CN105860395A - Silicon-free heat-conducting gasket and preparation method thereof - Google Patents
Silicon-free heat-conducting gasket and preparation method thereof Download PDFInfo
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- CN105860395A CN105860395A CN201610440610.2A CN201610440610A CN105860395A CN 105860395 A CN105860395 A CN 105860395A CN 201610440610 A CN201610440610 A CN 201610440610A CN 105860395 A CN105860395 A CN 105860395A
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- preparation
- raw material
- parts
- silicon
- conducting pad
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- 238000002360 preparation method Methods 0.000 title claims abstract description 40
- 239000002994 raw material Substances 0.000 claims abstract description 46
- 238000003756 stirring Methods 0.000 claims abstract description 32
- 238000004898 kneading Methods 0.000 claims abstract description 15
- 229920001971 elastomer Polymers 0.000 claims abstract description 13
- 238000004073 vulcanization Methods 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 46
- 239000010703 silicon Substances 0.000 claims description 46
- -1 2-(2-Butoxyethoxy) ethyl Chemical group 0.000 claims description 35
- 239000000843 powder Substances 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 28
- 150000002148 esters Chemical class 0.000 claims description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 21
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 20
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 19
- 239000012948 isocyanate Substances 0.000 claims description 15
- 238000004513 sizing Methods 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- 230000003078 antioxidant effect Effects 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000344 soap Substances 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- 229920000800 acrylic rubber Polymers 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000005303 weighing Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 17
- 150000002513 isocyanates Chemical class 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 229920002545 silicone oil Polymers 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 description 1
- FEWFXBUNENSNBQ-UHFFFAOYSA-N 2-hydroxyacrylic acid Chemical compound OC(=C)C(O)=O FEWFXBUNENSNBQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/247—Heating methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08K5/57—Organo-tin compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Materials Engineering (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a preparation method of a silicon-free heat-conducting gasket. The preparation method comprises the following main steps: weighing a first raw material and a second raw material for preparing the silicon-free heat-conducting gasket for later use; carrying out vacuum kneading and stirring on the first raw material at 150-180 DEG C for 2-6 hours; mixing the first raw material subjected to vacuum kneading and stirring with the second raw material and stirring the mixture for 4-40 minutes, thus obtaining a rubber compound; putting the rubber compound in a mold; carrying out hot pressed vulcanization on the mold to which the rubber compound is added under the vacuum condition of 130-160 DEG C for 4-15 minutes; cooling the product, thus obtaining the finished product. The preparation method of the silicon-free heat-conducting gasket has the advantages of simplicity in operation, high production efficiency, high quality of the produced finished product, low defective rate and low manpower cost. The silicon-free heat-conducting gasket prepared by the method has the characteristics that the silicon-free heat-conducting gasket has good heat-conducting property and does not yield oil in the extreme environment.
Description
Technical field
The present invention relates to a kind of heat-conducting pad field, and particularly to a kind of no-silicon type heat-conducting pad
And preparation method thereof.
Background technology
Along with the progress of science and technology, the usage amount of electronic equipments is increasing, needs under the high temperature conditions
The part with sealing function wanted increases the most accordingly, and heat-conducting pad of the prior art contains mostly
There is silicon, and be heated containing the silicone oil in silicon spacer and can ooze out under pressure between parts, make
Obtain the lost of life of heat-conducting pad.
And no-silicon type heat-conducting pad on the market prepares material because of it and preparation technology is the most perfect,
Production cost is higher, therefore, and a kind of advantage inheriting silica gel heat-conducting pad completely, the most not
Permeability, and the no-silicon type that its preparation cost is lower than the preparation cost of commercially available no-silicon type heat-conducting pad
Heat-conducting pad can fill up the blank of this respect very well.
Summary of the invention
It is an object of the invention to provide the preparation method of a kind of no-silicon type heat-conducting pad, this is without silicon
The preparation method of type heat-conducting pad has simple to operate, and production efficiency is high, goes out finished product high-quality,
Defect rate is low, the advantage that human cost is low.
Another object of the present invention is to provide a kind of no-silicon type heat-conducting pad, this no-silicon type heat conduction
It is good that pad has heat conductivility, and does not go out the feature of silicone oil under multiple extreme environmental conditions.
The present invention solves it and technical problem is that and realize by the following technical solutions:
The present invention proposes the preparation method of a kind of no-silicon type heat-conducting pad, this preparation method main
Step includes:
The first raw material and the second raw material of preparing no-silicon type heat-conducting pad are weighed standby, presses
Weight portion meter, the first raw material includes: liquid methacrylate class rubber 100 parts, conductive powder
100～1000 parts, (2-(2-Butoxyethoxy) ethyl) ester 10～40 parts；Second former material
Material meter by weight includes vulcanizing agent 0.1～1 part；By the first raw material at 150～180 DEG C
Vacuum kneading stir 2～6 hours, then by through vacuum kneading stir after the first raw material with
Second raw material mixing, is stirred for 4～40 minutes obtaining sizing material, sizing material is put in mould and
Hot-press vulcanization 4～15 minutes under 130～160 DEG C of vacuum conditions, then cool down to obtain finished product.
Liquid methacrylate resin has good mobility, can preferably coated powder, increasing
Add the fusion between conduction powder and colloid, thus improve the heat conductivity of product.Add (2-
(2-Butoxyethoxy) ethyl) ester improves pliability.Conductive powder improves heat conductive pad
The heat conductivility of sheet.The addition of antioxidant adds the service life of pad.Vulcanizing agent is heat
The important source material of pressure sulfidation.
The present invention proposes a kind of no-silicon type heat-conducting pad, and this no-silicon type heat-conducting pad is by above-mentioned system
Preparation Method prepares.
The no-silicon type heat-conducting pad of the embodiment of the present invention and preparation technology provide the benefit that: this no-silicon type
The preparation method of heat-conducting pad is simple to operate, it is possible to achieve whole process is intelligent and once feeds intake the highest
Can reach 600kg, greatly improve work efficiency, and saved human cost, produce effect
Rate is high, goes out finished product high-quality.The service life of this no-silicon type heat-conducting pad is long, and does not leak silicone oil.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below by right
Technical scheme in the embodiment of the present invention is clearly and completely described.In embodiment unreceipted
Actual conditions person, the condition advised according to normal condition or manufacturer is carried out.Agents useful for same or instrument
Device unreceipted production firm person, being can be by the commercially available conventional products bought and obtain.
Below the embodiment of the present invention is specifically described.
The present invention provides the preparation method of a kind of no-silicon type heat-conducting pad, this preparation method main
Step includes:
The first raw material and the second raw material of preparing no-silicon type heat-conducting pad are weighed standby, presses
Weight portion meter, the first raw material includes: liquid methacrylate class rubber 100 parts, conductive powder
100～1000 parts, (2-(2-Butoxyethoxy) ethyl) ester 10～40 parts；Second former material
Material meter by weight includes vulcanizing agent 0.1～1 part；By the first raw material at 150～180 DEG C
Vacuum kneading stir 2～6 hours, then by through vacuum kneading stir after the first raw material with
Second raw material mixing, is stirred for 4～40 minutes obtaining sizing material, sizing material is put in mould and
Hot-press vulcanization 4～15 minutes under 130～160 DEG C of vacuum conditions, then cool down to obtain finished product., liquid
Acrylate rubber includes liquid methacrylate rubber, liquid ethylene acrylate elastomer and liquid
At least one in state hydroxy acrylic acid rubber.Conductive powder includes aluminium oxide, aluminium hydroxide, nitrogen
Change one or more in boron, carborundum, metal powder.Vulcanizing agent is isocyanates hydroxy systems,
Phenolic and epoxy and the one in hydroxy systems, soap sulfur system, TCY vulcanizing system.TCY
For trithiocyanuric acid.
Liquid methacrylate resin has good mobility, can preferably coated powder, increase is led
Fusion between hot powder body and colloid, thus improve the heat conductivity of product.Add (2-(2-
Butoxyethoxy) ethyl) ester improves pliability.Conductive powder improves heat-conducting pad
Heat conductivility.The addition of antioxidant adds the service life of pad.Vulcanizing agent is hot pressing sulfur
The important source material of change process.
Further, the first raw material is counted by weight and is also included: 0～2 part of pigment, 0～2
Part antioxidant.Pigment includes any one in barba hispanica, iron oxide red, iron oxide yellow and white carbon black, anti-
Oxygen agent be double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines of 4,4'-, 4,4'-bis-(propyloxy phenyl base) diphenylamines,
In double (A, the A-dimethyl benzyl) diphenylamines of two [4-(1-methyl isophthalic acid-phenethyl) benzene] amine, 4,4'-one
Kind.
The addition of pigment makes to present different colors, thus meets the client's different need to product
Ask.The addition of antioxidant can reduce the oxidized rate of no-silicon type heat-conducting pad, increases no-silicon type and leads
The service life of hot pad
Further, the second raw material is counted by weight and is also included: 0～3 part of catalyst.Urge
Agent includes at least one in organotin, organo-bismuth and triethylamine.
The addition of catalyst accelerates vulcanizing agent and the reaction rate of liquid methacrylate resin.
The present invention proposes prepared by any of the above-described preparation method that a kind of present invention of employing proposes
No-silicon type heat-conducting pad.
Embodiment 1
The preparation method of a kind of no-silicon type heat-conducting pad that the present embodiment provides, its concrete operations walk
Suddenly it is:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 400 parts, (2-(2-Butoxyethoxy) ethyl) ester 10 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, iron oxide yellow 0.1 part, organotin 0.3 part,
Isocyanates 0.15 part, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 400 parts, (2-(2-Butoxyethoxy) ethyl) ester 10 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, iron oxide yellow 0.1 part add high-temperature vacuum and mediate
Stir 2 hours at 180 DEG C in blender.
Step C, is cooled to when 100 DEG C add organotin 0.3 part, isocyanates 0.15 part,
Double planetary mixer is used to obtain sizing material after stirring 15 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 160 DEG C, hot-press vulcanization 5 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 1.0-1.5W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap.
Embodiment 2
The preparation method of a kind of no-silicon type heat-conducting pad that the present embodiment provides, its concrete operations walk
Suddenly it is:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, white carbon black 0.1 part, organotin 0.25 part, isocyanide
Acid esters 0.13 part, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, white carbon black 0.1 part add high-temperature vacuum and mediate stirring
Stir 4 hours at 175 DEG C in machine.
Step C, is cooled to when 100 DEG C add organotin 0.25 part, isocyanates 0.13
Part, use double planetary mixer to obtain sizing material after stirring 15 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 150 DEG C, hot-press vulcanization 6 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 2.0-2.5W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap, heat conduction requires height, has certain insulating requirements to require occasion.
Embodiment 3
The preparation method of a kind of no-silicon type heat-conducting pad that the present embodiment provides, its concrete operations walk
Suddenly it is:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, boron nitride part 600 parts, aluminium powder 400 parts, (2-(2-Butoxyethoxy) ethyl)
Ester 10 parts, isocyanates 0.13 part, weigh standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, boron nitride part 600 parts, aluminium powder 400 parts, (2-(2-Butoxyethoxy) ethyl)
Stir 6 hours at 175 DEG C in ester 10 parts, addition high-temperature vacuum Kneeding stirrer.
Step C, is cooled to when 100 DEG C add isocyanates 0.1 part, uses double-planet to stir
Mix after machine stirs 40 minutes and obtain sizing material.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 130 DEG C, hot-press vulcanization 15 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 4.5-6.0W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap, heat conduction requires high, but the application blind that naked requires.
Embodiment 4
The preparation method of a kind of no-silicon type heat-conducting pad that the present embodiment provides, its concrete operations walk
Suddenly it is:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2 parts, white carbon black 2 parts, organotin 3 parts, isocyanates 1
Part, weigh standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2 parts, white carbon black 2 parts add high-temperature vacuum Kneeding stirrer
Interior stirring 4 hours at 160 DEG C.
Step C, is cooled to when 100 DEG C add organotin 3 parts, isocyanates 1 part, adopts
Sizing material is obtained with double planetary mixer after stirring 10 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 160 DEG C, hot-press vulcanization 4 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the nothing of preparation
Silicon conducting strip heat conductivity can reach 3.5-4.0W/mK, has surface microviscosity, 100 DEG C of companies
Continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitivity occasion and lead
Temperature gap, heat conduction requires height, has certain insulating requirements to require occasion.
Embodiment 5
The preparation method of a kind of no-silicon type heat-conducting pad that the present embodiment provides, its concrete operations walk
Suddenly it is:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, white carbon black 0.1 part, organotin 0.25 part, isocyanide
Acid esters 0.13 part, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 500 parts, (2-(2-Butoxyethoxy) ethyl) ester 20 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, white carbon black 0.1 part add high-temperature vacuum and mediate stirring
Stir 4 hours at 175 DEG C in machine.
Step C, is cooled to when 100 DEG C add organotin 0.25 part, isocyanates 0.13
Part, use double planetary mixer to obtain sizing material after stirring 15 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 150 DEG C, hot-press vulcanization 12 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 2.4-2.8W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap, heat conduction requires height, has certain insulating requirements to require occasion.
Embodiment 6
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 400 parts, (2-(2-Butoxyethoxy) ethyl) ester 10 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, iron oxide yellow 0.1 part, organotin 0.3 part,
Isocyanates 0.15 part, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 400 parts, (2-(2-Butoxyethoxy) ethyl) ester 10 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 1.8 parts, iron oxide yellow 0.1 part add high-temperature vacuum and mediate
Stir 6 hours at 180 DEG C in blender.
Step C, is cooled to when 100 DEG C add organotin 0.3 part, isocyanates 0.15 part,
Double planetary mixer is used to obtain sizing material after stirring 15 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 160 DEG C, hot-press vulcanization 5 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is less than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 1.5-2.0W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap.
Comparative example 1
A kind of preparation method of heat-conducting pad without silicone oil, its concrete operation step is as follows:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 1200 parts, (2-(2-Butoxyethoxy) ethyl) ester 50 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2.5 parts, iron oxide yellow 3 parts, organotin 4 parts, isocyanide
Acid esters 2 parts, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 1200 parts, (2-(2-Butoxyethoxy) ethyl) ester 50 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2.5 parts, iron oxide yellow 3 parts add high-temperature vacuum kneading and stir
Stir 7 hours at 200 DEG C in mixing machine.
Step C, is cooled to when 100 DEG C add organotin 4 parts, isocyanates 2 parts, adopts
Sizing material is obtained with double planetary mixer after stirring 50 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 180 DEG C, hot-press vulcanization 20 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is more than 2%, and human cost is low, the nothing of preparation
Silicon conducting strip heat conductivity can reach more than 4.0W/mK, but 100 DEG C of continuous work less than
Fuel-displaced, catabiosis occurred in 1000 hours.
Comparative example 2
A kind of preparation method of heat-conducting pad without silicone oil, its concrete operation step is as follows:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: liquid propene acid resin 100
Part, alumina powder 50 parts, (2-(2-Butoxyethoxy) ethyl) ester 5 parts, Carbimide.
Ester 0.01 part, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 20 parts, (2-(2-Butoxyethoxy) ethyl) ester 5 parts, addition height
Stir 1 hour at 100 DEG C in temperature vacuum kneading blender.
Step C, is cooled to when 100 DEG C add isocyanates 0.01 part, uses double-planet to stir
Mix after machine stirs 5 minutes and obtain sizing material.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 100 DEG C, hot-press vulcanization 2 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is more than 10%, and human cost is low, but preparation
The heat conductivity of conducting strip without silicon is at below 1.0W/mK, and 100 DEG C of continuous work are less than 1000
Hour occur fuel-displaced, catabiosis.
Comparative example 3
A kind of preparation method of heat-conducting pad without silicone oil, its concrete operation step is as follows:
2 parts and 100 parts propylene liguid acid resins of 4,4'-bis-(propyloxy phenyl base) diphenylamines are added
Mill carries out mill, cooked bag roller, is subsequently adding alumina powder 500 parts, (2-(2-fourth
Epoxide ethyoxyl) ethyl) ester 20 parts, white carbon black 2 parts, continue mill, mixing uniformly after add
Entering isocyanates 1 part, after putting through 10 times, mill terminates to obtain sizing material, sizing material is added mould and exists
Molding in 3 minutes is vulcanized at 170 DEG C.
This comparative example gained no-silicon type heat-conducting pad heat conductivity reaches 1.0-1.5W/mK, has table
Face viscosity, at 100 DEG C continuously work 1000 hours without permeability, without catabiosis, but
This technique is produced defect rate and is more than 2%, and it is high to produce human cost.
Comparative example 4
A kind of preparation method of heat-conducting pad without silicone oil, its concrete operation step is as follows:
Step A, will prepare the raw material of no-silicon type heat-conducting pad: on-liquid acroleic acid resin
100 parts, alumina powder 1200 parts, (2-(2-Butoxyethoxy) ethyl) ester 50 parts,
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2.5 parts of 4,4'-, iron oxide yellow 3 parts, organotin 4 parts,
Isocyanates 2 parts, weighs standby.
Step B, by liquid propene acid resin 100 in load weighted for step step A raw material
Part, alumina powder 1200 parts, (2-(2-Butoxyethoxy) ethyl) ester 50 parts, 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines 2.5 parts, iron oxide yellow 3 parts add high-temperature vacuum kneading and stir
Stir 2 hours at 200 DEG C in mixing machine.
Step C, is cooled to when 100 DEG C add organotin 4 parts, isocyanates 2 parts, adopts
Sizing material is obtained with double planetary mixer after stirring 50 minutes.
Step D, pours into gained sizing material in 200mm*400mm*2.0mm mould, with four
At a temperature of column hydraulic machine 180 DEG C, hot-press vulcanization 20 minutes, obtains no-silicon type heat-conducting pad.
The product defect rate that the present embodiment produces is more than 1%, and human cost is low, the present embodiment
The heat conductivity of conducting strip without silicon of preparation can reach 0.8-1.3W/mK, has surface microviscosity,
100 DEG C of continuous work 1000 hours without fuel-displaced, without catabiosis, be mainly used in silicone oil sensitive
Occasion thermal conductive gap.
The manpower that above-described embodiment puts into traditional heat-conducting pad production process with comparative example becomes
Originally compare, draw the height of human cost.
Table 1. embodiment 1～6 and comparative example 1～4 gained end properties and produce result and see table
Comparative example 1 and comparative example 2 compared to embodiment 1-4, its every material coefficient and each
Operation index is many not in the present invention, but its operating procedure still uses high-temperature vacuum kneading to stir
Mixing, its comparing result can be seen that the properties of product produced are not as good as embodiment 1-4, embodiment 1
The most identical except vacuum kneading mixing time other indices different with embodiment 6, embodiment
The vacuum kneading mixing time of 6 is more than embodiment 1, and its result is that embodiment 6 is produced
The heat conductivity of heat-conducting pad without silicon is higher than embodiment 1, illustrates at the time range that the present invention is given
The heat conductivity of heat-conducting pad without silicon of the interior the most long-living output of vacuum kneading mixing time is the best, implements
Example 2 is with embodiment 5 in addition to the hot-press vulcanization time is different, and other indices are the most identical,
The hot-press vulcanization time of embodiment 5 is big with the hot-press vulcanization time of embodiment 2, and its result is reality
The thermal conductivity ratio embodiment 2 executing the heat-conducting pad without silicon that example 5 is produced is high, illustrates at this
In the bright time range be given, the heat conduction system of the heat-conducting pad without silicon of the most long-living output of cure time
Number is the highest, but its identical with the raw materials for production of embodiment 4 of comparative example 3 uses the operation of mill
By contrast, technique, although can be seen that its product performance produced does not differs with embodiment 4
Too much, but its production defect rate is slightly higher, and clearance is observed and contrasted itself and traditional heat-conducting pad
Human cost height in process of production, comparative example 3 is of a relatively high, and comparative example 4 is former in production
Using non-liquid acroleic acid resin on material, other materials indexs and operation index are with embodiment 1
Identical, but final finished lead coefficient compared to use propylene liguid acid resin be the lower slightly of raw material,
And the defect rate produced is also the slightly higher of raw material compared to propylene liguid acid resin.
In sum, it is good that the no-silicon type heat-conducting pad of the embodiment of the present invention has heat conductivity, work
Making the time long, it is low that its preparation technology has production defect rate, advantage that human cost is low.
Embodiments described above is a part of embodiment of the present invention rather than whole enforcement
Example.The detailed description of embodiments of the invention is not intended to limit the model of claimed invention
Enclose, but be merely representative of the selected embodiment of the present invention.Based on the embodiment in the present invention, this
It is every other that field those of ordinary skill is obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
Claims (10)
1. the preparation method of a no-silicon type heat-conducting pad, it is characterised in that described preparation method
Comprise the following steps:
The first raw material and the second raw material of preparing no-silicon type heat-conducting pad are weighed standby, presses
Weight portion meter, described first raw material includes: liquid methacrylate class rubber 100 parts, heat conduction
Powder 100～1000 parts, (2-(2-Butoxyethoxy) ethyl) ester 10～40 parts；Described
Two raw materials are counted by weight and are included vulcanizing agent 0.1～1 part；Described first raw material is existed
At 150～180 DEG C, vacuum kneading stirs 2～6 hours, then will stir through described vacuum kneading
After described first raw material mix with described second raw material, be stirred for 4～40 minutes glue
Material, puts into described sizing material in mould and hot-press vulcanization 4～15 under 130～160 DEG C of vacuum conditions
Minute, then cool down to obtain finished product.
Preparation method the most according to claim 1, it is characterised in that described hot-press vulcanization
Time be 10～15 minutes.
3. according to the preparation method described in claim 1, it is characterised in that described first raw material
Count by weight and also include: 0～2 part of pigment, 0～2 part of antioxidant.
Preparation method the most according to claim 3, it is characterised in that described pigment includes
Any one in barba hispanica, iron oxide red, iron oxide yellow and white carbon black, described antioxidant is 4,4'-
Double (bis (alpha, alpha-dimethylbenzyl) base) diphenylamines, 4,4'-bis-(propyloxy phenyl base) diphenylamines, two [4-(1-methyl
-1-phenethyl) benzene] amine, at least one in double (A, the A-dimethyl benzyl) diphenylamines of 4,4'-.
Preparation method the most according to claim 2, it is characterised in that described second former material
Material is counted by weight and is also included: 0～3 part of catalyst.
6. with according to the preparation method described in claim 5, it is characterised in that described catalyst bag
Include at least one in organotin, organo-bismuth and triethylamine.
Preparation method the most according to claim 2, it is characterised in that described propylene liguid
Acid esters rubber includes liquid methacrylate rubber, liquid ethylene acrylate elastomer and liquid hydroxyl
At least one in base acrylic rubber.
Preparation method the most according to claim 2, it is characterised in that described conductive powder bag
Include at least one in aluminium oxide, aluminium hydroxide, boron nitride, carborundum and metal powder.
Preparation method the most according to claim 2, it is characterised in that described vulcanizing agent is
Isocyanates hydroxy systems, phenolic and epoxy and hydroxy systems, soap sulfur system and TCY sulfur
Any one in change system.
10. a no-silicon type heat-conducting pad, it is characterised in that described no-silicon type heat-conducting pad by
Preparation method described in any one of claim 1-9 prepares.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117004232A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
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| CN102807754A (en) * | 2011-05-31 | 2012-12-05 | 北京中石伟业技术有限公司 | Heat conduction gap filling material, preparation method and application thereof |
| CN103319829A (en) * | 2013-06-13 | 2013-09-25 | 深圳德邦界面材料有限公司 | Silicon-free heat-conducting gasket and preparation method thereof |
| CN104497585A (en) * | 2014-12-17 | 2015-04-08 | 苏州锦腾电子科技有限公司 | High-thermal-conductivity silicone rubber and preparation method thereof |
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| CN101407635A (en) * | 2008-11-14 | 2009-04-15 | 成都硅宝科技股份有限公司 | Addition type heat conducting silicon rubber and manufacturing method thereof |
| CN102807754A (en) * | 2011-05-31 | 2012-12-05 | 北京中石伟业技术有限公司 | Heat conduction gap filling material, preparation method and application thereof |
| CN103319829A (en) * | 2013-06-13 | 2013-09-25 | 深圳德邦界面材料有限公司 | Silicon-free heat-conducting gasket and preparation method thereof |
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| CN117004232A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
| CN117004232B (en) * | 2023-08-24 | 2024-04-05 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
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