CN105953193A - LED light heat sink - Google Patents
LED light heat sink Download PDFInfo
- Publication number
- CN105953193A CN105953193A CN201610448017.2A CN201610448017A CN105953193A CN 105953193 A CN105953193 A CN 105953193A CN 201610448017 A CN201610448017 A CN 201610448017A CN 105953193 A CN105953193 A CN 105953193A
- Authority
- CN
- China
- Prior art keywords
- accounts
- led fin
- heat sink
- led light
- light heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an LED light heat sink. The LED light heat sink comprises an outermost radiating layer, an intermediate bonding layer and an innermost matrix which are combined together, wherein the radiating layer comprises a natural graphite radiating film, an artificial graphite radiating film and a nano-carbon radiating film; the matrix is PU foam; the radiating layer accounts for 21-25% of the total weight of the LED light heat sink; the bonding layer accounts for 15-16% of the total weight of the LED light heat sink; and the matrix accounts for 58-66% of the total weight of the LED light heat sink. The LED light heat sink provided by the invention has the advantages of large radiation area and high radiation efficiency.
Description
Technical field
The present invention relates to a kind of LED fin.
Background technology
For fin material, every kind of its heat conductivility of material is different, arranges from high to low by heat conductivility, point
It not silver, copper, aluminum, steel.Can be the most expensive if but making fin with silver, therefore best scheme is copper for using.Although aluminum
Considerably cheaper, it is apparent that heat conductivity is just not as copper good (only about about the 50% of copper).
The most conventional fin material is copper and aluminium alloy, and the two is respectively arranged with its pluses and minuses.The heat conductivity of copper is good, but price
More expensive, difficulty of processing is higher, weight excessive (a lot of fine copper radiators have been above CPU counterweight quantitative limitation), and thermal capacity is less,
And easily aoxidize.And fine aluminium is too soft, it is impossible to directly use, being all that the aluminium alloy used just is provided that enough hardness, aluminum closes
The advantage of gold is cheap, lightweight, but heat conductivity will be far short of what is expected than copper.Some radiator respectively takes the chief, closes at aluminum
A piece of copper coin is embedded on gold foot of radiator.
Summary of the invention
It is big that the present invention provides one to have area of dissipation, the LED fin of radiating efficiency high advantage.
The technical scheme is that a kind of LED fin, described LED fin includes outermost heat radiation
The matrix combination of layer, the adhesive layer in intermediate layer and innermost layer forms, and described heat dissipating layer includes native graphite heat dissipation film, electrographite
Heat dissipation film, nano-sized carbon heat dissipation film, described matrix is PU foamed cotton, and described heat dissipating layer accounts for the overall component of LED fin
21%-25%, described adhesive layer accounts for the 15%-16% of the overall component of LED fin, and it is total that described matrix accounts for LED fin
The 58%-66% of body component.
In a preferred embodiment of the present invention, described adhesive layer is thermoplastic elastomer or thermoset rubber.
In a preferred embodiment of the present invention, described heat dissipating layer accounts for the 24% of the overall component of LED fin, described
Adhesive layer account for the 15% of the overall component of LED fin, described matrix accounts for the 61% of the overall component of LED fin.
A kind of LED fin of the present invention, has area of dissipation big, the advantage that radiating efficiency is high.
Detailed description of the invention
Below presently preferred embodiments of the present invention is described in detail so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that thus protection scope of the present invention is made apparent clear and definite defining.
Wherein, described LED fin includes outermost heat dissipating layer, the adhesive layer in intermediate layer and the matrix of innermost layer
Combining, described heat dissipating layer includes native graphite heat dissipation film, electrographite heat dissipation film, nano-sized carbon heat dissipation film, and described matrix is
PU foamed cotton, described heat dissipating layer accounts for the 21%-25% of the overall component of LED fin, and described adhesive layer accounts for LED fin
The 15%-16% of overall component, described matrix accounts for the 58%-66% of the overall component of LED fin.
Further illustrating, described adhesive layer is thermoplastic elastomer or thermoset rubber, and described heat dissipating layer accounts for LED and dissipates
The 24% of the overall component of backing, described adhesive layer accounts for the 15% of the overall component of LED fin, and described matrix accounts for LED and dissipates
The 61% of the overall component of backing.
Further illustrating, nano-sized carbon heat dissipation film is the heat dissipation film that nano-carbon material does, and the thinnest can accomplish 0 .03MM, receives
Rice carbon and graphite are isomers, and radiating principle is similar, the heat radiation power of general native graphite about 400, artificial stone
Ink is 1500, and the heat radiation power of nano-sized carbon is 1000-6000. heat radiation or highly effective fruit.Nano-sized carbon heat dissipation film does simultaneously
Being finished product, processing is only with die sinking, die-cut the most permissible, and the course of processing is very simple, and expense is low.Most important factor exists
In, the cost of nano-sized carbon heat dissipation film is the highest, and commercially price is far below electrographite, even than the price of some native graphite
The most cheap.
Further illustrating, PU foamed cotton is a kind of Novel environment-friendlymaterial material, nontoxic, tasteless, sound insulation, sound-absorbing, heat insulation, burn
Time pollution-free to air, resilience force is good, can arbitrarily adjust soft durometer and thickness, and the feature such as lightweight, is other foamed cotton class materials
Expect irreplaceable, hot pressing molding, it is possible to produce flame retardant type, it is adaptable to protecting ware for sports, handbag case and bag, automobile, Aero-Space,
Building, footwear material, toy, air-conditioning, petroleum pipeline insulation etc..Feature: thermal insulation: its trickle separated foam structure, can effectively drop
The energy exchange that low cross-ventilation causes, is suitable for making insulating tube, warming plate.And have anti-condensation concurrently, be allowed to be extremely suitable for using
Insulation material in many wet environments such as refrigerator, air-conditioning and freezers.Sound absorption properties: there is absorbing sound and lowering noise function, be suitable for aircraft,
Sound-absorbing deadener in the strong noise equipment such as rolling stock, automobile, motor and environment.Mouldability: thermostability is strong, extends
Performance is good, even density, can realize the molding of the deep part such as vacuum forming and thermoforming, thus can be used for air conditioning for automobiles evaporation
Material in terms of the inside gadgets such as cabinet, automobile hot pressing ceiling and footwear material.Resiliency: matter is semi-rigid foaming body, by after thump also
Do not lose originality energy, be used for the fields such as precision instrument, package semiconductor, be possible with its formability simultaneously, and for physical culture
The making field of protective articles and leisure goods.The present invention provides a kind of LED fin, has area of dissipation big, heat radiation effect
The advantage that rate is high.
The detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, any is familiar with this area
Technical staff in the technical scope that disclosed herein, the change can expected without creative work or replacement, all should contain
Cover within protection scope of the present invention.Therefore, the protection model that protection scope of the present invention should be limited with claims
Enclose and be as the criterion.
Claims (3)
1. a LED fin, it is characterised in that: described LED fin includes outermost heat dissipating layer, intermediate layer
The matrix combination of adhesive layer and innermost layer forms, and described heat dissipating layer includes native graphite heat dissipation film, electrographite heat dissipation film, nanometer
Carbon heat dissipation film, described matrix is PU foamed cotton, and described heat dissipating layer accounts for the 21%-25% of the overall component of LED fin, described
Adhesive layer accounts for the 15%-16% of the overall component of LED fin, and described matrix accounts for the 58%-of the overall component of LED fin
66%。
LED fin the most according to claim 1, it is characterised in that: described adhesive layer is thermoplastic elastomer or heat
Solidity rubber.
LED fin the most according to claim 1, it is characterised in that: it is overall that described heat dissipating layer accounts for LED fin
The 24% of component, described adhesive layer accounts for the 15% of the overall component of LED fin, and it is overall that described matrix accounts for LED fin
The 61% of component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448017.2A CN105953193A (en) | 2016-06-21 | 2016-06-21 | LED light heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448017.2A CN105953193A (en) | 2016-06-21 | 2016-06-21 | LED light heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105953193A true CN105953193A (en) | 2016-09-21 |
Family
ID=56907053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610448017.2A Pending CN105953193A (en) | 2016-06-21 | 2016-06-21 | LED light heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105953193A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1878451A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN102318438A (en) * | 2009-02-17 | 2012-01-11 | 乐金华奥斯有限公司 | Carbon nanotube sheet heater |
| US20120033384A1 (en) * | 2010-08-06 | 2012-02-09 | Pillai Unnikrishnan G | Graphite wrapped heat spreading pillow |
| CN202697129U (en) * | 2012-07-05 | 2013-01-23 | 苏州沛德导热材料有限公司 | Graphite heat conducting foam |
| CN103210539A (en) * | 2010-11-17 | 2013-07-17 | 乐金华奥斯有限公司 | Battery assembly having a heat-dissipating and heat-emitting function |
| CN103448309A (en) * | 2013-09-03 | 2013-12-18 | 苏州天脉导热科技有限公司 | Thermal diffusion composite material |
| CN103826425A (en) * | 2014-03-07 | 2014-05-28 | 青岛宝泰机电设备配套科技有限公司 | High-heat-conductivity foam gasket as well as preparation method and applications thereof |
| CN204168701U (en) * | 2014-11-13 | 2015-02-18 | 青岛卓英社科技有限公司 | Graphite heat conducting foam liner |
-
2016
- 2016-06-21 CN CN201610448017.2A patent/CN105953193A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1878451A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN102318438A (en) * | 2009-02-17 | 2012-01-11 | 乐金华奥斯有限公司 | Carbon nanotube sheet heater |
| US20120033384A1 (en) * | 2010-08-06 | 2012-02-09 | Pillai Unnikrishnan G | Graphite wrapped heat spreading pillow |
| CN103210539A (en) * | 2010-11-17 | 2013-07-17 | 乐金华奥斯有限公司 | Battery assembly having a heat-dissipating and heat-emitting function |
| CN202697129U (en) * | 2012-07-05 | 2013-01-23 | 苏州沛德导热材料有限公司 | Graphite heat conducting foam |
| CN103448309A (en) * | 2013-09-03 | 2013-12-18 | 苏州天脉导热科技有限公司 | Thermal diffusion composite material |
| CN103826425A (en) * | 2014-03-07 | 2014-05-28 | 青岛宝泰机电设备配套科技有限公司 | High-heat-conductivity foam gasket as well as preparation method and applications thereof |
| CN204168701U (en) * | 2014-11-13 | 2015-02-18 | 青岛卓英社科技有限公司 | Graphite heat conducting foam liner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160921 |