CN105895791A - 一种led倒装晶片 - Google Patents

一种led倒装晶片 Download PDF

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Publication number
CN105895791A
CN105895791A CN201510423312.8A CN201510423312A CN105895791A CN 105895791 A CN105895791 A CN 105895791A CN 201510423312 A CN201510423312 A CN 201510423312A CN 105895791 A CN105895791 A CN 105895791A
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Prior art keywords
flip chip
positive
electrode
led flip
wafer
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邹亮星
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Shandong Xingling Photoelectric Technology Co Ltd
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Shandong Xingling Photoelectric Technology Co Ltd
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Priority to CN201510423312.8A priority Critical patent/CN105895791A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供一种LED倒装晶片,涉及led照明灯具领域,包括蓝宝石衬底和设置于蓝宝石衬底上端的发光区,还包括晶片正负电极,所述晶片正负电极设置于发光区之上,所述晶片正负电极上印刷有颗粒状锡膏,颗粒状锡膏均匀的平铺在晶片正负电极的上端面,所述晶片正负电极的外沿上印刷保护绝缘胶。本发明提供的LED倒装晶片,结构设计更为合理,适于工业化生产,可简化生产工艺,降低生产成本;电极形状做了优化设计。

Description

一种LED倒装晶片
技术领域
本发明涉及LED照明灯具领域,尤其涉及一种LED倒装晶片。
背景技术
LED灯管也俗称光管、日光灯管,其光源采用LED作为发光体。LED是一种固态的半导体发光器件,作为新一代光源,正在迅猛发展。它可以直接把电转化为光。具有低压供电、耗能少、适用性强、稳定性高、响应时间短(开关特性好)、对环境无污染、多色发光、显色性能好等优点,是值得推广的新光源。
LED晶片为LED的主要原材料,LED主要依靠晶片来发光。传统的LED晶片结构多为正装晶片,生产和装配不方便,使LED灯具的生产成本升高。
发明内容
本发明的目的在于提供一种LED倒装晶片,以解决上述技术问题。该LED倒装晶片结构设计更为合理,适于工业化生产,可简化生产工艺,降低生产成本。
本发明所要解决的技术问题采用以下技术方案来实现:
一种LED倒装晶片,其特征在于:包括蓝宝石衬底和设置于蓝宝石衬底上端的发光区,还包括晶片正负电极,所述晶片正负电极设置于发光区之上,所述晶片正负电极上印刷有颗粒状锡膏,颗粒状锡膏均匀的平铺在晶片正负电极的上端面,所述晶片正负电极的外沿上印刷保护绝缘胶。
所述晶片正负电极由正负两个电极构成,其中一个电极的上端面由圆形区和延长区两部分构成,所述延长区连接在圆形区靠近另一个电极的一侧,并向另一个电极延伸;另一个电极的上端面为圆形。
所述延长区的延长末端为圆弧形,优化电流分布。
先按照常规LED正装晶片制作工艺,加工到研磨工序,倒装晶片的外延片研磨到指定厚度后,在高精密印刷机下,采购高精密钢网印刷小粒径锡膏,使经过特殊配方调配的小粒径锡膏均匀的平铺到晶片正负电极上;金相显微镜下检验印刷区域和印刷后锡膏成型效果达到预期目标;
在SPR锡膏测厚机内测试每颗LED晶片电极上锡膏厚度是否达到预期目标,超过预期目标或者未达到预期目标均判为不良品,重新清洗重新印刷;
将测试厚度合格的倒装晶片送入特殊定制的回流焊内,使晶片电极上的锡膏溶解,均匀的平铺到晶片电极上;
回流焊完成后再次印刷保护绝缘胶,保护并绝缘晶片电极外的位置。
本发明的有益效果是:
本发明提供的LED倒装晶片,结构设计更为合理,适于工业化生产,可简化生产工艺,降低生产成本;电极形状做了优化设计。
附图说明
图1为本发明的主视示意图;
图2为本发明的俯视示意图。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施例和附图,进一步阐述本发明,但下述实施例仅仅为本发明的优选实施例,并非全部。基于实施方式中的实施例,本领域技术人员在没有做出创造性劳动的前提下所获得其它实施例,都属于本发明的保护范围。
如图1、图2所示,一种LED倒装晶片,包括蓝宝石衬底1和设置于蓝宝石衬底1上端的发光区2,还包括晶片正负电极3,晶片正负电极3设置于发光区2之上,晶片正负电极3上印刷有颗粒状锡膏4,颗粒状锡膏4均匀的平铺在晶片正负电极3的上端面,晶片正负电极3的外沿上印刷保护绝缘胶5。
晶片正负电极3由正负两个电极构成,其中一个电极的上端面由圆形区和延长区两部分构成,延长区连接在圆形区靠近另一个电极的一侧,并向另一个电极延伸,延长区的延长末端为圆弧形;另一个电极的上端面为圆形。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的仅为本发明的优选例,并不用来限制本发明,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (3)

1.一种LED倒装晶片,其特征在于:包括蓝宝石衬底和设置于蓝宝石衬底上端的发光区,还包括晶片正负电极,所述晶片正负电极设置于发光区之上,所述晶片正负电极上印刷有颗粒状锡膏,颗粒状锡膏均匀的平铺在晶片正负电极的上端面,所述晶片正负电极的外沿上印刷保护绝缘胶。
2.根据权利要求1所述的LED倒装晶片,其特征在于:所述晶片正负电极由正负两个电极构成,其中一个电极的上端面由圆形区和延长区两部分构成,所述延长区连接在圆形区靠近另一个电极的一侧,并向另一个电极延伸;另一个电极的上端面为圆形。
3.根据权利要求2所述的LED倒装晶片,其特征在于:所述延长区的延长末端为圆弧形。
CN201510423312.8A 2015-07-13 2015-07-13 一种led倒装晶片 Pending CN105895791A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084684A1 (en) * 1999-12-01 2004-05-06 Cree Lighting Company Scalable LED with improved current spreading structures
CN102024884A (zh) * 2009-09-18 2011-04-20 晶元光电股份有限公司 光电半导体装置
CN104733600A (zh) * 2013-12-20 2015-06-24 晶能光电(江西)有限公司 一种倒装led芯片及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084684A1 (en) * 1999-12-01 2004-05-06 Cree Lighting Company Scalable LED with improved current spreading structures
CN102024884A (zh) * 2009-09-18 2011-04-20 晶元光电股份有限公司 光电半导体装置
CN104733600A (zh) * 2013-12-20 2015-06-24 晶能光电(江西)有限公司 一种倒装led芯片及其制备方法

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