CN105946305A - Fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and preparation method thereof - Google Patents
Fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and preparation method thereof Download PDFInfo
- Publication number
- CN105946305A CN105946305A CN201610301226.4A CN201610301226A CN105946305A CN 105946305 A CN105946305 A CN 105946305A CN 201610301226 A CN201610301226 A CN 201610301226A CN 105946305 A CN105946305 A CN 105946305A
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- fluorinated silicate
- foil layer
- copper foil
- base high
- copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- Laminated Bodies (AREA)
Abstract
The invention relates to a fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and a preparation method thereof. The compound base high frequency copper clad laminate comprises an uppermost first copper foil layer and a bottom second copper foil layer, a plurality of fluorinated silicate fiber electronic felt layers and PTFE glass fiber cloth layers are arranged between the first copper foil layer and the second copper foil layer, the fluorinated silicate fiber electronic felt layers and the PTFE glass fiber cloth layers are arranged alternately, during preparation, an interlayer is firstly laid well and then placed in a vacuum press to conduct heating lamination, the temperature in raised from room temperature to 400-460DEG C, the vacuum pressure is 1.0-7.0MPa, the lamination time is 400-600min, a water-cooling system is employed to perform cooling to 200DEG C, and finally the laminate is cut to a required size. The preparation method involved in the invention is simple, the steps are easy to operate, the prepared compound base high frequency copper clad laminate has high dielectric constant, high thermal conductivity and low dielectric loss angle tangent value, and also has strong ionic migration resistance and high machining performance, thus improving the sheet safety.
Description
Technical field
The present invention relates to a kind of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate and preparation method thereof, belong to and cover
Copper coin preparing technical field.
Background technology
Along with the fast development of copper-clad plate industry, nowadays the performance to copper-clad plate has had higher requirement, the most not merely wants
Copper-clad plate is asked to have high-k, low dielectric loss angle tangent value, low thermal coefficient of expansion etc. electric property and mechanical performance,
Also require that it possesses higher heat conductivity simultaneously because electronic devices and components just do less and less, if under duty its heat without
Method well penetrates and distributes, and will have a strong impact on its performance, and even can produce danger.
Summary of the invention
The invention aims to solve the problems referred to above, it is provided that a kind of fluorinated silicate filamentary electrons felt is combined
Base high-frequency copper-clad plate and preparation method thereof, preparation method is easily operated, and the composite base high-frequency copper-clad plate prepared has Gao Jie
Electric constant, high thermal conductivity coefficient and low dielectric loss angle tangent value.
The present invention adopts the following technical scheme that a kind of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, including
First copper foil layer of the superiors and the second copper foil layer of bottom, if the centre of described first copper foil layer and the second copper foil layer is provided with
Dried layer fluorinated silicate filamentary electrons carpet veneer and PTFE fiberglass cloth, described fluorinated silicate filamentary electrons carpet veneer and PTFE
Fiberglass cloth interval is arranged.
Further, the thickness of described fluorinated silicate filamentary electrons carpet veneer is 0.45～0.53mm.
Further, the thickness of described PTFE fiberglass cloth is 0.1～0.125mm.
Further, the thickness of described first copper foil layer and the second copper foil layer is 0.30～0.35mm.
The preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, comprises the steps:
(1) by fluorinated silicate filamentary electrons carpet veneer, PTFE fiberglass cloth interval lay after on outermost two sides
Place the first copper foil layer and the second copper foil layer respectively, induction system in being delivered to vacuum press, carry out intensification pressing, heating system
System is for electrical heating, and temperature rises to 400～460 DEG C from room temperature, and vacuum pressure is 1.0～7.0MPa, pressing time be 400～
600min；
(2) then use water-cooling system to lower the temperature, declined by the speed of 1～2 DEG C/min before 300 DEG C, press after 300 DEG C
5～10 DEG C/min carries out fast cooling, cools the temperature to 200 DEG C；
(3) substrate after cooling is transmitted to storage rack natural cooling by conveying system, finally cut into required on guillotine
Size.
Further, constant temperature 90～180min is kept after described step (1) rises to high temperature section.
Further, described step (3) is cooled to room temperature.
Preparation method of the present invention is simple, and step is easily operated, the dielectric constant of the composite base high-frequency copper-clad plate prepared
Size is 5 ~ 12, and dielectric loss angle tangent is 0.001 ~ 0.003, and heat conductivity is 0.7 ~ 1.2, and composite base high-frequency copper-clad plate has
Have high-k, high thermal conductivity coefficient and low dielectric loss angle tangent value, the most also have stronger resistance to ion migration ability and
Higher machinability；On the premise of ensureing the good electric property of sheet material and machinability, additionally it is possible to realize sheet material
High heat-sinking capability and resistance to ion migration ability, substantially increase the safety of sheet material.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Reference: fluorinated silicate filamentary electrons carpet veneer 1, PTFE fiberglass cloth the 2, first copper foil layer the 3, second bronze medal
Layers of foil 4.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
As it is shown in figure 1, fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, including the first copper foil layer of the superiors
With the second copper foil layer of bottom, if the centre of described first copper foil layer and the second copper foil layer is provided with dried layer fluorinated silicate fiber
Electronics carpet veneer and PTFE fiberglass cloth, described fluorinated silicate filamentary electrons carpet veneer and PTFE fiberglass cloth interval set
Put.Wherein, the thickness of fluorinated silicate filamentary electrons carpet veneer is 0.45～0.53mm, and the thickness of PTFE fiberglass cloth is
0.1～0.125mm, the thickness of the first copper foil layer and the second copper foil layer is 0.30～0.35mm.
Embodiment one:
The preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, comprises the steps:
(1) by fluorinated silicate filamentary electrons carpet veneer, PTFE fiberglass cloth interval lay after on outermost two sides
Place the first copper foil layer and the second copper foil layer respectively, induction system in being delivered to vacuum press, carry out intensification pressing, heating system
System is electrical heating, and temperature rises to 400 DEG C from room temperature, and vacuum pressure is 7.0MPa, keeps constant temperature 90min, pressure after rising to high temperature section
The conjunction time is 600min；
(2) then use water-cooling system to lower the temperature, decline by the speed of 1 DEG C/min before 300 DEG C, less than 300 DEG C after by 5
DEG C/min carries out fast cooling, cools the temperature to 200 DEG C；
(3) substrate after cooling is naturally cooled to room temperature by conveying system transmission to storage rack, finally cut on guillotine
Become required size.
Embodiment two:
The preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, comprises the steps:
(1) by fluorinated silicate filamentary electrons carpet veneer, PTFE fiberglass cloth interval lay after on outermost two sides
Place the first copper foil layer and the second copper foil layer respectively, induction system in being delivered to vacuum press, carry out intensification pressing, heating system
System is electrical heating, and temperature rises to 450 DEG C from room temperature, and vacuum pressure is 5.0MPa, keeps constant temperature 100min, pressure after rising to high temperature section
The conjunction time is 500min；
(2) then use water-cooling system to lower the temperature, decline by the speed of 1.5 DEG C/min before 300 DEG C, less than 300 DEG C after by 8
DEG C/min carries out fast cooling, cools the temperature to 200 DEG C；
(3) substrate after cooling is naturally cooled to room temperature by conveying system transmission to storage rack, finally cut on guillotine
Become required size.
Embodiment three:
The preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, comprises the steps:
(1) by fluorinated silicate filamentary electrons carpet veneer, PTFE fiberglass cloth interval lay after on outermost two sides
Place the first copper foil layer and the second copper foil layer respectively, induction system in being delivered to vacuum press, carry out intensification pressing, heating system
System is electrical heating, and temperature rises to 460 DEG C from room temperature, and vacuum pressure is 1.0MPa, keeps constant temperature 180min, pressure after rising to high temperature section
The conjunction time is 400min；
(2) then use water-cooling system to lower the temperature, decline by the speed of 2 DEG C/min before 300 DEG C, less than 300 DEG C after by 10
DEG C/min carries out fast cooling, cools the temperature to 200 DEG C；
(3) substrate after cooling is naturally cooled to room temperature by conveying system transmission to storage rack, finally cut on guillotine
Become required size.
Claims (7)
1. a fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate, it is characterised in that: include the first bronze medal of the superiors
Second copper foil layer (4) of layers of foil (3) and bottom, the centre of described first copper foil layer (3) and the second copper foil layer (4) is provided with some
Layer fluorinated silicate filamentary electrons carpet veneer (1) and PTFE fiberglass cloth (2), described fluorinated silicate filamentary electrons carpet veneer
(1) arrange with PTFE fiberglass cloth (2) interval.
2. fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate as claimed in claim 1, it is characterised in that: described fluorine
The thickness of SiClx silicate fiber electronics carpet veneer (1) is 0.45～0.53mm.
3. fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate as claimed in claim 1, it is characterised in that: described
The thickness of PTFE fiberglass cloth (2) is 0.1～0.125mm.
4. fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate as claimed in claim 1, it is characterised in that: described the
The thickness of one copper foil layer (3) and the second copper foil layer (4) is 0.30～0.35mm.
5. the preparation method of the fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate described in claim 1, its feature exists
In: comprise the steps:
(1) by fluorinated silicate filamentary electrons carpet veneer, PTFE fiberglass cloth interval lay after on outermost two sides
Place the first copper foil layer and the second copper foil layer respectively, induction system in being delivered to vacuum press, carry out intensification pressing, heating system
System is for electrical heating, and temperature rises to 400～460 DEG C from room temperature, and vacuum pressure is 1.0～7.0MPa, pressing time be 400～
600min；
(2) then use water-cooling system to lower the temperature, declined by the speed of 1～2 DEG C/min before 300 DEG C, press after 300 DEG C
5～10 DEG C/min carries out fast cooling, cools the temperature to 200 DEG C；
(3) substrate after cooling is transmitted to storage rack natural cooling by conveying system, finally cut into required on guillotine
Size.
6. the preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate as claimed in claim 5, its feature
It is: after described step (1) rises to high temperature section, keep constant temperature 90～180min.
7. the preparation method of fluorinated silicate filamentary electrons felt composite base high-frequency copper-clad plate as claimed in claim 5, its feature
It is: described step is cooled to room temperature in (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301226.4A CN105946305A (en) | 2016-05-04 | 2016-05-04 | Fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301226.4A CN105946305A (en) | 2016-05-04 | 2016-05-04 | Fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105946305A true CN105946305A (en) | 2016-09-21 |
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ID=56914450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610301226.4A Pending CN105946305A (en) | 2016-05-04 | 2016-05-04 | Fluorinated silicate fiber electronic felt compound base high frequency copper clad laminate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105946305A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490413A (en) * | 2011-12-16 | 2012-06-13 | 广东生益科技股份有限公司 | Manufacturing method of PTFE (polytetrafluoroethylene) coller clad plate |
-
2016
- 2016-05-04 CN CN201610301226.4A patent/CN105946305A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490413A (en) * | 2011-12-16 | 2012-06-13 | 广东生益科技股份有限公司 | Manufacturing method of PTFE (polytetrafluoroethylene) coller clad plate |
Non-Patent Citations (3)
| Title |
|---|
| 吴智华等主编: "《高分子材料成型工艺学》", 30 September 2010 * |
| 孙曼灵主编: "《环氧树脂应用原理与技术》", 30 September 2002 * |
| 辜信实主编: "《印制电路用覆铜箔层压板》", 28 February 2002 * |
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| PB01 | Publication | ||
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Application publication date: 20160921 |