CN105848464B - 一种使用方便且能大幅度提升组装效率的芯片组装治具 - Google Patents
一种使用方便且能大幅度提升组装效率的芯片组装治具 Download PDFInfo
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- CN105848464B CN105848464B CN201610404693.XA CN201610404693A CN105848464B CN 105848464 B CN105848464 B CN 105848464B CN 201610404693 A CN201610404693 A CN 201610404693A CN 105848464 B CN105848464 B CN 105848464B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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CN201610404693.XA CN105848464B (zh) | 2016-06-08 | 2016-06-08 | 一种使用方便且能大幅度提升组装效率的芯片组装治具 |
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CN201610404693.XA CN105848464B (zh) | 2016-06-08 | 2016-06-08 | 一种使用方便且能大幅度提升组装效率的芯片组装治具 |
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CN105848464A CN105848464A (zh) | 2016-08-10 |
CN105848464B true CN105848464B (zh) | 2018-09-07 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2266819Y (zh) * | 1996-08-29 | 1997-11-05 | 鸿海精密工业股份有限公司 | Ic插座 |
JP2004152535A (ja) * | 2002-10-29 | 2004-05-27 | Otax Co Ltd | 電子部品用ソケット |
US7438580B1 (en) * | 2007-09-20 | 2008-10-21 | Intel Corporation | Intermediate load mechanism for a semiconductor package |
CN201820957U (zh) * | 2008-08-05 | 2011-05-04 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN104464582A (zh) * | 2014-12-04 | 2015-03-25 | 昆山精讯电子技术有限公司 | 一种oled面板的压接治具 |
CN205667085U (zh) * | 2016-06-08 | 2016-10-26 | 蔡威宏 | 一种使用方便且能大幅度提升组装效率的芯片组装治具 |
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- 2016-06-08 CN CN201610404693.XA patent/CN105848464B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2266819Y (zh) * | 1996-08-29 | 1997-11-05 | 鸿海精密工业股份有限公司 | Ic插座 |
JP2004152535A (ja) * | 2002-10-29 | 2004-05-27 | Otax Co Ltd | 電子部品用ソケット |
US7438580B1 (en) * | 2007-09-20 | 2008-10-21 | Intel Corporation | Intermediate load mechanism for a semiconductor package |
CN201820957U (zh) * | 2008-08-05 | 2011-05-04 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN104464582A (zh) * | 2014-12-04 | 2015-03-25 | 昆山精讯电子技术有限公司 | 一种oled面板的压接治具 |
CN205667085U (zh) * | 2016-06-08 | 2016-10-26 | 蔡威宏 | 一种使用方便且能大幅度提升组装效率的芯片组装治具 |
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Address after: 274300 m south of Zhumiao village, Zhongxing Town, Shan county, Heze City, Shandong Province Patentee after: Cai Weihong Address before: 322300 Zhejiang city of Jinhua province Panan County town cross Lane No. 25 Patentee before: Cai Weihong |
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Effective date of registration: 20201223 Address after: 518100 room 503, building a, Jinyuan science and Technology Park, No. 52, Fengmen Road, Bantian street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongteng Electronics Co.,Ltd. Address before: 274300 south of Zhumiao village, Zhongxing Town, Shan county, Heze City, Shandong Province Patentee before: Cai Weihong |
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Granted publication date: 20180907 |
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CF01 | Termination of patent right due to non-payment of annual fee |