an upper portion and a lower portion, the thickness of the partition is the same as the height of the semiconductor particles of the semiconductor chilling plates, and the partition has one or more rectangular openings for fixing the semiconductor chilling plates.
6. The semiconductor air conditioner fan as claimed in claim 1, wherein the semiconductor cooling plate is fixed in the opening of the partition plate, and the semiconductor cooling plate is formed by arranging a plurality of N-type and P-type semiconductor particles with each other.
7. The semiconductor air conditioner fan as claimed in claim 1, wherein the heat conduction fin is thermally connected to the upper end of the semiconductor refrigeration fin, is made of copper or aluminum metal material, and comprises a cylinder and a heat dissipation plate connected to the cylinder, the diameter of the cylinder is the same as the side length of the semiconductor refrigeration fin, the height of the cylinder extends upward to below the impeller without affecting the rotation of the impeller, and the heat dissipation plate is vertically and uniformly distributed on the cylinder; the air inlet is circular and is uniformly distributed on the base shell between the impeller and the partition plate.
8. The semiconductor air conditioner fan as claimed in claim 1, wherein the circuit board is located in an area where the air inlet holes are distributed, and the circuit board electrically connects the power supply with the motor and the semiconductor refrigeration sheet; the switch is located an area that the fresh air inlet distributes and its toggle button is located the shell, and the switch is used for selecting to the operating condition of semiconductor air conditioner fan: closing, refrigerating and heating.
9. The semiconductor air conditioner fan as claimed in claim 1, wherein the heat conduction fin is thermally connected to the upper end of the semiconductor refrigeration fin, is made of copper or aluminum metal material, and comprises a cylinder and a heat dissipation plate connected to the cylinder, the diameter of the cylinder is the same as the side length of the semiconductor refrigeration fin, the height of the cylinder extends upward to below the impeller without affecting the rotation of the impeller, and the heat dissipation plate is vertically and uniformly distributed on the cylinder; the air inlet is circular and is uniformly distributed on the base shell between the impeller and the partition plate.
10. The semiconductor air conditioner fan as claimed in claim 1, wherein the heat exchange cavity is used for accommodating the part of the heat pipe extending to the refrigerating and heating box, the inner wall of the cold bin is made of aluminum, copper or other metal with good thermal conductivity, the inner wall of the hot bin is made of aluminum, copper or other metal with good thermal conductivity, the top of the hot bin is provided with a bin cover, when heating is needed, articles can be put in from the hot bin cover, the side part of the cold bin is provided with a bin door, and when refrigerating is needed, the articles can be put in from the cold bin door.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920828391.4U CN210179814U (en) | 2019-06-03 | 2019-06-03 | Novel semiconductor air-conditioning fan |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920828391.4U CN210179814U (en) | 2019-06-03 | 2019-06-03 | Novel semiconductor air-conditioning fan |
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| CN210179814U true CN210179814U (en) | 2020-03-24 |
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| CN201920828391.4U Active CN210179814U (en) | 2019-06-03 | 2019-06-03 | Novel semiconductor air-conditioning fan |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110068090A (en) * | 2019-06-03 | 2019-07-30 | 湖北经济学院 | A kind of novel semi-conductor air cooler |
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2019
- 2019-06-03 CN CN201920828391.4U patent/CN210179814U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110068090A (en) * | 2019-06-03 | 2019-07-30 | 湖北经济学院 | A kind of novel semi-conductor air cooler |
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