WO2017197767A1

WO2017197767A1 - Fast refrigerating device for fluid

Info

Publication number: WO2017197767A1
Application number: PCT/CN2016/092711
Authority: WO
Inventors: 尹善章; 陈克勇
Original assignee: 深圳市妈妈科技有限公司
Priority date: 2016-05-17
Filing date: 2016-08-01
Publication date: 2017-11-23
Also published as: CN105953524B; CN105953524A

Abstract

Disclosed is a fast refrigerating device for a fluid, the device comprising a container (1) for containing the fluid, a semiconductor refrigerating member (2), a radiator (3) and a radiation fan (4). The container (1) is provided with an inlet (11) and an outlet (12). The semiconductor refrigerating member (2) is electrically connected to an external power supply (200) and is provided with a cold end face (21) and a hot end face (22). The cold end face (21) is attached to the outer surface of the container and the hot end face (22) is attached to the radiator (3). The radiation fan (4) is mounted on the radiator (3). The semiconductor refrigerating member (2) of the fast refrigerating device utilizes electric energy fast refrigeration. Exchange of heat energy is achieved between heat of the fluid and the cold end face (21) of the semiconductor refrigerating member (2), therefore the temperature is lowered quickly. The heat absorbed by the semiconductor refrigerating member (2) is quickly transferred to the hot end face (22) from the cold end face (21), the heat on the hot end face (22) is transferred to the radiator (3), and the radiator (3) dissipates the heat into the air. The radiation fan (4) can accelerate the speed of air flow, such that the heat dissipation speed of the radiator (3) is increased.

Description

Fluid rapid cooling device

Technical field

The invention belongs to the technical field of fluid refrigeration, and in particular relates to a rapid refrigeration device for fluids.

Background technique

At present, compressor refrigeration technology is commonly used to rapidly cool fluids; its disadvantages are high cost, low refrigeration efficiency, and large size of refrigeration system.

In addition, for some special drinking fluids, such as milk brewed for babies, warm water is also required for drinking. The boiled boiling water of the boiler is cooled to the optimum dissolution temperature of various brands of milk powder (40-60) Brewing is carried out in order to achieve the best effect of milk powder dissolution and no loss of milk powder nutrition. But 40-60 The temperature of the milk is not directly available to the baby at the time, but also needs to be cooled for a long time.

Therefore, there is a need to develop a technique to be able to reduce the temperature of a fluid to a desired temperature in a short time.

technical problem

The technical problem to be solved by the present invention is to provide a The fluid rapid refrigerating device aims to solve the problems of high cost, low cooling efficiency and large size of the refrigeration system in the prior art by using the compressor refrigeration technology to rapidly cool the fluid.

Technical solution

The present invention is achieved by a fluid rapid refrigerating apparatus comprising a container for containing a fluid, the container having an inlet and an outlet, the rapid cooling device further comprising a semiconductor refrigeration unit, a heat sink and a cooling fan; The semiconductor refrigeration component is electrically connected to an external power source, and has a cold end surface that closely abuts the outer surface of the container, the hot end surface abuts the heat sink, and the heat dissipation fan is mounted on the heat sink on.

Further, the rapid cooling device further includes a heat insulating material that together with the semiconductor refrigeration member covers an outer circumference of the container, the heat insulating material having a position corresponding to an inlet and an outlet of the container Opening.

Further, the semiconductor refrigeration member is in the form of a sheet.

Further, the thickness of the heat insulating material is greater than or equal to the thickness of the semiconductor refrigeration member.

Further, the heat sink is a metal heat sink.

Further, the cold end surface is bonded to the outer surface of the container by a cold conductive glue, and the hot end surface is bonded to the heat sink by a thermal conductive adhesive.

Further, a conduit is disposed within the container, the inlet end of the conduit being in contact with the inlet of the vessel and the outlet end of the conduit being adjacent the bottom of the vessel.

Further, the catheter is L-shaped.

Further, the container is made of a metal material that conducts heat well.

Beneficial effect

Compared with the prior art, the present invention has the beneficial effects of: the invention The rapid refrigerating device has an outer surface of the container for accommodating the fluid and a cold end surface of the semiconductor refrigerating member. The semiconductor refrigerating member is rapidly cooled by electric energy, and the degree of refrigeration and speed can be controlled by an external circuit, and the heat of the fluid passes through the wall of the container. The body and the cold end face of the semiconductor refrigeration member exchange heat energy, so that the temperature of the fluid can be rapidly lowered. The heat absorbed by the semiconductor refrigeration component is quickly transferred from the cold end face to the hot end face, and the heat on the hot end face is transferred to the heat sink. The heat sink radiates heat to the air through its own heat dissipation characteristic, and the heat dissipation fan can accelerate the air flow. Speed, which speeds up the heat dissipation of the heat sink. Therefore, the rapid cooling device of the present invention can rapidly cool the temperature of the fluid.

DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal cross-sectional view showing a fluid rapid cooling device according to an embodiment of the present invention.

Embodiments of the invention

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in FIG. 1, in accordance with a preferred embodiment of the present invention, a fluid rapid refrigerating apparatus includes a container 1 for containing a fluid, a semiconductor refrigerating member 2, a radiator 3, and a cooling fan 4.

The container 1 has an inlet 11 and an outlet 12 which are made of a metal material which is thermally conductive. The semiconductor refrigeration unit 2 is electrically connected to the external power source 200, and has a cold end surface 21 and a hot end surface 22, the cold end surface 21 is in close contact with the outer surface of the container 1, and the heat end surface 22 is in close contact with the heat sink 3. The heat sink 3 is a conductive metal heat sink. The heat dissipation fan 4 is mounted on the heat sink 3.

Specifically, in order to achieve a tight and stable fit without affecting the transfer of thermal energy, the cold end surface 21 is bonded to the outer surface of the container 1 by a cold conductive glue, and the hot end surface 22 is bonded to the heat sink 3 by a thermal conductive adhesive.

In order to prevent the external space from affecting the temperature of the fluid, the above-mentioned rapid cooling device further includes a heat insulating material 5 which together with the semiconductor refrigeration member 2 covers the outer periphery of the container 1, and the heat insulating material 5 corresponds to the inlet 11 of the container 1. The locations of the outlets 12 and the outlets 12 have openings 51 and openings 52, respectively.

The semiconductor refrigeration member 2 is in the form of a sheet; the thickness of the heat insulating material 5 is greater than or equal to the thickness of the semiconductor refrigeration member 2, so that the heat of the heat sink 3 or the thermal end surface of the semiconductor refrigeration member 2 is reversed to cause the cold end surface of the semiconductor refrigeration member 2 or the container 1 Rapid cooling is affected.

The container 1 is provided with a conduit 13 which is L-shaped; the inlet end 131 of the conduit 13 is connected to the inlet 11 of the container 1, the outlet end 132 is close to the bottom of the container 1, and the fluid is under the action of gravity from the inlet of the container 1. 11 flows rapidly to the bottom of the vessel 1 so that the fluid forms a closed loop, and the fluid can be in contact with the inner wall of the vessel 1 near the cold end face 21 multiple times, speeding up the exchange of heat energy and allowing the fluid to cool rapidly. It can be seen that, in the rapid cooling device of the embodiment, the outer surface of the container 1 for accommodating the fluid is in close contact with the cold end surface 21 of the semiconductor refrigerating member 2, and the semiconductor refrigerating member 2 is rapidly cooled by electric energy, and the degree of refrigeration and speed can be externally The circuit realizes control that the heat of the fluid exchanges heat with the cold end face 21 of the semiconductor refrigeration member 2 through the wall of the container 1, so that the temperature of the fluid can be rapidly lowered. The heat absorbed by the semiconductor refrigeration unit 2 is quickly transferred from the cold end surface 21 to the hot end surface 22, and the heat on the hot end surface 22 is transferred to the heat sink 3. The heat sink 3 dissipates heat to the air through its own heat dissipation characteristics, and dissipates heat. The fan 4 speeds up the flow of air, thereby accelerating the heat dissipation rate of the heat sink 3. Therefore, the rapid cooling device of the present embodiment can rapidly cool the temperature of the fluid.

In order to further embody the technical effects of the embodiment, the following is a description of the process of rapid cooling of the milk by taking the milk brewed by the baby as an example: mixing the boiled warm water (40-60 degrees) with the milk powder into the milk. Using the rapid cooling device of the present embodiment, the boiled boiling water is rapidly cooled to about 15 degrees of cold water, and the cold water is neutralized with 40-60 degrees of milk to synthesize the 37.5 degrees of milk required for the baby.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims

A fluid rapid cooling device comprising a container for containing a fluid, the container having an inlet and an outlet, wherein the rapid cooling device further comprises a semiconductor refrigeration unit, a heat sink and a heat dissipation fan; the semiconductor refrigeration unit Electrically connected to an external power source having a cold end surface that abuts the outer surface of the container, and a thermal end surface that abuts the heat sink, the heat dissipating fan being mounted on the heat sink.
A rapid fluid refrigerating apparatus according to claim 1, wherein said rapid refrigerating apparatus further comprises a heat insulating material, said heat insulating material and said semiconductor refrigeration member together covering an outer periphery of said container, said partition The thermal material has an opening at a location corresponding to the inlet and outlet of the container.
A rapid fluid refrigerating apparatus according to claim 1, wherein said semiconductor refrigeration member is in the form of a sheet.
A rapid fluid refrigerating apparatus according to claim 2, wherein said heat insulating material has a thickness greater than or equal to a thickness of said semiconductor refrigeration member.
A rapid fluid refrigerating apparatus according to claim 1, wherein said heat sink is a metal heat sink.
The fluid rapid refrigerating apparatus according to any one of claims 1 to 5, wherein the cold end surface is adhered to the outer surface of the container by a cold conductive glue, and the hot end surface is passed through the thermal conductive adhesive The heat sink is bonded.
A fluid rapid refrigerating apparatus according to any one of claims 1 to 5, wherein a conduit is provided in the container, an inlet end of the conduit is connected to an inlet of the vessel, and an outlet end thereof is adjacent The bottom of the container.
A fluid rapid refrigerating apparatus according to claim 7, wherein said duct is L-shaped.
The fluid rapid refrigerating apparatus according to any one of claims 1 to 5, wherein the container is made of a metal material having good heat conductivity.