CN209052591U - A kind of ceramic base PCB copper-clad plate that graphene is modified - Google Patents
A kind of ceramic base PCB copper-clad plate that graphene is modified Download PDFInfo
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- CN209052591U CN209052591U CN201820853052.7U CN201820853052U CN209052591U CN 209052591 U CN209052591 U CN 209052591U CN 201820853052 U CN201820853052 U CN 201820853052U CN 209052591 U CN209052591 U CN 209052591U
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- graphene
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- clad plate
- copper
- copper foil
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- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011889 copper foil Substances 0.000 claims abstract description 23
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 22
- 239000000843 powder Substances 0.000 description 18
- 238000007731 hot pressing Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 244000137852 Petrea volubilis Species 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- -1 graphite Alkene Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Carbon And Carbon Compounds (AREA)
Abstract
A kind of ceramic base PCB copper-clad plate that graphene is modified, including ceramic base prepreg, copper foil；One layer of chemical vapor deposition graphene is equipped between ceramic base prepreg, copper foil.Or the two sides of ceramic base prepreg is all one layer of chemical vapor deposition graphene, the outside of graphene is copper foil.Wherein the modified potsherd of graphene is by the method for chemical vapor deposition by the surface of graphene growth to potsherd.Then copper foil is invested by prepreg two sides by hot-press method.The calorifics of copper-clad plate, electrical and mechanical performance are greatly improved since there are graphenes between potsherd and copper foil by ceramic base PCB copper-clad plate prepared by the method.
Description
Technical field
The utility model relates to a kind of new ceramics base PCB copper-clad plates, belong to the preparation field of PCB copper-clad plate.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is important electronic component, is electronic component
Supporter is the carrier of electronic component electrical connection.With being constantly progressive for electronic information technology development, electronic equipment high frequency
Change is development trend, especially as wireless network, satellite communication it is increasingly developed, information products constantly move towards at a high speed and high frequency
Change.Develop new generation product and require frequency PCB plate, the especially communication products such as satellite system, mobile phone reception base station are necessary
It using high-frequency circuit board, applies with these and is rapidly developed within the coming years, can have wilderness demand to frequency PCB plate.
Ceramic base copper-clad plate is widely used in the field PCB.Ceramic base copper-clad plate has high resistance, excellent high frequency
The advantages that performance, high-heat performance, good chemical and thermal stability, high-melting-point.These advantages are all design of electronic circuits and production
In it is required.
Graphene is a kind of two-dimension plane structure by carbon atom hexagonal accumulation group face.Due to its with excellent calorifics,
The performances such as electricity, machinery, recent years, heat was concerned.The prepreg of PCB copper-clad plate needs excellent hot property and mechanicalness
Can, copper foil needs excellent electric property again.Therefore, we are dedicated to improving the heat of PCB copper-clad plate by introducing graphene
It learns, electrical and mechanical performance.It is 5G communication times high-frequency copper-clad plate to greatly improve the performance of common PCB copper-clad plate now
Contribution strength.
Utility model content
Purpose of utility model: in order to overcome the deficiencies in the prior art, the utility model provides a kind of novel graphite
Alkene modified ceramic base PCB copper-clad plate and preparation method, the main potsherd and copper foil modified including graphene, specific structure is such as
Shown in Fig. 1.Wherein the modified potsherd of graphene is by the method for chemical vapor deposition by graphene growth to ceramic piece
Surface.Then copper foil is invested by potsherd two sides by hot-press method.The PCB copper-clad plate prepared by the method, due to pottery
There are graphenes between tile and copper foil, therefore greatly improve the calorifics of copper-clad plate, electrical and mechanical performance.
Technical solution: to achieve the above object, a kind of the technical solution adopted in the utility model are as follows: pottery that graphene is modified
Porcelain PTFE base PCB copper-clad plate, including ceramic base prepreg, copper foil 3；A stratification is equipped between ceramic base prepreg 1, copper foil
Learn vapor deposition graphene.
A kind of ceramic-PTFE base PCB copper-clad plate that graphene is modified, including ceramic base prepreg, copper foil；Ceramic base half
The two sides of cured sheets is all one layer of chemical vapor deposition graphene, and the outside of graphene is copper foil.
A kind of modified ceramic base PCB copper-clad plate preparation method of graphene, comprising the following steps:
S1: by weight, 98-98.5 parts of Al are weighed2O3Powder, 0.2-0.5 parts of MgO powders, 0.3-0.6 parts of CaO powders,
0.9-1 parts of SiO2Powder, the partial size of powder are necessarily less than 0.5 micron, and load weighted powder is put into ball mill, are added
500ml alcohol, with 200-300r/min speed, ball milling 5-7 hours.
S2: dry-pressing formed with the pressure of 2-3MPa with dry-pressing formed machine after drying by mixture obtained in step S2.
S3: ceramic body obtained in step S2 is placed in Muffle, with 920-960 DEG C sintering 10-12 hours.
S4: being cut to required thickness for ceramics obtained in step S3, and is polishing to 2000 mesh sand paper smooth.
S5: the potsherd obtained by step S4 method is placed in chemical vapor depsotition equipment cavity, carries out stone
Black alkene growth.
S6: the upper and lower surface of sample obtained in step S5 is put into copper foil, is put into hot pressing furnace and carries out hot pressing.Hot pressing item
Part is that vacuum degree is extracted into greater than 1 × 10-3It after mbar, starts to warm up, temperature-rise period is first quickly to be raised to 150 with 30-50 minutes
DEG C, then 380-405 DEG C is warming up to 90-100 minutes.Soaking time is 120-180 minutes.The process of pressurization is divided into two
Step, it is 2-3MPa that temperature-rise period, which applies pressure, and it is 2.5-3.5MPa that insulating process, which applies pressure,.
S7: after step S6 process, it is naturally cooling to room temperature, then release, release speed should be less than 0.1MPa/s.It will
The modified ceramic base PCB copper-clad plate of the graphene pressed is taken out from hot pressing furnace, obtains desired sample to the end.
The working principle of the utility model are as follows: the method that chemical vapor deposition is used between potsherd and copper foil is grown into graphite
Alkene leads to the excellent properties of graphene, greatly improves electricity, calorifics and the mechanical performance of copper-clad plate.
Further, in the step S5, during graphene growth, chemical vapor depsotition equipment vacuum degree should be greater than 5
×10-4Mbar, growth temperature are 375-380 DEG C.
Copper-clad plate performance test analysis is obtained in 1 Examples 1 and 2 of table
The utility model has the advantages that the preparation side for the ceramic base PCB copper-clad plate that a kind of novel graphene provided by the utility model is modified
Method has the advantage that (1) manufacture craft is simple, cost is relatively low, and the operation cycle is short, Repeatability compared with the existing technology
It is good, it is suitble to volume production；(2) by growing graphite with chemical vapor deposition method between ceramic base semi-cured sheet of copper clad plate and copper foil
Alkene lays the requirements at the higher level of pcb board for the 5G epoch so that the calorifics of copper-clad plate, electrical and mechanical performance greatly promote
Basis.And common PCB medium is FR4 material, the dielectric constant of relative atmospheric is 4.2-4.7.This dielectric constant is meeting
It varies with temperature, within the temperature range of 0-70 degree, maximum changing range can achieve 20%.The variation meeting of dielectric constant
Lead to the variation of circuit delay 10%, temperature is higher, is delayed bigger.Dielectric constant can also change with signal frequency, and frequency is higher
Dielectric constant is smaller.100M or less can use capacitor and delay between 4.5 computing boards.Internal layer in the pcb board of general FR4 material
The transmission speed of signal is 180ps/inch (1inch=1000mil=2.54cm).
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model.
Specific embodiment
The utility model is further described below with reference to embodiment.
As shown, 31 be upper copper；21 be upper layer graphene (thickness is within 40-200nm)；1 is ceramic substrate；
22 be lower layer's graphene；32 be lower copper foil.
A kind of embodiment 1: preparation method for the ceramic base PCB copper-clad plate that novel graphene is modified, comprising the following steps:
S1: by weight, 98 parts of Al are weighed2O3Powder, 0.5 part of MgO powder, 0.6 part of CaO powder, 0.9 part of SiO2Powder,
The partial size of powder is 0.3 ± 0.05 micron, and load weighted powder is put into ball mill, 500ml alcohol is added, with 300r/min
Speed, ball milling 6 hours.
S2: dry-pressing formed with the pressure of 3MPa with dry-pressing formed machine after drying by mixture obtained in step S2.
S3: ceramic body obtained in step S2 is placed in Muffle, is sintered 10 hours with 960 DEG C.
S4: being cut to required thickness for ceramics obtained in step S3, and is polishing to 2000 mesh sand paper smooth.
S5: the potsherd obtained by step S4 method is placed in chemical vapor depsotition equipment cavity, carries out stone
Black alkene growth.During graphene growth, chemical vapor depsotition equipment vacuum degree is 2 × 10-4Mbar, growth temperature are 378 DEG C.
S6: the upper and lower surface of sample obtained in step S5 is put into copper foil, is put into hot pressing furnace and carries out hot pressing.Hot pressing item
Part is that vacuum degree is extracted into 2 × 10-4It after mbar, starts to warm up, temperature-rise period is first quickly to be raised to 150 DEG C with 50 minutes, is then used
100 minutes are warming up to 402 DEG C.Soaking time is 150 minutes.The process of pressurization is divided into two steps, and temperature-rise period applies pressure
For 2MPa, it is 2.5MPa that insulating process, which applies pressure,.
S7: after step S6 process, being naturally cooling to room temperature, then release, and release speed is 0.05MPa/s.It will pressure
The modified ceramic base PCB copper-clad plate of the graphene got togather is taken out from hot pressing furnace, obtains desired sample to the end.
Embodiment 2:
A kind of preparation method for the ceramic base PCB copper-clad plate that novel graphene is modified, comprising the following steps:
S1: by weight, 98.5 parts of Al are weighed2O3Powder, 0.3 part of MgO powder, 0.3 part of CaO powder, 0.9 part of SiO2Powder
Body, the partial size of powder are 0.3 ± 0.05 micron, and load weighted powder is put into ball mill, 500ml alcohol is added, with 300r/
Min speed, ball milling 6 hours.
S2: dry-pressing formed with the pressure of 3MPa with dry-pressing formed machine after drying by mixture obtained in step S2.
S3: ceramic body obtained in step S2 is placed in Muffle, is sintered 10 hours with 960 DEG C.
S4: being cut to required thickness for ceramics obtained in step S3, and is polishing to 2000 mesh sand paper smooth.
S5: the potsherd obtained by step S4 method is placed in chemical vapor depsotition equipment cavity, carries out stone
Black alkene growth.During graphene growth, chemical vapor depsotition equipment vacuum degree is 2 × 10-4Mbar, growth temperature are 380 DEG C.
S6: the upper and lower surface of sample obtained in step S5 is put into copper foil, is put into hot pressing furnace and carries out hot pressing.Hot pressing item
Part is that vacuum degree is extracted into 1 × 10-4It after mbar, starts to warm up, temperature-rise period is first quickly to be raised to 150 DEG C with 50 minutes, is then used
100 minutes are warming up to 395 DEG C.Soaking time is 180 minutes.The process of pressurization is divided into two steps, and temperature-rise period applies pressure
For 3MPa, it is 3.5MPa that insulating process, which applies pressure,.
S7: after step S6 process, being naturally cooling to room temperature, then release, and release speed is 0.05MPa/s.It will pressure
The modified ceramic base PCB copper-clad plate of the graphene got togather is taken out from hot pressing furnace, obtains desired sample to the end.
The hot of ceramic base PCB copper-clad plate, electricity and the machine being modified by the graphene that embodiment 1 and embodiment 2 obtain
Tool performance is as shown in table 1.
The above is only the preferred embodiment of the utility model, it should be pointed out that: for the common skill of the art
For art personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these improve and
Retouching also should be regarded as the protection scope of the utility model.
Claims (3)
1. a kind of modified ceramic base PCB copper-clad plate of graphene, which is characterized in that including ceramic base prepreg, copper foil；Ceramics
One layer of chemical vapor deposition graphene is equipped between base prepreg, copper foil.
2. a kind of modified ceramic base PCB copper-clad plate of graphene, which is characterized in that including ceramic base prepreg, copper foil；Ceramics
The two sides of base prepreg is all one layer of chemical vapor deposition graphene, and the outside of graphene is copper foil.
3. the modified ceramic base PCB copper-clad plate of graphene according to claim 1 or 2, which is characterized in that the thickness of graphene
Degree is 40-200nm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820853052.7U CN209052591U (en) | 2018-06-04 | 2018-06-04 | A kind of ceramic base PCB copper-clad plate that graphene is modified |
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|---|---|---|---|
| CN201820853052.7U CN209052591U (en) | 2018-06-04 | 2018-06-04 | A kind of ceramic base PCB copper-clad plate that graphene is modified |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108409310A (en) * | 2018-06-04 | 2018-08-17 | 南京大学 | The ceramic base PCB copper-clad plates and preparation method that a kind of graphene is modified |
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2018
- 2018-06-04 CN CN201820853052.7U patent/CN209052591U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108409310A (en) * | 2018-06-04 | 2018-08-17 | 南京大学 | The ceramic base PCB copper-clad plates and preparation method that a kind of graphene is modified |
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