CN105904960B - Cooling module - Google Patents
Cooling module Download PDFInfo
- Publication number
- CN105904960B CN105904960B CN201610099015.7A CN201610099015A CN105904960B CN 105904960 B CN105904960 B CN 105904960B CN 201610099015 A CN201610099015 A CN 201610099015A CN 105904960 B CN105904960 B CN 105904960B
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- China
- Prior art keywords
- condenser
- radiator
- refrigerant
- cooling module
- pipe
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K11/00—Arrangement in connection with cooling of propulsion units
- B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
- B60K11/04—Arrangement or mounting of radiators, radiator shutters, or radiator blinds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
- F28D1/0426—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids with units having particular arrangement relative to the large body of fluid, e.g. with interleaved units or with adjacent heat exchange units in common air flow or with units extending at an angle to each other or with units arranged around a central element
- F28D1/0452—Combination of units extending one behind the other with units extending one beside or one above the other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0234—Header boxes; End plates having a second heat exchanger disposed there within, e.g. oil cooler
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0043—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for fuel cells
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/008—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for vehicles
- F28D2021/0084—Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/008—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for vehicles
- F28D2021/0091—Radiators
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Air-Conditioning For Vehicles (AREA)
- Details Of Heat-Exchange And Heat-Transfer (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
the present invention provides a cooling module, comprising: a first radiator configured to cool the fuel cell stack; a second heat sink arranged in a predetermined region in front of the first heat sink in an air flow direction and configured to cool the electronic components; a first condenser disposed in other remaining area in front of the first radiator in an air flow direction and heat-exchanging with ambient air to condense refrigerant; and a second condenser disposed in the second radiator and heat-exchanged with the coolant to condense the refrigerant. Therefore, in the cooling module of the present invention, since the second radiator and the first condenser are disposed side by side with each other in front of the first radiator and the second condenser is disposed inside the second radiator, the refrigerant condensing performance can be improved while reducing the size of the cooling module.
Description
Technical Field
The present invention relates to a cooling module, and more particularly, to a cooling module in which a second radiator and a first condenser are arranged side by side with each other in front of a first radiator, and the second condenser is disposed within the second radiator, thereby reducing the size while supporting high refrigerant condensation performance.
Background
Generally, in a vehicle in which an internal combustion engine is mounted, heat generated at the time of operation of the engine is transmitted to a cylinder head, a piston, and a valve, and therefore, when the temperature of these components excessively rises, they thermally expand or thermally degrade, resulting in strength degradation, shortened life of the engine, deteriorated combustion, and knocking or pre-ignition to reduce the output of the engine.
in addition, when the fuel cell stack is not completely cooled, the oil film of the inner circumferential surface of the cylinder is cut off, which reduces the lubricating function, the oil changes to cause abnormal friction of the cylinder, and the piston is welded to the inner wall surface of the cylinder.
in a vehicle, electric/electronic components including a motor, an inverter, and a stack need to be cooled in addition to a fuel cell stack, and here, since a coolant passing through the fuel cell stack and a coolant passing through the electric/electronic components are different in temperature, they cannot have a single cooling system.
fig. 1 is a cooling system for a vehicle, in which fig. 1(a) shows a fuel cell stack cooling system and fig. 1(b) shows an electronic component cooling system.
in detail, the fuel cell stack cooling system 10 includes: a water pump 15 that circulates a coolant for cooling the fuel cell stack 1; a first radiator 11 that cools the coolant; a first coolant storage tank 13 that supplies coolant to the first radiator 11; the first coolant adjustment cap 12.
Here, in the fuel cell stack cooling system 10, the first radiator 11, the water pump 15, and the fuel cell stack 1 are connected by the first connection line 14.
in addition, the electronic component cooling system 20 includes: a water pump 25 that circulates a coolant for cooling the electronic component 2; a second radiator 21 that cools the coolant; a second coolant storage tank 23 that supplies coolant to the second radiator 21; a second coolant adjustment cap 22.
Here, an example of an electronic component cooling system 20 formed to include an electronic component 2 is shown, wherein the electronic component 2 includes an inverter and a starter/generator.
in addition, similarly to the fuel cell stack cooling system 10, in the electronic component cooling system 20, the second radiator 21, the water pump 25, and the electronic component 2 are connected by the second connection line 24.
here, the first and second radiators 11 and 21 include a condenser 30, a fan and shroud assembly 40 forming a cooling module 50, and exchange heat with wind and air introduced through the fan and shroud assembly 40.
an example of a cooling module 50 is shown in fig. 2.
However, the cooling module 50 shown in fig. 2 is difficult to have sufficient condensing efficiency because the area where the second radiator 21 is formed is reduced in size of the condenser 30, and it is also difficult for the second radiator 21 to ensure that a sufficient amount of coolant flows in the second radiator 21.
Another example of a cooling module 50 is shown in fig. 3.
the cooling module 50 shown in fig. 3 includes the condenser 30, the second radiator 21, and the first radiator 11 arranged in parallel in the direction of air flow. However, in the configuration of fig. 3, the air heated by the condenser 30 passes through the second radiator 21, which negatively affects the performance of the second radiator 21.
further, the temperature of the air supplied to the second radiator 21 significantly differs depending on the load amount of the condenser 30, so that it is difficult to ensure stable performance of the second radiator 21.
Therefore, it is required to develop a cooling module that can be reduced in size while ensuring sufficient performance of the first radiator, the second radiator, and the condenser constituting the cooling module.
Documents of the related art
(patent document 1) korean patent publication No. 2013-0012968 (title of invention: cooling module and control method thereof)
disclosure of Invention
the present invention provides a cooling module in which a second radiator and a first condenser are arranged side by side with each other in front of a first radiator, and the second condenser is disposed in the second radiator, thereby improving cooling condensation performance of the cooling module while reducing the size of the cooling module.
The present invention also provides a cooling module in which a second radiator and a first condenser are arranged side by side with each other to reduce the amount of pressure drop of air, eliminating a reduction in the amount of wind, thereby improving the cooling performance of coolant and the condensing performance of the condenser.
The present invention also provides a cooling module in which wind is not blocked by a tube and the construction of the tube is simplified to facilitate assembly, which leads to a reduction in size.
In one aspect, a cooling module includes: a first radiator configured to cool the fuel cell stack; a second heat sink arranged in a predetermined region in front of the first heat sink in an air flow direction and configured to cool the electronic components; a first condenser disposed in other remaining area in front of the first radiator in an air flow direction and heat-exchanged with ambient air to condense refrigerant, the cooling module further comprising: and a second condenser disposed in the second radiator and heat-exchanged with the coolant to condense the refrigerant. Therefore, in the cooling module of the present invention, since the second radiator and the first condenser are arranged side by side with each other in front of the first radiator and the second condenser is provided inside the second radiator, it is possible to improve the refrigerant condensation performance while reducing the size of the cooling module.
The second heat sink may include: a pair of first header tanks configured to include a combination of a header and a tank, and disposed side by side with each other and spaced apart from each other by a predetermined distance; a first pipe having both ends fixed to the first header tank to form an electronic component coolant flow passage; and a first fin interposed between the first tubes, so that the second condenser can be disposed within the first header tank. Specifically, in the cooling module, the first header tanks of the second radiators are spaced apart in the height direction, and the second condenser may be disposed in the first header tank located at the lower side, whereby the coolant may be efficiently cooled by the wind, and the refrigerant may be efficiently cooled by the cooled coolant.
The cooling module may further include: an inlet pipe configured to supply the refrigerant to the second condenser; a connection pipe configured to supply the refrigerant having passed through the second condenser to the first condenser; an outlet pipe configured to discharge the refrigerant having passed through the first condenser, whereby the refrigerant may be supplied to the second condenser, the second condenser and the first condenser may be connected, and the refrigerant of the first condenser may be discharged.
specifically, the first condenser may include: a pair of second header tanks disposed side by side with each other and spaced apart from each other by a predetermined distance; a second pipe having both ends fixed to a second header tank to form a refrigerant flow path; a second fin interposed between the second tubes; and a vapor-liquid separator provided on one side of the second header tank, whereby the second condenser is a water-cooled condenser cooled by a cooling liquid, and the first condenser may be an air-cooled condenser cooled by air.
In the cooling module, the second header tanks are disposed to be spaced apart from each other in a width direction of the vehicle, the vapor-liquid separator is disposed adjacent to the second radiator, and one side of the connection pipe is connected to an upper region of the second header tank in which the vapor-liquid separator is disposed, whereby wind is not blocked by the pipe and connection of the pipe can be simplified.
In particular, the connection tube may comprise: a first pipe unit arranged side by side in a length direction with a first header tank provided with a second condenser; and a second pipe unit configured to extend from the first pipe unit and to be bent in a length direction of the vapor-liquid separator, whereby a flow of wind passing through the first pipe and the first fin forming region of the second radiator and the second pipe and the second fin forming region of the first condenser, which are in direct heat exchange with ambient air, is not interfered with.
the connection pipe may include: a1 st-1 st pipe unit bent from a left lower end of the second radiator and arranged along an outer side surface of the second radiator in a vertical direction; and a2-1 st tube unit disposed along an upper surface of the second radiator in a direction toward the first condenser.
The outlet pipe may be formed in the second header tank which is not provided with the vapor-liquid separator.
With the cooling module constructed as described above, the refrigerant introduced through the inlet pipe is condensed in the first region by the second condenser, introduced through the connection pipe and condensed while passing through a predetermined region of the first condenser in the second region, vapor-liquid separated by the vapor-liquid separator in the third region, the liquid-phase refrigerant separated by the vapor-liquid separator is supercooled in the fourth region, and then discharged through the outlet pipe, where the second zone has an even number of paths, so that the refrigerant is transferred from the second header tank connected to the vapor-liquid separator to the second header tank not connected to the vapor-liquid separator, and then returns again, since the outlet pipe is arranged in the second header tank without connecting the vapor-liquid separator, the fourth zone has an odd number of paths, and thus, the second tubes of the first condenser have an odd number of paths.
According to the configuration of the present invention, in the cooling module, when the second condenser is not provided in the second radiator, the first condenser may be configured to be equal to or larger than the second radiator.
In the cooling module, when the second condenser is included in the second radiator, the second radiator may be configured to be larger than the first condenser.
Therefore, in the cooling module of the present invention, since the second radiator and the first condenser are arranged side by side with each other in front of the first radiator and the second condenser is provided inside the second radiator, the cooling module can have enhanced refrigerant condensation performance while being reduced in size.
In particular, in the cooling module of the present invention, since the second radiator and the first condenser are arranged side by side with each other, the amount of pressure drop of air is reduced without reducing the amount of wind, which improves the cooling performance of the coolant and the condensing performance of the condenser.
In addition, in the cooling module of the present invention, wind is not blocked by the duct, and the construction of the duct is simplified to facilitate assembly and reduce the size of the cooling module.
drawings
Fig. 1 is a view showing a cooling system for a vehicle.
fig. 2 and 3 are views schematically showing a related art cooling module.
Fig. 4 to 6B are a perspective view, an exploded perspective view, and a front view of a cooling module according to an embodiment of the present invention.
Fig. 7 is a schematic cross-sectional view of a region forming a second heat sink of the cooling module according to an embodiment of the invention.
fig. 8 is a schematic cross-sectional view of a region of a first condenser forming a cooling module according to an embodiment of the invention.
Fig. 9 and 10 are views illustrating an example of a second condenser of the cooling module according to the embodiment of the present invention.
Fig. 11 is a view illustrating a flow of refrigerant in a cooling module according to an embodiment of the present invention.
Fig. 12 is a view showing another flow of the refrigerant in the cooling module according to the embodiment of the present invention.
fig. 13 to 16 are views illustrating another flow of the refrigerant in the cooling module according to the embodiment of the present invention.
fig. 17A and 17B are views showing examples of differently sized second radiators and first condensers constituting a cooling module according to an embodiment of the present invention.
Detailed Description
Hereinafter, the cooling module 1000 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
fig. 4 to 6B are a perspective view, an exploded perspective view, and a front view of the cooling module 1000 according to the embodiment of the present invention, fig. 7 is a schematic sectional view of a region where the second heat sink 200 of the cooling module 1000 is formed according to the embodiment of the present invention, and fig. 8 is a schematic sectional view of a region where the first condenser 300 of the cooling module 1000 is formed according to the embodiment of the present invention.
The cooling module 1000 according to the embodiment of the present invention includes a first radiator 100, a second radiator 200, a first condenser 300, and a second condenser 400.
The first heat sink 100 (for cooling the components of the fuel cell stack) may include: a pair of water collecting tanks 110 disposed side by side with each other and spaced apart from each other by a predetermined distance; a pipe 120, both ends of the pipe 120 being fixed to the header tank 110; and fins 130 interposed between the tubes 120. That is, when the coolant for cooling the fuel cell stack flows in the first radiator 100, the first radiator 100 may exchange heat with ambient air to cause the coolant to be cooled.
The second heat sink 200 (a component for cooling the electronic components) is disposed in a predetermined area in front of the first heat sink 100 in the air flow direction. The electronic component is an electronic component including a motor, an inverter, and a stack other than the fuel cell stack, or may be an electronic component whose heating temperature is lower than that of the fuel cell stack and which is to be cooled. Here, the second radiator 200 may include a first header tank 210, first tubes 220, and first fins 230.
the first water collecting tanks 210 are disposed side by side in pairs and spaced apart from each other by a predetermined distance, and the first water collecting tanks 210 are formed by a combination of the header 211 and the water tank 212. The header 211 has pipe insertion holes (not shown) formed to have a size corresponding to the first pipes 220 so that the first pipes 220 can be inserted therein and form a space in which the electronic component cooling liquid flows. Here, the second condenser 400 is installed in one of the first header tanks 210, and the first header tank 210 has a perforated portion 212a to supply the refrigerant to the second condenser 400 and discharge the refrigerant from the second condenser 400.
both ends of the first tubes 220 are fixed to the first header tank 210 to form a coolant flow passage, and the first fins 230 are interposed between the first tubes 220.
Here, the first header tanks 210 of the second radiator 200 are spaced apart from each other in a height direction, and the second condenser 400 is disposed in the upper first header tank 210 or the lower first header tank 210.
The first condenser 300 is disposed in front of the first radiator 100 in the air flow direction and is disposed side by side with the second radiator 200. That is, the first condenser 300 is disposed in front of the first radiator 100 together with the second radiator 200, where the second radiator 200 is disposed in a predetermined area in front of the first radiator 100 and the first condenser 300 is disposed in other area in front of the first radiator 100. That is, fig. 7 and 8 are sectional views of the cooling module 1000 in the lateral direction according to the embodiment of the present invention, and in particular, fig. 7 illustrates an area where the second radiator 200 is formed, and fig. 8 illustrates an area where the first condenser 300 is formed. Therefore, in the cooling module 1000 according to the embodiment of the present invention, the second radiator 200 and the first condenser 300 are arranged side by side with each other in front of the first radiator 100, and since the second condenser 400 is provided in the second radiator 200, it is possible to improve the refrigerant condensation performance while reducing the size of the cooling module 1000.
In addition, the first condenser 300 (an assembly that exchanges heat with ambient air to condense refrigerant) includes a second header tank 310, second tubes 320, second fins 330, and a vapor-liquid separator 340.
The second header tanks 310 are spaced apart from each other by a predetermined distance and are arranged side by side with each other.
Both ends of the second pipe 320 are fixed to the second header tank 310 to form a refrigerant flow channel. Here, the second fins 330 are inserted between the second tubes 320.
The vapor-liquid separator 340 is connected to one of the second header tanks 310 to separate vapor-phase refrigerant and liquid-phase refrigerant, and the vapor-liquid separator 340 has a structure in which vapor-phase refrigerant is delivered to the upper side and liquid-phase refrigerant is delivered to the lower side, so that only liquid-phase refrigerant eventually flows to the second pipe 320 to cause supercooling. Here, in the cooling module 1000, the second header tanks 310 of the first condenser 300 are disposed to be spaced apart from each other in the width direction of the vehicle, and the vapor-liquid separator 340 is connected to the second header tank 310 disposed adjacent to the second radiator 200.
Here, the cooling module 1000 of the present invention may include a fan and shroud assembly 600, and in fig. 7 and 8, examples in which the fan and shroud assembly 600 is disposed behind the first heat sink 100 in an air flow direction are shown.
The second condenser 400 (an assembly that cools the refrigerant together with the first condenser 300) is disposed in the first header tank 210 of the second radiator 200 and exchanges heat with the electronic assembly to cool the refrigerant. As the second condenser 400, various types of condensers may be provided in the first header tank 210 of the second radiator 200, fig. 9 shows a double-pipe condenser, and fig. 10 shows a stacked condenser using plates 430. The second condenser 400 shown in fig. 9 is a double-tube condenser having an inner tube 422 and an outer tube 421, in which refrigerant flows between the inner tube 422 and the outer tube 421, and an electronic component cooling liquid flows inside the inner tube 422 and outside the outer tube 421, thereby performing heat exchange. Fig. 9 shows an example in which an inner fin (not shown) is provided between the inner tube 422 and the outer tube 421. Shown in fig. 10 is a type in which a refrigerant flows in the inner space formed by the plate 430, and the electronic component cooling liquid flows at the outside thereof, causing heat exchange between the two. Both configurations shown in fig. 9 and 10 include a pair of inlet/outlet boss portions 410, the inlet/outlet boss portions 410 being fixed to a perforated portion formed in the first header tank 210 and allowing refrigerant to flow in and out through the inlet/outlet boss portions 410.
In the cooling module 1000 according to the embodiment of the present invention, preferably, the refrigerant passes through the second condenser 400 and is then supplied to the first condenser 300. Accordingly, an inlet pipe 510 allowing refrigerant to flow therethrough is connected to one of the inlet/outlet boss parts 410, and a connection pipe 520 allowing refrigerant to be discharged therefrom to be supplied to the first condenser 300 is connected to the other of the inlet/outlet boss parts 410. Further, the first condenser 300 includes an outlet pipe 530 for discharging the refrigerant having passed through the first condenser 300.
The inlet pipe 510 extends from the lower side in the width direction of the vehicle to supply the refrigerant to the inlet/outlet boss portion 410, and the connection pipe 520 supplies the refrigerant having passed through the second condenser 400 to the first condenser 300. In other words, the refrigerant supplied to the second condenser 400 through the inlet pipe 510 is heat-exchanged with the electronic component cooling liquid to be cooled for a first time, the refrigerant supplied to the first condenser 300 through the connection pipe 520 is heat-exchanged with the ambient air to be cooled for a second time, and then the refrigerant is vapor/liquid separated, supercooled, and then discharged through the outlet pipe 530.
The inlet pipe 510, the connection pipe 520, and the discharge pipe 530 may be variously formed according to the positions of the first condenser 300, the second condenser 400, and the second radiator 200, and their configurations and internal refrigerant flows will be described in more detail below.
in the cooling module 1000 shown in fig. 4 to 6B, the following configuration is shown as an example: the second condenser 400 is provided in the first header tank 210, the second header tank 310 is formed in the width direction of the vehicle, and the vapor-liquid separator 340 is disposed at one first header tank 310 (located at a central portion in the width direction of the vehicle) of a pair of first header tanks 310 adjacent to the second radiator 200, whereby the connection pipe 520 is connected to an upper portion of the second header tank 310 connected to the vapor-liquid separator 340 of the first condenser 300, thereby simplifying the pipe.
In detail, the connection pipe 520 includes a first pipe portion 521, the first pipe portion 521 being arranged side by side with the first header tank 210 provided with the second condenser 400 along a length direction (width direction), and a second pipe portion 522 extending from the first pipe portion 521 and bent along a length direction (height direction) of the vapor-liquid separator 340.
therefore, in the cooling module 1000 of the present invention, since the substantial heat exchange with the air by the first tube 220 and first fin 230 forming region of the second radiator 200 and the second tube 320 and second fin 330 forming region of the first condenser 300 is not interfered by the connection tube 520 connecting the first condenser 300 and the second condenser 400, the deterioration of the heat exchange performance can be prevented. Further, it is preferable that the outlet pipe 530 is formed in the second header tank 310 where the vapor-liquid separator 340 is not provided, and it is preferable that an extension portion of the outlet pipe 530 is fixed in parallel to the second header tank 310 together with the inlet pipe 510.
Meanwhile, in the present invention, the connection pipe may be constructed in the form shown in fig. 6B. Fig. 6A and 6B are front views of a cooling module 1000 according to the present invention. The cooling module 1000 of fig. 6A and 6B is different in the installation position of the connection pipe, and other components of the cooling module 1000 are the same.
That is, the connection pipe 520 serves to supply the refrigerant passing through the second condenser 400 to the first condenser 300. The connection pipe 520 shown in fig. 6B includes a1 st-1 st pipe part 521 and a2 nd-1 st pipe part 522, the 1 st-1 st pipe part 521 starting from the second condenser 400, being bent from a lower end of the left side of the second radiator 200 and extending along the outer side surface of the second radiator 200 in a vertical direction (height direction), and the 2 nd-1 st pipe part 522 being bent at an upper end of the left side and extending toward the first condenser 300 in a horizontal direction (width direction). That is, the connection pipe 520 shown in fig. 6B is configured to surround the side surface and the upper surface of the second radiator 200 and connect the second condenser 400 and the first condenser 300.
even though the connection pipes are connected by such a pipe configuration, the refrigerant supplied to the second condenser 400 through the inlet pipe 510 exchanges heat with the electronic component cooling liquid to be cooled for the first time, and the refrigerant supplied to the first condenser 300 exchanges heat with the ambient air to be cooled for the second time, undergoes vapor/liquid separation, is supercooled, and is then discharged through the outlet pipe 530.
fig. 11 is a view illustrating a flow of refrigerant in the cooling module 1000 according to an embodiment of the present invention, and fig. 12 is a view illustrating another flow of refrigerant in the cooling module 1000 according to an embodiment of the present invention (fig. 11 and 12 illustrate specific refrigerant flows of the configurations of fig. 4 to 6B). Here, as a specific refrigerant flow, the refrigerant introduced through the inlet pipe 510 passes through the second condenser 400 in the first region a1 to be condensed, the refrigerant introduced through the connection pipe 520 passes through a predetermined region of the first condenser 300 in the second region a2 to be condensed, the refrigerant is subjected to vapor-liquid separation by the vapor-liquid separator 340 in the third region A3, and the liquid-phase refrigerant separated by the vapor-liquid separator 340 is supercooled in the fourth region a4 and then discharged through the outlet pipe 530. That is, the heat exchange regions through the second tubes 320 of the first condenser 300 are the second region a2 and the fourth region a4, the second region a2 includes the 2-1 region a2-1 and the 2-2 region a2-2, in the 2-1 region a2-1, the refrigerant introduced substantially by the connection pipe 520 connected to the upper portion of the second header tank 310 adjacent to the vapor-liquid separator 340 flows to the other of the second header tanks 310 (i.e., the second header tank 310 not provided with the vapor-liquid separator 340), in the 2 nd-2 nd region a2-2, the refrigerant is returned to one of the second header tanks 310 (i.e., the second header tank 310 adjacent to the vapor-liquid separator 340), here, the area may be repeated to have an even number of partitions according to the number and position of partitions in the second header tank 310. The fourth area a4 is where only liquid-phase refrigerant, which is obtained after the refrigerant passes through the vapor-liquid separator 340 in the third area A3, flows to be supercooled. Since the outlet pipe 530 is formed at the other one of the second header tanks 130, the fourth area a4 has an odd number of paths.
Fig. 11 shows an example in which the second area a2 has two paths and the fourth area a4 has one path. Specifically, the refrigerant introduced into the second condenser 400 through the inlet pipe 510 is cooled by the electronic component cooling liquid (in the first region a 1), introduced into one of the second header tanks 310 through the connection pipe 520 and flows to the other of the second header tanks 310 through the second pipes 320 in the 2-1 region a2-1, and flows to one of the second header tanks 310 through the other second pipes 320 in the 2-2 region a2-2 to be cooled by ambient air (in the second region a 2), and the separated liquid-phase refrigerant passing through the vapor-liquid separator 340 (in the third region A3) flows to the second header tank 310 through the other second pipes 320 to be supercooled (in the fourth region a 4), and is discharged through the outlet pipe 530.
Fig. 12 shows another example in which the second region a2 has four paths and the fourth region a4 has one path, the example shown in fig. 12 is the same as the example shown in fig. 11 except that the second region a2 has four paths including the 2-1 st region a2-1, the 2-2 nd region a2-2, the 2-3 rd region a2-3, the 2-4 th region a2-4, in the 2-1 st region a2-1, the refrigerant is introduced into one of the second header tanks 310 through the connection pipe 520 and flows to the other of the second header tanks 310 through the second pipe 320, in the 2-2 nd region a2-2, the refrigerant flows to one of the second header tanks 310 through the other second pipe 320, in the 2-3 rd region a2-3, the refrigerant flows to the other of the second header tanks 310 through the other second pipe 320, and in the 2 nd to 4 th region a2-4, the refrigerant flows to one of the second header tanks 310 through the other second pipes 320.
Fig. 13 to 16 are views illustrating another flow of the refrigerant in the cooling module 1000 according to the embodiment of the present invention. First, fig. 13 shows an example of a configuration similar to that shown in fig. 11, but a second condenser 400 is provided in the first header tank 210 at the upper portion of the second radiator 200. Further, an inlet pipe 510 is connected to the left side of the second condenser 400, a connection pipe 520 is connected to the second header tank 310 of the first condenser 300 adjacent to the second condenser 400, and an outlet pipe 530 extends from the lower side of the second header tank 310 where the vapor-liquid separator 340 is not formed.
The configurations shown in fig. 14 to 16 show that the second radiator 200 and the first condenser 300 are disposed at mutually opposite sides, as compared with the configuration shown in fig. 11. In detail, the inlet pipe 510 is connected to one side (right side in fig. 14) of the second condenser 400 disposed in the first header tank 210 of the lower portion of the second radiator at the right side to transfer refrigerant, the connection pipe 520 connects the other side of the second condenser 400 to the second header tank 310 on the right side of the first condenser 300, and the outlet pipe 530 extends from the lower portion of the second header tank 310 on the right side to be adjacent to the first header tank 210 of the lower portion of the second radiator 200. Here, the refrigerant passes through the first region a1 to the fourth region a4, and the second region a2 includes a2-1 region a2-1, a2-2 region a2-2, and a2-3 region a2-3, and in the 2-1 region a2-1, the refrigerant is introduced into the right second header tank 310 of fig. 14 through the connection pipe 520 and flows to the left second header tank 310 through the second pipe 320, and in the 2-2 region a2-2, the refrigerant flows to the right second header tank 310 through the other second pipe 320, and in the 2-3 region a2-3, the refrigerant flows to the left second header tank 310 through the other second pipe 320.
Although fig. 15 and 16 show a configuration example having a configuration similar to that in fig. 14, the second condenser 400 is provided in the first header tank 210 at the upper portion of the second radiator 200. In addition, an inlet pipe 510 is connected to the right side of the second condenser 400, and a connection pipe 520 is connected to the second header tank 310 of the first condenser 300 adjacent to the second condenser 400. Here, fig. 15 shows an example in which the outlet pipe 530 extends to be adjacent to the lower first header tank 210, and fig. 16 shows an example in which the outlet pipe 530 extends between the second radiator 200 and the first condenser 300, and is bent and extends to be adjacent to the upper first header tank 210.
In fig. 11 to 16, the flows inside the inlet pipe 510, the connection pipe 520, and the outlet pipe 530 are indicated by dotted lines. Each of the cooling modules 1000 shown in fig. 11 to 16 may variously modify the position where the second condenser 400 is disposed, the arrangement of the second radiator 200 and the first condenser 300, and the number and position of the partitions formed in the first condenser 300 according to the embodiment.
In the present invention, the sizes of the second radiator 200 and the first condenser 300 may be different. Here, the sizes of the second radiator 200 and the first condenser 300 may be different according to the presence or absence of the second condenser 400.
In the case where the second condenser 400 is provided in the second radiator 200, the second radiator 200 is configured to be larger than the first condenser 300, as described in the above embodiment. On the other hand, in the case where the second condenser 400 is not provided in the second radiator 200, the first condenser 300 is configured to be equal to or larger than the second radiator 200. This is because the first condenser 300 needs to perform the function of the second condenser 400. An example in which the size of the first condenser 300 is larger than that of the second radiator 200 is shown in fig. 17A. Fig. 17B shows a case where the size of the first condenser 300 is substantially the same as that of the second radiator 200.
Although the sizes of the second radiator 200 and the first condenser 300 are different, the refrigerant condensing performance of the cooling module can be improved, and the size of the cooling module can be reduced.
While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by the embodiments but only by the appended claims. It is to be appreciated that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention.
Claims (14)
1. A cooling module, comprising:
A first radiator configured to cool the fuel cell stack;
a second heat sink arranged in a predetermined region in front of the first heat sink in an air flow direction and configured to cool the electronic components;
A first condenser disposed in other remaining area in front of the first radiator in an air flow direction and heat-exchanging with ambient air to condense refrigerant;
A second condenser disposed in the second radiator and heat-exchanged with the coolant to condense the refrigerant,
wherein the second condenser is arranged in the first water collecting tank at the lower side,
The second radiator and the first condenser are arranged side by side with each other in the width direction of the first radiator,
And the second radiator and the first condenser receive wind at the same time,
Wherein the cooling module further comprises:
an inlet pipe configured to supply the refrigerant to the second condenser;
A connection pipe configured to supply the refrigerant having passed through the second condenser to the first condenser;
An outlet pipe configured to discharge the refrigerant having passed through the first condenser,
Wherein, the connecting pipe includes:
a first pipe unit arranged side by side with the first header tank in a length direction;
And a second pipe unit configured to extend from the first pipe unit and to be bent in a length direction of the vapor-liquid separator.
2. The cooling module of claim 1, wherein the second heat sink comprises:
a pair of first water collecting tanks configured to include a combination of a header and a water tank, the pair of first water collecting tanks being disposed side by side with each other and spaced apart from each other by a predetermined distance;
A first pipe having both ends fixed to the first header tank to form an electronic component coolant flow passage;
And a first fin interposed between the first tubes.
3. The cooling module according to claim 2, wherein the first header tanks of the second radiator are spaced apart from each other in a height direction.
4. The cooling module of claim 1, wherein the first condenser comprises:
A pair of second header tanks disposed side by side with each other and spaced apart from each other by a predetermined distance;
A second pipe having both ends fixed to a second header tank to form a refrigerant flow path;
A second fin interposed between the second tubes;
A vapor-liquid separator provided on one side of the second header tank.
5. The cooling module according to claim 4, wherein the refrigerant introduced through the inlet pipe is condensed by the second condenser in the first region, introduced through the connection pipe and condensed while passing through a predetermined region of the first condenser in the second region, vapor-liquid separated by the vapor-liquid separator in the third region, the liquid-phase refrigerant separated by the vapor-liquid separator is supercooled in the fourth region, and then discharged through the outlet pipe.
6. The cooling module of claim 1, wherein the first condenser is configured to be equal to or larger than the second radiator.
7. The cooling module of claim 1, wherein the second heat sink is configured to be larger than the first condenser.
8. A cooling module, comprising:
A first radiator configured to cool the fuel cell stack;
A second heat sink arranged in a predetermined region in front of the first heat sink in an air flow direction and configured to cool the electronic components;
a first condenser disposed in other remaining area in front of the first radiator in an air flow direction and heat-exchanging with ambient air to condense refrigerant;
A second condenser disposed in the second radiator and heat-exchanged with the coolant to condense the refrigerant,
wherein the second condenser is arranged in the first water collecting tank at the lower side,
The second radiator and the first condenser are arranged side by side with each other in the width direction of the first radiator,
And the second radiator and the first condenser receive wind at the same time,
wherein the cooling module further comprises:
An inlet pipe configured to supply the refrigerant to the second condenser;
A connection pipe configured to supply the refrigerant having passed through the second condenser to the first condenser;
An outlet pipe configured to discharge the refrigerant having passed through the first condenser,
Wherein, the connecting pipe includes:
A1 st-1 st pipe unit bent from a left lower end of the second radiator and arranged along an outer side surface of the second radiator in a vertical direction;
And a2-1 st tube unit disposed along an upper surface of the second radiator in a direction toward the first condenser.
9. The cooling module of claim 8, wherein the second heat sink comprises:
A pair of first water collecting tanks configured to include a combination of a header and a water tank, the pair of first water collecting tanks being disposed side by side with each other and spaced apart from each other by a predetermined distance;
A first pipe having both ends fixed to the first header tank to form an electronic component coolant flow passage;
And a first fin interposed between the first tubes.
10. The cooling module according to claim 9, wherein the first header tanks of the second radiator are spaced apart from each other in a height direction.
11. The cooling module of claim 8, wherein the first condenser comprises:
a pair of second header tanks disposed side by side with each other and spaced apart from each other by a predetermined distance;
A second pipe having both ends fixed to a second header tank to form a refrigerant flow path;
A second fin interposed between the second tubes;
a vapor-liquid separator provided on one side of the second header tank.
12. The cooling module according to claim 11, wherein the refrigerant introduced through the inlet pipe is condensed by the second condenser in the first region, introduced through the connection pipe and condensed while passing through a predetermined region of the first condenser in the second region, vapor-liquid separated by the vapor-liquid separator in the third region, the liquid-phase refrigerant separated by the vapor-liquid separator is supercooled in the fourth region, and then discharged through the outlet pipe.
13. the cooling module of claim 8, wherein the first condenser is configured to be equal to or larger than the second radiator.
14. the cooling module of claim 8, wherein the second heat sink is configured to be larger than the first condenser.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0025628 | 2015-02-24 | ||
| KR20150025628 | 2015-02-24 | ||
| KR1020160011454A KR102543060B1 (en) | 2015-02-24 | 2016-01-29 | Cooling module |
| KR10-2016-0011454 | 2016-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105904960A CN105904960A (en) | 2016-08-31 |
| CN105904960B true CN105904960B (en) | 2019-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610099015.7A Active CN105904960B (en) | 2015-02-24 | 2016-02-23 | Cooling module |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20160245595A1 (en) |
| CN (1) | CN105904960B (en) |
| DE (1) | DE102016202742A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10766340B2 (en) * | 2014-07-29 | 2020-09-08 | Hanon Systems | Air conditioner system for vehicle |
| US10317150B2 (en) * | 2016-11-21 | 2019-06-11 | United Technologies Corporation | Staged high temperature heat exchanger |
| KR102371426B1 (en) * | 2017-12-21 | 2022-03-08 | 한온시스템 주식회사 | Cooling module |
| WO2020022726A1 (en) * | 2018-07-24 | 2020-01-30 | 한온시스템 주식회사 | Water-cooling type condenser |
| CN111006417A (en) * | 2020-01-06 | 2020-04-14 | 林泳鑫 | New energy automobile water-cooled condenser |
| US11904677B2 (en) * | 2020-11-27 | 2024-02-20 | Hanon Systems | Cooling module placed on side of vehicle |
| CN114312493A (en) * | 2022-02-28 | 2022-04-12 | 重庆长安新能源汽车科技有限公司 | Fuel cell cooling module and vehicle |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008056152A (en) * | 2006-09-01 | 2008-03-13 | Nissan Motor Co Ltd | Cooling device for hybrid vehicle |
| KR20110056598A (en) * | 2009-11-23 | 2011-05-31 | 현대자동차주식회사 | Cooling module for fuel cell vehicle |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2763753Y (en) * | 2005-01-13 | 2006-03-08 | 安徽江淮汽车股份有限公司 | Car air conditioning system |
| KR101304864B1 (en) * | 2010-12-27 | 2013-09-05 | 한라비스테온공조 주식회사 | Cooling module |
| KR101318643B1 (en) | 2011-07-27 | 2013-10-17 | 한라비스테온공조 주식회사 | Cooling module and control method thereof |
| CN103121393B (en) * | 2011-11-17 | 2015-07-08 | 株式会社电装 | Configuration of vehicle heat exchanger |
| US20150101778A1 (en) * | 2013-10-14 | 2015-04-16 | Hyundai Motor Company | Cooling module for vehicle |
| KR102205848B1 (en) * | 2013-12-31 | 2021-01-21 | 한온시스템 주식회사 | Cooling module and Cooling System for Vehicles |
-
2016
- 2016-02-23 CN CN201610099015.7A patent/CN105904960B/en active Active
- 2016-02-23 DE DE102016202742.5A patent/DE102016202742A1/en active Pending
- 2016-02-24 US US15/051,697 patent/US20160245595A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008056152A (en) * | 2006-09-01 | 2008-03-13 | Nissan Motor Co Ltd | Cooling device for hybrid vehicle |
| KR20110056598A (en) * | 2009-11-23 | 2011-05-31 | 현대자동차주식회사 | Cooling module for fuel cell vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105904960A (en) | 2016-08-31 |
| US20160245595A1 (en) | 2016-08-25 |
| DE102016202742A1 (en) | 2016-08-25 |
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