CN105855271A - Recycling process for residual wastes left after recovery of waste circuit boards - Google Patents
Recycling process for residual wastes left after recovery of waste circuit boards Download PDFInfo
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- CN105855271A CN105855271A CN201610342711.6A CN201610342711A CN105855271A CN 105855271 A CN105855271 A CN 105855271A CN 201610342711 A CN201610342711 A CN 201610342711A CN 105855271 A CN105855271 A CN 105855271A
- Authority
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- Prior art keywords
- circuit board
- copper
- residue
- printed circuit
- pcb
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- 239000002699 waste material Substances 0.000 title claims abstract description 23
- 238000011084 recovery Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000008569 process Effects 0.000 title claims abstract description 12
- 238000004064 recycling Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000005484 gravity Effects 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 14
- 239000002002 slurry Substances 0.000 claims abstract description 12
- 238000000926 separation method Methods 0.000 claims abstract description 10
- 239000013078 crystal Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000012216 screening Methods 0.000 claims abstract description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 14
- 239000008187 granular material Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical group CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims description 4
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 238000005336 cracking Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000002045 lasting effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- SXTLQDJHRPXDSB-UHFFFAOYSA-N copper;dinitrate;trihydrate Chemical compound O.O.O.[Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O SXTLQDJHRPXDSB-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 241001572350 Lycaena mariposa Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- -1 Polytetrafluoroethylene Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229950000845 politef Drugs 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/80—Destroying solid waste or transforming solid waste into something useful or harmless involving an extraction step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a recycling process for residual wastes left after recovery of waste circuit boards. Materials recovered from the residual wastes can be prepared into resin tiles and copper nitrate crystals. The recycling process comprises the following steps of S1, crushing, namely placing the waste circuit boards on which apparatus elements are dismounted into crushing equipment to carry out coarse crushing, lasting for 30-40min, adding water after coarse crushing, and further crushing to form a crushed material, wherein the weight part of the water is 8-10 times as much as that of the waste circuit boards, the crushing particle size is 0.1-1.2mm, and the crushed material and the water form slurry; and S2, gravity separation, namely enabling the slurry to enter a first shaking table to carry out gravity separation, and separating copper particles in the slurry from residues of printed circuit boards under the actions of vibration and gravity, wherein the copper particles enter a collecting tank, the left residues of the printed circuit boards enter a second shaking table so as to be subjected to secondary screening, and the copper particles left in the residues of the printed circuit boards are further recovered to enter the collecting tank, and the copper particles are obtained from the collecting tank and are spin-dried by using a spin dryer. By using the recycling process, waste materials are changed into things of value, and the residues of the printed circuit boards are changed into resin tile commodities and copper nitrate commodities, so that not only is the problem of environment pollution solved, but also fat profits are brought.
Description
Technical field
The present invention relates to useless circuit board recovery technology field, particularly relate to the residue waste product recycling recovery process after a kind of useless circuit board reclaims.
Background technology
China is the first in the world big printed substrate manufacturing country, and the yield of wiring board reaches 1.3 hundred million square metres/year, based on stock utilization about 90%, and leftover bits about 14,400,000 square metre/year that printed circuit board (PCB) produces, about 3.6 ten thousand tons/year.In addition, the leftover bits produced by base material manufacturing enterprise are about the 7% of its finished product, the leftover bits that copper-clad plate produces are about 2.5 ten thousand tons/year, by finished printed circuit board in the utilization rate about 95% of complete system plant, the discarded circuit board that complete system plant produces is about 20,000 tons/year, and above-mentioned three summations are about 8.1 ten thousand tons/year.It addition, the total amount of old circuit board that the electronic product that the electronic waste of the annual import of China and native country are scrapped is disassembled reaches more than 500,000 tons.
Useless circuit board comprises useless copper-clad plate, useless prints wiring board, printing circuit board with integrated circuit and electronic device, and copper-clad plate is the raw data produced and print wiring board, is primarily made up of substrate, Copper Foil, binding agent.The primary data of substrate is synthetic resin and enhancing data, and synthetic resin primarily has phenolic resin, epoxy resin, politef etc. therebetween, and enhancing data generally has papery, glass fibre and cloth three kinds.The appearance of substrate is Copper Foil, and Copper Foil selects machining and electrodeposition method to produce, and currently produces based on electrodeposition method, and copper thickness is usually 18 m, 25 m, 35 m, 70 m and 105 m.Copper Foil binding agent covers securely on substrate, just constitutes copper-clad plate.The copper-clad plate that China many is used has phenolic paper copper-clad plate, epoxy papery copper-clad plate, Epoxy Glassfiber Cloth Copper Clad Laminate, Copper Clad Laminates Based On Polytetrafluoroethylene, polyimide flexible copper-clad plate, the most middle-grade above civil electric appliance, instrument and meter select epoxy copperplate, large usage quantity.The copper-clad plate of the multiplex phenolic paper of civil electric appliance of middle low level.Useless copper-clad plate is defect ware, the leftover pieces occurred in the process of producing, and yellow occurs because of the conditional Copper Foil of appearance, the most yellow plate.The useless confused discrimination of copper-clad plate copper content, low about 15%, high up to more than 70%, it is a kind of valuable source regaining copper.Print wiring board and be called for short PCB.Generally making printed wiring by predetermined planning on insulation material, print original paper or conductive pattern that both combine is referred to as printed circuit, the conductive pattern supplying electrically linking between components and parts on insulating substrate is referred to as printed wiring.The sheet of printed circuit or printed wiring is i.e. referred to as printing wiring board.Print wiring board and be primarily directed to the various electronic devices and components fixed installation supply supports such as integrated circuit, the wiring completed between the various electronic devices and components such as integrated circuit and electric linking or electric insulation etc., it is actively soldering supply welding resistance figure together, for components and parts plug-in mounting, checks, repair supply identification character and figure.Useless circuit-board card is primarily from the electrical equipment of various calcellations, and kind is many, common are green plate and yellow plate, and the greenest plate primarily dismantles from useless television set, computer, communication apparatus, is worth higher；Yellow plate the most primarily dismantles from recorder, stereo set, washing machine, air-conditioning, is worth relatively low.The comparison of ingredients of useless circuit-board card is mixed and disorderly, in addition to printing wiring board, also rich in integrated circuit and various electronic devices and components, principal component is the organic substances such as silicon dioxide, Copper Foil, lead, stannum, the noble metal of ferrum trace and plastics, resin, paint, thus it is bigger than the disposal difficulty of useless copper-clad plate, useless printing wiring board to dispose difficulty.
The composition of useless circuit board is mixed and disorderly, regains and disposes difficulty greatly, and circuit board adds the organic substance of many in the process of producing, and in the withdrawal disposal process of useless circuit board, slightly imprudence is it is possible to occur serious pollution to environment.Currently, the recycling disposal technical ability of the useless circuit board of China is the most relatively backward, we have proposed the residue waste product recycling recovery process after a kind of useless circuit board reclaims for this.
Summary of the invention
The technical problem existed based on background technology, the present invention proposes the residue waste product recycling recovery process after a kind of useless circuit board reclaims.
Residue waste product after a kind of useless circuit board that the present invention proposes reclaims recycles recovery process, and the material of described residue waste recovery can be made into resin tile and copper nitrate crystal, comprises the following steps:
S1, broken: the useless circuit board having removed electric elements to be put into disintegrating apparatus carries out coarse crushing, continue 30-40min, the water the continuation that add 8-10 times of weight portion after coarse crushing crush and form particle, and particle size after cracking forms slurry at 0.1-1.2mm, particle and water；
S2, gravity separation: slurry enters the first shaking table and carries out gravity separation, under the effect of vibration and gravity, copper granule in slurry and printed circuit board (PCB) residue are separated, wherein copper granule enters and collects pond, remaining printed circuit board (PCB) residue enters the second shaking table and carries out postsearch screening, copper granule remaining in printed circuit board (PCB) residue is recovered further entrance and collects pond, dried by drier from collecting acquisition copper granule pond, again by obtaining copper powder after drying, collect simultaneously and obtain printed circuit board (PCB) residue；
S3, collect reaction: printed circuit board (PCB) residue is put into Multistage settling groove and carries out crude sedimentation, after having deposited, being transferred in retort by printed circuit board (PCB) residue, add salpeter solution according to the ratio of solid and liquid 1:1, the time of sealing up for safekeeping is 2-3h, it is made to react complete, wherein the copper on printed circuit board (PCB) residue and salpeter solution reaction generate nitric oxide, and nitric oxide is nitrogen dioxide with air oxidation by water-stop again, finally reacts completely obtain salpeter solution with water；
S4, processes: will react printed circuit board (PCB) residue completely and take out, and with clear water drip washing 2-4min, i.e. can get the resin cut without copper, reacted liquid is evaporated under reduced pressure through drying machine and i.e. can get copper nitrate crystal；
S5, recycles: by three-layer co-extruded Technology, resin is made resin tile, and packs warehouse-in.
Preferably, described disintegrating apparatus is disintegrating machine.
Preferably, the concentration of described salpeter solution is 0.1-2mol/L.
Preferably, in described S3, reacted salpeter solution can enter the recycling of nitric acid recovery pond.
In the present invention, useless circuit board first carrying out broken and gravity separation, obtains copper powder, the response rate reaches between 85-95%, then is cut by the copper of printed circuit board (PCB) residue the most about 3% and separate, and such plastics and copper can serve as raw material and sells；High-quality resin tile product can also be made and copper nitrate product is sold, the present invention turns waste into wealth, printed circuit board (PCB) residue is become resin tile commodity and copper nitrate commodity, in removal process, if cupric 3% is calculated, reference market price, copper nitrate production nitrate trihydrate copper 11.33%, 20000-25000 yuan/ton；Resin tile 51 yuan/square metre, thick 3 millimeters.Weight about 4-4.5 kilogram/square metre.Equivalent 1.1 ten thousand yuan/ton, producer price 42 yuan/square metre, equivalent 0.93 ten thousand yuan/ton, not only solve problem of environmental pollution, also bring enormous profits.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is explained orally further.
Residue waste product after a kind of useless circuit board that the present invention proposes reclaims recycles recovery process, and the material of described residue waste recovery can be made into resin tile and copper nitrate crystal, comprises the following steps:
S1, broken: the useless circuit board having removed electric elements to be put into disintegrating apparatus carries out coarse crushing, continue 30-40min, the water the continuation that add 8-10 times of weight portion after coarse crushing crush and form particle, and particle size after cracking forms slurry at 0.1-1.2mm, particle and water；
S2, gravity separation: slurry enters the first shaking table and carries out gravity separation, under the effect of vibration and gravity, copper granule in slurry and printed circuit board (PCB) residue are separated, wherein copper granule enters and collects pond, remaining printed circuit board (PCB) residue enters the second shaking table and carries out postsearch screening, copper granule remaining in printed circuit board (PCB) residue is recovered further entrance and collects pond, dried by drier from collecting acquisition copper granule pond, again by obtaining copper powder after drying, collect simultaneously and obtain printed circuit board (PCB) residue；
S3, collect reaction: printed circuit board (PCB) residue is put into Multistage settling groove and carries out crude sedimentation, after having deposited, being transferred in retort by printed circuit board (PCB) residue, add salpeter solution according to the ratio of solid and liquid 1:1, the time of sealing up for safekeeping is 2-3h, it is made to react complete, wherein the copper on printed circuit board (PCB) residue and salpeter solution reaction generate nitric oxide, and nitric oxide is nitrogen dioxide with air oxidation by water-stop again, finally reacts completely obtain salpeter solution with water；
S4, processes: will react printed circuit board (PCB) residue completely and take out, and with clear water drip washing 2-4min, i.e. can get the resin cut without copper, reacted liquid is evaporated under reduced pressure through drying machine and i.e. can get copper nitrate crystal；
S5, recycles: by three-layer co-extruded Technology, resin is made resin tile, and packs warehouse-in.
Wherein generating copper nitrate by copper with nitric acid reaction, its reaction equation is:
Cu+4HNO3(dense)=Cu (NO3)2+2NO2↑+2H2O；
3Cu+8HNO3(dilute)=3Cu (NO3)2+2NO↑+4H2O；
Above in reaction equation, nitric oxide is nitrogen dioxide with air oxidation by water-stop again, then reacts generation salpeter solution completely with water.
Useless circuit board first carrying out broken and gravity separation, obtains copper powder, the response rate reaches between 85-95%, then is cut by the copper of printed circuit board (PCB) residue the most about 3% and separate, and such plastics and copper can serve as raw material and sells；High-quality resin tile product can also be made and copper nitrate product is sold, the present invention turns waste into wealth, printed circuit board (PCB) residue is become resin tile commodity and copper nitrate commodity, in removal process, if cupric 3% is calculated, reference market price, copper nitrate production nitrate trihydrate copper 11.33%, 20000-25000 yuan/ton；Resin tile 51 yuan/square metre, thick 3 millimeters.Weight about 4-4.5 kilogram/square metre.Equivalent 1.1 ten thousand yuan/ton, producer price 42 yuan/square metre, equivalent 0.93 ten thousand yuan/ton, not only solve problem of environmental pollution, also bring enormous profits.
The above; it is only the present invention preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; any those familiar with the art is in the technical scope that the invention discloses; according to technical scheme and inventive concept equivalent or change in addition thereof, all should contain in protection scope of the present invention.
Claims (4)
1. the residue waste product recycling recovery process after a useless circuit board reclaims, it is characterised in that the material of described residue waste recovery can be made into resin tile and copper nitrate crystal, comprises the following steps:
S1, broken: the useless circuit board having removed electric elements to be put into disintegrating apparatus carries out coarse crushing, continue 30-40min, the water the continuation that add 8-10 times of weight portion after coarse crushing crush and form particle, and particle size after cracking forms slurry at 0.1-1.2mm, particle and water；
S2, gravity separation: slurry enters the first shaking table and carries out gravity separation, under the effect of vibration and gravity, copper granule in slurry and printed circuit board (PCB) residue are separated, wherein copper granule enters and collects pond, remaining printed circuit board (PCB) residue enters the second shaking table and carries out postsearch screening, copper granule remaining in printed circuit board (PCB) residue is recovered further entrance and collects pond, dried by drier from collecting acquisition copper granule pond, again by obtaining copper powder after drying, collect simultaneously and obtain printed circuit board (PCB) residue；
S3, collect reaction: printed circuit board (PCB) residue is put into Multistage settling groove and carries out crude sedimentation, after having deposited, being transferred in retort by printed circuit board (PCB) residue, add salpeter solution according to the ratio of solid and liquid 1:1, the time of sealing up for safekeeping is 2-3h, it is made to react complete, wherein the copper on printed circuit board (PCB) residue and salpeter solution reaction generate nitric oxide, and nitric oxide is nitrogen dioxide with air oxidation by water-stop again, finally reacts completely obtain salpeter solution with water；
S4, processes: will react printed circuit board (PCB) residue completely and take out, and with clear water drip washing 2-4min, i.e. can get the resin cut without copper, reacted liquid is evaporated under reduced pressure through drying machine, i.e. can get copper nitrate crystal；
S5, recycles: by three-layer co-extruded Technology, resin is made resin tile, and packs warehouse-in.
Residue waste product after a kind of useless circuit board the most according to claim 1 reclaims recycles recovery process, it is characterised in that described disintegrating apparatus is disintegrating machine.
Residue waste product after a kind of useless circuit board the most according to claim 1 reclaims recycles recovery process, it is characterised in that the concentration of described salpeter solution is 0.1-2mol/L.
Residue waste product after a kind of useless circuit board the most according to claim 1 reclaims recycles recovery process, it is characterised in that in described S3, and reacted salpeter solution can enter the recycling of nitric acid recovery pond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610342711.6A CN105855271A (en) | 2016-05-23 | 2016-05-23 | Recycling process for residual wastes left after recovery of waste circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610342711.6A CN105855271A (en) | 2016-05-23 | 2016-05-23 | Recycling process for residual wastes left after recovery of waste circuit boards |
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| Publication Number | Publication Date |
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| CN105855271A true CN105855271A (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610342711.6A Pending CN105855271A (en) | 2016-05-23 | 2016-05-23 | Recycling process for residual wastes left after recovery of waste circuit boards |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921496A (en) * | 2016-06-13 | 2016-09-07 | 王枝宝 | Waste circuit board residue treatment method |
| CN106947109A (en) * | 2017-03-24 | 2017-07-14 | 福建工程学院 | A kind of method that epoxy resin is reclaimed from discarded circuit board |
| CN113618971A (en) * | 2021-08-11 | 2021-11-09 | 九江一晖环保集团有限公司 | Waste epoxy resin treatment process |
-
2016
- 2016-05-23 CN CN201610342711.6A patent/CN105855271A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921496A (en) * | 2016-06-13 | 2016-09-07 | 王枝宝 | Waste circuit board residue treatment method |
| CN106947109A (en) * | 2017-03-24 | 2017-07-14 | 福建工程学院 | A kind of method that epoxy resin is reclaimed from discarded circuit board |
| CN106947109B (en) * | 2017-03-24 | 2020-04-24 | 福建工程学院 | Method for recycling epoxy resin from waste circuit board |
| CN113618971A (en) * | 2021-08-11 | 2021-11-09 | 九江一晖环保集团有限公司 | Waste epoxy resin treatment process |
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Application publication date: 20160817 |