CN105904099A - SIP module manufacturing method and elargol groove cutting method and system - Google Patents
SIP module manufacturing method and elargol groove cutting method and system Download PDFInfo
- Publication number
- CN105904099A CN105904099A CN201610301017.XA CN201610301017A CN105904099A CN 105904099 A CN105904099 A CN 105904099A CN 201610301017 A CN201610301017 A CN 201610301017A CN 105904099 A CN105904099 A CN 105904099A
- Authority
- CN
- China
- Prior art keywords
- groove
- radium
- reserved
- data
- shine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Milling Processes (AREA)
Abstract
The invention discloses an SIP module manufacturing method and an elargol groove cutting method and system and relates to the field of semiconductors. The elargol groove cutting method comprises the step that S10, groove cutting data in a curing region of an SIP module are obtained and comprise a groove cutting path and a groove cutting position; S20, cutting is conducted in the curing region through laser according to the groove cutting data, a groove for being filled with elargol is formed, and a preserved curing part exists in the position between the groove and the exposed region of the SIP module; S30, after the elargol charged into the groove is cured, data of the distance between the preserved curing part and the exposed region are obtained; and S40, according to preset laser control parameters corresponding to the distance data, the preserved curing part is cut through laser, and the curing region and the exposed region are broken through. After the elargol is cured, the corresponding preset laser control parameters are automatically obtained, the preserved curing part is cut, and the product scrapped probability is reduced.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to the manufacture method of a kind of SIP module, elargol ditch
The cutting method of groove and system.
Background technology
Along with development and the progress of radium-shine cutting technique, because its precision is high, speed is fast, heat affected area is little,
It is difficult to make that deformation of products, cost performance are high, use cost is low, steady performance makes radium-shine cutting skill
Art is widely used at semicon industry.
In semicon industry, system in package (SIP, System In a Package) mainly will
Several functions integrated chip, in one encapsulates, reaches the purpose of Function Integration Mechanism.Different arrangements of chips
Mode, from different interior bonds technology collocation, makes the encapsulation form of SIP produce diversified combination.
Module, refers to weld the chip needed for module and active member, passive at the upper surface of PCB
Element, makes the PCBA of module, and the upper surface of PCBA is carried out filler, makes glue cover PCBA
The chip of upper surface and active member, passive device, then make adhesive curing make module.
There may be consolidation zone and exposed region, demand based on product on one module, need by
The two region is got through, and utilizes elargol to connect between region.Prior art is straight with radium-shine cutting technique
Connect the capsulation material on the line position of zone boundary to excise and form groove, then insert silver in this groove
Glue.
But owing to elargol is liquid before uncured, the characteristic of its flowing may pollute other can not
The region of contamination elargol, thus cause product rejection.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of SIP module, the cutting method of elargol groove
And system, while meeting product demand, getting through consolidation zone and exposed region, it is to avoid do not solidify
Elargol be stained with effective district of SIP module, improve product yield.
The technical scheme that the present invention provides is as follows:
A kind of cutting method of the elargol groove of SIP module, including: step S10 obtains described SIP
Groove cutting data in the consolidation zone of module；Described groove cutting data includes: groove cutting road
Footpath and groove cutting position；Step S20, according to described groove cutting data, uses radium-shine described solid
Changing region to cut, form the groove of elargol to be filled, described groove is naked with described SIP module
Reserved cured portion is there is in dew between region；Step S30 is when the elargol solidification inserting described groove
After, obtain the reserved described cured portion range data to described exposed region；Step S40 according to
The default radium-shine control parameter that described range data is corresponding, uses the described solidified portion that radium-shine excision is reserved
Point, described consolidation zone and described exposed region are got through.
It is further preferred that described step S30 specifically includes: it is described solid that the collection of step S31 is reserved
Change the part picture to described exposed region；Described picture is processed by step S32, is calculated
Reserved described cured portion is to the range data of described exposed region.
It is further preferred that described step S40 specifically includes: step S41 inquires about described range data
Residing predeterminable range scope of data；Step S42 is according to institute corresponding to described predeterminable range scope of data
State default radium-shine control parameter, obtain the described default radium-shine control parameter that described range data is corresponding；
Step S43 described presets radium-shine control parameter according to obtain, uses reserved described solid of radium-shine excision
Change part, described consolidation zone and described exposed region are got through.
It is further preferred that also include before described step S10: step S00 configuration described preset away from
Radium-shine control parameter is preset from corresponding described of scope of data, described predeterminable range scope of data.
It is further preferred that described range data includes: reserved described cured portion is near described naked
The one end in dew region and described exposed region are between one end of reserved described cured portion
Distance.
The present invention also provides for the manufacture method of a kind of SIP module, including: step S100 is PCB's
Upper surface welds the chip needed for described SIP module, active member, passive device, described PCB
Lower surface there is reserved solder joint, make the PCBA of described SIP module；Wherein, described PCBA
Upper surface include: region to be solidified and exposed region；The step S200 upper table to described PCBA
In face, region to be solidified carries out filler, makes glue cover region to be solidified in the upper surface of described PCBA
Chip, active member, passive device, then make adhesive curing make consolidation zone, described consolidation zone
Described SIP module is constituted with described exposed region；Step S400 obtains consolidating of described SIP module
Change the groove cutting data in region；Described groove cutting data includes: groove cutting path and groove
Cutting position；Step S500, according to described groove cutting data, uses radium-shine in described consolidation zone
Cut, form the exposed region of the groove of elargol to be filled, described groove and described SIP module
Between there is reserved cured portion；Step S600, after the elargol inserting described groove solidifies, obtains
Take the reserved described cured portion range data to described exposed region；Step S700 is according to described
The default radium-shine control parameter that range data is corresponding, uses the described cured portion that radium-shine excision is reserved,
Described consolidation zone and described exposed region are got through；The step S800 surrounding to described SIP module
And upper surface carries out metal sputtering and forms EMI electro-magnetic screen layer.
It is further preferred that described EMI electro-magnetic screen layer described SIP module is got through after described in
Consolidation zone and described exposed region connect, and to the described consolidation zone after getting through and described exposed area
Territory carries out EMI electromagnetic shielding.
It is further preferred that described step S600 specifically includes: it is described that the collection of step S610 is reserved
Cured portion is to the picture of described exposed region；Described picture is processed by step S620, calculates
Obtain the described cured portion the reserved range data to described exposed region.
It is further preferred that described step S700 specifically includes: step S710 inquiry described distance number
According to residing predeterminable range scope of data；Step S720 is corresponding according to described predeterminable range scope of data
Described preset radium-shine control parameter, obtain described range data corresponding described preset radium-shine control ginseng
Number；Step S730, according to the described default radium-shine control parameter obtained, uses radium-shine excision to reserve
Described cured portion, gets through described consolidation zone and described exposed region.
It is further preferred that also include between described step S200 and described step S400: step
The described radium that the S300 described predeterminable range scope of data of configuration, described predeterminable range scope of data are corresponding
Penetrate control parameter.
It is further preferred that described range data includes: reserved described cured portion is near described naked
The one end in dew region and described exposed region are between one end of reserved described cured portion
Distance.
The present invention also provides for the diced system of the elargol groove of a kind of SIP module, including: control module；
Acquisition module, electrically connects with described control module, under the control of described control module, obtains described
Groove cutting data in the consolidation zone of SIP module；And, when the elargol inserting described groove is solid
After change, under the control of described control module, obtain reserved described cured portion to described SIP mould
The range data of the exposed region of group；Wherein, described groove cutting data includes: groove cutting path
With groove cutting position；Memory module, electrically connects with described control module, in described control module
Under control, radium-shine control parameter is preset in storage；Radium-shine module, electrically connects with described control module,
Under the control of described control module, according to described groove cutting data, use radium-shine in described curing area
Territory is cut, and forms the groove of elargol to be filled, and described groove is described naked with described SIP module
Reserved cured portion is there is in dew between region；And, under the control of described control module, according to
Corresponding described of described range data presets radium-shine control parameter, uses reserved described solid of radium-shine excision
Change part, described consolidation zone and described exposed region are got through.
It is further preferred that described acquisition module specifically includes: gather submodule, gather reserved institute
State the cured portion picture to described exposed region；Process submodule, described picture processed,
It is calculated the reserved described cured portion range data to described exposed region.
It is further preferred that described memory module, it is further used for storing predeterminable range scope of data；
Described radium-shine module includes: data query submodule, inquire about residing for described range data described preset
Range data scope；Parameter acquiring submodule, according to described predeterminable range scope of data corresponding described in
Preset radium-shine control parameter, obtain the described default radium-shine control parameter that described range data is corresponding；Radium
Penetrate excision submodule, according to the described default radium-shine control parameter obtained, use radium-shine excision to reserve
Described cured portion, gets through described consolidation zone and described exposed region；And, according to described ditch
Groove cutting data, uses and radium-shine cuts in described consolidation zone, form the groove of elargol to be filled,
Reserved cured portion is there is between the exposed region of described groove and described SIP module.
It is further preferred that also include: configuration module, electrically connect with described control module, described
Under the control of control module, configure described predeterminable range scope of data, described predeterminable range scope of data
Corresponding described default radium-shine control parameter.
It is further preferred that described range data includes: reserved described cured portion is near described naked
The one end in dew region and described exposed region are between one end of reserved described cured portion
Distance.
Compared with prior art, the beneficial effects of the present invention is:
1, need not the region of elargol in order to avoid not solidified elargol flow to SIP module, produce
The problem scrapped, therefore, when using the radium-shine consolidation zone got through on SIP module and exposed region,
In needing the region got through, the one end near exposed region leaves some cured portion, makes needs get through
Region first become the groove of elargol to be filled out and reserved cured portion, after inserting elargol, reserved consolidates
Change part is equivalent to dykes and dams for not solidified elargol, which prevent elargol and flow to exposed area
Territory, cause the possibility of product rejection；After the elargol inserting groove solidifies, then with radium-shine by reserved
Cured portion is destroyed, and makes consolidation zone and exposed region get through.Second time destroys reserved cured portion
After, it forms same groove with previous elargol groove；Reserved cured portion according to obtaining arrives
The range data of exposed region, automatically selects the default radium-shine control parameter of correspondence, it is ensured that for the second time
The radium-shine position cut out is only the elongated end of the groove of cutting for the first time, can't cut askew, impact
Other region of SIP module, has ensured product quality.
2, when PCBA carries out filler solidification, because of the reasons such as mould loss, the consolidation zone of SIP module
Certain plastic packaging skew can be there is.Cut in time filling out the groove of elargol for the first time, be by identifying Mark
The region needing cutting is positioned by point, even if each SIP module is for cutting for the first time
Mark point position is identical, owing to there is the problem of plastic packaging skew, and the solidification that each SIP module is reserved
The length of part is the most different, accordingly, it would be desirable to carry out reserved cured portion according to practical situation
Location, it is ensured that can correctly excise reserved cured portion and not affect other ground during second time cutting
Side.And it is contemplated to get through consolidation zone and exposed region based on the purpose carrying out radium-shine cutting, therefore
Exposed region is just set for reference position, gathers reserved cured portion to exposed by CCD
The picture in region, thus obtain the cured portion the reserved range data to exposed region, for following choosing
Select corresponding radium-shine control parameter to provide the foundation.
3, reserved cured portion length is different, and it needs the region cut also the most different, because of
This needs to carry out second time under corresponding radium-shine control parameter and excises reserved cured portion, according to obtaining
The reserved cured portion obtained, to the position data of exposed region, automatically selects corresponding radium-shine control and joins
Number, confirms starting point and the working length of operation；Avoid the mistake that manual switching causes, reduce
The probability of product rejection.
4, configuration is preset range data scope and corresponding preset radium-shine control parameter be follow-up normally
The basic guarantee of operation.
5, reserved cured portion is not in order to affect properties of product, and this body length is the most comparatively short, typically
At hundreds of about um, and according to the demand of product, the length of exposed region is also the least, one
As at about 100um, based on this, for range data it is expressly intended that further ensure excision
During the cured portion reserved, the starting point of operation and working length can be accurately positioned, it is ensured that
Excision effect.
6, the manufacture process of SIP module is welding chip, active member, passive on PCB hollow plate
Element, thus make PCBA；Based on product demand, a part of region of PCBA can not carry out solid
Change, therefore need the region of solidification to carry out filler solidification in cure stage is to PCBA, thus obtain
To the SIP module needed；And carry out beating by consolidation zone and exposed region according to product demand further
Logical, in the part that consolidation zone is got through, insert elargol；Although the consolidation zone of SIP module is insulation
Body, but insert the region of elargol and exposed region all contains circuit and on-insulated, in order to ensure SIP mould
Group is not had influence on by other products in subsequent applications, needs SIP module is carried out metal sputtering, shape
Become EMI electro-magnetic screen layer.
7, the circuit inserted in the region of elargol and exposed region is shielded by EMI electro-magnetic screen layer
Cover, simultaneously the most also exposed region with insert the region of elargol and connect, thus ensure consolidation zone and exposed
Being successfully connected of region.
The manufacture method of SIP module of the present invention, the cutting method of elargol groove and system, getting through
When the consolidation zone of SIP module and exposed region, first reserve a little cured portion, utilize this to solidify
The elargol that do not solidifies inserted is stopped by part, makes elargol will not flow to other regions；When elargol is solid
After change, according to the distance between reserved cured portion and exposed region, automatically obtain corresponding presetting
Radium-shine control parameter is excised, and thoroughly gets through consolidation zone and exposed region, automatically obtains corresponding
Preset radium-shine control parameter and ensure that product quality, it is to avoid cause during manual switching radium-shine control parameter
The generation of mistake, reduce the probability of product rejection.
Accompanying drawing explanation
Below by the way of the most understandable, accompanying drawings preferred implementation, to a kind of SIP
The above-mentioned characteristic of the manufacture method of module, the cutting method of elargol groove and system, technical characteristic, excellent
Point and implementation thereof are further described.
Fig. 1 is the flow chart of one embodiment of cutting method of the elargol groove of SIP module of the present invention；
Fig. 2 is the flow chart of another embodiment of cutting method of the elargol groove of SIP module of the present invention；
Fig. 3 is the flow chart of one embodiment of manufacture method of SIP module of the present invention；
Fig. 4 is the flow chart of another embodiment of manufacture method of SIP module of the present invention；
Fig. 5 is the structural representation of one embodiment of diced system of the elargol groove of SIP module of the present invention
Figure；
Fig. 6 is that the structure of another embodiment of diced system of the elargol groove of SIP module of the present invention is shown
It is intended to；
Fig. 7 is the three-dimensional structure diagram of the elargol groove of SIP module of the present invention；
Fig. 8 is the sectional view of C-C in Fig. 7；
Fig. 9 is the sectional view of the B-B after the elargol solidification that the groove in Fig. 7 is inserted.
Drawing reference numeral illustrates:
10. control module, 20. memory modules, 30. acquisition modules, 31. gather submodule, and 32. process
Submodule, 40. radium-shine modules, 41. data query submodules, 42. parameter acquiring submodules, 43. is radium-shine
Excision submodule, 50. configuration modules, 61.PCB, 62. plastic packaging materials, 63. grooves, 64. reserved consolidating
Change part, 65. exposed regions, 66. elargol, 67. reserved cured portion near one end of exposed region,
68. exposed regions are near one end of reserved cured portion.
Detailed description of the invention
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below by right
The detailed description of the invention of the present invention is described according to accompanying drawing.It should be evident that the accompanying drawing in describing below is only
It is some embodiments of the present invention, for those of ordinary skill in the art, is not paying creativeness
On the premise of work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, and obtain other enforcement
Mode.
For making simplified form, each figure only schematically show part related to the present invention, it
Do not represent its practical structures as product.It addition, so that simplified form readily appreciates, having
A little figures have the parts of identical structure or function, only symbolically depicts one of them, or only
Mark one of them.In this article, " one " not only represents " only this ", it is also possible to represent
The situation of " more than one ".
In one embodiment of the invention, as it is shown in figure 1, the elargol groove of a kind of SIP module
Cutting method, including: step S10 obtains the groove cutting data in the consolidation zone of SIP module；
Groove cutting data includes: groove cutting path and groove cutting position；Step S20 is cut according to groove
Cut data, use and radium-shine cut in consolidation zone, form the groove of elargol to be filled, groove with
Reserved cured portion is there is between the exposed region of SIP module；Step S30 is when the silver inserting groove
After adhesive curing, obtain the reserved cured portion range data to exposed region；Step S40 according to away from
From the default radium-shine control parameter that data are corresponding, use the cured portion that radium-shine excision is reserved, will solidification
Region and exposed region are got through.
Concrete, as shown in Figure 7, Figure 8, step S10 obtains groove cutting data, be to utilize
Starting point and the operating area of the groove of cutting elargol to be filled out for the first time are positioned by Mark point,
So that radium-shine light beam falls is specifying region, cutting the consolidation zone of SIP module, formation is treated
Fill out the groove 63 of elargol；Because the position of Mark point is arranged and in order to get through consolidation zone and exposed region
Real start bit be equipped with some skew, it is ensured that use radium-shine excision consolidation zone for the first time, formed
After the groove filling out elargol, reserved cured portion 64 between this groove and exposed region, can be there is.
In this groove, need to insert elargol carry out sticking of micro-element, and not solidified elargol is liquid,
The characteristic of its flowing may be stained with in SIP module other and be need not the region that elargol sticks, thus makes
Become product rejection；And the most reserved cured portion here is equivalent to dykes and dams, block flowing
Elargol flow to the region that need not it, such as: exposed region, reduce product and produce and scrap
Chance.
It addition, the consolidation zone in SIP module is solidification when, because of a series of factors such as moulds
May result in the consolidation zone on SIP module and there is certain plastic packaging skew；Even if Mark point
Position is the most constant, and different SIP modules are after fluting for the first time, and the length of reserved cured portion is also
Can difference；In order to get through exposed region and consolidation zone, this reserved cured portion must inserted
After elargol solidification cut, and the difference of its length means the length of the starting point of operation and operation not
With, radium-shine light beam to be controlled according to practical situation and fall in correct position, reserved the consolidating of guarantee
Change part is accurately excised.Staff can control radium-shine light beam reserved according to practical situation
Cured portion excision, but manual operation is often with the generation of certain mistake, increases product
The possibility that product are scrapped.
Therefore, the present invention can automatically select corresponding default radium-shine control parameter according to practical situation,
While ensureing the cured portion that correct excision is reserved, also avoid the generation of mistake, reduce product
The probability scrapped.Because the position of exposed region is constant in SIP module, and what second time was cut
Purpose is contemplated to the reserved cured portion excision between elargol groove and exposed region, the most naked
Dew region just becomes datum mark, by the distance of reserved cured portion to exposed region, obtains and needs
Want starting point and the working length of operation, by reserved solidified portion under the control of corresponding relevant parameter
Cut and remove.
It should be noted that as shown in Fig. 7, Fig. 8, Fig. 9, no matter be to cut out silver to be filled out for the first time
The groove 63 of glue, or the cured portion 64 that excision is reserved, these Regional resection are all SIP moulds
Plastic packaging material 62 in group, can't cut the PCB 61 under plastic packaging material 62；It addition, the
During the cured portion 64 that secondary excision is reserved, need to be properly positioned, it is ensured that the solidified portion that excision is reserved
The groove formed after dividing 64 aligns with the groove 63 after cutting for the first time, the cured portion that excision is reserved
The groove formed after 64 is only the elongated end of the groove 63 after cutting for the first time, themselves is one
Road groove, has simply divided cutting twice.
Preferably, step S30 specifically includes: step S31 gathers reserved cured portion to exposed area
The picture in territory；Picture is processed by step S32, is calculated reserved cured portion to exposed area
The range data in territory.
Concrete, the cured portion that collection is reserved, to the picture of exposed region, then utilizes picture processing
Technology, calculates the distance between both, is to select corresponding default radium-shine control parameter below
Premise.
Preferably, step S40 specifically includes: step S41 inquiry predeterminable range residing for range data
Scope of data；Step S42, according to default radium-shine control parameter corresponding to predeterminable range scope of data, obtains
Take the default radium-shine control parameter that range data is corresponding；Step S43 is according to the default radium-shine control obtained
Parameter, uses the cured portion that radium-shine excision is reserved, consolidation zone and exposed region is got through.
Concrete, system pre-sets the radium-shine control ginseng of some range data scopes and correspondence
Number, when the distance of reserved cured portion Yu exposed region is in certain range data scope, radium-shine
Light beam, can be reserved under the control of default radium-shine control parameter corresponding to this range data scope
Cured portion excise exactly, it is ensured that consolidation zone and exposed region are got through smoothly is same
Time, also it is further ensured that it will not cut to other region, causes product rejection；It is also understood that
Ensure under the most radium-shine cutting, only form groove consolidation zone and exposed region got through together.
Preferably, also include before step S10: step S00 configuration predeterminable range scope of data, pre-
If the default radium-shine control parameter that range data scope is corresponding.
Concrete, the default radium-shine control parameter of configuration predeterminable range scope of data and its correspondence is to protect
The basis of the cured portion that the correct excision of card is reserved；Preset radium-shine control parameter to include: focusing parameter,
Beam energy parameters etc., beam energy parameter includes: frequency, power, speed etc..It addition, it is exposed
The positional information in region can also configure before cutting, it is ensured that is recognizing reserved cured portion
Positional information after, range data between the two can be calculated.
Preferably, as it is shown in figure 9, range data includes: reserved cured portion is near exposed region
One end 67 and exposed region distance between one end 68 of reserved cured portion.
Concrete, the a-quadrant in Fig. 9 is exposed region 65, when the elargol 66 inserting groove solidifies
After, it is necessary to the cured portion 64 that excision is reserved, in order to be further ensured that the accuracy of radium-shine operation,
Distance between reserved cured portion 64 and exposed region 65 has been done further restriction.It
So being basic as calculating near one end 67 of exposed region by reserved cured portion, it is because
Such design can confirm the starting point of operation rapidly；Because exposed region 65 and first time cut
The original position cut also is fixing, it is meant that reserved cured portion near groove one end position also
It is constant, it is understood that for, reserved cured portion is leaned near groove one end and exposed region
Distance between one end 68 of nearly reserved cured portion is also constant；And it is reserved according to obtain
Cured portion near one end 67 of exposed region and exposed region near reserved cured portion
Distance between one end 68, it is possible to obtain the working length of reality, i.e. reserved cured portion
Length, thus select the default radium-shine control parameter of correspondence, make radium-shine light beam fall on a corresponding position,
Reserved cured portion is excised exactly.Each data, the accurately defining of parameter, reduce product
Scrap probability, reduce the loss of unnecessary product, save resource.
In another embodiment of the present invention, as in figure 2 it is shown, the elargol groove of a kind of SIP module
Cutting method, including: step S00 configuration predeterminable range scope of data, predeterminable range scope of data
Corresponding default radium-shine control parameter；The groove that step S10 obtains in the consolidation zone of SIP module is cut
Cut data；Groove cutting data includes: groove cutting path and groove cutting position；Step S20
According to groove cutting data, use and radium-shine cut in consolidation zone, form the ditch of elargol to be filled
, between the exposed region of groove and SIP module, there is reserved cured portion in groove；Step S30 is when filling out
After entering the elargol solidification of groove, obtain the reserved cured portion range data to exposed region；Distance
Data include: reserved cured portion near one end of exposed region and exposed region near reserved
Distance between one end of cured portion；Step S30 specifically includes: step S31 gathers reserved consolidating
Change the part picture to exposed region；Picture is processed by step S32, is calculated reserved consolidating
Change the part range data to exposed region；Step S40 is according to default radium-shine control corresponding to range data
Parameter processed, uses the cured portion that radium-shine excision is reserved, consolidation zone and exposed region is got through；Step
Rapid S40 specifically includes: step S41 inquiry predeterminable range scope of data residing for range data；Step
S42, according to default radium-shine control parameter corresponding to predeterminable range scope of data, obtains range data corresponding
Default radium-shine control parameter；Step S43, according to the default radium-shine control parameter obtained, uses radium-shine
The cured portion that excision is reserved, gets through consolidation zone and exposed region.
Concrete, use the method for secondary cut exposed region and consolidation zone to be got through, secondary cut
Refer to, first cut out the groove of elargol to be filled out for the first time, at this groove near one end of exposed region
A little consolidation zone reserved, makes the elargol inserting groove because being unlikely to flow to exposed area when changing
Territory, causes product rejection；After elargol solidifies, then carry out the second cutting, by reserved cured portion
Excision.Such operating type, one ensures that elargol will not be attached to unnecessary region, two bases
The practical situation of reserved cured portion, automatically selects corresponding default radium-shine control parameter, improves
Get through the probability of exposed region and consolidation zone smoothly, reduce because the radium-shine control parameter of mistake causes product
Product cause, when the cured portion that excision is reserved, the problem scrapped.
In another embodiment of the present invention, as it is shown on figure 3, the manufacture method of a kind of SIP module,
Including: step S100 the upper surface of PCB weld the chip needed for SIP module, active member,
Passive device, the lower surface of PCB has reserved solder joint, makes the PCBA of SIP module；Wherein,
The upper surface of PCBA includes: region to be solidified and exposed region；Upper to PCBA of step S200
In surface, region to be solidified carries out filler, makes glue cover the core in region to be solidified in the upper surface of PCBA
Sheet, active member, passive device, then make adhesive curing make consolidation zone, consolidation zone and exposed
Region constitutes SIP module；Step S400 obtains the groove cutting in the consolidation zone of SIP module
Data；Groove cutting data includes: groove cutting path and groove cutting position；Step S500 root
According to groove cutting data, use and radium-shine cut in consolidation zone, form the groove of elargol to be filled,
Reserved cured portion is there is between the exposed region of groove and SIP module；Step S600 is when inserting
After the elargol solidification of groove, obtain the reserved cured portion range data to exposed region；Step
S700, according to default radium-shine control parameter corresponding to range data, uses the solidification that radium-shine excision is reserved
Part, gets through consolidation zone and exposed region；Step S800 is to the surrounding of SIP module and upper table
Face carries out metal sputtering and forms EMI electro-magnetic screen layer.
Concrete, after having welded corresponding chip and element on PCB hollow plate, the product obtained is
PCBA；Following step carries out filler solidification to PCBA exactly, and due to the demand of product,
A part of region on PCBA may not carry out filler solidification, therefore, solidifies this system at filler
Journey needs this region is covered, other region is carried out filler solidification, so after operation,
Consolidation zone and exposed region will be there is on the SIP module of rear formation；Then need SIP module
On consolidation zone and exposed region get through, the groove cut out is inserted elargol and sticks tiny unit
Part, owing to being liquid when elargol does not solidifies, in order to ensure that it will not flow to unnecessary region, example
As: exposed region, use the method for secondary cut to get through: 1) cut out elargol to be filled out for the first time
Groove, there is reserved cured portion in groove and exposed region, this reserved cured portion is to inserting
The elargol of the flowing in groove plays barrier effect, limits the flowing space of elargol, it is ensured that elargol only can be
Groove flows, sticks the element in this groove, other regions will not be flow to；2) solid when elargol
After change, then reserved cured portion excision, exposed region and consolidation zone are got through.
Preferably, consolidation zone and exposed region after SIP module is got through by EMI electro-magnetic screen layer connect
Connect, and the consolidation zone after getting through and exposed region are carried out EMI electromagnetic shielding.
Concrete, all there is circuit, and it in the region that exposed region on SIP module and elargol stick
Be not insulation, follow-up use may exist electromagnetic interference, accordingly, it would be desirable to SIP
Module carries out sputtering EMI electro-magnetic screen layer, and this EMI electro-magnetic screen layer is to exposed region and elargol district
Territory has carried out electromagnetic shielding, is also connected together in the two region, it is achieved that exposed region is with solid
Change the connection in region.It addition, EMI electromagnetic shielding is not only to exposed region and elargol region, and
It is the upper surface to SIP module and surrounding has carried out EMI electromagnetic shielding, reduce SIP module
The situation of electromagnetic interference is not had in follow-up use.
Preferably, step S600 specifically includes: step S610 gathers reserved cured portion to exposed
The picture in region；Picture is processed by step S620, is calculated reserved cured portion to naked
The range data in dew region.
Preferably, step S700 specifically includes: step S710 inquiry range data residing for preset away from
From scope of data；Step S720 according to default radium-shine control parameter corresponding to predeterminable range scope of data,
Obtain the default radium-shine control parameter that range data is corresponding；Step S730 is default radium-shine according to obtain
Control parameter, use the cured portion that radium-shine excision is reserved, consolidation zone and exposed region are got through.
Preferably, also include between step S200 and step S400: step S300 configuration preset away from
From the radium-shine control parameter that scope of data, predeterminable range scope of data are corresponding.
Preferably, range data includes: reserved cured portion is near one end of exposed region and naked
Dew region distance between one end of reserved cured portion.
Concrete, during owing to PCBA to be carried out filler solidification, the problem that plastic packaging skew may be there is,
Even if reserved cured portion is identical near the position of groove one end, the length of its reserved cured portion
Also different, need to use corresponding radium-shine control parameter according to practical situation, could be correctly by reserved
Cured portion excision, and do not injure other region that can not be cut, therefore, reserved obtaining
Cured portion to after the distance between exposed region, automatically select corresponding presetting and radium-shine control ginseng
Number, it is ensured that reserved cured portion can correctly be excised so that it is with the groove pair cut out for the first time
Together, after the cured portion that second time excision is reserved, SIP module only has one groove and exposed area
Territory connects.
In another embodiment of the present invention, as shown in Figure 4, the manufacture method of a kind of SIP module,
Including: step S100 the upper surface of PCB weld the chip needed for SIP module, active member,
Passive device, the lower surface of PCB has reserved solder joint, makes the PCBA of SIP module；Wherein,
The upper surface of PCBA includes: region to be solidified and exposed region；
Step S200 carries out filler to region to be solidified in the upper surface of PCBA, makes glue cover PCBA
Upper surface in the chip in region to be solidified, active member, passive device, then make adhesive curing make
Consolidation zone, consolidation zone and exposed region constitute SIP module；
The radium-shine control that step S300 configuration predeterminable range scope of data, predeterminable range scope of data are corresponding
Parameter processed；
Step S400 obtains the groove cutting data in the consolidation zone of SIP module；Groove cutting number
According to including: groove cutting path and groove cutting position；
Step S500, according to groove cutting data, uses and radium-shine cuts in consolidation zone, is formed
, between the exposed region of groove and SIP module, there is reserved solidified portion in the groove of elargol to be filled
Point；
Step S600, after the elargol inserting groove solidifies, obtains reserved cured portion to exposed area
The range data in territory；Step S600 specifically includes: step S610 gathers reserved cured portion to naked
The picture in dew region；Picture is processed by step S620, is calculated reserved cured portion and arrives
The range data of exposed region；Range data includes: reserved cured portion is near the one of exposed region
End and exposed region distance between one end of reserved cured portion；
Step S700, according to default radium-shine control parameter corresponding to range data, uses radium-shine excision pre-
The cured portion stayed, gets through consolidation zone and exposed region；Step S700 specifically includes: step
S710 inquiry predeterminable range scope of data residing for range data；Step S720 is according to predeterminable range number
According to the default radium-shine control parameter that scope is corresponding, obtain the default radium-shine control ginseng that range data is corresponding
Number；Step S730, according to the default radium-shine control parameter obtained, uses the solidification that radium-shine excision is reserved
Part, gets through consolidation zone and exposed region；
Step S800 carries out metal sputtering form EMI electromagnetic screen to surrounding and the upper surface of SIP module
Cover layer；EMI electro-magnetic screen layer SIP module is got through after consolidation zone and exposed region connect, and
Consolidation zone after getting through and exposed region are carried out EMI electromagnetic shielding.
Concrete, SIP module, can be to the upper table of SIP after having got through exposed region and consolidation zone
Face and surrounding sputtering EMI electro-magnetic screen layer, it is ensured that the connection between exposed region and consolidation zone
While, also make the circuit in exposed region and elargol region avoid the electromagnetic interference in follow-up use
Problem.
In another embodiment of the present invention, as it is shown in figure 5, the elargol groove of a kind of SIP module
Diced system, including control module 10；Acquisition module 30, electrically connects with control module 10,
Under the control of control module 10, obtain the groove cutting data in the consolidation zone of SIP module；
And, after the elargol inserting groove solidifies, under the control of control module 10, acquisition is reserved
Cured portion is to the range data of the exposed region of SIP module；Wherein, groove cutting data includes:
Groove cutting path and groove cutting position；Memory module 20, electrically connects with control module 10,
Under the control of control module 10, radium-shine control parameter is preset in storage；Radium-shine module 40, with control mould
Block 10 electrically connects, under the control of control module 10, according to groove cutting data, use radium-shine
Consolidation zone is cut, and forms the exposed region of the groove of elargol to be filled, groove and SIP module
Between there is reserved cured portion；And, under the control of control module 10, according to distance number
According to corresponding default radium-shine control parameter, use the cured portion that radium-shine excision is reserved, by consolidation zone
Get through with exposed region.
Concrete, in the diced system of the elargol groove of SIP module, the function of control module is counted by industry
Calculation machine realizes, it may also be said to be that with other hardware, its internal processor is carried out in industrial computer
Control；The function of memory module is then realized by memorizer；Radium-shine module, namely laser apparatus, bag
Having included laser head, galvanometer, focus lamp etc., these devices ensure that the radium-shine light beam of corresponding energy is permissible
Fall in position accurately, thus realize accurately cutting；The function of acquisition module is real by CCD camera
Existing.
Treated operation original position and the operation area filling out elargol groove according to Mark point by CCD camera
Territory positions, thus obtains corresponding groove cutting data, and groove cutting data includes: groove is cut
Cut path and groove cutting position, also include groove radium-shine control parameter, this groove radium-shine control parameter
Including energy parameter and focusing parameter, make laser head send the radium-shine light beam of corresponding energy, galvanometer,
The whereabouts that controls of the devices such as condensing lens is cut in correct position, forms the groove of elargol to be filled out.
As it is shown in figure 9, after elargol 66 solidifies, need the practical situation according to reserved cured portion 64,
Automatically use corresponding preset radium-shine control parameter reserved cured portion 64 is excised exactly and not
Damage other region, reduce the probability of product rejection.
Preferably, acquisition module 30 specifically includes: gather submodule 31, gathers reserved solidified portion
Assign to the picture of exposed region；Process submodule 32, picture is processed, is calculated reserved
Cured portion to the range data of exposed region.
Concrete, as stated above, the function gathering submodule can be by the taking lens of CCD camera
Realize, the picture of the reserved cured portion of shooting to exposed region it can be understood as shooting photo in
Need cured portion and the exposed region simultaneously including reserving；And process submodule, can be by being assemblied in
Picture processor in CCD camera realizes, can according to grayscale contrast's principle calculate between the two away from
From data, provide the foundation for subsequently selected corresponding default radium-shine control parameter.In view of cost,
Process submodule to be realized by the processor in industrial computer.
Preferably, memory module 20, it is further used for storing predeterminable range scope of data；Radium-shine mould
Block 40 includes: data query submodule 41, inquiry predeterminable range scope of data residing for range data；
Parameter acquiring submodule 42, according to the default radium-shine control parameter that predeterminable range scope of data is corresponding,
Obtain the default radium-shine control parameter that range data is corresponding；Radium-shine excision submodule 43, according to acquisition
Default radium-shine control parameter, use the cured portion that radium-shine excision is reserved, by consolidation zone and exposed
Region is got through；And, according to groove cutting data, use and radium-shine cut in consolidation zone, shape
Become the groove of elargol to be filled, between the exposed region of groove and SIP module, there is reserved solidified portion
Point.
Concrete, data query submodule, parameter acquiring submodule function can be by laser apparatus
Data processor realizes, it is also possible to because the consideration of cost, industrial computer realize.Preset radium-shine
Control parameter to include: focusing parameter and energy parameter；Energy parameter includes: speed, power, frequency
Deng；Focusing parameter includes: the reserved initial job position of cured portion, working length, it is also possible to
It is interpreted as, the cutting path of reserved cured portion and the cutting position of reserved cured portion.According to
The range data obtained can obtain corresponding predeterminable range scope of data, thus obtains the distance obtained
The default radium-shine control parameter that data are corresponding, makes the radium-shine light beam of corresponding energy under the control of this parameter
Control at the device such as galvanometer, focus lamp is fallen and is being specified position, cuts reserved cured portion
Remove.
Preferably, also include: configuration module 50, electrically connect with control module 10, in control module
Under the control of 10, the default radium that configuration predeterminable range scope of data, predeterminable range scope of data are corresponding
Penetrate control parameter.
Concrete, the function of configuration module is realized by industrial computer, by default range data scope
And the default radium-shine control parameter configuration of correspondence is in industrial computer, reserving according to follow-up acquisition
Cured portion select corresponding to preset radium-shine control parameter to the range data of exposed region, make radium-shine
Light beam can excise reserved cured portion exactly, automatically selects corresponding default radium-shine control parameter
Reduce and destroy other regions of SIP module when excising reserved cured portion and cause product rejection
Situation.
Preferably, range data includes: reserved cured portion is near one end of exposed region and naked
Dew region distance between one end of reserved cured portion.
Concrete, reserved cured portion and exposed region itself are the most small, and clear and definite ground is fixed
Justice range data can ensure that radium-shine light beam is accurately controlled, and improves radium-shine light beam and successfully excises reserved
The probability of cured portion, reduce the situation producing product rejection.
In another embodiment of the present invention, as shown in Figure 6, the elargol groove of a kind of SIP module
Diced system, including:
Control module 10；
Configuration module 50, electrically connects with control module 10, under the control of control module 10, joins
Put the default radium-shine control parameter that predeterminable range scope of data, predeterminable range scope of data are corresponding；
Acquisition module 30, electrically connects with control module 10, under the control of control module 10, obtains
Take the groove cutting data in the consolidation zone of SIP module；And, when the elargol inserting groove solidifies
After, under the control of control module, the exposed region of the cured portion that acquisition is reserved to SIP module
Range data；Range data includes: reserved cured portion is near one end of exposed region and exposed
Region distance between one end of reserved cured portion；Acquisition module 30 specifically includes: adopt
Collection submodule 31, gathers the reserved cured portion picture to exposed region；Process submodule 32,
Picture is processed, is calculated the reserved cured portion range data to exposed region；
Wherein, groove cutting data includes: groove cutting path and groove cutting position；
Memory module 20, electrically connects with control module 10, under the control of control module 10, deposits
Radium-shine control parameter is preset in storage, and, store predeterminable range scope of data；
Radium-shine module 40, electrically connects with control module 10, under the control of control module 10, and root
According to groove cutting data, use and radium-shine cut in consolidation zone, form the groove of elargol to be filled,
Reserved cured portion is there is between the exposed region of groove and SIP module；And, in control module
Control under, according to the default radium-shine control parameter that range data is corresponding, use radium-shine excision reserved
Cured portion, gets through consolidation zone and exposed region；Radium-shine module 40 includes: data query
Module 41, inquiry predeterminable range scope of data residing for range data；Parameter acquiring submodule 42,
According to the default radium-shine control parameter that predeterminable range scope of data is corresponding, obtain corresponding pre-of range data
If radium-shine control parameter；Radium-shine excision submodule 43, according to the default radium-shine control parameter obtained,
Use the cured portion that radium-shine excision is reserved, consolidation zone and exposed region are got through；And, according to
Groove cutting data, uses and radium-shine cuts in consolidation zone, form the groove of elargol to be filled,
Reserved cured portion is there is between the exposed region of groove and SIP module.
Concrete, due to the problem of plastic packaging skew, make the reserved cured portion of each SIP module
Length is the most different, it is therefore desirable to select to preset radium-shine control parameter accordingly according to practical situation
Ensure that reserved cured portion is accurately excised, and with first after the cured portion that excision is reserved for the second time
The secondary elargol groove alignment cut out, only forms a groove after secondary cut and gets through with exposed region.
The range data scope preset and the default radium-shine control parameter of its correspondence can be deposited with the form of formula
Storage, in industrial computer, after obtaining corresponding range data, automatically selects according to practical situation
Corresponding formula, excises reserved cured portion under the control of this formula.Automatically select phase
The formula answered, it is to avoid the generation of the mistake that manual switching operation formula causes, reduces product report
Useless probability.
It should be noted that, above-described embodiment all can independent assortment as required.The above is only this
The preferred implementation of invention, it is noted that for those skilled in the art,
Under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improve and
Retouching also should be regarded as protection scope of the present invention.
Claims (16)
1. the cutting method of the elargol groove of a SIP module, it is characterised in that including:
Step S10 obtains the groove cutting data in the consolidation zone of described SIP module；
Described groove cutting data includes: groove cutting path and groove cutting position；
Step S20, according to described groove cutting data, uses and radium-shine cuts in described consolidation zone
Cut, form the groove of elargol to be filled, between the exposed region of described groove and described SIP module
There is reserved cured portion；
Step S30, after the elargol inserting described groove solidifies, obtains reserved described cured portion
Range data to described exposed region；
Step S40, according to default radium-shine control parameter corresponding to described range data, uses radium-shine cutting
Except reserved described cured portion, described consolidation zone and described exposed region are got through.
2. a cutting method for the elargol groove of SIP module as claimed in claim 1, it is special
Levying and be, described step S30 specifically includes:
Step S31 gathers the reserved described cured portion picture to described exposed region；
Described picture is processed by step S32, is calculated reserved described cured portion to institute
State the range data of exposed region.
3. a cutting method for the elargol groove of SIP module as claimed in claim 1, it is special
Levying and be, described step S40 specifically includes:
Step S41 inquiry predeterminable range scope of data residing for described range data；
Step S42 is joined according to described default radium-shine control that described predeterminable range scope of data is corresponding
Number, obtains the described default radium-shine control parameter that described range data is corresponding；
Step S43, according to the described default radium-shine control parameter obtained, uses radium-shine excision to reserve
Described cured portion, gets through described consolidation zone and described exposed region.
4. a cutting method for the elargol groove of the SIP module as described in claim 1-3 is arbitrary,
It is characterized in that, also include before described step S10:
Step S00 configures described predeterminable range scope of data, described predeterminable range scope of data correspondence
Described preset radium-shine control parameter.
5. a cutting method for the elargol groove of the SIP module as described in claim 1-3 is arbitrary,
It is characterized in that, described range data includes:
Reserved described cured portion is leaned near one end of described exposed region and described exposed region
Distance between one end of nearly reserved described cured portion.
6. the manufacture method of a SIP module, it is characterised in that including:
Step S100 welds the chip needed for described SIP module, active element at the upper surface of PCB
Part, passive device, the lower surface of described PCB has reserved solder joint, makes described SIP module
PCBA；
Wherein, the upper surface of described PCBA includes: region to be solidified and exposed region；
In the step S200 upper surface to described PCBA, region to be solidified carries out filler, makes glue cover
The chip in region to be solidified, active member, passive device in the upper surface of described PCBA, then
Make adhesive curing make consolidation zone, described consolidation zone and described exposed region and constitute described SIP
Module；
Step S400 obtains the groove cutting data in the consolidation zone of described SIP module；
Described groove cutting data includes: groove cutting path and groove cutting position；
Step S500, according to described groove cutting data, uses and radium-shine cuts in described consolidation zone
Cut, form the groove of elargol to be filled, between the exposed region of described groove and described SIP module
There is reserved cured portion；
Step S600, after the elargol inserting described groove solidifies, obtains reserved described cured portion
Range data to described exposed region；
Step S700, according to default radium-shine control parameter corresponding to described range data, uses radium-shine cutting
Except reserved described cured portion, described consolidation zone and described exposed region are got through；
Step S800 carries out metal sputtering form EMI to surrounding and the upper surface of described SIP module
Electro-magnetic screen layer.
7. the manufacture method of a SIP module as claimed in claim 6, it is characterised in that:
Described EMI electro-magnetic screen layer described SIP module is got through after described consolidation zone and described
Exposed region connects, and the described consolidation zone after getting through and described exposed region carry out EMI electricity
Magnetic shield.
8. the manufacture method of a SIP module as claimed in claim 6, it is characterised in that institute
State step S600 to specifically include:
Step S610 gathers the reserved described cured portion picture to described exposed region；
Described picture is processed by step S620, is calculated reserved described cured portion to institute
State the range data of exposed region.
9. the manufacture method of a SIP module as claimed in claim 6, it is characterised in that institute
State step S700 to specifically include:
Step S710 inquiry predeterminable range scope of data residing for described range data；
Step S720 is joined according to described default radium-shine control that described predeterminable range scope of data is corresponding
Number, obtains the described default radium-shine control parameter that described range data is corresponding；
Step S730, according to the described default radium-shine control parameter obtained, uses radium-shine excision to reserve
Described cured portion, gets through described consolidation zone and described exposed region.
10. a manufacture method for the SIP module as described in claim 6-9 is arbitrary, its feature
It is, also includes between described step S200 and described step S400:
Step S300 configures described predeterminable range scope of data, described predeterminable range scope of data correspondence
Described radium-shine control parameter.
The manufacture method of 11. 1 kinds of SIP modules as described in claim 6-9 is arbitrary, its feature
Being, described range data includes:
Reserved described cured portion is leaned near one end of described exposed region and described exposed region
Distance between one end of nearly reserved described cured portion.
The diced system of the elargol groove of 12. 1 kinds of SIP modules, it is characterised in that including:
Control module；
Acquisition module, electrically connects with described control module, under the control of described control module, obtains
Take the groove cutting data in the consolidation zone of described SIP module；And, when inserting described groove
Elargol solidification after, under the control of described control module, obtain reserved described cured portion and arrive
The range data of the exposed region of described SIP module；
Wherein, described groove cutting data includes: groove cutting path and groove cutting position；
Memory module, electrically connects with described control module, under the control of described control module, deposits
Radium-shine control parameter is preset in storage；
Radium-shine module, electrically connects with described control module, under the control of described control module, and root
According to described groove cutting data, use and radium-shine cut in described consolidation zone, formed to be filled
The groove of elargol, between the described exposed region of described groove and described SIP module, existence is reserved
Cured portion；And, under the control of described control module, corresponding according to described range data
Described default radium-shine control parameter, uses the described cured portion that radium-shine excision is reserved, by described solid
Change region and described exposed region is got through.
The diced system of the elargol groove of 13. 1 kinds of SIP modules as claimed in claim 12, its
Being characterised by, described acquisition module specifically includes:
Gather submodule, gather the reserved described cured portion picture to described exposed region；
Process submodule, described picture is processed, is calculated reserved described cured portion
Range data to described exposed region.
The diced system of the elargol groove of 14. 1 kinds of SIP modules as claimed in claim 12, its
It is characterised by:
Described memory module, is further used for storing predeterminable range scope of data；
Described radium-shine module includes:
Data query submodule, inquires about the described predeterminable range scope of data residing for described range data；
Parameter acquiring submodule, according to described predeterminable range scope of data corresponding described preset radium-shine
Control parameter, obtain the described default radium-shine control parameter that described range data is corresponding；
Radium-shine excision submodule, according to the described default radium-shine control parameter obtained, uses radium-shine cutting
Except reserved described cured portion, described consolidation zone and described exposed region are got through；And,
According to described groove cutting data, use and radium-shine cut in described consolidation zone, formed and wait to fill out
Fill the groove of elargol, between the exposed region of described groove and described SIP module, there is reserved consolidating
Change part.
The cutting of the elargol groove of 15. 1 kinds of SIP modules as described in claim 12-14 is arbitrary
System, it is characterised in that also include:
Configuration module, electrically connects with described control module, under the control of described control module, joins
Put corresponding described of described predeterminable range scope of data, described predeterminable range scope of data and preset radium-shine
Control parameter.
The cutting of the elargol groove of 16. 1 kinds of SIP modules as described in claim 12-14 is arbitrary
System, it is characterised in that described range data includes:
Reserved described cured portion is leaned near one end of described exposed region and described exposed region
Distance between one end of nearly reserved described cured portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301017.XA CN105904099B (en) | 2016-05-09 | 2016-05-09 | A kind of manufacture method of SIP modules, the cutting method and system of elargol groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301017.XA CN105904099B (en) | 2016-05-09 | 2016-05-09 | A kind of manufacture method of SIP modules, the cutting method and system of elargol groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105904099A true CN105904099A (en) | 2016-08-31 |
| CN105904099B CN105904099B (en) | 2017-09-29 |
Family
ID=56748544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610301017.XA Active CN105904099B (en) | 2016-05-09 | 2016-05-09 | A kind of manufacture method of SIP modules, the cutting method and system of elargol groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105904099B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706174A (en) * | 2017-09-26 | 2018-02-16 | 环维电子(上海)有限公司 | A kind of preparation method of electronics module with low warpage and the electronics module |
| CN108573892A (en) * | 2017-03-08 | 2018-09-25 | 先进科技新加坡有限公司 | Method and apparatus for cutting the chip substantially coated by opaque material |
| CN111438444A (en) * | 2018-12-28 | 2020-07-24 | 北京北科天绘科技有限公司 | Laser cutting method and system based on device array mass transfer |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5814532A (en) * | 1996-04-30 | 1998-09-29 | Rohm Co., Ltd. | Method of manufacturing semiconductor laser |
| JP2000040784A (en) * | 1998-07-24 | 2000-02-08 | Fujitsu Ltd | Semiconductor device, semiconductor device unit and manufacture thereof |
| EP1521299A2 (en) * | 2003-10-02 | 2005-04-06 | Sony Corporation | Method of mounting a semiconductor chip with an adhesive film and apparatus using the same |
| CN101162713A (en) * | 2006-10-12 | 2008-04-16 | 日月光半导体制造股份有限公司 | Packaging structure and conducting wire rack thereof |
| CN101309552A (en) * | 2007-05-17 | 2008-11-19 | 楠梓电子股份有限公司 | Conducting construction of circuit board and manufacturing method therefor |
| CN102376524A (en) * | 2010-08-24 | 2012-03-14 | 汎铨科技股份有限公司 | Two-stage sealing adhesive removing method for semiconductor element and laser grooving processing device |
| US8778780B1 (en) * | 2005-10-13 | 2014-07-15 | SemiLEDs Optoelectronics Co., Ltd. | Method for defining semiconductor devices |
-
2016
- 2016-05-09 CN CN201610301017.XA patent/CN105904099B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5814532A (en) * | 1996-04-30 | 1998-09-29 | Rohm Co., Ltd. | Method of manufacturing semiconductor laser |
| JP2000040784A (en) * | 1998-07-24 | 2000-02-08 | Fujitsu Ltd | Semiconductor device, semiconductor device unit and manufacture thereof |
| EP1521299A2 (en) * | 2003-10-02 | 2005-04-06 | Sony Corporation | Method of mounting a semiconductor chip with an adhesive film and apparatus using the same |
| US8778780B1 (en) * | 2005-10-13 | 2014-07-15 | SemiLEDs Optoelectronics Co., Ltd. | Method for defining semiconductor devices |
| CN101162713A (en) * | 2006-10-12 | 2008-04-16 | 日月光半导体制造股份有限公司 | Packaging structure and conducting wire rack thereof |
| CN101309552A (en) * | 2007-05-17 | 2008-11-19 | 楠梓电子股份有限公司 | Conducting construction of circuit board and manufacturing method therefor |
| CN102376524A (en) * | 2010-08-24 | 2012-03-14 | 汎铨科技股份有限公司 | Two-stage sealing adhesive removing method for semiconductor element and laser grooving processing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108573892A (en) * | 2017-03-08 | 2018-09-25 | 先进科技新加坡有限公司 | Method and apparatus for cutting the chip substantially coated by opaque material |
| CN107706174A (en) * | 2017-09-26 | 2018-02-16 | 环维电子(上海)有限公司 | A kind of preparation method of electronics module with low warpage and the electronics module |
| CN107706174B (en) * | 2017-09-26 | 2024-05-10 | 环维电子(上海)有限公司 | Electronic module with low warpage and preparation method of electronic module |
| CN111438444A (en) * | 2018-12-28 | 2020-07-24 | 北京北科天绘科技有限公司 | Laser cutting method and system based on device array mass transfer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105904099B (en) | 2017-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7205654B2 (en) | Programmed material consolidation methods for fabricating heat sinks | |
| CN105904099A (en) | SIP module manufacturing method and elargol groove cutting method and system | |
| US6500746B2 (en) | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods | |
| CN104674212B (en) | By the method and apparatus of burst ultrashort pulse energy transmission positive deposition on matrix | |
| US6951779B2 (en) | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | |
| CN107924830A (en) | Method for cutting processing target and workpiece disconnecting device | |
| CN114829043A (en) | Powder bed fusion additive manufacturing method | |
| CN109353004A (en) | Spot shaping method, apparatus, computer equipment and storage medium | |
| KR20170074595A (en) | SYSTEM AND METHOD FOR Additive Manufacturing | |
| CN105479019A (en) | Method for processing wafer | |
| CN108215175A (en) | For the method for adding type manufacture three-dimension object | |
| CN105728956B (en) | The radium-shine cutting method and system of a kind of SIP modules | |
| JP7390327B2 (en) | 3D additive manufacturing device and 3D additive manufacturing method | |
| CN114799534A (en) | Method and apparatus for repairing light emitting device | |
| CN109950213B (en) | Integrated circuit sample and preparation method thereof | |
| JP5586852B2 (en) | Method for brazing at least two laminated members together | |
| US6528757B2 (en) | Apparatus processing a gate portion in a semiconductor manufacturing apparatus, which remove a gate correspondence portion from a semiconductor package connected to a lead frame, and a resin burr deposited on a lead portion associated with the semiconductor package | |
| CN108807202B (en) | A kind of method of laser production solder bump | |
| JP2019050264A (en) | Wafer processing method | |
| CN106981457A (en) | For shielding integrated circuit high-density packages electromagnetic interference method and laser process equipment | |
| CN109648086B (en) | Metal grafting method based on selective laser melting technology and laser melting equipment | |
| JP6952289B2 (en) | Resistors and their manufacturing methods | |
| KR100413032B1 (en) | Apparatus for removing flash from integrated circuit package using laser | |
| CN114188233A (en) | Chip packaging method and system | |
| CN102403241A (en) | Double-side plastic packaging method of LGA (Land Grid Array) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |