CN105845298A - Dual-layer resin encapsulated waterproof negative-temperature thermistor - Google Patents
Dual-layer resin encapsulated waterproof negative-temperature thermistor Download PDFInfo
- Publication number
- CN105845298A CN105845298A CN201610300724.7A CN201610300724A CN105845298A CN 105845298 A CN105845298 A CN 105845298A CN 201610300724 A CN201610300724 A CN 201610300724A CN 105845298 A CN105845298 A CN 105845298A
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- Prior art keywords
- chip
- layer
- waterproof
- double
- layer resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to a dual-layer resin encapsulated waterproof negative-temperature thermistor. The dual-layer resin encapsulated waterproof negative-temperature thermistor comprises a chip, a pin and a protection layer, wherein the pin is connected with the chip, the protection layer wraps the chip, a waterproof layer is arranged between the chip and the protection layer, and the protection layer encapsulates the whole surface of the chip. The dual-layer resin encapsulated waterproof negative-temperature thermistor has super high waterproof performance on an extremely thin condition (0.005 nanometer), and the product size is not increased; and ceramic powder having an expansion coefficient same as the chip is adopted, the protection material on the surface of an electronic assembly can maintain the same contraction ratio as the chip, and cannot be deformed and cracked during the wave soldering process, moisture can be prevented from permanently entering, and thus, the effects of preventing the moisture and resisting acid and alkaline of the electronic assembly are achieved.
Description
Technical field
The present invention relates to a kind of negative temperature coefficient thermistor, especially a kind of double-layer resin encapsulating water proof type negative temperature thermosensitive resistor.
Background technology
Resin-encapsulate type negative temperature thermosensitive resistor, household electrical appliances, medical, etc. field be widely used.It is highly sensitive, volume is little, cheap, be swift in response, easy to use, it is not necessary to consider to introduce lead resistance and the mode of connection, and power is little, reliability is high, it has also become the main flow of household electric appliances temperature sensor.It possesses the many merits such as manufacturing process is simple, cheap, be widely used, and plays irreplaceable effect in terms of temperature sensing, measurement.But simultaneously because of its structure, the restriction of composition, isolation moisture capacity is more weak, have because electrode (silver-colored) migration causes the risk of product failure.
So-called silver migrates (migration), refer to that argent electrode etc. is in the presence of electric current, voltage, in the case of engaging with various insulant, because the moisture absorption of insulant or the suction along with water, argent is caused to produce, in this surface or inside, phenomenon of dividing a word with a hyphen at the end of a line. due to this phenomenon, it produces the exception of defective insulation the most at last, and the mortality more likely producing whole system is destroyed.Therefore, while the miniaturization of electronic building brick, interelectrode distance also and then reduces, and how reducing because transport phenomena makes performance reduce or lose efficacy to be important problem.
Summary of the invention
The technical problem to be solved in the present invention is: proposes a kind of double-layer resin encapsulating water proof type negative temperature thermosensitive resistor, is solved the problems such as silver migration by coating material optimization.
The technical solution adopted in the present invention is: a kind of double-layer resin encapsulating water proof type negative temperature thermosensitive resistor, the pin being connected with chip including chip and be wrapped in the protective layer of chip exterior, is provided with waterproof layer between described chip and protective layer；Described waterproof layer encapsulates whole chip surface.
Further, waterproof layer of the present invention is mixed by interpolation organic bond and the ceramic powders identical with multichip ceramic composition in waterproof colloidal materials；Described waterproof colloidal materials accounts for the 89～93% of gross weight；Organic bond accounts for the 2～6% of gross weight；Ceramic powders accounts for the 3～7% of gross weight.
Further say, waterproof colloidal materials of the present invention by acryl resin powder and firming agent according to 3:1 proportions；Described organic bond has terpineol, levelling agent, dispersant according to 3:1:1 proportions；The two or more pottery that described ceramic powders is made up of transiting state metal element oxide mixes；Total particle diameter is 0.1～10 μm.
Further saying, the preparation technology of waterproof layer of the present invention is:
1) dispensing: according to the one-tenth assignment system powder of multichip ceramic, obtain the mixture of metal-oxide；
2) levigate: the powder that will prepare, use ethanol as medium ball milling, be finely ground to D50=0.4 μm slurry；
3) dry, pulverize: use 35 DEG C of drying and processings slow to slurry, pulverizing, 2000 mesh to sieve；
4) porcelain is become: use actual temperature 1290～1310 DEG C to sinter porcelain into；
5) levigate: to use ethanol as medium ball milling, be finely ground to D50=0.1～the slurry of 10 μm；
6) dry, pulverize: drying and processing slow to slurry, pulverizing, 1000 mesh sieve；
7) glue: proportionally acryl resin powder, solvent, porcelain powder mixing manufacture are become waterproof layer.
Further saying, protective layer of the present invention is epoxy resin or silicones.
The invention has the beneficial effects as follows: in the case of very thin (0.005mm), possess superpower water resistance, do not increase product size；And because using the ceramic powders with the chip coefficient of expansion of the same race; this electronic package surface protection material can stablize the shrinkage ratio identical with chip holding; and will not deform during wave soldering, chap; the steam that blocks that can be lasting enters, and thereby makes electronic building brick reach anti-steam, effect of antiacid alkali.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the present invention；
In figure: 1, chip；2, pin；3, protective layer；4, waterproof layer.
Detailed description of the invention
Presently in connection with accompanying drawing and preferred embodiment, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, and the basic structure of the present invention is described the most in a schematic way, and therefore it only shows the composition relevant with the present invention.
As it is shown in figure 1, a kind of double-layer resin encapsulating water proof type negative temperature thermosensitive resistor, the pin 2 being connected with chip 1 including chip 1 and the protective layer 3 being wrapped in chip exterior, protective layer is epoxy resin or silicones, possesses some strength, toughness.Waterproof layer 4 it is provided with between chip and protective layer；Waterproof layer encapsulates whole chip surface.Its production procedure is:
Chip prepares → welds → and resin-encapsulate waterproof layer prepares → encapsulates internal layer novel self-made resin encapsulating waterproof layer, solidification → encapsulating outer layer insulation resin → make finished product
Waterproof layer 4 is mixed by interpolation organic bond and the ceramic powders identical with multichip ceramic composition in waterproof colloidal materials；Described waterproof colloidal materials accounts for the 89～93% of gross weight；Organic bond accounts for the 2～6% of gross weight；Ceramic powders accounts for the 3～7% of gross weight.It not only possesses good water proofing property (its main body marine glue effect), also form shrinkage factor, the coefficient of expansion and chip infinite approach because it adds ceramic powders, cause it to be unlikely to deform through Reflow Soldering, dip-soldering machine etc., chap, the anti-water stability of long sustaining.
Waterproof colloidal materials by acryl resin powder and firming agent according to 3:1 proportions；Described organic bond has terpineol, levelling agent, dispersant according to 3:1:1 proportions；The two or more pottery that described ceramic powders is made up of transiting state metal element oxide mixes；Total particle diameter is 0.1～10 μm.
Waterproof layer proportion designs four kinds altogether, such as following table:
The preparation technology of waterproof layer is:
1) dispensing: according to the one-tenth assignment system powder of multichip ceramic, obtain the mixture of metal-oxide；
2) levigate: the powder that will prepare, use ethanol as medium ball milling, be finely ground to D50=0.4 μm slurry；
3) dry, pulverize: use 35 DEG C of drying and processings slow to slurry, pulverizing, 2000 mesh to sieve；
4) porcelain is become: use actual temperature 1290～1310 DEG C to sinter porcelain into；
5) levigate: to use ethanol as medium ball milling, be finely ground to D50=0.1～the slurry of 10 μm；
6) dry, pulverize: drying and processing slow to slurry, pulverizing, 1000 mesh sieve；
7) glue: proportionally acryl resin powder, solvent, porcelain powder mixing manufacture are become waterproof layer.
Silver migration problem is not only solved by coating material optimization, and cost relatively uses the low cost more than 35% of " the gold metal electrode such as (Au), platinum (Pt), palladium (Pd) weakens silver migration ", will have the wide market space.
The detailed description of the invention of the simply present invention described in description above, the flesh and blood of the present invention is not construed as limiting by various illustrations, person of an ordinary skill in the technical field after having read description can to before described detailed description of the invention make an amendment or deform, without departing from the spirit and scope of the invention.
Claims (5)
1. a double-layer resin encapsulating water proof type negative temperature thermosensitive resistor, is connected with chip including chip
Pin and be wrapped in the protective layer of chip exterior, it is characterised in that: set between described chip and protective layer
It is equipped with waterproof layer；Described waterproof layer encapsulates whole chip surface.
2. double-layer resin encapsulating water proof type negative temperature thermosensitive resistor as claimed in claim 1, its feature exists
Organic bond and identical with multichip ceramic composition is added in: described waterproof layer is by waterproof colloidal materials
Ceramic powders mix；Described waterproof colloidal materials accounts for the 89～93% of gross weight；Organic bond accounts for always
The 2～6% of weight；Ceramic powders accounts for the 3～7% of gross weight.
3. double-layer resin encapsulating water proof type negative temperature thermosensitive resistor as claimed in claim 2, its feature exists
In: described waterproof colloidal materials by acryl resin powder and firming agent according to 3:1 proportions；Described has
Machine binding agent has terpineol, levelling agent, dispersant according to 3:1:1 proportions；Described ceramic powders is by mistake
The two or more pottery crossing state metal oxides composition mixes；Total particle diameter is 0.1～10 μm.
4. double-layer resin encapsulating water proof type negative temperature thermosensitive resistor as claimed in claim 3, its feature exists
In: the preparation technology of described waterproof layer is:
1) dispensing: according to the one-tenth assignment system powder of multichip ceramic, obtain the mixture of metal-oxide；
2) levigate: the powder that will prepare, use ethanol as medium ball milling, be finely ground to D50=0.4 μm slurry
Material；
3) dry, pulverize: use 35 DEG C of drying and processings slow to slurry, pulverizing, 2000 mesh to sieve；
4) porcelain is become: use actual temperature 1290～1310 DEG C to sinter porcelain into；
5) levigate: to use ethanol as medium ball milling, be finely ground to D50=0.1～the slurry of 10 μm；
6) dry, pulverize: drying and processing slow to slurry, pulverizing, 1000 mesh sieve；
7) glue: proportionally acryl resin powder, solvent, porcelain powder mixing manufacture are become waterproof layer.
5. double-layer resin encapsulating water proof type negative temperature thermosensitive resistor as claimed in claim 1, its feature exists
In: described protective layer is epoxy resin or silicones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610300724.7A CN105845298A (en) | 2016-05-09 | 2016-05-09 | Dual-layer resin encapsulated waterproof negative-temperature thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610300724.7A CN105845298A (en) | 2016-05-09 | 2016-05-09 | Dual-layer resin encapsulated waterproof negative-temperature thermistor |
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| Publication Number | Publication Date |
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| CN105845298A true CN105845298A (en) | 2016-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610300724.7A Pending CN105845298A (en) | 2016-05-09 | 2016-05-09 | Dual-layer resin encapsulated waterproof negative-temperature thermistor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620901A (en) * | 2008-07-04 | 2010-01-06 | 爱普科斯电子元器件(珠海保税区)有限公司 | Flame-retardant and explosion-proof voltage dependent resistor |
| CN102318016A (en) * | 2009-02-16 | 2012-01-11 | 日本贵弥功株式会社 | Electronic component manufacturing method |
| CN103531316A (en) * | 2013-10-23 | 2014-01-22 | 上海长园维安电子线路保护有限公司 | Polymer PTC element with excellent weather resistance and its manufacturing method |
| CN204010867U (en) * | 2014-07-28 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | A kind of high temperature resistant moistureproof NTC themistor |
| CN104987729A (en) * | 2015-06-04 | 2015-10-21 | 常熟市林芝电子有限责任公司 | High voltage-resistance organic silicon encapsulating material for ceramic thermistor |
-
2016
- 2016-05-09 CN CN201610300724.7A patent/CN105845298A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620901A (en) * | 2008-07-04 | 2010-01-06 | 爱普科斯电子元器件(珠海保税区)有限公司 | Flame-retardant and explosion-proof voltage dependent resistor |
| CN102318016A (en) * | 2009-02-16 | 2012-01-11 | 日本贵弥功株式会社 | Electronic component manufacturing method |
| CN103531316A (en) * | 2013-10-23 | 2014-01-22 | 上海长园维安电子线路保护有限公司 | Polymer PTC element with excellent weather resistance and its manufacturing method |
| CN204010867U (en) * | 2014-07-28 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | A kind of high temperature resistant moistureproof NTC themistor |
| CN104987729A (en) * | 2015-06-04 | 2015-10-21 | 常熟市林芝电子有限责任公司 | High voltage-resistance organic silicon encapsulating material for ceramic thermistor |
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