CN105869618B - 鼓垫、制造方法及电子鼓 - Google Patents

鼓垫、制造方法及电子鼓 Download PDF

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CN105869618B
CN105869618B CN201610201887.XA CN201610201887A CN105869618B CN 105869618 B CN105869618 B CN 105869618B CN 201610201887 A CN201610201887 A CN 201610201887A CN 105869618 B CN105869618 B CN 105869618B
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CN105869618A (zh
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沈国水
王伟基
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Hangzhou Shunhesheng Electronic Technology Co.,Ltd.
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Hangzhou Shunling New Material Technology Co Ltd
Hangzhou Shunhe Silicone Rubber Products Co Ltd
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    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10HELECTROPHONIC MUSICAL INSTRUMENTS; INSTRUMENTS IN WHICH THE TONES ARE GENERATED BY ELECTROMECHANICAL MEANS OR ELECTRONIC GENERATORS, OR IN WHICH THE TONES ARE SYNTHESISED FROM A DATA STORE
    • G10H3/00Instruments in which the tones are generated by electromechanical means
    • G10H3/12Instruments in which the tones are generated by electromechanical means using mechanical resonant generators, e.g. strings or percussive instruments, the tones of which are picked up by electromechanical transducers, the electrical signals being further manipulated or amplified and subsequently converted to sound by a loudspeaker or equivalent instrument
    • G10H3/14Instruments in which the tones are generated by electromechanical means using mechanical resonant generators, e.g. strings or percussive instruments, the tones of which are picked up by electromechanical transducers, the electrical signals being further manipulated or amplified and subsequently converted to sound by a loudspeaker or equivalent instrument using mechanically actuated vibrators with pick-up means
    • G10H3/146Instruments in which the tones are generated by electromechanical means using mechanical resonant generators, e.g. strings or percussive instruments, the tones of which are picked up by electromechanical transducers, the electrical signals being further manipulated or amplified and subsequently converted to sound by a loudspeaker or equivalent instrument using mechanically actuated vibrators with pick-up means using a membrane, e.g. a drum; Pick-up means for vibrating surfaces, e.g. housing of an instrument
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10DSTRINGED MUSICAL INSTRUMENTS; WIND MUSICAL INSTRUMENTS; ACCORDIONS OR CONCERTINAS; PERCUSSION MUSICAL INSTRUMENTS; AEOLIAN HARPS; SINGING-FLAME MUSICAL INSTRUMENTS; MUSICAL INSTRUMENTS NOT OTHERWISE PROVIDED FOR
    • G10D13/00Percussion musical instruments; Details or accessories therefor
    • G10D13/01General design of percussion musical instruments
    • G10D13/02Drums; Tambourines with drumheads
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10DSTRINGED MUSICAL INSTRUMENTS; WIND MUSICAL INSTRUMENTS; ACCORDIONS OR CONCERTINAS; PERCUSSION MUSICAL INSTRUMENTS; AEOLIAN HARPS; SINGING-FLAME MUSICAL INSTRUMENTS; MUSICAL INSTRUMENTS NOT OTHERWISE PROVIDED FOR
    • G10D13/00Percussion musical instruments; Details or accessories therefor
    • G10D13/01General design of percussion musical instruments
    • G10D13/03Practice drumkits or pads
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10DSTRINGED MUSICAL INSTRUMENTS; WIND MUSICAL INSTRUMENTS; ACCORDIONS OR CONCERTINAS; PERCUSSION MUSICAL INSTRUMENTS; AEOLIAN HARPS; SINGING-FLAME MUSICAL INSTRUMENTS; MUSICAL INSTRUMENTS NOT OTHERWISE PROVIDED FOR
    • G10D13/00Percussion musical instruments; Details or accessories therefor
    • G10D13/10Details of, or accessories for, percussion musical instruments
    • G10D13/26Mechanical details of electronic drums

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  • Acoustics & Sound (AREA)
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

鼓垫、制造方法及电子鼓。本发明涉及一种鼓垫及制造方法,鼓垫包括发泡橡胶构成的主体部,与该主体部结合且覆盖的表层部,其特征在于,表层部设有若干通孔,主体部与通孔融合。表层部、主体部均采用具有硅氧键的硅橡胶。本发明的技术方案工序简单、制造方便,同时表层部、主体部材料硬度都可控,采用该制造方法得到的鼓垫,其表层部、主体部结合牢固、各项性能优良。

Description

鼓垫、制造方法及电子鼓
技术领域
本发明涉及电子打击乐器中的鼓垫以及其制造方法。
背景技术
电子打击乐器中有起电音转换的鼓垫,为了实现传统鼓中鼓皮的音效及击打效果,鼓垫所选材料及结构需要实现两种效果,其一是鼓垫击打感觉(击打触感)尽可能接近鼓皮的击打感觉,其二是鼓垫吸收冲击能力及回弹性能好,避免鼓垫共振。
鼓垫击打感觉由鼓垫材料及其硬度决定,材料太硬,手或者肘就会感到疼痛。材料太软恢复系数小,槌棒几乎不回弹。有两项指标可以侧面衡量鼓垫材料的击打感觉,一个是鼓垫的恢复系数,该恢复系数是用槌棒的顶端刚回弹之后的速度除以槌棒的顶端刚要接触该鼓垫之前速度的值,它可以反映鼓垫材料的回弹特性,如果鼓垫不能很好地回弹,那么就会降低重复击打的性能。另一个是槌棒与鼓垫之间的接触时间,该接触时间是从该槌棒接触到该鼓垫表面的时刻直至离开。当接触时间太长时,就会降低重复击打性能。
授权公告号CN 101540165 B的鼓垫中国发明专利,公开的鼓垫由泡沫橡胶制成,所述泡沫橡胶包括天然橡胶、二烯橡胶、聚氨酯橡胶以及硅橡胶中的至少一种。采用这种材料的鼓垫,控制其硬度可实现合适的恢复系数,回弹性能好保证声音衰减能力,且在用槌棒击打鼓垫时槌棒与击打表面之间具有合适的接触时间。但是,主体部分发泡橡胶材料接触空气使用,会因紫外线、氧气或水分而引起老化,影响鼓垫寿命及使用效果。
针对这个问题,授权公告号CN 101551994 B公开了一种鼓垫及其制造方法,此种方案的鼓垫采用多层复合结构,它由无纺布针织材料层、树脂层以及橡胶层,通过热熔及模制工序一体固化而成。
针织织物和无纺布的纤维材料上下两层分别与树脂层、橡胶层融合,并形成阻隔橡胶本体与空气的保护层,防止击打面被弄脏、保持耐用性。该保护层具有可伸展性,位于保护层之下的橡胶本体层具有双向可伸展性能,因而鼓垫能够获得很大的可伸展性能,保证击打部位局部地变形,并具有很大的回复力,因此击打感觉不僵硬,鼓棒可很好地回弹。此外,通过无纺布的纤维材料结合橡胶层,无需使用粘合剂来结合,无纺布针织材料层、树脂层以及橡胶层结合强度很高。但本方案需要添加塑化剂,并且需要热熔及模制,工序复杂。
发明内容
本发明要解决的技术问题是:提供一种工序简单、制造方便,同时表层部、主体部材料硬度都可控,并且表层部、主体部结合牢固、各项性能优良的鼓垫及制造方法。
本发明鼓垫所采用的技术方案是:一种鼓垫,包括发泡橡胶构成的主体部,与该主体部结合且覆盖的表层部,其特征在于,表层部设有若干通孔,主体部与通孔融合。表层部、主体部均采用具有硅氧键的硅橡胶。
本发明制造鼓垫方法所采用的技术方案是:一种制造鼓垫的方法,该鼓垫包括:发泡橡胶构成的主体部,与该主体部结合且覆盖的表层部,其特征在于,该方法工序包括:表层部预制工序:以预定的形状、厚度制备表层部,然后在该表层部上打通孔;模制工序:在模具中放置预制的表层部,表层部将模具分割成底面预留空间和背面空间,在模具背面空间,注入泡沫胶材料后,将模具闭合并发泡形成主体部。
本发明的优点:
1、本鼓垫采用预制的表层部与主体部橡胶复合结构,预制的表层部形成阻隔主体部橡胶本体与空气的保护层,防止击打面被弄脏、保持耐用性。同时,表层部、主体部都采用具有硅氧键的硅橡胶,表层部、主体部材料硬度、恢复系数都可调,并且表层部、主体部之间同为硅橡胶,结合牢固,使鼓垫具有自然、出色的击打感觉。
2、表层部预先设有通孔,该通孔能与主体部橡胶发泡充分融合,使表层部、主体部结合紧密,并且无需使用粘合剂。
3、主体部橡胶发泡硫化时要释放出低分子产物,本发明在表层部上开有通孔,该通孔能将主体部橡胶发泡硫化过程中的产物引导排出到模具中,同时发泡橡胶与通孔融合,保证主体部与表层部的紧密结合。
附图说明
图1为鼓垫的剖视图。
图2为利用模具的模制工艺过程的截面图,示出从下到上依次的底布填充的预留空间层、表层部硅胶层、主体部硅胶层。
图中:1、模具;2、主体部硅胶层;3、表层部硅胶层;4、由布纤维填充形成的底面预留空间;31、通孔。
具体实施方式
下面结合说明书附图对实施例进行详细说明:
如图1、2,本发明鼓垫所采用的技术方案是:一种鼓垫,包括发泡橡胶构成的主体部2,与该主体部结合且覆盖的表层部3,表层部、主体部均采用具有硅氧键的硅橡胶(主体部也可采用发泡橡胶)。并且表层部设有若干通孔31,主体部与通孔融合。
表层部先预制成型,然后将主体部的橡胶层发泡结合在表层部之上,由于表层部与主体部都采用硅氧键的硅橡胶,性质相同因此结合牢固。并且表层部设有通孔,发泡过程中的主体部可充分融合在表层部之上。
此外,表层部、主体部为分步骤制成,表层部及主体部的材料硬度、厚度、恢复系数都可单独设定。表层部硅胶层硬度在20°A~80°A(橡胶硬度邵氏A硬度对照表,A是单位),优选数值为50°A。表层部厚度选择范围在0.2mm以上,优选为0.3-0.5mm。
包括表层部及主体部的鼓垫其硬度、恢复系数、接触时间优选数值范围:Asker硬度C中的橡胶硬度在50至55范围之间,恢复系数在0.8至0.99之间,发泡比重在0.75至0.78之间,接触时间在2至10ms之间。
如图1、2所示,本发明制造鼓垫方法所采用的技术方案是:一种制造鼓垫的方法,该鼓垫包括:包括发泡橡胶构成的主体部,与该主体部结合且覆盖的表层部,表层部、主体部均采用具有硅氧键的硅橡胶。
主体部的硅橡胶材料采用具有硅氧键的硅橡胶,例如泡沫硅RTV(室温硫化型)橡胶,在模制时使用型号为KE521(A/B)泡沫硅,其为信越有机硅有限公司(ShinEtsu SiliconCo.,Ltd)制造的双液型RTV橡胶。或者,道康宁(Dow Corning)公司的型号为Silicone 3-6548泡沫硅。本实施例采用KE521(A/B)泡沫硅。
其中该方法工序包括:
表层部预制工序:表层部材料采用硅氧键的硅橡胶。本实施例采用高温硫化硅胶HTV(热硫化型),高温硫化硅橡胶制得混炼胶,然后入模以预定的形状和预定的厚度制备表层部硅胶层,本实施例为圆形,然后模具内加温、加压硫化成型(加工成固定形状程序,也可在硫化制得表层部之后,再将该表层部硅胶层沿着下一步的模具以及主体部形状切割成圆形)。接着,在表层部上打通孔。该打孔方式,在表层部硅胶层圆心击打区域布孔较多,圆心之外的较少。
模制工序:为在模具1中形成底面预留空间4,本实施例为放置布纤维层,并在布纤维层上放预制的表层部,而后称量双液型RTV(室温硫化)橡胶的液态材料A和液态材料B,并将其充分地混合。随后,将液态材料A、B的混合物注入模具中表层部之上的背面空间,将模具闭合,并在室温下使混合物发泡及固化,并模制成型主体部硅橡胶层。

Claims (4)

1.一种制造鼓垫的方法,该鼓垫包括:发泡橡胶构成的主体部,与该主体部结合且覆盖的表层部,其特征在于,
该方法工序包括:
表层部预制工序:以预定的形状、厚度制备表层部,然后在该表层部上打通孔;
模制工序:放置布纤维层,并在布纤维层上放预制的表层部,表层部将模具分割成底面预留空间和背面空间,在模具背面空间,注入泡沫胶材料后,将模具闭合发泡形成主体部。
2.根据权利要求1所述的方法,其特征在于:所述底面预留空间由含空隙的填充物填充形成。
3.根据权利要求1所述的方法,其特征在于:表层部、主体部均采用具有硅氧键的硅橡胶。
4.根据权利要求3所述的方法,其特征在于:所述表层部采用热硫化硅橡胶,所述主体部采用室温硫化橡胶。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439432B2 (en) * 2004-03-08 2008-10-21 Yamaha Corporation Pad for electronic drum and electronic drum
CN101608495A (zh) * 2009-07-20 2009-12-23 湖北美恒达新型保温装饰材料有限公司 免粘接复合基层金属面层保温装饰板及其制造方法
CN201517681U (zh) * 2009-09-24 2010-06-30 卓肇慕 具有上下嵌合槽的隔热材结构
CN101894544B (zh) * 2009-05-08 2013-06-12 雅马哈株式会社 鼓垫及其制造方法
JP5733370B2 (ja) * 2013-11-11 2015-06-10 ヤマハ株式会社 打撃検出装置
US9142202B2 (en) * 2013-08-20 2015-09-22 Yamaha Corporation Electronic percussion pad and method of manufacturing electronic percussion pad
CN105185360A (zh) * 2014-06-04 2015-12-23 雅马哈株式会社 打击垫

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439432B2 (en) * 2004-03-08 2008-10-21 Yamaha Corporation Pad for electronic drum and electronic drum
CN101894544B (zh) * 2009-05-08 2013-06-12 雅马哈株式会社 鼓垫及其制造方法
CN101608495A (zh) * 2009-07-20 2009-12-23 湖北美恒达新型保温装饰材料有限公司 免粘接复合基层金属面层保温装饰板及其制造方法
CN201517681U (zh) * 2009-09-24 2010-06-30 卓肇慕 具有上下嵌合槽的隔热材结构
US9142202B2 (en) * 2013-08-20 2015-09-22 Yamaha Corporation Electronic percussion pad and method of manufacturing electronic percussion pad
JP5733370B2 (ja) * 2013-11-11 2015-06-10 ヤマハ株式会社 打撃検出装置
CN105185360A (zh) * 2014-06-04 2015-12-23 雅马哈株式会社 打击垫

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