A kind of ald vacuum coater produced for solar battery sheet
Technical field
The present invention relates to technical field of vacuum plating, be specifically related to solar cell vacuum coater based on technique for atomic layer deposition.
Background technology
Efficiently crystal silicon battery is an important development trend of photovoltaic industry.For increasing the photoelectric transformation efficiency of crystal silicon battery to greatest extent, crystal silicon battery surface passivation technology is one of necessary means of high-efficiency battery manufacture.And along with improving further of battery production technology is being updated and improved.
Ald (Atomic layer deposition, ALD) technology is a film deposition techniques based on surface chemistry gas phase is reacted.It is by being introduced separately reaction chamber by two or more chemical gas predecessors, make each predecessor, on surface, base, the most saturated surface chemical reaction occur respectively, gas phase product reacted to saturated surface and unreacted gas purging are clean therebetween, therefore material can be plated in substrate surface with monatomic form membrane, and in the range of the thickness of the film deposited and the uniformity are accurately controlled in atomic layer level thickness.It is different from traditional film deposition techniques, such as physical vapour deposition (PVD) (Physical Vapor Deposition, PVD), chemical gaseous phase deposition (Chemical Vapor Deposition) etc., ALD can form the special performance such as high-quality, free of pinholes, conformality film at on-plane surface labyrinth and three-dimensional structure surface.Ald (ALD) technology, as one of state-of-the-art film deposition techniques, is widely used to the manufacturing industry such as the microelectronics of advanced person, display, MEMS, inductor, photovoltaic cell.For efficient crystal silicon battery, the made thin-film material of ald, such as alundum (Al2O3), silica etc. can be as field-effect passivating film, extend electronics and the binding time in hole pair by reducing crystal silicon surface defect, thus increase minority carrier life time, reach to increase photoelectric transformation efficiency.But be limited to lack effective batch production type apparatus for atomic layer deposition, this technology fails to realize the industrialization of solar battery sheet always and produces.
Summary of the invention
1, the technical problem to be solved
For in prior art, in ALD course of reaction, reacting gas mixes in air inlet pipe or gas distribution tube, chemical reaction is just there is in entering reaction cavity, and existing ALD device cannot carry out ald in high volume, entering batch production pattern, the present invention proposes a kind of apparatus for atomic layer deposition that can produce in batches.
By the Specialty Design to inner chamber body, with a narrow inner chamber body passage, and control the flow direction of atom air-flow with pumping airflow, allow more substrate be placed in this atmosphere, by the control of the amount to source, deposit one or more layers atomic layer, the method film forming is uniform, is better than CVD vapor deposition film.This device has also used shower plate technology, can effectively stop the generation of CVD film.
The present invention, by application shower plate technology, makes the problem of the inhomogeneities of reacting gas distribution in existing ALD technique have been resolved;Inner cap and the outer chamber lid of inner chamber body are link gears, and outer chamber lid is closed simultaneously, and shower plate also simultaneously closes off;Ensure that the atomic layer of inner chamber body is not leak into extraneous areas by pressure differential in interior outer chamber, pumping airflow direction can only be followed, participate in ald;This device is also equipped with exhaust gas processing device, uses multilayer filter disc, then is passed through air reaction, eliminates tail gas, generates innocuous substance.
2, technical scheme.
Vacuum apparatus for atomic layer deposition, described device includes outer chamber, inner chamber body, shower plate, heating system, cooling system, process gas system, vavuum pump and exhaust gas processing device;Inner chamber body is placed on the center of outer chamber, and centre is supported by support, and shower plate is located at inner chamber body top and simultaneously for the top cover of inner chamber body;Heating system is located at outside inner chamber body, and cooling system is located at outside outer chamber, and process gas system is connected with inner chamber body by process gas pipeline and pulse valve, and inner chamber body is connected with exhaust gas processing device, vavuum pump successively by process gas pipeline;It is characterized in that, described shower plate is fixed with outer chamber lid by connecting shaft and spring.
Outer chamber and inner chamber body are horizontal positioned, and outer chamber lid and vacuum line are arranged on the side of outer chamber, and solar battery sheet is entered inner chamber body by outer chamber lid in batches, is loaded.
Process gas system produces the gas required for ALD reacts by chemical reaction, and is fed gas in inner chamber body by the connection of process gas pipeline;The bleeding point of inner chamber body, through the flange at tail end of outer chamber, the tail end outer wall of inner chamber body and the inside-wall surface contact of the flange at tail end of outer chamber, has space, is not fully insulated between inner chamber body and outer chamber, the internal outer chamber of vavuum pump is bled simultaneously.Outer chamber is provided with adjustable gas flow measuring unit, by adjusting inner chamber body and outer chamber contact surface gap and interior outer chamber gas flow, can control the pressure differential of inside and outside cavity, and make outer chamber pressure more than inner chamber body pressure.
Vavuum pump can internally be bled by outer chamber simultaneously, and interior outer chamber reaches pressure balance by injecting appropriate inert gas, meets technological requirement.Reach, with the regulation of technique nitrogen, the pressure that interior outer chamber is different, it is ensured that the air-flow of interior reaction chamber and the flow direction are stable by vavuum pump.
Shower plate and outer chamber lid are connected by four connecting shafts, and shower plate slides in connecting shaft, sheathed four high temperature resistant springs in described connecting shaft.The present invention uses cylinder to be compressed by exocoel lid and seals, and while closing outer chamber lid, is compressed by shower plate by spring force, it is achieved shower plate and the sealing of inner chamber body.
Heating system is located at outside inner chamber body, for heating bore body, reaches the temperature required for ALD reaction;Cooling system is located at outside outer chamber, for cooling down outer chamber and needing seal etc. to need to keep the parts of certain low temperature for cooling.It is provided with thermal insulation board in the middle of described shower plate and outer chamber lid.
Process gas through outer chamber, enters inner chamber body flange by pipeline, inner chamber body flange has the hole connecting outer chamber, then is flowed into shower plate by the gas outlet of inner chamber body flange.
Another embodiment is, process gas and carrier gas are connected with shower plate by pipeline, then process gas and carrier gas is sprayed from shower plate under vacuo.
Described shower plate is provided with air inlet pipe and gas distribution tube;Air inlet pipe is separate and gas distribution tube is separate.
Equipped with the ALD triple valve of tape pulse on the pipeline of process gas, by the control of ALD pulse valve being reached the control to the process gas scale of construction, thus control the thickness of film on substrate or the number of plies of atomic deposition.
Exhaust gas processing device is connected between vavuum pump and inner chamber body, by bleeding, is evacuated in exhaust gas processing device by the tail gas of cavity, is re-filled with certain amount of air and reacts, generates harmless particle.
Solar battery sheet batch is vertically disposed on supporting boat, and multiple supporting boats, from side loading, are placed in inner chamber body, and solar battery sheet is parallel to flow of process gases direction.
3, the technical scheme using the present invention to provide, compared with existing known technology, has a following remarkable result:
The present invention by the unique design to inner chamber body, keeps consistent, under the effect of vavuum pump with the external form of the carrier of carrying substrates, it is ensured that the flow direction of air-flow and uniform and stable, with applicable batch production;By the design of shower plate, ald is allowed to be confined in the narrow space of inner chamber;The air inlet process gas pipeline of shower plate reacting gas and distribution process gas pipeline are completely self-contained, ensure that reacting gas is completely independent before entering reaction chamber, completely avoid the generation of CVD, and be evenly distributed in air-flow reaction chamber, be beneficial to the atomic deposition layer obtained;Exhaust gas processing device, by dangerous gas, with air reaction under the effect of the filter disc of multilayer, generates harmless material, and the production making device is more environmentally-friendly.
Solar battery sheet is vertically disposed on supporting boat, is parallel to flow of process gases direction, it is ensured that the uniformity of every the plated film of cell piece, and particulate pollutant can be avoided to be attached on cell piece, it is ensured that the made passivating film of high-quality ald.
Accompanying drawing explanation
Fig. 1 vacuum of the present invention apparatus for atomic layer deposition structure chart.
Wherein, 1-inner chamber body;6-shower plate;;9-outer chamber;10-heating system;11-cooling system;12-ALD valve;13-exhaust gas processing device;14-vavuum pump;15-0-inert gas carrier;15-1 the first material source bottle;15-2 the second material gas reaction source;15-3 the 3rd material source bottle;15-4 the 4th material source bottle;.
The structural representation of the inner chamber body of Fig. 2 present invention.
Wherein, 1-inner chamber body;2-inner chamber body flange;The flange at tail end of 3-inner chamber body;4-bleeding point;5-process gas mouth.
The structural representation of the shower plate of Fig. 3 present invention.
Wherein, 6-shower plate;6-1 shower plate air inlet;6-2 mouth spray;6-3 shower plate fixes seat.
The front view of the connection of Fig. 4 A shower plate of the present invention and outer chamber lid.
Wherein, 6-shower plate;7-outer chamber lid.
The side view of the connection of Fig. 4 B shower plate of the present invention and outer chamber lid.
Wherein, 6-shower plate;7-outer chamber lid;8-thermal insulation board.
Detailed description of the invention
Below in conjunction with Figure of description and specific embodiment, the present invention is described in detail.
As it is shown in figure 1, be the structural representation of vacuum atomic layer unit.
Described device includes inner chamber body 1, shower plate 6, outer chamber 9, heating system 10, cooling system 11, process gas system 15, vavuum pump 14 and exhaust gas processing device 13.
Inner chamber body 1 is located on the support in outer chamber 9, and shower plate 6 is located at inner chamber body 1 top, and shower plate 6 is the top cover of inner chamber body 1 simultaneously;Heating system 10 is located at outside inner chamber body 1, cooling system 11 is located at outside outer chamber 9, process gas system is connected with inner chamber body 1 by process gas pipeline and pulse valve 12, inner chamber body 1 is connected with exhaust gas processing device 13, vavuum pump 14 successively by vacuum pipe, after reacting gas is discharged in inner chamber body, first pass through exhaust gas processing device 13 to process, enter vavuum pump 14.
Process gas system provides various different reacting gas sources, purging inert gas 15-0 for ALD reaction, wherein the first material source bottle 15-1, second material source bottle 15-2,3rd material source bottle 15-3, in 4th material source bottle 15-4, hold different liquid or solid source material chemicals respectively, by inert gas, the source material chemicals of needs is set out, second material source bottle 15-2 is gas source, holds gaseous chemical source.All reacting gas sources are all connected with inert gas, the carrier gas that inert gas reacts as ALD and purging gas.
Substrate is placed in inner chamber body 1, is reacted by ALD, and gas occurs chemical reaction on substrate, forms plated film.
As in figure 2 it is shown, be the structural representation of the inner chamber body of vacuum apparatus for atomic layer deposition, inner chamber body 1 is provided with inner chamber body flange 2, and inner chamber body flange 2 is provided with bleeding point 4, and this bleeding point connects vacuum extractor, the vacuum state in ensureing inner chamber body 1;The afterbody of inner chamber body 1 is provided with flange at tail end 3, and flange at tail end 3 is provided with process gas mouth 5.
As it is shown on figure 3, be the structural representation of shower plate 6, shower plate 6 is provided with air inlet 6-1, mouth spray 6-2, shower plate fixed plate 6-3;Shower plate 6 is fixed with outer chamber lid by shower plate fixed plate 6-3, and in the present embodiment, air inlet is provided with 4, lays respectively on four angles of shower plate.
As shown in Figure 4 A and 4 B shown in FIG., described shower plate 6 is connected by the inner chamber body flange 2 of inner chamber body 1 is fixing with inner chamber body 1, and described shower plate 6 is fixed with outer chamber lid 7 by connecting shaft and spring.
Below schematically creation and embodiment thereof to the present invention is described, and protection scope of the present invention includes but not limited to the description above.Shown in accompanying drawing is also one of embodiment of the invention, and actual structure is not limited thereto.So; if those of ordinary skill in the art is enlightened by the present invention; in the case of without departing from the creation objective of the present invention, design the frame mode similar to technical scheme and embodiment without creative, the protection domain of this patent all should be belonged to.