CN105900194A

CN105900194A - Acoustic noise cancellation in multi-layer capacitors

Info

Publication number: CN105900194A
Application number: CN201480073012.5A
Authority: CN
Inventors: J·G·科勒; P·J·尤恩加
Original assignee: Apple Computer Inc
Current assignee: Apple Inc
Priority date: 2014-01-13
Filing date: 2014-12-31
Publication date: 2016-08-24
Anticipated expiration: 2034-12-31
Also published as: CN105900194B; CN110033946B; JP6744364B2; JP2020145460A; JP2018191000A; EP3078040B1; JP2017510057A; KR101845491B1; US9672986B2; JP7050113B2; CN110033946A; KR102075281B1; KR20180036796A; TW201546846A; JP6626447B2; US20150200056A1; EP3078040A1; WO2015105719A1; EP3754678B1; KR20160106158A

Abstract

A device is presented in the invention for decoupling voltage transients occurring on a voltage signal generated by a voltage regulator. The dev ice may decouple the voltage transients from circuits coupled to the voltage regulator. The device may include two capacitors that may be contained in a single package. The two capacitors may be coupled to the voltage signal from the voltage regulator such that one capacitor is also coupled to a ground reference and the other capacitor is also coupled to a supply voltage. The capacitors may be constructed in a multi-layer ceramic capacitor (MLCC) process. The materials that form the MLCC may be arranged such that the MLCC package does not change shape or vibrate in response to voltage level fluctuations on the voltage signal.

Description

Acoustic noise in multi-layer capacitor eliminates

Technical field

The embodiment described herein relates to capacitor design field, and more particularly relates to make Being embodied as of the capacitor that voltage transient minimizes.

Background technology

In electronic circuit, complex component such as microprocessor or SOC(system on a chip) (SoC) have the power of fluctuation Demand, is therefore placed around capacitor to keep supply voltage when current needs changes at these equipment Stable.These so-called " decouplings " or " bypass " capacitor be connected power supply and grounding parts it Between, and serve as the local low-impedance voltage source of the transient current occurred when can process the fluctuation of load. By the capacitor of aluminium or tantalum electrolyte manufacture be for decoupling a selection because its low cost and Electric capacity is big.Additionally, in some embodiments, during operation, the power supply of these capacitors is utilized The voltage level of voltage keeps relative constancy, so that electrolytic condenser is a kind of suitably choosing Select.

To the requirement drive of the less portable set small form factor requirements to more widget demand.Electrolysis Matter capacitor may not provide best option, because they possibly cannot provide minimum capacitor side Case.Adjust additionally, the Power-reducing techniques improving battery life brings according to the movable level of equipment Save the system of its supply voltage.Contemporary portable devices may usually make decoupling capacitors in millisecond magnitude Time interval at by the voltage influence of dynamic step between multiple level, this level is e.g. 0.8V and 1.8V.And, electrolytic condenser may will not provide best option, because it may The soonest the voltage level of change will not be responded.Alternatively, ceramic technology Development bring the multilayer ceramic capacitor (MLCC) being suitable as decoupling capacitors, it can provide thing Manage small-sized parts and allow voltage level to change quickly.

But, the combination of MLCC technology and dynamic power voltage may result in problem.MLCC makes The pottery that during electric field change at the conductive plate two ends being used in this type of capacitor, its shape may somewhat change Dielectric substance (such as, barium titanate).These alterations of form are likely due to multiple physical phenomenon, Including piezo-electric effect, electrostriction and Coulomb force, and MLCC may be caused in response to this capacitor The change of voltage level at terminal two ends and mechanical oscillation.This vibration may be pacified by capacitor Decorate and couple, cause mechanical oscillation in the circuit board, if the frequency in the range of audibility occurs electricity Voltage level changes, and equipment the most then may be caused to launch audible noise.

First this audible characteristic (being commonly called " capacitor is sung ") of MLCC is relating to And the MLCC application of AC signal filtering is observed, and it is derived from the noise of electronic equipment Reason.Measuring and calculate the physical displacement showing in capacitor may be minimum so that capacitor surface May only move a part for single atom width.But, owing to may relate to the biggest power, coupling The overall mechanical power closed in system is possibly for being macroscopic view for people and can hear.Therefore, May need technology that the most this characteristic is reduced or eliminated.A kind of mode can be amendment capacitor peace Dress, to reduce coupling between MLCC and circuit board.Another way can be to arrange multiple electric capacity Device so that by major part noise coupling to the resonance mode that can not hear of circuit board.But, two Kind of technology all may be hindered by the fact as follows: the physical cause of vibration of all kinds and know very Less, and the details of capacitor shape change is processed details by its indoor design and seller and is affected, So that the batch production of this type of scheme is highly difficult.

Wishing to there is a kind of equipment can be according to supply voltage voltage wink from circuit decoupling supply voltage Become.Desired equipment should be also little profile, in portable set, and can resist just Characteristic sung by the capacitor described.Set forth below is the system and method for low noise capacitance apparatus.

Summary of the invention

The invention discloses the various embodiments of capacitor.In a broad aspect, it is contemplated that go out a kind of equipment, A kind of system and a kind of method, the of the first node that wherein this equipment includes being couple in common encapsulation One group of conductive plate, second group of conductive plate of the Section Point being couple in common encapsulation and be couple to 3rd group of conductive plate of the 3rd node in common encapsulation.Conductive plate in first group of conductive plate can be by cloth Put the conductive plate in second group of conductive plate and between the conductive plate in the 3rd group of conductive plate.

In another one embodiment, another conductive plate in first group of conductive plate can be disposed in Between two or more conductive plates in second group of conductive plate, and the 3rd in first group of conductive plate Conductive plate can be disposed between two or more conductive plates in the 3rd group of conductive plate.A reality Executing in scheme, the conductive plate in second group of conductive plate can be with the adjacent cloth of conductive plate in the 3rd group of conductive plate Put.

In another embodiment, in the conductive plate in first group of conductive plate and second group of conductive plate Space between conductive plate can include the conductive plate in dielectric substance, and first group of conductive plate and The space between conductive plate in three groups of conductive plates can include dielectric substance.In additional embodiment In, this dielectric substance can be made up of ceramic material.In some embodiments, this dielectric substance Voltage level can be configured to respond to reduce and shrink and swollen in response to voltage level change increase Swollen.In other embodiments, this dielectric substance can be configured to respond to voltage level change increasing Shrink greatly and reduce in response to voltage level change and expand.

Accompanying drawing explanation

Detailed description below will be described with reference to the drawings, and carries out accompanying drawing briefly now Bright.

Fig. 1 shows the block diagram of the embodiment of the circuit including voltage-stablizer and SoC.

Fig. 2 shows the possible waveform of the circuit including voltage-stablizer and SoC.

Fig. 3 includes Fig. 3 (A), Fig. 3 (B) and Fig. 3 (C), it illustrates at several voltage potential Vertical stress on multi-layer capacitor.

Fig. 4 shows another embodiment of the circuit including voltage-stablizer and SoC.

Fig. 5 includes Fig. 5 (A), Fig. 5 (B) and Fig. 5 (C), it illustrates at several voltage potential Vertical stress on multi-layer capacity formula network.

Fig. 6 includes Fig. 6 (A), Fig. 6 (B) and Fig. 6 (C), it illustrates at several voltage potential Parallel stress on multi-layer capacitor.

Fig. 7 includes Fig. 7 (A), Fig. 7 (B) and Fig. 7 (C), it illustrates at several voltage potential Parallel stress on multi-layer capacity formula network.

Fig. 8 shows the flow chart of the embodiment for the method decoupled by voltage transient from SoC.

Fig. 9 shows another embodiment of the circuit including voltage-stablizer and SoC.

Figure 10 shows the embodiment of the multi-layer capacity formula network including three capacitors.

Figure 11 shows the flow process of the embodiment for the method decoupled by voltage transient from supply voltage Figure.

Although the disclosure easily various modification can be adapted form and alternative form, but with the side of citing in accompanying drawing Formula illustrates and will be described in detail herein its specific embodiments.It will be appreciated, however, that accompanying drawing and Detailed description of the invention is not intended to be limited to the disclosure particular form illustrated, and antithesis, its mesh Be to cover in the spirit and scope of the disclosure being defined by the appended claims all repair Reshaping formula, equivalents and alternative form.Title used herein is only used for the purpose of tissue, and It is not intended to the scope for limiting specification.As used in whole patent application, to permit The meaning (i.e., it is meant that have possibility) permitted rather than compulsory meaning are (i.e., it is meant that must Must) use words " possible ".Similarly, words " include " (" include ", " including ", and " includes ") mean to include but not limited to.

Various unit, circuit or miscellaneous part can be described as " being configured to " and perform one or more Task.In this type of context, " being configured to " is to generally meaning that " having " is in the operation phase Between perform the broad sense statement of structure of " circuit " of this or the multi-task.So, even if at list During the current access failure of unit/circuit/component, unit/circuit/component may be alternatively configured as performing this task.Logical Often, the circuit forming the structure corresponding with " being configured to " can include hardware circuit.Similarly, for In describing convenient, can be described as performing one or more task by various unit/circuit/component.This type of Description should be construed as including that phrase " is configured to ".Statement is configured to perform one or more Unit/the circuit/component of task is intended to this unit/circuit/component is never called 35U.S.C. § clearly The explanation of 112 (f).More generally, the statement to any element is the most clearly intended to never call 35U.S.C. § 112 (f) for the explanation of this element, unless described especially " be used for ... device " or " use In ... step " language.

Detailed description of the invention

Along with portable set is designed in less encapsulation and includes more merit in its design Can, the demand that the parts used in the designs are less in terms of physics is increasing always.Such as, It is likely to be due to a variety of causes and makes electricity container in a portable device.Can help for example with capacitor The stable voltage level by transient current factors influencing demand (also referred to as " decouples " or " other Road ").In order to realize the form factor of necessity, some manufacturers may have been used ceramic technology, all As such as manufacturing the multilayer ceramic capacitor (MLCC) of this type of decoupling capacitors.

MLCC may present the characteristic being referred to alternatively as " capacitor is sung ".Capacitor is sung and is referred to Due to the reaction of dielectric substance in MLCC, in response to the change of the voltage level at capacitor two ends, This MLCC may carry out the characteristic of mechanical oscillation.

In order to reduce the effect that the capacitor in decoupling circuit is sung, the solution including proposing is disclosed herein The scheme of the capacitor design of coupling circuit and proposal.Scheme can be suitably to interweave with being formed in MLCC The electrode of capacitor so that the alteration of form in a region can by equal in another region but Contrary alteration of form compensates.Therefore, capacitor as entirety can stand little overall shape change be To not having overall shape to change, the energy launched possibly as acoustic noise can be maintained in capacitor And dissipate as the heat of negligible quantity.The potential advantage of this mode is that it does not relies on shape The understanding of reason of changes, though during producing in batches material properties different or along with MLCC aging and Drift, it is possible to work on.The details of this scheme described below.

The general introduction of the system being adjusted

In fig. 1 it is shown that include the block diagram of the embodiment of the system of voltage-stablizer and SoC.In example In the embodiment shown, system 100 includes the voltage-stablizer 101 being couple to supply voltage 102.VREG Output 103 can be the output produced by voltage-stablizer 101 and can be provided that SoC 104.Real at some Executing in scheme, coupling between voltage-stablizer 101 and SoC 104 can include stray inductance L105.It is being The embodiment of system 100 can include capacitor C106.

Voltage-stablizer 101 can receive the first voltage level such as supply voltage 102 as input, and produces There is the VREG output 103 of the second voltage level.In some embodiments, the first voltage level The second voltage level can be higher than.In other embodiments, the second voltage level can be higher than the first voltage Level.Voltage-stablizer 101 can be any suitable regulator design with various characteristic, such as example Such as switching regulator or linear, step-down or boosting and AC-to DC or DC-to-DC 's.

Supply voltage 102 can provide electric power to system 100, and more specifically can be to voltage-stablizer 101 Electric power is provided.Supply voltage 102 can be on dc source such as battery, or AC power such as wall Socket.In some embodiments, supply voltage 102 can be another voltage-stablizer or voltage rectifier Output, the output of the most such as battery charger.The voltage level of supply voltage 102 can be in Be suitable at the value that the value of SoC 104 is different, it is thus possible to need voltage-stablizer 101 to be adjusted to appropriate voltage Level.

VREG output 103 could be for the power supply of SoC 104.In some embodiments, VREG output 103 is positively retained under stable nominal voltage level, such as, be fixed under 1.8V. But, in other embodiments, VREG output can have can another by SoC 104 or system The nominal voltage level able to programme that one processor is arranged.In this type of embodiment, can be according to need Regulate the voltage level of VREG output 103, think that SoC 104 supplies voltage level, thus The movable level of coupling SoC 104.

SoC 104 can include processor, memory and any number of functional block.Various embodiment party In case, SoC 104 can be microprocessor, special IC (ASIC), field programmable gate array Or any other circuit of variable load may be placed on voltage-stablizer 101 (FPGA).SoC 104 can To be the main place in portable computing device (such as smart phone, panel computer or media player) Reason device.In other embodiments, SoC 104 can be configured to perform particular task or relevant appoint The such as graphics process, audio frequency of being engaged in processes or the coprocessor of radio communication.Depend on that currently perform appoints Business, SoC 104 can be operated under a nominal voltage level and maybe can be operated under multiple voltage level.? In some embodiments, SoC 104 can enter and exit battery saving mode, movable low time reduce power consumption also Raise power consumption quickly to perform one or more task.The change of movable level can quickly, such as one second Clock occurs repeatedly.SoC 104 can be couple to voltage-stablizer 101, thinks that VREG output arranges target voltage Level.In other embodiments, another processor in system can be provided for VREG output Voltage level and indicate SoC 104 according to VREG output perform.

Some embodiments can include stray inductance L105.In various embodiments, inductance L105 The self-inductance of wire trace on the circuit board at constructing system 100 place can be represented.I.e. inductance L105 can To be the less desirable effect of other design alternatives in system rather than discrete parts.Other embodiment party In case, inductance L105 can be a part for voltage-stablizer 101 design.Voltage due to inductor two ends Dropping proportional to the time speed of the change by the electric current of inductor, therefore inductance L105 may cause The voltage level of VREG output 103 declines in response to the sudden change of power demand or raises, such as example If as SoC 104 exits suddenly or enters battery saving mode.

In order to compensate owing to inductance L105 maybe may cause the spread of voltage in VREG output 103 The change of voltage level of VREG output 103 that causes of other factors, some embodiments can be wrapped Include capacitor C106.Owing to capacitor stores electric charge and resists voltage jump, C106 can use and be stored Electric charge supply unexpected current needs, if such as SoC 104 exits battery saving mode and opens suddenly Begin to consume more electric power, in VREG output 103, thus keep more consistent voltage level.C106 May be in response to raising suddenly and supplying electric charge of SoC 104 power demand, voltage-stablizer 101 is stable simultaneously To new power consumption levels.On the contrary, if owing to such as SoC 104 enters battery saving mode and there is power consumption Suddenly reducing, C106 can absorb unnecessary electric charge, until voltage-stablizer 101 is stabilized to new power consumption electricity Flat.

The block diagram of Fig. 1 is merely illustrative.System 100 in Fig. 1 is shown only for showing reality herein Execute parts necessary to scheme.In other embodiments, system 100 may be included in Fig. 1 and do not shows The various miscellaneous parts gone out.

The effect of capacitor C106 can be illustrated in fig. 2.Fig. 2 shows and can represent in system 100 The possible waveform of the relation of voltage level and the time of operation period VREG output 103.Common ginseng Examine the waveform of system 100 and Fig. 2 in Fig. 1, such as in the system not including capacitor such as C106 In the embodiment of 100, waveform 201 can represent the voltage level of VREG output 103.On the contrary, exist Including in the embodiment of the system 100 of capacitor, waveform 202 can represent VREG output 103 Voltage level.

Waveform 201 can illustrate the current needs sudden change impact on voltage-stablizer 101, and defeated without VREG Go out the capacitor not coupled between 103 and grounding parts.Waveform 201 shows in response to being illustrated by the broken lines Point at occur current needs change voltage level in peak and valley the most greatly.Peak upwards may It is to be caused owing to the activity of SoC 100 reduces suddenly to be declined suddenly by the current drain of SoC 100 's.The ghost effect causing inductance L105 can prevent voltage-stablizer 101 fast to declining suddenly of current drain Speed is reacted, thus causes obtaining charge accumulation in VREG output 103, and this may cause then temporarily Time voltage raise because electric charge may be had nowhere to go.Owing to voltage-stablizer 101 can be stabilized to new Current levels consumes, and therefore Voltage Peak can be decreased back to the nominal voltage level of VREG output 103.

At the alternately point at peak, waveform 201 also show the biggest paddy in VREG output 103. Downward paddy is probably and is caused by suddenly raising of SoC 104 activity.Equally, if voltage-stablizer 101 is the most stable, then stray inductance L105 can resist the change of the electric current from voltage-stablizer 101.Knot Really, not enough electric current may flow into SoC 104 to meet the unexpected rising of current needs.Electric current is not The result of foot is, the voltage level of VREG output 103 may reduce, until voltage-stablizer 101 energy Enough overcome the effect of inductance L105 and be adjusted to new current needs.Along with voltage-stablizer 101 is stable, The voltage level of VREG output 103 may raise and return to nominal voltage level.

On the contrary, between the grounding parts during waveform 202 can be illustrated in VREG output 103 and system 100 Add the effect of capacitor C106.Waveform 202 shows the current needs in response to indicated point The much smaller peak and valley of change.Additionally, compared with when being excluded with C106, including peak during C106 May be shorter with the duration of paddy.If current needs reduces suddenly, in the example of waveform 201 The stored charge having nowhere to go can flow to C106, and this may cause the voltage level of VREG output 103 Only have and raise in a small amount.If current needs reduces suddenly, then it may happen that contrary situation, In C106, stored charge may temporarily flow to SoC 104, until voltage-stablizer 101 is stable.

The waveform of Fig. 2 is intended to indicate that the example of a possible embodiment.Waveform shown in Fig. 2 It is only used to show the concept being associated with the embodiment of Fig. 1.The reality relevant to system 100 The parts that waveform based on circuit design, may be used, the technology used and system 100 operate The environmental condition at place and other factors and change.

Multilayer ceramic capacitor

As it has been described above, ceramic capacitor and especially MLCC are used as decoupling capacitors such as Fig. 1 In C106 appropriately selected.Forwarding Fig. 3 to, it includes Fig. 3 (A), Fig. 3 (B) and Fig. 3 (C), and it shows Gone out (A) under stable nominal voltage level, (B) is under voltage level suddenly negative drift, and (C) exists Unexpected voltage just drifting about under the diagram of MLCC.Capacitor 300 includes being couple to leading of grounding parts Body 301 and the conductor 302 being couple to voltage source 304.By dielectric 303 by conductor 301 and conductor 302 are isolated from each other.

Conductor 301 and conductor 302 can include by the separate multiple layer metal of dielectric 303.Constitute conductor Each layer of 301 can be coupled to each other on one end of capacitor 300, and each layer not removing composition conductor 302 can It is coupled to each other on opposite ends, but other configurations are also possible.This metal level (also referred to as plate) Can be to intersperse so that each layer replaces between conductor 301 and conductor 302.Conductor 301 and leading Body 302 is shown to have seven plates, and each plate is provided to illustrate easily.In some embodiments In, the actual quantity of plate can be more than 1000, and the sum of plate can determine that capacitor 300 One factor of capacitance.

Shape can be carried out by non-conducting material the most such as ceramic material (such as, barium titanate or titanium dioxide) Become dielectric 303.In order to regulate some characteristics of capacitor, this material can include additive, such as example Such as the alumina silicate being used together with barium titanate or magnesium silicate, and the zinc that is used together with titanium dioxide or Zirconium.In other embodiments, other suitable materials can be used as dielectric 303.At voltage (V) voltage levels constant of 304, when not changing because of the change of above-mentioned current needs, this electricity is situated between Matter can have relatively uniform thickness between the plate of conductor 301 and conductor 302.Fig. 3 (A) shows Capacitor 300 under nominal operating voltage.

If the voltage level of voltage (V-Δ V) 304 declines the value Δ V as shown in Fig. 3 (B), then dielectric 303 may shrink, thus reduce the every of the dielectric 303 between the plate of conductor 301 and conductor 302 The thickness of individual layer.In other embodiments, dielectric 303 may be in response to the negative drift of voltage level And expand.If capacitor 300 has hundreds of or more laminate, then cumulative effect is probably capacitor Overall size is significantly drifted about and the barycenter of capacitor 300 may be made to drift about, and this may cause drift Physical force is passed on the circuit board that capacitor 300 can be attached.

If the voltage level of voltage (V+ Δ V) 304 is from the nominal voltage level increase value shown in Fig. 3 (C) Δ V, then be likely to occur reverse effect, and dielectric 303 may expand, so that capacitor Drift about on the direction that the barycenter of 300 is contrary when shrinking with dielectric.In other embodiments, electricity is situated between Matter 303 can be shunk in response to the negative drift of voltage level.With reference to Fig. 1, if C106 corresponds to MLCC such as capacitor 300, and SoC 104 works, thus produce periodic power consumption and increase Big and reduce, this periodically power consumption changes and may form voltage between conductor 301 and conductor 302 Drift, thus cause capacitor 300 to vibrate at the frequency being inversely proportional to the change of power consumption cycle.This Vibration may be transferred to circuit board, and if frequency be in the range of audibility, then may hear Humming or other noises.Even if frequency is outside the range of audibility, the vibration of gained is likely to electric capacity Device 300 attachment point circuit board pressurization, and if attachment point rupture, then may cause the thing of circuit Reason fault.

It may be noted that the illustration of Fig. 3 is the most for purposes of illustration.This illustration has been simplified and has exaggerated, To emphasize the voltage-transition impact on the shape of MLCC.Additionally, for the plate number shown in each conductor May be the biggest in actual MLCC.

With reference now to Fig. 4, it illustrates another embodiment of the system including voltage-stablizer and SoC Block diagram.In the embodiment illustrated, system 400 includes the voltage stabilizing being couple to supply voltage 402 Device 401.VREG output 403 is the output of voltage-stablizer 401 generation and can be provided that SoC 404. In some embodiments, coupling between voltage-stablizer 401 and SoC 404 can include stray inductance L405.Inductance L405 is probably the conduction on the circuit board of the lead-in wire by voltage-stablizer 401 or system 400 Trace causes.Capacitor C407 can export 403, and electric capacity relative to grounding parts decoupling VREG Device C408 can decouple VREG output 403 relative to supply voltage 402.

Voltage-stablizer 401, supply voltage 402, VREG output 403, SoC 404 and inductance L405 are Can be analogous respectively to the voltage-stablizer 101 from Fig. 1, supply voltage 102, VREG output 103, SoC 104 and inductance L105, therefore can show as the most described in reference diagram 1.System 400 The capacitor C408 between VREG output 403 and supply voltage 402 can be included.In order to Fig. 1 In C106 the decoupling of equivalent level is provided when comparing, the capacitance of C407 with C408 can together be added Reach the capacitance of C106.In this way, can store in C407 and C408 and stored The electric charge of the electric charge equivalent in C106.

Referring again to the waveform of Fig. 2, the upwards spike on the voltage level of VREG output 403 may Positive Δ V can be formed on C407.But, this upwards spike C408 may be had negative effect, Thus form equal but negative Δ V, because C408 is couple to supply voltage 402 rather than grounding parts.Class As, the downward spike on the voltage level of VREG output 403 may be formed negative on C407 Δ V, and form equivalent but contrary Δ V on C408.The characteristic that this is equal but contrary can be used Alleviate the anamorphic effect shown by the dielectric substance in MLCC.

In order to show above-mentioned concept, simplify the block diagram of Fig. 4.System 400 in Fig. 4 illustrate only For showing parts necessary to embodiments herein.In other embodiments, system 400 can It is included in the various miscellaneous parts not shown in Fig. 4.

Forwarding Fig. 5 to, it includes Fig. 5 (A), Fig. 5 (B) and Fig. 5 (C), it illustrates MLCC another Individual embodiment.Fig. 5 includes three diagrams, it illustrates (A) under nominal voltage level, (B) is at electricity Under voltage level negative drift suddenly, and the capacitor 500 that (C) is under unexpected voltage is just drifting about.Electric capacity Device 500 includes the conductor 501 being couple to voltage (V) 504 and is couple to the conductor 502 of grounding parts.By Conductor 501 and conductor 502 are isolated from each other by dielectric 503.Capacitor 500 also includes being couple to supply The conductor 505 of piezoelectric voltage (power supply) 506.

Capacitor 500 can include two capacitors with single shared conductor and two independent conductors. The first capacitor can be formed by arrangement of conductors 501 and conductor 502.This capacitor may correspond to Fig. 4 In C407.The second capacitor, and second can be formed by arrangement of conductors 501 and conductor 505 Capacitor may correspond to the C408 in Fig. 4.As will be described, by group in same encapsulation Close capacitor C407 and C408, dielectric 503 can be alleviated in response to capacitor C407 and C408 two The voltage change of end and the effect that changes.

Conductor 501 can be substantially similar to the conductor 301 in Fig. 3.In various embodiments, conductor 501 can have plate more more or less of than conductor 301, and plate can have similar or different shape. Conductor 502 can be similar to the conductor 302 in Fig. 3.But, conductor 502 can have relative to conductor 501 There is less plate.Conductor 505 can be similar to conductor 502 in terms of composition and structure.Conductor 505 can have Have and the plate of conductor 502 equal number, or conductor 505 can have more more or less than conductor 502 Plate.In some embodiments, the plate number of conductor 502 and 505 altogether can be equal to conductor 501 Plate number.In other embodiments, conductor 502 and 505 altogether can have more more than conductor 501 or Less plate.In the illustration of Fig. 5, conductor 505 is dragged so that seems conductor 505 and leads Body 502 intersects.But, any leading can not be set up between the conductor 502 and 505 in capacitor 500 Power path.

Plate from conductor 502 and conductor 505 can be interspersed with between the plate of conductor 501, from And form pattern.This pattern starts from the plate from top conductor 502, is followed by from conductor 501 Plate, followed by from the plate of conductor 505, followed by from the plate of conductor 501.This pattern is then Repeat: 502-501-505-501-502 etc..This pattern is only a lot of of the plate of three conductors of interspersion A kind of mode in possible mode.Such as, another kind of suitable layout can be 501-505-501- 505-501-502-501-502, and then repeat.In some embodiments, there is repeat patterns It is likely not to have and keeps the plate of conductor 502 and conductor 505 to mix the most important.But, it may be noted that come Not adjacent with the plate from conductor 505 from the plate of conductor 502, because so may be at supply voltage The 3rd capacitor is formed between 506 and grounding parts.But, in other embodiments, this is probably symbol Desired want, will be discussed in more detail after a while in the document.

As explained above with described in Fig. 3, when the voltage levels constant of voltage 504, dielectric is being led Relatively uniform thickness can be had between body 501 and the plate of 502 and between conductor 501 and the plate of 505 Degree.Fig. 5 (A) shows the capacitor 500 under nominal operating voltage.Assume that supply voltage 506 is protected Keeping steady fixed, if the voltage level drop-out value Δ V of voltage (V-Δ V) 504, then dielectric 503 may be Shrink between conductor 501 and conductor 502, as explained above with described in Fig. 3.But, dielectric 503 May expand between conductor 501 and conductor 505, because described with reference to FIG. 4, see C408 To Δ V be equally likely to the Δ V that seen by C407 but contrary.If suitably arranging three conductors Plate and dielectric 503, then the overall shape of capacitor may will not significantly change, as shown in Fig. 5 (B) 's.

If the voltage level of voltage (V+ Δ V) 504 raises rather than drop-out value Δ V, then dielectric 503 can By expanding with the opposite way just described and shrinking.As shown in Fig. 5 (C), capacitor 500 Overall shape can will not significantly change equally, because the dielectric 503 between conductor 501 and the plate of 502 Expansion can eliminate the contraction of the dielectric 503 between conductor 501 and the plate of 505.

In the embodiment of Fig. 5, dielectric 503 is illustrated as receiving in response to negative voltage level drift Contracting, and expand in response to positive voltage level drift.As was described in connection with figure 3, in other embodiments In, dielectric 503 shrinks in response to positive voltage level drift, and drifts about in response to negative voltage level And expand.In any embodiment, suitably arrange that three conductors and dielectric substance still can realize The reduction of capacitor 500 change in shape.

The embodiment of Fig. 5 also show single dielectric, i.e. dielectric 503.Other embodiment party In case, between different layers conductive plate, use different dielectric substances.Such as, can lead at some layers The first dielectric substance shunk in response to negative voltage level drift is used between electroplax.Can be at some Another dielectric substance expanded in response to negative voltage level drift is used between layer conductive plate.Except Having outside different physical characteristic, various dielectric substances mentioned above also can have different electric Characteristic, the most such as capacitivity.

In some embodiments, stacking can include intersperse from conductor 502 all plates with carry out self-conductance The plate of body 501, then intersperse all plates from conductor 505 and the plate from conductor 501 so that There is no the plate of conductor 502 between two plates of conductor 505, and vice versa.Although this layout Can the overall shape of holding capacitor device 500, but barycenter still may drift about in encapsulation, and this is still So it is likely to result in physical force and is delivered to circuit board.Indicated above, in some embodiments, at three The pattern between the plate of conductor with repetition is likely not to have the plate mixing keeping conductor 502 and conductor 505 The most important.Between the plate of conductor 505, the plate purpose of distributed conductive 502 can be at capacitor 500 Encapsulation in distributed mass drift, thus produced final physical power can be reduced.

It may be noted that the illustration of Fig. 5 is the most for purposes of illustration.This illustration has been simplified and has exaggerated, To emphasize the voltage-transition impact on the shape of MLCC.Additionally, in the various embodiments of MLCC In, can be different for the plate number shown in each conductor.

Fig. 3 and Fig. 5 illustrates the effect that the dielectric of the plane being perpendicular to conductor plate expands and shrinks. Fig. 6 includes Fig. 6 (A), Fig. 6 (B) and Fig. 6 (C), it illustrates dielectric substance and the most also can be parallel to Plate expands and shrinks.Fig. 6 includes the capacitor with the structure of the capacitor 300 being similar in Fig. 3 Three illustrations of 600.Three illustrations in Fig. 6 show that (A) has the nominal voltage of voltage (V) 604 Level, the voltage level bust Δ V of (B) voltage (V-Δ V) 604 and the electricity of (C) voltage (V+ Δ V) 604 Voltage level jumps the capacitor 600 of Δ V.In the these three of Fig. 6 illustrates, illustrate only parallel effect Should.Not shown vertical effect discussed above.

In Fig. 6 (A), capacitor 600 is it can be seen that the nominal voltage level of voltage 604, and electricity is situated between Matter 603 can be at its baseline shape.In Fig. 6 (B), the voltage level of voltage 604 may decline ΔV.Declining in response to voltage level, dielectric 603 can be parallel to conductor 601 and the plate of conductor 602 And shrink.In Fig. 6 (C), the voltage level of voltage 604 may raise Δ V and non-decreasing Δ V.Cause This, dielectric 603 can be parallel to the plate growth of conductor.As previously disclosed, dielectric 603 Alteration of form may cause vibration to be delivered to circuit board, if the voltage level change of correspondence occurs can Listen under frequency, then this may be heard.

The illustration of Fig. 6 is used only for showing.The part of this illustration is simplified, and other part quilts Exaggerate the impact emphasizing voltage-transition to the shape of MLCC.In various embodiments, institute in figure The plate quantity shown may be different from the illustration in actual MLCC with relative scale.

Forward Fig. 7 to, it illustrates the enforcement of the MLCC structure being similar to that structure shown in Fig. 5 Scheme.Fig. 7 includes three illustrations, Fig. 7 (A), Fig. 7 (B) and Fig. 7 (C), it illustrates (A) and has electricity The nominal voltage level of pressure (V) 704, the voltage level bust Δ V of (B) voltage (V-Δ V) 704 and (C) The voltage level of voltage (V+ Δ V) 704 jumps the capacitor 700 of Δ V.Equally, in order to easily manage Solve, illustrate only parallel effect.

Fig. 7 (A) shows electricity Jie with the nominal voltage level that baseline shape is simultaneously subjected to voltage 704 Matter 703.If the voltage level of the voltage 704 as shown in Fig. 7 (B) declines Δ V, then dielectric 703 The board plane of the panel area that can be parallel to conductor 702 shrinks.But, at the panel area of conductor 705, Dielectric 703 is inflatable.Expand and shrink this combination may result in dielectric 703 some " word Shape " edge, but compared with the capacitor 600 in the Fig. 6 under the same terms, overall shape change Can be minimum.Can illustrate similar effect in Fig. 7 (C), wherein the voltage level of voltage 704 raises Δ V, and non-decreasing.In this case, dielectric 703 can be parallel to the panel area of conductor 702 The planar expansion of plate, and contraction around the plate of conductor 705.This can realize dielectric 703 and be similar to Otherwise but glyph edges.

The example illustrating only reception and registration concept shown in the figure 7.This illustration has been simplified and has overstated Greatly, to emphasize the voltage-transition impact on the shape of MLCC.In various embodiments, in the drawings The quantity of shown plate and relative scale may be different from actual MLCC.

For the method decoupling voltage transient

Turning now to Fig. 8, it presents the flow chart of the method for decoupling voltage transient.The method May correspond to the capacitor 500 in system 400 and Fig. 5 shown in the diagram.Collective reference figure 4, Fig. 5 and Fig. 8, the method can begin at frame 801.

Such as, the voltage (frame 802) being adjusted can be generated by voltage-stablizer 401.Voltage-stablizer 401 can Receive supply voltage 402 and as input and export the voltage being adjusted, i.e. VREG output 403.Surely Depressor 401 and/or system 400 are implemented in circuit board thereon can include stray inductance the most such as inductance L405, this may cause voltage responsive to be fluctuated in the current drain change of SoC 404.

In order to reduce the voltage level change of VREG output 403, i.e. stablize VREG output 403 Voltage level, can couple the first capacitor the most such as C407 from VREG output 403 to grounding parts (frame 803).This capacitor may be in response to raising suddenly of the voltage level of VREG output 403 and Store the excess charges from voltage-stablizer 401.Additionally, C407 may be in response to VREG output 403 The reducing suddenly and supply voltage level from stored charge to SoC 404.In other embodiments In, the first capacitor can be couple to the signal in addition to grounding parts.Have and export less than VREG Any signal of the voltage level of the minimum stabilization of level of 403 can be all suitable.

In order to stablize VREG output 403 further, can be from VREG output 403 to supply voltage 402 couple the second capacitor the most such as C408 (frame 804).This capacitor may be in response to VREG Export the reduction suddenly of the voltage level of 403 and store the excess charges from voltage-stablizer 401.This Outward, C408 may be in response to the raising suddenly and supply to SoC 404 of voltage level of VREG output 403 Answer stored charge.In other embodiments, the second capacitor can be couple to except supply voltage Signal outside 402.There is the maximum working voltage stabilization of level more than VREG output 403 Any signal of voltage level can be all suitable.

The first conductor being used for capacitor can be couple to VREG and export 403 (frames 805).This is years old One conductor may correspond to the conductor 501 in Fig. 5.First conductor can be parallel to each other and spaced apart by being arranged to The multiple plate of conductive material opened are constituted.Multiple plates can be coupled together at public side.

As another parts of capacitor C407, the second conductor can be couple to grounding parts (frame 806).This second conductor may correspond to conductor 502.Individual second conductor can be by being similar to the first conductor cloth The multiple plate of conductive material put are constituted.In some embodiments, this second conductor can have ratio first The plate that conductor is less.

The 3rd conductor being used for capacitor C408 can be couple to supply voltage such as supply voltage 402 (frame 807).3rd conductor may correspond to conductor 505.3rd conductor is configurable to be similar to Second conductor, plurality of plate is arranged in parallel and is coupled together at public side.

Next step of the method can be the plate (frame of the second conductor of interspersing between all plates of the first conductor 808).By interspersing, the plate of the second conductor can be disposed parallel to the plate of the first conductor so that as Fruit is not all of also being that the plate of most of second conductor is all near at least one plate of the first conductor.Should Any part of the first conductor all can not contact any part of the second conductor.At the first conductor and second Little uniform gap can be kept between each plate of conductor.Available suitable dielectric substance such as example As ceramic compound fills little uniform gap.

The method can intersperse the plate (frame of the 3rd conductor now between remaining plate of the first conductor 809).The plate of the 3rd conductor can be disposed parallel to the plate of the first conductor so that the one of the 3rd conductor A little or all plate is near at least one plate of the first conductor.As the second conductor, can lead first Keeping little uniform gap between each plate of body and the 3rd conductor, this gap may utilize similar electricity Jie Material is filled.Any part of the 3rd conductor all can not contact the first conductor or the second conductor Any part.

Can be interspersed between all plates of the first conductor the second conductor and the plate of the 3rd conductor so that second Any plate of conductor is not the most near the plate of the 3rd conductor, and do not has the first conductor between the two Plate.Interspersion plate also can obtain a kind of pattern, and wherein at least some plate of this second conductor is positioned at the 3rd and leads Between at least some plate of body, wherein the plate of the first conductor is positioned at any of the second conductor and the 3rd conductor Plate between.Such as, " 1 " represents the plate of the first conductor, and " 2 " represent the plate of the second conductor, and And " 3 " represent the plate of the 3rd conductor, suitable pattern may is that 1-2-1-3-1-2-1-3-1 or 2-1-3- 1-3-1-2-1-2-1.The another kind of suitably pattern that can use in some embodiments is: 1-2-1-1-3-1- 1-2-1-1-3-1, in this case, can use except aforementioned dielectric materials between the 1-1 layer repeated Outside suitable insulating materials.Suitable insulating materials is thinner than dielectric substance, or comparable Dielectric is more pliable and tougher, and therefore, it is possible to absorbs some produced due to dielectric contraction and expansion Power.Interspersion pattern can be or can not be repeat.The method can terminate in frame 810.

It may be noted that MLCC presents the electricity of change in shape when being used as being exposed to voltage level change The example of container.But, feature disclosed in the document is not really wanted to be limited to MLCC technology.Can The feature expressed herein is applied to each conductor to be made up of more than one plate and conductor or electricity Medium may change in response to voltage level and stand any capacitor technology of shape distortion.

The method of Fig. 8 is only an example.In some embodiments, the quantity of step can different and/ Or can carry out according to different order.Although step is illustrated as sequentially carrying out, but can some steps of executed in parallel Suddenly.

Above with reference in the discussion of Fig. 5, if it may be noted that the plate of conductor 502 and conductor 505 Plate is adjacent, can form the 3rd other capacitor, and in some embodiments, this can be on power supply Voltage level provides additional stability.

Turning now to Fig. 9, it illustrates system 900.System 900 can include the system that is similar to 400 Parts, are such as couple to the voltage-stablizer 901 of supply voltage 902.VREG output 903 can be by surely Depressor 901 produce output and can be provided that SoC 904.In some embodiments, voltage-stablizer Coupling between 901 and SoC 904 can include stray inductance L905.Capacitor C907 can be relative to connecing Ground portion decouples VREG output 903, and capacitor C908 can solve relative to supply voltage 902 Coupling VREG output 903.Stray inductance L909 can be included in supply voltage 902 and C908 it Between.Stray inductance L910 can be included between grounding parts and C907.Capacitor C911 can be relative to Grounding parts decouples supply voltage 902.

Voltage-stablizer 901, supply voltage 902, VREG output 903, SoC 904, inductance L905, Capacitor C907 and C908 all can be similar to the voltage-stablizer 401 from Fig. 4, supply voltage 402, VREG output 403, SoC 404, inductance L405, capacitor C407 and C408, therefore can show For as the most described in reference diagram 4.

System 900 includes in system 400 optional feature that may be unreferenced, including inductance L909 and L910.In some embodiments, inductance L909 and L910 can be stray inductance.Inductance L909 Can include in supply voltage 902 and electric from the power supply on the circuit board at constructing system 900 place The stray inductance of the conductive trace of pressure 902.Inductance L910 can include the leading to grounding parts on circuit board The stray inductance of electric trace.Adding inductance L909 and L910 can be at supply voltage 902 and grounding parts mark Auxiliary voltage transition is formed, because the load being placed on supply voltage 902 is due to voltage-stablizer 901 on line Maybe may be couple to supply voltage 902 but the current drain of any other circuit unshowned change and become Change.

In order to compensate the additional stray effect of L909 and L910, can be from supply voltage 902 to grounding parts Couple the 3rd capacitor C911.Being similar to other decoupling capacitors described herein, C911 may be in response to Trace stores electric charge to the raising suddenly of voltage level of supply voltage 902, and may be in response to trace Electric charge is supplied to the reducing suddenly of voltage level of supply voltage 902.Relative to the mark to grounding parts Line is contrary it may be the case that real.Trace may result in the decline of the voltage level of grounding parts C911 stores electric charge, and trace may result in C911 supply electricity to the rising of the voltage level of grounding parts Lotus.

In order to show above-mentioned concept, simplify the block diagram of Fig. 9.System 900 in Fig. 9 only illustrates It is used for showing parts necessary to embodiments herein.In other embodiments, system 900 May be included in the various miscellaneous parts not shown in Fig. 9.

Forward Figure 10 to, it illustrates an embodiment of another capacitor the most such as MLCC. Capacitor 1000 includes the conductor 1001 being couple to voltage (V) 1004 and is couple to the conductor of grounding parts 1002.By dielectric 1003, conductor 1001 and conductor 1002 can be isolated from each other.Capacitor 1000 Also include the conductor 1005 being couple to supply voltage (power supply) 1006.Dielectric 1007 can be used for by The plate of conductor 1002 separates with the plate of conductor 1005.

Structure with regard to the capacitor between conductor 1001 and 1002 and between conductor 1001 and 1005 For, capacitor 1000 can be similar to the capacitor 500 in Fig. 5.By conductor 1001 and 1002 The capacitor that plate is formed may correspond to the C907 in Fig. 9.Similarly, by conductor 1001 and 1005 shape The capacitor become may correspond to the C908 in Fig. 9.In the illustration of Figure 10, conductor 1005 is shown Go out so that seem that conductor 1005 and 1002 intersects.But, for as described in capacitor 500 , any conductive path can not be set up between the conductor 1002 and 1005 in capacitor 1000.

Capacitor 1000 can be different from capacitor 500, and this is that capacitor 1000 can have and is parallel to The plate of conductor 1005 in its vicinity and by the plate of the separate conductor of dielectric 1,007 1002.Dielectric 1007 can be a part for dielectric 1003, or dielectric 1007 can be with 1003 points of dielectric Open.The plate of the plate and conductor 1002 in its vicinity that are parallel to conductor 1005 can be at supply voltage The 3rd capacitor is formed between 1006 and grounding parts.3rd capacitor may correspond in Fig. 9 C911。

It may be noted that the illustration of Figure 10 is the most for purposes of illustration.This illustration has been simplified and has exaggerated, To emphasize the voltage-transition impact on the shape of multi-layer capacitor.Additionally, for shown in each conductor Plate number may be the biggest in actual embodiment.

For the method decoupling supply voltage

Forwarding Figure 11 to, it presents the flow chart of the method for decoupling supply voltage.The method can be right Should be in the capacitor 1000 in the system 900 and Figure 10 shown in Fig. 9.Collective reference Fig. 9, Figure 10 And Figure 11, the method can proceed after the step 809 in the method for Fig. 8 and start from frame 1101。

Can be by interspersing from having already coupled to the plate of conductor such as conductor 1002 of grounding parts and coupling of controlling oneself The plate of the conductor such as conductor 1005 receiving supply voltage 902 forms the 3rd capacitor (frame 1102).Can be with the plate of the plate of conductor 1005 arrangement of conductors 1002 abreast so that conductor 1002 At least one plate is parallel at least one plate in its vicinity of conductor 1005.Can be conductor 1002 He Keeping little uniform gap between each plate of 1005, this little uniform gap may utilize suitable electricity Jie Material is filled.In some embodiments, arrange that condenser armature can as described in connection with fig. 11 The deformation of the dielectric substance in reduction capacitor, thus may eliminate and capacitor as described above " sing " audible noise being associated.

For stable power-supplying voltage the most such as supply voltage 902, can be as shown in the C911 in Fig. 9 The 3rd capacitor (frame 1103) is coupled to grounding parts from supply voltage 902.3rd capacitor can ring Ying Yu is couple to raising suddenly and storing of the voltage level of the trace on the circuit board of supply voltage 902 Excess charges.Additionally, the 3rd capacitor may be in response to be couple on the circuit board of supply voltage 902 The reducing suddenly and supply stored charge of the voltage level of trace.In other embodiments, Three capacitors can be couple to the signal in addition to supply voltage 902 and grounding parts, and can be depending on electric capacity How device C907 and C908 is couple in system 900.

It may be noted that the method for Figure 11 is the most merely illustrative.In some embodiments, the quantity of step can Different and/or can carry out according to different order.Although step is illustrated as sequentially carrying out, but can executed in parallel Each step.

Once fully understand above disclosure, a lot of variations and the modification skill for this area Will become clear from for art personnel.It is contemplated that be interpreted to contain by claims below These type of variations all and modification.

Claims

1. an equipment, including:

More than first conductive plate, the first segment that described more than first conductive plate is couple in common encapsulation Point；

More than second conductive plate, described more than second conductive plate be couple in described common encapsulation Two nodes；With

3rd many conductive plates, the described 3rd many conductive plates be couple in described common encapsulation Three nodes；

At least the first conductive plate in wherein said more than first conductive plate is disposed in described more than second In at least the first conductive plate in individual conductive plate and described 3rd many conductive plates at least Between first conductive plate.

Equipment the most according to claim 1, at least in wherein said more than first conductive plate Two conductive plates are disposed between at least two conductive plate in described more than second conductive plate, And at least the 3rd conductive plate in wherein said more than first conductive plate is disposed in described Between at least two conductive plate in more than three conductive plate.

Equipment the most according to claim 1, in wherein said more than first conductive plate described extremely Between described at least the first conductive plate in few first conductive plate and described more than second conductive plate The first space include the institute in dielectric substance, and wherein said more than first conductive plate State described at least the first conductive plate at least the first conductive plate and described 3rd many conductive plates Between second space include described dielectric substance.

Equipment the most according to claim 3, wherein said dielectric substance includes ceramic material.

Equipment the most according to claim 1, at least in wherein said more than second conductive plate Two conductive plates are adjacently positioned with at least the second conductive plate in described 3rd many conductive plates.

Equipment the most according to claim 3, wherein said dielectric substance is configured to respond to Negative voltage level and shrink, and in response to positive voltage level change and expand.

Equipment the most according to claim 3, wherein said dielectric substance is configured to respond to Positive voltage level changes and shrinks, and expands in response to negative voltage level change.

8. a system, including:

Power supply, described power supply is configured to provide the first voltage electricity between plus end and negative terminal Flat；

Voltage-stablizer, described voltage-stablizer is couple to described power supply, and wherein said voltage-stablizer is configured to Generating the second voltage level at lead-out terminal, wherein said second voltage level depends on Described first voltage level；

First capacitor, described first capacitor be coupled in described lead-out terminal and described negative terminal it Between, wherein said first capacitor includes be couple to described lead-out terminal more than first First subgroup of conductive plate and be couple to described negative terminal more than second conductive plate the One subgroup；With

Second capacitor, described second capacitor be coupled in described lead-out terminal and described plus end it Between, wherein said second capacitor includes be couple to described lead-out terminal described first Second subgroup of multiple conductive plates and the 3rd many conductive plates being couple to described plus end The first subgroup；

At least one conductive plate in wherein said more than first conductive plate is disposed in described more than second In at least one conductive plate in individual conductive plate and described 3rd many conductive plates at least Between one conductive plate.

System the most according to claim 8, also includes being coupled in described plus end and described negative terminal The 3rd capacitor between son, wherein said 3rd capacitor includes being couple to described negative terminal The second subgroup of described more than second conductive plate and be couple to the described 3rd of described plus end Second subgroup of multiple conductive plates.

System the most according to claim 8, wherein common encapsulation includes being couple to described voltage-stablizer Output first node, be couple to the Section Point of described negative terminal and be couple to described just 3rd node of terminal.

11. systems according to claim 10, wherein said first node is couple to the first conductor The plurality of conductive plate, and wherein said Section Point is couple to the institute of described second conductor State multiple conductive plate, and wherein said 3rd node is couple to the described of described 3rd conductor Multiple conductive plates.

12. systems according to claim 8, described the first of wherein said more than first conductive plate Subgroup is separated by described first subgroup of dielectric substance with described more than second conductive plate, And described second subgroup of wherein said more than first conductive plate passes through dielectric substance and institute State described first subgroup of the 3rd many conductive plates separately.

13. systems according to claim 12, wherein dielectric substance includes ceramic material.

14. systems according to claim 9, described the second of wherein said 3rd many conductive plates Subgroup is separated by described second subgroup of dielectric substance with described more than second conductive plate.

15. 1 kinds of methods, including:

Generate according to the input voltage signal being in the second voltage level and be in the first voltage level Output voltage signal；

Stablize by coupling the first capacitor between described output voltage signal and grounding parts reference Described output voltage signal, wherein said first capacitor includes being couple to described output First subgroup of more than first conductive plate of voltage signal is joined with being couple to described grounding parts In first subgroup of more than second conductive plate examined, and described more than first conductive plate At least one conductive plate and described more than second conductive plate at least one conductive plate Adjacent；And

By coupling the second capacitor between described output voltage signal and described input voltage signal Stablizing described output voltage signal, wherein said second capacitor includes being couple to institute State the second subgroup of described more than first conductive plate of output voltage signal and be couple to institute Stating the first subgroup of the 3rd many conductive plates of input voltage signal, described more than first is individual In at least another conductive plate in conductive plate and described 3rd many conductive plates at least One conductive plate is adjacent, and dielectric substance is arranged on described more than first conductions At least one conductive plate in described first subgroup of plate and described more than second conductive plate Described first subgroup in adjacent plate between.

16. methods according to claim 15, also include by described input voltage signal and institute State grounding parts with reference between couple the 3rd capacitor to stablize described input voltage signal, wherein Described 3rd capacitor includes described more than second conductive plate being couple to described grounding parts reference The second subgroup and be couple to described input voltage signal described 3rd many conductive plates the Two subgroups.

17. methods according to claim 15, wherein said output voltage signal is couple to public envelope First node in dress, described grounding parts is with reference to being couple to the second section in described common encapsulation Point, and the 3rd node that described input voltage signal is couple in described common encapsulation.

18. methods according to claim 17, wherein said first node is couple to described more than first Individual conductive plate, described Section Point is couple to described more than second conductive plate, and described Three nodes are couple to described 3rd many conductive plates.

19. methods according to claim 15, wherein said dielectric substance at least includes the first electricity Dielectric material and the second dielectric substance.

20. methods according to claim 19, wherein said first dielectric substance is configured to ring Should shrink in negative voltage level and expand in response to positive voltage level change, and its Described in the second dielectric substance be configured to respond to positive voltage level and shrink and respond Expand in negative voltage level change.