CN105826446A - Frame member and manufacturing method of sealed photosemiconductor element - Google Patents

Frame member and manufacturing method of sealed photosemiconductor element Download PDF

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Publication number
CN105826446A
CN105826446A CN201610045311.9A CN201610045311A CN105826446A CN 105826446 A CN105826446 A CN 105826446A CN 201610045311 A CN201610045311 A CN 201610045311A CN 105826446 A CN105826446 A CN 105826446A
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CN
China
Prior art keywords
space
frame component
optical semiconductor
sealant
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610045311.9A
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Chinese (zh)
Inventor
三田亮太
北山善彦
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Nitto Denko Corp
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Nitto Denko Corp
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Publication date
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Publication of CN105826446A publication Critical patent/CN105826446A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention provides a frame member and a manufacturing method of a sealed photosemiconductor element. The frame member is used for sealing a photosemiconductor element through utilization of a sealing layer formed from a sealing material. The frame member comprises: a first frame part formed in a manner of forming a first space; a second frame part which is configured outside the first frame to be spaced from the first frame and to form a second space between the second and first frame parts and is configured to encircle the first frame; and a connection part for connecting the first and second frame parts. The first space is provided for the sealing layer and the photosemiconductor element. The second space is used for accepting the left parts except the part of the sealing material forming the sealing layer of the photosemiconductor element.

Description

Frame component and the manufacture method of encapsulating optical semiconductor element
Technical field
The present invention relates to the manufacture method of frame component and encapsulating optical semiconductor element, specifically, relate to frame component and use this frame component to carry out the manufacture method of encapsulating optical semiconductor element of encapsulating optical semiconductor element.
Background technology
In the past, the technology utilizing sealant encapsulating optical semiconductor element to manufacture encapsulating optical semiconductor element it is known to.
Such as, it is proposed that following methods is (for example, referring to Japanese Unexamined Patent Publication 2013-214716 publication.).I.e., first, prepare the substrate of optical semiconductor, diaphragm seal have been installed, they are arranged at forcing press.Specifically, substrate is configured at the upper plate of forcing press, diaphragm seal is configured at the lower plate of forcing press.Meanwhile, distance piece is configured in the way of surrounding diaphragm seal.Afterwards, make forcing press work, in the way of spacer contacts, diaphragm seal is pressurizeed by the peripheral end portion of the upper plate of forcing press.Thus, diaphragm seal is pressurized and encapsulating optical semiconductor element.
But, for formed the encapsulant of diaphragm seal be commonly angled relative to by distance piece round space arrange with having residue, accordingly, there are such unfavorable condition: remaining encapsulant from by distance piece round space cross distance piece, the component etc. around such as forcing press is polluted.
Summary of the invention
It is an object of the invention to, it is provided that the frame component of the pollution of a kind of component being prevented from surrounding and use the manufacture method of encapsulating optical semiconductor element of this frame component.
The present invention (1) is a kind of frame component, and it carrys out encapsulating optical semiconductor element for utilizing the sealant formed by encapsulant, it is characterised in that this frame component includes: the 1st frame portion, and it is constituted in the way of forming the 1st space；2nd frame portion, it configures in the way of forming the 2nd space in the outside in described 1st frame portion and described 1st frame portion interval between itself and described 1st frame portion, and configures in the way of surrounding described 1st frame portion；Linking part, it is for linking up described 1st frame portion and described 2nd frame portion, described 1st space is for described sealant and the configuration of described optical semiconductor, described 2nd space remaining part outside the part receiving the described sealant that the formation in described encapsulant seals described optical semiconductor.
Use this frame component, it is possible to sealant and optical semiconductor are configured at the 1st space, and afterwards, the remaining part outside the part of the sealant that the formation in the encapsulant when pressurizeing them seals optical semiconductor is accommodated in the 2nd space.
Therefore, it is possible to prevent the pollution of the component of the surrounding of frame component.
It addition, the frame component (2) of the present invention is according to the frame component described in (1), wherein, described 1st frame portion has the 1st groove connected in described 1st space with described 2nd space.
In this frame component, in the case of the 1st space is filled with by encapsulant, it is possible to make the remaining encapsulant in the 1st space pass through in the 1st groove, and be stowed in the 2nd space.Therefore, it is possible to utilize the 1st groove to be accommodated in swimmingly in the 2nd space by remaining encapsulant.
It addition, the frame component (3) of the present invention is according to the frame component described in (1) or (2), wherein, described 2nd space is provided with multiple, and described linking part has the 2nd groove of described 2nd space connection adjacent one another are.
In this frame component, even the situation that the 2nd space in the 2nd space adjacent one another are is filled with by remaining encapsulant, it is also possible to received remaining encapsulant by the 2nd groove by another the 2nd space.I.e. it is capable of by remaining encapsulant to be accommodated in successively in the 2nd space from one to another order.Therefore, it is possible to utilize sealant encapsulating optical semiconductor element equably.
It addition, the frame component (4) of the present invention is according to the frame component described in (2) or (3), wherein, described linking part is provided with multiple, and described 2nd space is divided into multiple by multiple described linking parts.
In this frame component, it is possible to remaining encapsulant is accommodated in each space being divided into the 2nd multiple spaces, therefore, it is possible to be reliably prevented the pollution of the component of the surrounding of frame component.
It addition, the frame component (5) of the present invention is according to the frame component described in (4), wherein, multiple described 2nd spaces have the 3rd space and aperture area the 4th space less than the aperture area in described 3rd space.
In this frame component, multiple 2nd spaces have the 3rd bigger space of aperture area and less the 4th space of aperture area, therefore, compared with the frame component in multiple spaces bigger with only having aperture area, it is possible to seek the miniaturization of frame component.
It addition, the frame component (6) of the present invention is according to the frame component described in (5), wherein, described 1st space is connected by described 1st groove with described 3rd space.
In this frame component, in the case of the 1st space is filled with by encapsulant, it is possible to make the remaining encapsulant in the 1st space first pass through in the 1st groove and it be preferentially accommodated in the 3rd space.And then, remaining encapsulant is crossed the 1st frame portion and is accommodated in the 3rd space and the 4th space.And, the aperture area in the 3rd space is more than the aperture area in the 4th space, therefore, even if preferentially receiving remaining encapsulant, it is also possible to allow sufficiently storage.
It addition, the frame component (7) of the present invention is according to the frame component described in (5) or (6), wherein, described 3rd space is connected by described 2nd groove with described 4th space.
In this frame component, in the case of the 1st space is filled with by encapsulant, first the remaining encapsulant in the 1st space crosses the 1st frame portion, afterwards, is accommodated in the 3rd space and the 4th space.And then, if less the 4th space of aperture area is filled by remaining encapsulant, the most remaining encapsulant can be via the 2nd groove by bigger the 3rd space storage of aperture area.It is to say, the 3rd space can assist the 4th space to receive remaining encapsulant.
It addition, the manufacture method of the encapsulating optical semiconductor element of the present invention (8) includes following operation: preparing lower plate, upper plate and above-mentioned frame component, wherein, this upper plate can be oppositely disposed with described lower plate at spaced intervals in the upside of described lower plate；Described frame component is configured at upside relative to the upper surface of described lower plate；It is configured at upside relative to the upper surface of described lower plate in the way of described sealant described sealant in time projecting along above-below direction is configured at described 1st space；Described optical semiconductor is configured at downside relative to the lower surface of described upper plate；Described upper plate is arranged as opposed in the upside of described lower plate with described lower plate in the way of optical semiconductor described when projecting along above-below direction is contained in described sealant；And by described upper plate and described lower plate are pressurizeed, described sealant is pressurizeed and utilizes described sealant to seal described optical semiconductor, utilizing described sealant to seal in the operation of described optical semiconductor, the remaining part outside the part of the described sealant that the formation in described encapsulant seals described optical semiconductor is accommodated in described 2nd space.
The method using the present invention, come in the operation of encapsulating optical semiconductor element utilizing sealant, remaining part outside the part of the sealant that the formation in encapsulant seals optical semiconductor is accommodated in the 2nd space, therefore, it is possible to prevent the pollution of the component of the surrounding of frame component.
Use frame component and the manufacture method of encapsulating optical semiconductor element of the present invention, it is possible to prevent the pollution of the component of the surrounding of frame component.
Accompanying drawing explanation
Fig. 1 represents the axonometric chart of the 1st embodiment (frame component has the form that the width in the 1st groove, the width in the 3rd space and the 4th space is identical) of the frame component of the present invention.
Fig. 2 represents the top view of the frame component shown in Fig. 1.
Fig. 3 represents the exploded perspective view when frame component shown in Fig. 1, diaphragm seal, members sheet, lower clamp and upper fixture are placed to forcing press.
Fig. 4 A and Fig. 4 B is the process chart that frame component, diaphragm seal, members sheet, lower clamp and upper fixture are placed in forcing press, and Fig. 4 A represents that top view (having had an X-rayed a top view during part and the upper plate of upper fixture), Fig. 4 B represent the sectional view of the line A-A along Fig. 4 A.
Fig. 5 A and Fig. 5 B is the process chart pressurizeed relative to lower increased pressure board by upper increased pressure board, and Fig. 5 A represents top view (having had an X-rayed a top view during part and the upper plate of upper fixture), and Fig. 5 B represents the sectional view of the line A-A along Fig. 5 A.
Fig. 6 A and Fig. 6 B is the process chart manufacturing optical semiconductor device, and Fig. 6 A represents that the operation peeled from support plate by encapsulating optical semiconductor element, Fig. 6 B represent the operation that encapsulating optical semiconductor element is installed on substrate.
Fig. 7 represents exploded perspective view when in the variation of the 1st embodiment, frame component, diaphragm seal, members sheet, lower clamp and upper fixture are placed to forcing press.
Fig. 8 A and Fig. 8 B is the process chart that frame component, diaphragm seal, members sheet, lower clamp and upper fixture are placed in forcing press, and Fig. 8 A represents that upward view, Fig. 8 B represent the sectional view of the X-X line along Fig. 8 A.
Fig. 9 A～Fig. 9 C is the operation relative to upper fixture configuration members sheet, Fig. 9 A represents preparation members sheet and the operation of upper fixture, Fig. 9 B represents that the operation making members sheet slide relative to upper fixture, Fig. 9 C represent that alignment the 2nd protuberance utilizing the 2nd to sell carrys out the operation that straining element component sheet moves to the right.
Figure 10 A and Figure 10 B is the operation relative to upper fixture configuration members sheet, and Figure 10 A and Fig. 9 A is corresponding, represents and prepares members sheet and the operation of upper fixture, and Figure 10 B and Fig. 9 B is corresponding, represents the operation making members sheet slide relative to upper fixture.
Figure 11 is the variation of the 1st embodiment, represents will have exploded perspective view when the upper fixture of 4 sheet configuring areas, 4 members sheets, 4 diaphragm seals and 4 frame components are placed in forcing press.
Figure 12 represents the upper fixture in the variation shown in Figure 11 and the upward view of members sheet.
Figure 13 represents the top view of the variation (being not provided with the form of the 1st groove) of frame component.
Figure 14 represents the top view of the variation (also being provided with the form of the 1st groove at the 1st right part and the 1st left part) of frame component.
Figure 15 represents the top view of the variation (the 1st groove is located at the left and right directions central part of the 1st front portion and the form of the left and right directions central part at the 1st rear portion) of frame component.
Figure 16 represents the top view of the variation (width in the 4th space is less than the form of the width in the 3rd space) of frame component.
Figure 17 represents the top view of the 2nd embodiment form of the 2nd groove (the frame component have) of frame component.
Figure 18 A and Figure 18 B is the process chart that the frame component shown in Figure 17, diaphragm seal, members sheet, lower clamp and upper fixture are placed in forcing press and are pressurizeed them, Figure 18 A represents top view (having had an X-rayed a top view during part and the upper plate of upper fixture), and Figure 18 B represents sectional view.
Figure 19 represents the top view of the 3rd embodiment (frame component has the 1st groove and the form of the 2nd groove) of frame component.
Detailed description of the invention
1st embodiment and the 2nd embodiment of the frame component of the present invention are described.
＜ the 1st embodiment ＞
In fig. 2, paper above-below direction be fore-and-aft direction (the 1st direction), on the upside of paper be rear side (side in the 1st direction), on the downside of paper be front side (opposite side in the 1st direction).Paper left and right directions is left and right directions (2nd direction orthogonal with the 1st direction), is left side (side in the 2nd direction) on the left of paper, is right side (opposite side in the 2nd direction) on the right side of paper.Thickness of paper direction is above-below direction (3rd direction orthogonal with the 1st direction and the 2nd direction), and paper nearby side is upside (side in the 3rd direction), and paper depth side is downside (opposite side in the 3rd direction).Specifically, it is as the criterion with the direction arrow of each figure.
1. frame component
Frame component 1 is to be used when utilizing sealant 43 (aftermentioned, with reference to Fig. 5 A and Fig. 5 B) to carry out encapsulating optical semiconductor element 46 (aftermentioned, with reference to Fig. 5 A and Fig. 5 B).Specifically, as shown in Figure 1 and Figure 2, frame component 1 is such as formed by metal, has plate shape (writing board shape) relatively thin on above-below direction.It addition, frame component 1 has overlooks substantially rectangular profile.Frame component 1 have one, the 1st frame portion 2, the 2nd frame portion 3 configured in the way of surrounding the 1st frame portion 2 and the linking part 4 that the 1st frame portion 3 of frame portion the 2 and the 2nd is linked up.
1st frame portion 2 is the inboard portion before and after frame component 1 on direction and left and right directions (direction, face).1st frame portion 2 has the substantially rectangular shaped as frame shape of vertical view.1st frame portion 2 have one, extend along the 1st front portion 21 that left and right directions extends, along left and right directions and rear side and the 1st anterior 21 intervals in the 1st front portion 21 and the 1st rear portion 22 being arranged as opposed to the 1st front portion 21, the 1st right part 23 that the right part of the 1st front portion 21 and the right part at the 1st rear portion 22 are linked up, the 1st left part 24 that the left part of the 1st front portion 21 and the left part at the 1st rear portion 22 are linked up.1st anterior 21 and the 1st rear portion 22 has the 1st groove 8 described later.It addition, the 1st frame portion 2 has the 1st space 10 formed within it.
1st space 10 is the peristome (through hole) that the thickness direction (above-below direction) along frame component 1 runs through frame component 1.1st space 10 by the 1st frame portion 2 round, there is vertical view rectangular shape.1st space 10 has the size that can configure for sealant 43 described later and multiple optical semiconductor 46 (with reference to Fig. 5 A and Fig. 5 B).
2nd frame portion 2 of frame portion the 3 and the 1st is configured at direction before and after the 1st frame portion 2 and the outside on left and right directions (direction, face) at spaced intervals.2nd frame portion 3 has the profile identical with the profile during vertical view of frame component 1.2nd frame portion 3 have one, the front portion that is configured at the 2nd frame portion 3 and the 2nd front portion 31 extended along left and right directions, extend and be spaced apart between rear side and the 2nd front portion 31 in the 2nd front portion 31 interval along left and right directions and the 2nd rear portion 32 being arranged as opposed to, the 2nd right part 33 linked up in the right part of the 2nd front portion 31 and the right part at the 2nd rear portion 32 and the 2nd left part 34 linked up in the left part of the 2nd front portion 31 and the left part at the 2nd rear portion 32.
2nd anterior 31 and the 2nd rear portion 32 is respectively provided with vertical view rectangular shape longer on left and right directions.
2nd right part 33 has the shape extended along fore-and-aft direction.2nd right part 33 has the right recess 35 caved in from its right-hand member edge towards left side.Right recess 35 has vertical view rectangular shape, is configured at direction central part before and after the 2nd right part 33.
2nd left part 34 has the shape extended along fore-and-aft direction.2nd left part 34 has the left recess 36 caved in from its left end edge towards right side.Left recess 36 has vertical view rectangular shape, is configured at direction central part before and after the 2nd left part 34.
Linking part 4 is provided with multiple (4).Specifically, linking part 4 is configured at four corners of frame component 1.Specifically, each corner in each corner in four corners in the 1st frame portion 2 and four corners in the 2nd frame portion 3 is linked up by linking part 4.That is, linking part 4 has the right front linking part 51 linked up in the right part (the right forward corner in the 1st frame portion 2) of the 1st front portion 21 and the right part (the right forward corner in the 2nd frame portion 3) of the 2nd front portion 31, the left front linking part 52 that the left part (the left front corner in the 1st frame portion 2) of the 1st front portion 21 and the left part (the left front corner in the 2nd frame portion 3) of the 2nd front portion 31 are linked up, linking part 53 behind the right side that the right part (the right back angle in the 1st frame portion 2) at the 1st rear portion 22 and the right part (the right back angle in the 2nd frame portion 3) at the 2nd rear portion 32 are linked up, the left back linking part 54 that the left part (the left back corner in the 1st frame portion 2) at the 1st rear portion 22 and the left part (the left back corner in the 2nd frame portion 3) at the 2nd rear portion 32 are linked up.Behind the right side before linking part 53 and left back linking part 54 and the right side linking part 51 and left front linking part 52 relative to being that line configures symmetrically by the imaginary line LA that left recess 5 and right recess 6 link.
And, frame component 1 has linking part 4, and therefore, the 2nd space 11 is formed between the 1st frame portion 3 of frame portion the 2 and the 2nd.
2nd space 11 is configured at the outside in the 1st frame portion 2 between the 1st space 10 in the way of the 2nd frame portion 3.2nd space 11 is the peristome (through hole, slit) that the thickness direction (above-below direction) along frame component 1 runs through frame component 1.2nd space 11 is divided into multiple (4) by multiple linking parts 4 (linking part 53 and left back linking part 54 behind right front linking part 51, left front linking part 52, the right side).It is to say, the 2nd space 11 is divided into multiple (4).Specifically, the 2nd space 11 has the 3rd separate space 26, space the 25 and the 4th.
3rd space 25 is configured at front portion and the rear portion of frame component 1.3rd space 25 has front space 55 independent of each other and rear space 56.
Front space 55 is configured at the front portion of frame component 1.Front space 55 extends along left and right directions.Front space 55 is divided formed by the 1st front portion 31, front portion the 21, the 2nd, right front linking part 51 and left front linking part 52, has vertical view rectangular shape longer on left and right directions.It is long that left and right directions length (length) L1 of front space 55 is set to identical with the left and right directions length in the 1st space 10 or than the 1st space 10 left and right directions length.Direction length (width) W1 for example, more than 1mm, preferably more than 3mm before and after front space 55, it addition, for example, below 20mm, preferably below 10mm.Aperture area (aperture area during vertical view of front space 55.The most identical.) less than the aperture area in the 1st space 10.Specifically, the aperture area of front space 55 is such as less than the 25% of the aperture area in the 1st space 10, preferably less than 15%, more preferably less than 10%, it addition, e.g. more than 1%.
Rear space 56 is configured at the rear portion of frame component 1.Rear space 56 extends along left and right directions.Rear space 56 is divided by linking part 53 behind the 1st rear portion 32, rear portion the 22, the 2nd, the right side and left back linking part 54 and forms, and has the vertical view rectangular shape that left and right directions is longer.Left and right directions length (length) L2 and fore-and-aft direction length (width) W2 of rear space 56 are identical with W1 and L1 of front space 55 respectively.The aperture area of rear space 56 is identical with the aperture area of front space 55.
4th space 26 is configured at left part and the right part of frame component 1.4th space 26 has right space 57 independent of each other and left space 58.
Right space 57 is configured at the right part of frame component 1.Right space 57 extends along fore-and-aft direction.Right space 57 is divided by linking part 53 behind the 1st right part the 23, the 2nd right part 33, right front linking part 51 and the right side and forms, and has the vertical view rectangular shape that fore-and-aft direction is longer.Before and after right space 57, direction length (length) L3 is set to identical or longer than direction length L9 before and after the 1st space 10 with direction length L9 before and after the 1st space 10.Left and right directions length (width) W3 of right space 57 is identical with above-mentioned W1 and W2.Thus, the aperture area of right space 57 is identical with the aperture area of the aperture area of front space 55 and rear space 56.
Left space 58 is configured at the left part of frame component 1.Left space 58 extends along fore-and-aft direction.Left space 58 is divided by the 1st left part the 24, the 2nd left part 34, left front linking part 52 and left back linking part 54 and forms, and has the vertical view rectangular shape extended along fore-and-aft direction.Before and after left space 58, direction length L4 and left and right directions length (width) W4 are identical with L3 and W3 of right space 57 respectively.The aperture area of left space 58 is identical with the aperture area of right space 57.
Total aperture area in 4 the 2nd spaces 11 (front space 55, rear space 56, right space 57 and left space 58) is less than the aperture area in the 1st space 10, specifically, it is such as less than the 50% of area of the 1st space 10, preferably less than 35%, more preferably less than 20%, it addition, e.g. more than 5%.
And then, in this frame component 1, the 1st frame portion 2 has the 1st groove 8.Specifically, the 1st groove 8 is arranged at the 1st anterior 21 and the 1st rear portion 22.
1st groove 8 is provided with multiple.1st groove 8 has the front groove 81 being located at the 1st front portion 21 and the pit 82 being located at the 1st rear portion 22.
Front groove 81 is provided with multiple (two), specifically, is located at the respective top, both ends, left and right of the 1st front portion 21.Multiple front grooves 81 are the grooving (groove) that the upper surface from the 1st front portion 21 starts to be resected to thickness direction (above-below direction) midway respectively.Multiple front grooves 81 are respectively provided with main section view rectangular shape.Multiple front grooves 81 respectively overlook time along fore-and-aft direction across the 1st front portion 21, its leading section arrive front space 55, thereafter end arrive the 1st space 10.It addition, multiple respective bottom surfaces of front groove 81 are positioned at the position lower than the upper surface of the left and right directions central part of the 1st front portion 21, right front linking part 51 and this three of left front linking part 52 along left and right directions when projecting.
Pit 82 configures symmetrically in line relative to above-mentioned imaginary line LA and front groove 81 and is formed.Specifically, pit 82 is provided with multiple (two).Pit 82 is located at the respective top, both ends, left and right at the 1st rear portion 22.Multiple pits 82 are the grooving (groove) that the upper surface from the 1st rear portion 22 starts to be resected to thickness direction midway respectively.Multiple pits 82 are respectively provided with main section view rectangular shape.Multiple pits 82 respectively overlook time along fore-and-aft direction across the 1st rear portion 22, thereafter end arrive rear space 56, its leading section arrive the 1st space 10.It addition, multiple respective bottom surfaces of pit 82 be positioned at than the left and right directions central part at the 1st rear portion 22, the right side when projecting along left and right directions after the low position of the upper surface of linking part 53 and this three of left back linking part 54.
1st space 10 is connected by the 1st groove 8 with the 2nd space 11.Specifically, the 1st space 10 is connected by the 1st groove 8 with the 3rd space 25.More specifically, the 1st space 10 is connected by front groove 81 with front space 55, and the 1st space 10 is connected by pit 82 with rear space 56.
On the other hand, the 1st space 10 does not connects with the 4th space 26.It addition, the 3rd space 25 does not connects with the 4th space 26 yet.
The size of the 1st groove 8 can suitably set.Specifically, as with reference to Fig. 1, the width W5 of the 1st groove 8 is such as more than 0.5mm, preferably more than 1mm, it addition, e.g. below 20mm, preferably below 10mm.
As long as more than the lower limit above-mentioned for width W5 of the 1st groove 8, it becomes possible to making stripping film 42 fall in (being pressed into) the 1st groove 8 fully, remaining encapsulant α can pass through the 1st groove 8, the thickness therefore making sealant 43 is stable.
On the other hand, as long as below the upper limit above-mentioned for width W5 of the 1st groove 8, then the remaining encapsulant α inflow to the 3rd space 25 can be suppressed, it is possible to prevent from producing the deficiency of encapsulant in the 1st space 10.Therefore, it is possible to prevent from producing space and/or surface indentation in sealant 43.
Degree of depth D e.g. more than the 0.01mm of the 1st groove 8, preferably more than 0.03mm, more preferably more than 0.05mm.It addition, less than the 80% of the thickness T of degree of depth D of the 1st groove 8 e.g. frame component 1, specifically, e.g. below 0.5mm, preferably below 0.3mm, more preferably below 0.2mm.
As long as more than the lower limit that degree of depth D of the 1st groove 8 is above-mentioned, filler and/or fluorophor contained by encapsulant just can pass through the 1st groove 8, and suppression produces segregation near the 1st groove 8, additionally, being not intended to the flowing of remaining encapsulant α, the thickness making sealant 43 is stable.
On the other hand, as long as below the above-mentioned upper limit of degree of depth D of the 1st groove 8, it becomes possible to suppress the remaining encapsulant α inflow to the 3rd space 25, it is possible to prevent from producing the deficiency of encapsulant in the 1st space 10.Therefore, it is possible to prevent from producing space and/or surface indentation in sealant 43.
2. encapsulating optical semiconductor element and the manufacture method of optical semiconductor device
Then, to using this frame component 1 come encapsulating optical semiconductor element 46 method manufacturing encapsulating optical semiconductor element 47 and use encapsulating optical semiconductor element 47 to illustrate to the method manufacturing optical semiconductor device 48.
In the method, as shown in Figure 3, first, the lower clamp 61 of an example as lower plate, the upper fixture 71 of an example, frame component 1, diaphragm seal 41 and the members sheet 49 (preparing an example of the operation of lower plate, upper plate and frame component) as upper plate are prepared respectively.
Lower clamp 61 is such as formed by metal, as shown in Fig. 3 and Fig. 4 A, has substantially rectangular writing board shape.Lower clamp 61 has the profile bigger than the profile of frame component 1.Lower clamp 61 has the 1st pin 62, spring 63, telltale mark 64 and hole, lower location 65.
1st pin 62 is configured at four corners of lower clamp 61.It is generally cylindrical shaped that multiple (4) the 1st pin 62 is respectively provided with that four respective upper surfaces in corner from lower clamp 61 extend towards upside.
Spring 63 is arranged accordingly with multiple 1st pins 62.Multiple springs 63 are the compression helical spring that can stretch along above-below direction respectively.Multiple springs 63 insert (installation) for the 1st pin 62 respectively.
Telltale mark 64 is configured with multiple (4).Specifically, multiple (4) telltale marks 64 are arranged in than multiple (4) the 1st pin 62 position in the inner part at spaced intervals with multiple (4) the 1st pin 62.Multiple telltale marks 64 are respectively provided with vertical view generally L-shaped shape.Telltale mark 64 is to be formed by cutting the upper surface of lower clamp 61.Telltale mark 64 is arranged in and the 4 of stripping film 42 positions that corner is corresponding.
Hole, lower location 65 is configured with multiple (two) in the way of corresponding with the right recess 35 and left recess 36 of frame component 1.Hole, lower location 65 is the through hole running through lower clamp 61 along thickness direction.Hole, multiple lower location 65 is respectively provided with the vertical view rectangular shape extended along fore-and-aft direction.
Upper fixture 71 is such as formed by metal, has substantially rectangular writing board shape.Upper fixture 71 has the profile identical with the profile of lower clamp 61.Upper fixture 71 has hole, upper location 72.It addition, upper fixture 71 has sheet configuring area 70.
Hole, upper location 72 is the through hole running through upper fixture 71 along thickness direction.Hole, upper location 72 is configured with multiple (4) in four corners of upper fixture 71.Hole, upper location 72 has the shape and size can inserted for the 1st pin 62.
As it is shown on figure 3, sheet configuring area 70 is the region of the central authorities of the lower surface of upper fixture 71, it it is the region for members sheet 49 described later configuration.
Diaphragm seal 41 includes stripping film 42 and sealant 43.Preferably, diaphragm seal 41 is only made up of stripping film 42 and sealant 43.
Diaphragm seal 41 has writing board shape, specifically has predetermined thickness, has and extends along left and right directions and fore-and-aft direction and smooth surface and the smooth back side.
Stripping film 42 is in order to until utilizing the period protection sealant 43 of sealant 43 encapsulating optical semiconductor element 46 and being pasted on the back side (lower surface in Fig. 4 B) of sealant 43 in a releasable manner.Stripping film 42 is formed by flexible thin film.It addition, the sticking veneer of stripping film 42 is it is to say, the contact surface contacted with sealant 43 is carried out the lift-off processing such as fluorine process as required.
As stripping film 42, thin polymer film, such as potsherd, the such as metal formings etc. such as such as polyethylene film, mylar (PET etc.) can be listed.It addition, the shape of stripping film 42 has such as overlooks rectangular shape (including rectangle, strip) etc..
As shown in Figure 4 B, stripping film 42 is sized to the Zhou Duanyuan of stripping film 42 when projecting along thickness direction and is placed in the upper surface of frame component 1.Specifically, stripping film 42 is sized to stripping film 42 and covers the 1st space 11, space the 10 and the 2nd.
More than the thickness of stripping film 42 e.g. 1 μm, more than preferably 10 μm, it addition, below e.g. 2000 μm, below preferably 1000 μm.
Sealant 43 is formed as a generally rectangular plate shape by encapsulant.
As encapsulant, such as sealing resin composition can be listed.Sealing resin composition contains sealing resin.
As sealing resin, the resin of the transparency can be listed, specifically, thermosetting resin, thermoplastic resin can be listed, it is preferred that thermosetting resin can be listed.
As thermosetting resin, such as two benches reaction curable resin, an elementary reaction curable resin can be listed.
Two benches reaction curable resin has two reaction mechanisms, it can realize B-stage (semi-solid preparation) from A stage condition in the reaction in the 1st stage, it follows that C-stage (being fully cured) can be realized from B-stage state in the reaction in the 2nd stage.It is to say, two benches reaction curable resin is can to become the thermosetting resin of B-stage state by the heating condition of appropriateness.But, two benches reaction curable resin also is able to the most just become C-stage state by violent heating from A stage condition and do not maintain B-stage state.Additionally, B-stage state is thermosetting resin is the state between aqueous A stage condition and the C-stage state being fully cured, and it is somewhat to carry out solidifying and gelation, modulus of elasticity in comperssion are less than the semisolid of the elastic modelling quantity of C-stage state or solid state.
One elementary reaction curable resin has 1 reaction mechanism, and it can realize C-stage (being fully cured) from A stage condition in the reaction in the 1st stage.In addition, one elementary reaction curable resin includes following thermosetting resin: stop this reaction in the midway of the reaction in the 1st stage, B-stage state can be become from A stage condition, heat the most further, the reaction in the 1st stage can be started again at, realize C-stage (being fully cured) from B-stage state.It is to say, this thermosetting resin is the thermosetting resin that can become B-stage state.Certainly, one elementary reaction curable resin includes following thermosetting resin: can not be controlled this compositions of thermosetting resin in the way of the stopping of the midway of the reaction in a stage to make this thermosetting resin, that is, B-stage state cannot be become, disposably just realize C-stage (being fully cured) from A stage condition.
It is to say, thermosetting resin includes depending on that heating condition can become the thermosetting resin of B-stage state and cannot become the thermosetting resin of B-stage state.
As sealing resin, such as organic siliconresin, epoxy resin, polyurethane resin, polyimide resin, phenolic resin, Lauxite, melamine resin, unsaturated polyester resin etc. can be listed.
As sealing resin, organic siliconresin, epoxy resin preferably can be listed.
As organic siliconresin, the thermosetting silicone resin that can become the thermosetting silicone resin of B-stage state, B-stage state cannot be become preferably can be listed.
As epoxy resin, the thermosetting epoxy resin that can become B-stage state can be listed.
Above-mentioned sealing resin can also be same kind of resin or the resin of multiple kind.
And then, sealing resin composition also is able to containing filler, fluorophor.
As filler, the granule such as inorganic particle, organic granular can be listed.
As inorganic particle, such as silicon oxide (SiO can be listed2), Talcum (Mg3(Si4O10) (HO) 2), aluminium oxide (Al2O3), boron oxide (B2O3), calcium oxide (CaO), zinc oxide (ZnO), strontium oxide (SrO), magnesium oxide (MgO), zirconium oxide (ZrO2), Barium monoxide (BaO), stibium oxide (Sb2O3) etc. oxide, such as aluminium nitride (AlN), silicon nitride (Si3N4) etc. the particles of inorganic material such as nitride (inorganic matter).It addition, as inorganic particle, the composite inorganic composition granule such as prepared from foregoing illustrative inorganic matter can be listed, specifically, can list the composite inorganic oxide particle (specifically, glass particle etc.) prepared from oxide.
As the organic material of organic granular, such as propylene resin, phenylethylene resin series, acrylicstyrene system resin, silicon-type resin, polycarbonate-based resin, benzoguanamine system resin, polyolefin-based resins, polyester system resin, polyamide series resin, polyimides system resin etc. can be listed.
Filler can be used singly or in combination.
For the content ratio of filler, it is more than such as 1 mass % relative to sealing resin composition, more than preferably 3 mass %, it addition, below e.g. 80 mass %, below preferably 75 mass %.
As fluorophor, the red-emitting phosphors etc. that the yellow fluorophor that blue light such as can be converted to sodium yellow can be listed, blue light can be converted to red light.
As yellow fluorophor, (Ba, Sr, Ca) can be listed such as2SiO4；Eu, (Sr, Ba)2SiO4: silicate phosphor, the such as Y such as Eu (barium orthosilicate (BOS))3Al5O12: Ce (YAG (yttrium-aluminium-garnet): Ce), Tb3Al3O12: Ce) etc. Ce (TAG (terbium aluminium garnet): there is the nitrogen oxides fluorophor etc. such as the carbuncle type fluorophor of carbuncle type crystal structure, such as Ca-α-SiAlON.
As red-emitting phosphors, such as CaAlSiN can be listed3: Eu, CaSiN2: the nitride phosphors etc. such as Eu.
As the shape of fluorophor, the most spherical, tabular, needle-like etc. can be listed.
More than the meansigma methods of the greatest length of fluorophor (for spherical situation, be mean diameter) e.g. 0.1 μm, more than preferably 1 μm, it addition, below e.g. 200 μm, below preferably 100 μm.
Fluorophor can be used singly or in combination.
For the mixing ratio of fluorophor, it is more than such as 0.1 mass % relative to sealing resin composition, more than preferably 0.5 mass %, below e.g. 90 mass %, below preferably 80 mass %.
In order to prepare sealant 43, the filler and the fluorophor that such as by above-mentioned sealing resin and select cooperation as required coordinate, and prepare the varnish of sealing resin composition, it follows that this varnish is coated on the upper surface of stripping film 42.Thus, the film of sealing resin composition is formed.It follows that in the case of sealing resin is thermosetting resin, make the film of sealing resin composition realize B-stage.Specifically, film is heated.Thus, sealant 43 it is prepared for.
Shearing store elastic modulus G of 80 DEG C of sealant 43 ' e.g. more than 3Pa, preferably more than 12Pa, it addition, e.g. below 140Pa, preferably below 70Pa.Shearing store elastic modulus G of 80 DEG C of sealant 43 ' it is measured from by carrying out dynamic viscoelastic under conditions of frequency 1Hz, programming rate 20 DEG C/min, temperature range 20 DEG C～150 DEG C.
Sealant 43 is sized to, and the volume V1 that the volume V0 of sealant 43 deducts the volume of the stripping film 42 that can be housed in the 1st space 10 and the volume of optical semiconductor 46 and obtains with the volume from the 1st space 10 is identical or more than volume V1.Specifically, V0 is such as more than the 100% of V1, more than the 105% of more than the 102% of preferably V1, more preferably V1, it addition, less than the 120% of e.g. V1.
Specifically, the thickness of sealant 43 is set to thickness that is identical with the thickness of frame component 1 or that be thicker than frame component 1, specifically, be frame component 1 thickness such as more than 100%, preferably more than the 102% of the thickness of frame component 1, more preferably more than the 105% of the thickness of frame component 1, it addition, e.g. frame component 1 thickness less than 150%.More than the thickness of sealant 43 e.g. 50 μm, more than preferably 200 μm, it addition, below e.g. 2000 μm.
As it is shown on figure 3, sealant 43 is sized to the upper surface exposure that sealant 43 makes the peripheral end portion of stripping film 42.It is to say, sealant 43 be dimensioned so as to the size less than stripping film 42.Specifically, before and after sealant 43, direction length and left and right directions length are set to be shorter than direction length and left and right directions length before and after stripping film 42 respectively.
It addition, the volume of sealant 43 is set to such as 100 more than volume % of the open volume in the 1st space 10, preferably 102 more than volume %, it addition, 110 below volume % of the open volume in the e.g. the 1st space 10, preferably 107 below volume %.Additionally, the volume of sealant 43 is set to, (the 1st space 10 is buried from the volume of the 1st space 10 remaining encapsulant α, and then flow to the volume of encapsulant α of outside) more than the such as 0 volume % of open volume (open volume of front space 55 and the total measurement (volume) of the open volume of rear space 56) in the 3rd space 25, preferably 40 more than volume % of the open volume in the 3rd space 25, additionally, open volume 100 below the volume % in the e.g. the 3rd space 25, preferably 80 below volume %.
As long as the volume of sealant 43 fills more than above-mentioned lower limit relative to the open volume in the 3rd space 25, it becomes possible to suppression produces space and/or concavo-convex in the 1st space 10.As long as the volume of sealant 43 is filled less than the above-mentioned upper limit relative to the open volume in the 3rd space 25, encapsulant just can be suppressed to spill (outflow) outside frame component 1, the thickness making sealant 43 is stable, and then, it is possible to prevent because of the above-mentioned pollution spilling the fixture to surrounding that (outflow) causes.
More than the thickness of diaphragm seal 41 e.g. 51 μm, more than preferably 201 μm, it addition, below e.g. 3000 μm, below preferably 1000 μm.
Members sheet 49 includes optical semiconductor 46 and the support plate 45 of the lower surface being configured at optical semiconductor 46.Preferably, members sheet 49 is only made up of optical semiconductor 46 and support plate 45.
The optical elements such as optical semiconductor 46 e.g. LED or LD.Optical semiconductor 46 is formed along the substantially writing board shape of fore-and-aft direction and left and right directions.It addition, optical semiconductor 46 is in overlooking substantially rectangular shape, it is formed as a generally rectangular shape along above-below direction and the cross sectional shape of fore-and-aft direction and the cross sectional shape along above-below direction and left and right directions.More than thickness (above-below direction length) e.g. 0.1 μm of optical semiconductor 46, more than preferably 0.2 μm, it addition, below e.g. 500 μm, below preferably 200 μm.Optical semiconductor 46 is spaced apart compartment of terrain along fore-and-aft direction and left and right directions and is configured with multiple.Multiple optical semiconductor 46 respective fore-and-aft direction length and left and right directions length are set properly.The adjacent interval between optical semiconductor 46 is set properly.
Support plate 45 be in order to utilize diaphragm seal 41 to cover and encapsulating optical semiconductor element 46, obtain encapsulating optical semiconductor element 47 after, until peel seal optical semiconductor 47 period protection encapsulating optical semiconductor element 47 optical semiconductor 46 (with reference to Fig. 6 A) and so that the back side (lower surface in Fig. 6 A) of the optical semiconductor 46 in encapsulating optical semiconductor element 47 can be pasted in the way of peeling off.It is to say, support plate 45 is laminated in the back side of optical semiconductor 46 in the way of covering the back side (lower surface in Fig. 6 A) of optical semiconductor 46.
Support plate 45 is formed by the material as above-mentioned stripping film 42.It addition, support plate 45 can be formed by the hot stripping film that encapsulating optical semiconductor element 47 can be easily peeled off by heating.And then, it is possible at the surface configuration pressure-sensitive adhesive layer of support plate 45.
As shown in Fig. 3 and Fig. 4 B, support plate 45 is sized to such as include the size in the 1st space 11, space the 10 and the 2nd when overlooking.It is to say, support plate 45 is set to the Zhou Duanyuan of such as support plate 45 is contained in the size in the 2nd frame portion 3.Or, support plate 45 also be able to the size that is set as comprising the circumference of frame component 1.It addition, support plate 45 also is able to be set as such as being contained in lower clamp 61 and the size of upper fixture 71.
More than the thickness of support plate 45 e.g. 10 μm, more than preferably 50 μm, it addition, below e.g. 1000 μm, below preferably 100 μm.
It follows that in the method, frame component 1 is configured at the upper surface (frame component is configured at an example of the operation of upside relative to the upper surface of lower plate) of lower clamp 61.
It follows that in the method, as shown in Figure 4 B, diaphragm seal 41 is configured at the upper surface (sealant is configured at an example of the operation of upside relative to the upper surface of lower plate) of frame component 1.
Specifically, while stripping film 42 covers (closing) the 1st space the 11 and the 1st, space the 10, the 2nd groove 8, the upper surface of frame component 1 in the way of sealant 43 is positioned at the 1st space 10 when projecting by diaphragm seal 41, it is configured at along above-below direction.Specifically, with reference to Fig. 3, in the way of 4 corners of stripping film 42 are overlapping with 4 telltale marks 64 when projecting along thickness direction by stripping film 42, diaphragm seal 41 is configured at the upper surface of frame component 1.Additionally, sealant 43 is to be configured at stripping film 42 in the way of upside.
Sealant 43 by be configured at when projecting along above-below direction the 1st space 10 central part and not overlapping with the peripheral end portion in the 1st space 10 in the way of configure.On the other hand, stripping film 42 configures in the way of closing the upper end in both the 1st spaces 11, space the 10 and the 2nd.
It follows that in the method, members sheet 49 is configured at the lower surface (optical semiconductor is configured at an example of the operation of downside relative to the lower surface of upper plate) of upper fixture 71.
Specifically, by support plate 45 fixing (stickup) in the lower surface of upper fixture 71.Optical semiconductor 46 is to be configured at support plate 45 in the way of downside.
Afterwards, in the method, upper fixture 71 is oppositely disposed relative to lower clamp 61.
Specifically, the upper end of the 1st pin 62 is inserted hole 72, upper location.Then, the part of the surrounding being positioned at hole, location 72 of upper fixture 71 is supported by spring 63.
Now, the interior ora terminalis in hole, lower location 65 and right recess 35 and left recess 36 configure in the way of overlapping in the vertical direction.
Thus, when optical semiconductor 46, support plate 45 and diaphragm seal 41 are clipped between lower clamp 61 and upper fixture 71, and when optical semiconductor 46 and sealant 43 and not in contact with and when being oppositely disposed, they are placed in lower clamp 61 and upper fixture 71.It addition, upper fixture 71 is laid relative to lower clamp 61 in the way of optical semiconductor 46 is contained in sealant 43 when projecting along above-below direction.
Afterwards, in the method, lower clamp 61 and upper fixture 71 are placed in forcing press 90.
Forcing press 90 is parallel flat forcing press, has lower increased pressure board 91 and is configured at the upside of lower increased pressure board 91 and is configured to the upper increased pressure board 92 that can pressurize to downside relative to lower increased pressure board 91.
In order to lower clamp 61 and upper fixture 71 being placed in forcing press 90, specifically, the lower surface of lower clamp 61 is arranged at the upper surface of the lower increased pressure board 91 of forcing press 90.Thus, lower clamp 61 and upper fixture 71 are configured between lower increased pressure board 91 and upper increased pressure board 92.
Afterwards, as shown in Figure 5A and 5B, by upper increased pressure board 92 is pressurizeed relative to lower increased pressure board 91, sealant 43 is pressurizeed, utilize sealant 43 to cover and encapsulating optical semiconductor element 46 (sealant pressurization is utilized an example of the operation of sealant encapsulating optical semiconductor element).
Now, the lower surface of the peripheral end portion of support plate 45 is subject to the pressure from upper increased pressure board 92 downward for sealant 43 side pressure to be entered, until contacting with the stripping film 42 of the upper surface being configured at frame component 1.
So, sealant 43 covers the lower surface of optical semiconductor 46 and side and encapsulating optical semiconductor element 46 in the 1st space 10.Accompanying with this, the stripping film 42 of sealant 43 and the downside that is configured at sealant 43 falls in the 1st space 10.
It follows that the remaining encapsulant α for the 1st space 10 of sealant 43 is preferentially moved to the 2nd space 11 by the 1st groove 8, it is accommodated in the 2nd space 11.Remaining encapsulant α makes stripping film 42 fall in (under push away) the 1st groove 8 when by 1 groove 8, and by, after the 1st groove 8, being accommodated in front space 55 and rear space 56.
Pressurization further, remaining encapsulant α crosses the 1st frame portion 2 and is accommodated in 4 the 2nd spaces 11.It is to say, remaining encapsulant α crosses the 1st front portion 21, the 1st rear portion 22, the 1st right part 23 and the 1st left part 24 respectively and is accommodated in front space 55, rear space 56, right space 57 and left space 58 respectively.
Afterwards, upper increased pressure board 92 is pulled up relative to lower increased pressure board 91.Thus, the pressurization of pressure relief machine 90.
Thus, can obtain along the state that above-below direction clips there is sealant 43 and the encapsulating optical semiconductor element 47 by the hermetically sealed multiple optical semiconductors 46 of sealant 43 being stripped sheet 42 and support plate 45.
Afterwards, encapsulating optical semiconductor element 47, stripping film 42 and support plate 45 are reclaimed from lower clamp 61, upper fixture 71 and frame component 1, in the case of sealant 43 is containing thermosetting resin, encapsulating optical semiconductor element 47 is heated and makes sealant 43 be fully cured (C-stage).
Afterwards, stripping film 42 is peeled off from encapsulating optical semiconductor element 47, afterwards, remove remaining encapsulant α.Meanwhile, as shown in Figure 6A, by encapsulating optical semiconductor element 47 be supported on support plate 45 state and with in the way of respectively corresponding with multiple optical semiconductors 46 by encapsulating optical semiconductor element 47 singualtion.
Afterwards, as shown in Figure 6B, the encapsulating optical semiconductor element 47 after singualtion is installed on substrate 50.Specifically, as shown in the arrow of Fig. 6 A, encapsulating optical semiconductor element 47 is peeled from support plate 45, it follows that encapsulating optical semiconductor element 47 is installed on substrate 50.Specifically, optical semiconductor 46 is flip-chip mounted relative to substrate 50.
Substrate 50 is in the substantially rectangular writing board shape extended along fore-and-aft direction and left and right directions, e.g. insulated substrate.It addition, substrate 50 has the terminal (not shown) being configured at upper surface.
Thus, the optical semiconductor device 48 of the encapsulating optical semiconductor element 47 including substrate 50 and be installed on substrate 50 can be obtained.Preferably, the sealant 43 of optical semiconductor device 48 only by substrate 50, is installed on substrate 50 optical semiconductor 46, covering encapsulating optical semiconductor element 46 is constituted.
3. the action effect of the 1st embodiment
Use this frame component 1, in the 1st space 10 in configuration sealant 43 and optical semiconductor 46, afterwards, when they pressurizes, it is possible to the remaining encapsulant α outside utilizing the 2nd space 11 to receive the part of formation sealant 43 in encapsulant.
Therefore, it is possible to prevent the component of the surrounding in the 2nd space 11, specifically, the lower increased pressure board 91 of forcing press 90 and the pollution of upper increased pressure board 92.
In this frame component 1, in the case of the 1st space 10 is filled with by encapsulant, it is possible to make the remaining encapsulant α in the 1st space 10 be accommodated in the 2nd space 11 by the 1st groove 8.Therefore, it is possible to utilize the 1st groove 8 to be accommodated in swimmingly in the 2nd space 11 by remaining encapsulant α.
Additionally, in this frame component 1, can utilize the 2nd space 11 be divided into each multiple spaces i.e., front space 55, rear space 56, right space 57, left space 58 receive remaining encapsulant α respectively, with this, it is possible to be reliably prevented the pollution of the component of the surrounding of frame component 1.
In this frame component 1, in the case of the 1st space 10 is filled with by encapsulant, it is possible to make the remaining encapsulant α in the 1st space 10 first pass through the 1st groove 8 and preferentially be accommodated in the 3rd space 25.And then, remaining encapsulant α can cross the 1st frame portion 2 and be accommodated in the 3rd space 26, space the 25 and the 4th.
Use the manufacture method of above-mentioned encapsulating optical semiconductor element 47, in the operation utilizing sealant 43 encapsulating optical semiconductor element 46, the 2nd space 11 is utilized to receive remaining encapsulant α, therefore, it is possible to prevent lower increased pressure board 91 and the pollution of upper increased pressure board 92 of the component of the surrounding of frame component 1, specifically forcing press 90.
4. variation
In variation, the component as the 1st above-mentioned embodiment and operation are marked identical labelling referring to the drawings and description is omitted.
In this variation, as shown in Fig. 7, Fig. 8 A and Fig. 8 B, upper fixture 71 has engaging portion 73, alignment the 1st protuberance 76 and hole 77.Sheet configuring area 70 is located at around in engaging portion 73, alignment the 1st protuberance 76 and hole 77.
As shown in Fig. 7 A and Figure 10 A, engaging portion 73 is respectively provided with 1 in each end at the both ends, left and right of the lower surface of upper fixture 71.Two engaging portions 73 are configured at identical position along left and right directions when projecting.Two engaging portions 73 are respectively provided with the substantially rectangular plate shape that the fore-and-aft direction when looking up is longer.As shown in Figure 10 A, two engaging portions 73 are respectively provided with notch part 74 and claw 75.
Notch part 74 is the part of the upper end excision of the inner end by engaging portion 73.Thus, engaging portion 73 has positive section view substantially L-shaped.
Claw 75 is formed by notch part 74, be in engaging portion 73 towards on the prominent protuberance of the central authorities of fixture 71.It addition, claw 75 is formed by notch part 74, therefore, the lower surface with upper fixture 71 is formed at spaced intervals.
In engaging portion 73, utilize claw 75 to support left and right two ora terminalis of support plate 45 while being housed in by left and right two ora terminalis of support plate 45 in notch part 74, prevent support plate 45 from coming off downwards.
As shown in Fig. 7 A and Fig. 9 A, alignment the 1st protuberance 76 is provided with multiple (multiple) in the rearward end of the lower surface of upper fixture 71.Multiple alignment the 1st protuberances 76 are spaced apart compartment of terrain relative configuration along left and right directions.The substantially rectangular plate shape that when multiple alignment the 1st protuberances 76 are respectively provided with vertical view, left and right directions is longer.Multiple alignment the 1st protuberances 76 are respectively provided with the shape that the lower surface from upper fixture 71 highlights downward.The front end face alignment of multiple alignment the 1st protuberances 76, specifically, the front end face of multiple alignment the 1st protuberances 76 configures in the way of being in identical position when projecting along left and right directions.
Hole 77 is provided with multiple (two) in the leading section of upper fixture 71.Multiple (two) hole 77 is spaced apart compartment of terrain relative configuration along left and right directions.Multiple holes 77 are arranged accordingly with alignment the 1st protuberance 76.Specifically, two holes 77 are respectively arranged at the position overlapping with alignment the 1st protuberance 76 laying respectively at both ends, left and right when projecting along fore-and-aft direction.Multiple holes 77 are respectively provided with vertical view circular shape.Multiple holes 77 are respectively provided with the thickness direction along upper fixture 71 and run through the shape of upper fixture 71.Multiple holes 77 are respectively provided with hole 79 and lower opening 80.
The top in hole 77 is located in upper hole 79.Upper hole 79 has the hole shape extended along thickness direction.Upper hole 79 has the size of the head 67 (aftermentioned) that can house the 2nd pin 78.
Lower opening 80 is located at the bottom in hole 77, and specifically, the downside in hole 79 is located in lower opening 80 and upper hole 79 continuously.Lower opening 80 extends along thickness direction, has the hole shape relative to upper hole 79 undergauge.Lower opening 80 has the size in the bar portion 66 (aftermentioned) that can house the 2nd pin 78.
In method in this variation, the operation of the lower surface that members sheet 49 is configured at upper fixture 71 is implemented as described below.
I.e., first, as shown in Fig. 9 A and Figure 10 A, support plate 45 is configured at the front of upper fixture 71.
It follows that as shown in the arrow of Fig. 9 A, Fig. 9 B and Figure 10 B, make support plate 45 move backward relative to the lower surface of upper fixture 71.Specifically, the upper surface making support plate 45 slides relative to the lower surface of upper fixture 71.
Support plate 45 is sized to corresponding with the configuration in engaging portion 73, alignment the 1st protuberance 76 and hole 77.Specifically, as shown in Fig. 7 and Fig. 9 A, before and after support plate 45, direction length L6 is set to the distance between front end face and the end edge of lower opening 80 of alignment the 1st protuberance 76 is that distance L5 is identical.As shown in Fig. 7 and Figure 10 B, length L7 that left and right directions length L8 of support plate 45 is set between the side facing notch part 74 in relative two engaging portions 73 is identical or is slightly smaller than this length L7 and is set greater than length L9 between the claw 75 in two engaging portions 73.
And, make support plate 45 move backward in the way of left and right two ora terminalis of support plate 45 is housed in notch part 74.Thus, claw 75 prevents support plate 45 from coming off downwards.
It follows that as shown in Figure 9 B, support plate 45 is made to slide until the end edge of support plate 45 contacts with the front end face of multiple alignment the 1st protuberances 76.After the end edge of support plate 45 contacts with the front end face of multiple alignment the 1st protuberances 76, as shown in Figure 9 C, the 2nd pin 78 is inserted in hole 77.
2nd pin 78 has the cross section shape in substantially T word.2nd pin 78 has the bar portion 66 extended along above-below direction and is connected with the upper end in bar portion 66 and the head 67 that extends along direction, face (fore-and-aft direction and left and right directions).Head 67 has substantially circular plate shape.
While being housed in by head 67 in upper hole 79, lower opening 80 is run through in bar portion 66, and then, the bottom in bar portion 66 highlights downwards from lower opening 80.The bottom in bar portion 66 constitutes alignment the 2nd protuberance 68.Alignment the 2nd protuberance 68 is utilized to prevent support plate 45 from moving towards front.
It is to say, on this in fixture 71, as shown in Figure 10 B, utilize engaging portion 73 prevent support plate 45 from coming off and prevent the dislocation on the left and right directions of support plate 45.As shown in Figure 9 C, utilize dislocation that alignment the 1st protuberance 76 and alignment the 2nd protuberance 68 prevent before and after support plate 45 on direction that the position on direction before and after support plate 45 is directed at.
In this variation, when members sheet 49 is configured at fixture 71, utilizes engaging portion 73 that the left and right directions position of members sheet 49 is directed at and the claw 75 of engaging portion 73 can be utilized to prevent members sheet 49 from coming off.It addition, can utilize alignment the 1st protuberance 76 and alignment the 2nd protuberance 68 that position, direction before and after members sheet 49 is directed at.Thereby, it is possible to members sheet 49 is fixed exactly relative to upper fixture 71.
In the 1st embodiment, frame component 1 is being configured in the operation of fixture 71, as it is shown on figure 3, be configured with 1 members sheet 49 for 1 upper fixture 71.But, in another variation, as shown in figure 11, it is configured with multiple, specifically 4 members sheets 49 for 1 upper fixture 71.
As shown in figs. 11 and 12, upper fixture 71 has 4 sheet configuring areas 70.4 sheet configuring areas 70 are arranged with front and back 2 row, left and right 2 row.Upper fixture 71 has engaging portion 73, alignment the 1st protuberance 76 and hole 77 corresponding with 4 sheet configuring areas 70 respectively.
Rear side at the sheet configuring area 70 being positioned at prostatitis is configured with alignment the 1st protuberance 76, configures porose 77 in the front side of this sheet configuring area 70.On the other hand, being configured with alignment the 1st protuberance 76 in the front side of the sheet configuring area 70 being positioned at rank rear, the rear side at this sheet configuring area 70 configures porose 77.Alignment 1st protuberance 76 corresponding with the sheet configuring area 70 being positioned at prostatitis and corresponding with the sheet configuring area 70 being positioned at rank rear be directed at direction central part before and after the 1st protuberance 76 is arranged in upper fixture 71 relative to one another along fore-and-aft direction.On the other hand, corresponding with the sheet configuring area 70 being positioned at prostatitis hole 77 and the hole 77 corresponding with the sheet configuring area 70 being positioned at rank rear are respectively arranged at each end at both ends before and after upper fixture 71.
It is configured with engaging portion 73 4 respective left and right sides of sheet configuring area 70.The engaging portion 73 configured in the left side of the sheet configuring area 70 being positioned at right row and the engaging portion 73 configured on the right side of the sheet configuring area 70 being positioned at left column are arranged in the left and right directions central part of fixture 71 relative to one another along left and right directions.On the other hand, the engaging portion 73 configured on the right side of the sheet configuring area 70 being positioned at right row and the engaging portion 73 configured in the left side of the sheet configuring area 70 being positioned at left column are respectively arranged at each end at the both ends, left and right of fixture 71.
In this variation, members sheet 49 is being configured in the operation of fixture 71, as shown in figure 11, each of 4 members sheets 49 is being configured relative to each of 4 sheet configuring areas 70.
It addition, frame component 1 is being configured in the operation of lower clamp 61,4 frame components 1 to be configured at by 4 frame components 1 upper surface of lower clamp 61 in the way of corresponding with 4 members sheets 49 and 4 support plates 45.
It addition, be configured at by diaphragm seal 41 in the operation of frame component 1,4 diaphragm seals 41 are configured in the way of corresponding with 4 frame components 1 upper surface of 4 frame components 1.
Use this variation, 1 lower clamp 61 and 1 upper fixture 71 is utilized to clip multiple (4) members sheet 49, multiple (4) frame component 1 and multiple (4) diaphragm seal 41 and carry out encapsulating optical semiconductor element 46, therefore (even members sheet 49, frame component 1 and/or diaphragm seal 41 are the most small-sized, also) a lot of optical semiconductor 46 can be sealed efficiently, manufacture multiple encapsulating optical semiconductor element 47 efficiently.
Additionally, in above-mentioned variation, as shown in figs. 11 and 12, upper fixture 71 is configured with 4 sheet configuring areas 70 with front and back 2 row, left and right 2 row, but its quantity is not particularly limited, for instance, it is possible to configure 2 × n sheet configuring area 70 with front and back 2 row, left and right n row (n is integer), but to this and not shown.
In the 1st embodiment, as in figure 2 it is shown, the 1st frame portion 2 has the 1st groove 8.But, as shown in figure 13, it is also possible to not there is the 1st groove 8 ground and constitute the 1st frame portion 2.
1st space 10 and the 2nd space 11 are divided by the 1st frame portion 2 and the connection between the 1st space 11, space the 10 and the 2nd are blocked.
Relative to lower increased pressure board 91 on increased pressure board 92 pressurize time, remaining encapsulant α crosses the 1st frame portion 2 from the 1st space 10, enters the 2nd space 11 and is accommodated in the 2nd space 11.
It addition, as shown in figure 14, the 1st groove 8 is in addition to being arranged at the 1st anterior 21 and the 1st rear portion 22, it is also possible to be arranged at the 1st right part the 23 and the 1st left part 24.It is to say, the 1st rear portion the 22, the 1st, front portion the 21, the 1st right part the 23 and the 1st left part 24 is respectively provided with two the 1st grooves 8.
Two the 1st grooves 8 in 1st right part 23 are right grooves 83.
Right groove 83 is located at the top at both ends before and after the 1st right part 23.Two right grooves 83 are the grooving (groove) that the upper surface from the 1st right part 23 starts to be resected to thickness direction (above-below direction) midway respectively.Multiple right grooves 83 are respectively provided with side section view rectangular shape.Two right grooves 83 respectively when overlooking along left and right directions across the 1st right part 23, its right part arrives right space 57, and its left part arrives the 1st space 10.It addition, two right respective bottom surfaces of groove 83 be positioned at than the 1st right part 23 when projecting along fore-and-aft direction before and after direction central part, right before the upper surface of this three of linking part 53 is low behind linking part 51 and the right side position.
Two the 1st grooves 8 in 1st left part 24 are left grooves 84.
Left groove 84 is relative to being configured symmetrically in line by the imaginary line LB of the center of gravity (center in the 2nd space 11) of frame component 1 and right groove 83 along fore-and-aft direction and being formed.
In the case of frame component 1 shown in Figure 14, it is possible to make remaining encapsulant α from the 2nd space 11 by right groove 83 and left groove 84, respectively enter right space 57 and left space 58 and be accommodated in right space 57 and left space 58.
As in figure 2 it is shown, in the 1st embodiment, the 1st groove 8 is located at both ends, left and right and the both ends, left and right at the 1st rear portion 22 of the 1st front portion 21.But, as shown in figure 15, it is also possible to the 1st groove 8 is located at left and right directions central part and the left and right directions central part at the 1st rear portion 22 of the 1st front portion 21.
It is to say, the 1st groove 8 has 1 front groove 81 and 1 pit 82.
Front groove 81 is provided with 1 for the 1st front portion 21.
Pit 82 is provided with 1 for the 1st rear portion 22.
It addition, front groove 81 and the respective quantity of pit 82 are not particularly limited, although not shown, but more than 3 such as can also be respectively.
Additionally, as shown in Figure 2, in the 1st embodiment, the width W1 of the width in the 3rd space 25, specifically the front space 55 and width W2 of rear space 56 is set as identical with the width W4 of the width W3 of the width in the 4th space 26, specifically right space 57 and left space 58.But, as shown in figure 16, it is possible to the width (the width W3 of right space 57 and the width W4 of left space 58) in the 4th space 26 is set to narrower than the width in the 3rd space 25 (the width W1 of front space 55 and the width W2 of rear space 56).
Left and right directions length (width) W3 of right space 57 and left and right directions length (width) W4 of left space 58 is less than such as the 100% of W1 and W2, preferably less than 75%, more preferably less than 50%, additionally, e.g. more than 10%, specifically, e.g. below 20mm, preferably below 10mm, more preferably below 2mm, it addition, e.g. more than 0.5mm.
It addition, the aperture area in the 4th space 26 (right space 57 and left space 58) is set less than the aperture area in the 3rd space 25 (front space 55 and rear space 56).
And, in the frame component 1 shown in Figure 16, multiple 2nd spaces 11 have the 3rd bigger space 25 of aperture area and less the 4th space 26 of aperture area, therefore, compared with the frame component (the 1st embodiment, reference Fig. 2) in the 3rd space 26, space the 25 and the 4th identical with having aperture area, it is possible to seek the miniaturization of frame component 1.
And then, the aperture area in the 3rd space 25 is more than the aperture area in the 4th space 26, therefore, even if preferentially receiving remaining encapsulant α, it is also possible to allow sufficiently storage.
It addition, prepared the sealing resin composition of such as B-stage as sealant 43, but it also is able to film not heated, directly using the film of the sealing resin composition in A stage as sealant 43.In this case, the viscosity of the sealing resin composition in A stage e.g. 1, more than 000mPa s, preferably 3, more than 000mPa s, more preferably 5, more than 000mPa s, it addition, e.g. 1,000, below 000mPa s, preferably 500, below 000mPa s, more preferably 200, below 000mPa s.Additionally, the temperature that the viscosity of the sealing resin composition in A stage is the sealing resin composition by the A stage is adjusted to 25 DEG C, uses E type cone viscosimeter to measure.
Additionally, in the 1st embodiment, first, as shown in Fig. 3, Fig. 4 A and Fig. 4 B, preparation has support plate 45, is supported by the members sheet 49 of the optical semiconductor 46 of plate 45 supporting, next, as shown in Figure 5A and 5B, use frame component 1, lower clamp 61 and upper fixture 71, utilize sealant 43 to cover and encapsulating optical semiconductor element 46, as shown in Figure 6A, obtain encapsulating optical semiconductor element 47, afterwards, as shown in Figure 6B, encapsulating optical semiconductor element 47 is installed on substrate 50, it is thus achieved that optical semiconductor device 48.But, as with reference to Fig. 3 and Fig. 4 B, it is also possible to be, in advance optical semiconductor 46 is installed on substrate 95, afterwards, uses frame component 1, lower clamp 61 and upper fixture 71, utilize sealant 43 to cover and encapsulating optical semiconductor element 46, thus obtain optical semiconductor device 48.
In the 1st embodiment, as shown in Figure 4 B, members sheet 49 is configured at the lower surface of upper fixture 71, but as long as being the downside of the lower surface at upper fixture 71, it is not particularly limited, such as, it is also possible in the way of the lower surface of multiple optical semiconductors 46 with the upper surface of sealant 43, members sheet 49 is placed on diaphragm seal 41, by members sheet 49 to lay in the way of the lower surface interval of upper fixture 71, but to this and not shown.
＜ the 2nd embodiment ＞
In the 2nd embodiment, the component as the 1st above-mentioned embodiment and operation are marked identical labelling referring to the drawings and description is omitted.
In the 1st embodiment, as in figure 2 it is shown, be provided with the 1st groove 8 connected in the 1st space 25, space the 10 and the 3rd.But, in the 2nd embodiment, as shown in figure 17, the 2nd groove 85 that two the 2nd spaces 11 adjacent one another are are connected by the 1st groove 8 and being provided with is substituted.
In fig. 17, the 2nd groove 85 is arranged at linking part 4.Specifically, the 2nd groove 85 have be arranged at the right side before linking part 51 right before groove 86, be arranged at left front linking part 52 left front groove 87, be arranged at the right side after the right pit 88 of linking part 53 and be arranged at the left back groove 89 of left back linking part 54.
Before right, groove 86 is the grooving (groove) that the upper surface of linking part 51 starts to be resected to above-below direction midway before the right side.Before right, groove 86 extends to rear side along with going towards right side from the right part of front space 55, arrives the leading section of right space 57.Thus, front space 55 (the 3rd space 25) and right space 57 (the 4th space 26) are connected by right front groove 86.
Left front groove 87 is the grooving (groove) that the upper surface from left front linking part 52 starts to be resected to above-below direction midway.Left front groove 87 extends to rear side along with going towards a left side from the left part of front space 55, arrives the leading section of left space 58.Thus, front space 55 (the 3rd space 25) and left space 58 (the 4th space 26) are connected by left front groove 87.
Right pit 88 is the grooving (groove) that the upper surface of linking part 53 starts to be resected to above-below direction midway behind the right side.Right pit 88, along with going towards the right side from the right part of rear space 56 and forward side extension, arrives the rearward end of right space 57.Thus, rear space 56 (the 3rd space 25) and right space 57 (the 4th space 26) are connected by right front groove 86.
Left back groove 89 is the grooving (groove) that the upper surface from left back linking part 54 starts to be resected to above-below direction midway.Left back groove 89, along with going towards a left side from the left part of rear space 56 and forward side extension, arrives the rearward end of left space 58.Thus, rear space 56 (the 3rd space 25) and left space 58 (the 4th space 26) are connected by left back groove 89.
Thus, multiple 2nd spaces 11 communicate with each other via multiple 2nd grooves 85.
Using this frame component 1 to manufacture in the method for encapsulating optical semiconductor element 47, as shown in figure 18b, members sheet 49 and diaphragm seal 41 are being placed in lower clamp 61 and upper fixture 71, and they are placed in forcing press 90.
Afterwards, as shown in figure 18b, by upper increased pressure board 92 being pressurizeed relative to lower increased pressure board 91, sealant 43 is pressurizeed, utilize sealant 43 to cover and encapsulating optical semiconductor element 46.
Then, remaining encapsulant α crosses the 1st frame portion 2 from the 1st space 10 and is accommodated in the 2nd space 11.Specifically, remaining encapsulant α crosses the 1st front portion 21, the 1st rear portion 22, the 1st right part 23 and the 1st left part 24 and is accommodated in front space 55, rear space 56, right space 57 and left space 58 respectively.
It addition, the remaining encapsulant α of any one in the 3rd space 26, space the 25 and the 4th is by the 2nd groove 85, moves to another one, and be incorporated in another one.
＜ the 3rd embodiment ＞
In the 3rd embodiment, the component as the 1st above-mentioned embodiment and the 2nd embodiment and operation marking identical labelling referring to the drawings, description is omitted.
In the 1st embodiment, as in figure 2 it is shown, be provided with the 1st groove 8 at frame component 1.It addition, in the 2nd embodiment, as shown in figure 17, be provided with the 2nd groove 85 at frame component 1.But, in the 3rd embodiment, as shown in figure 19, it is provided with both the 1st groove the 8 and the 2nd grooves 85 at frame component 1.
As shown in figure 19, right front groove 86 extends from the right part of front space 55 to rear side, and arrives the leading section of right space 57.Left front groove 87 extends from the left part of front space 55 to rear side, and arrives the leading section of left space 58.
Right pit 88 extends from the right part forward side of rear space 56, and arrives the rearward end of right space 57.Left back groove 89 extends from the left part forward side of rear space 56 and arrives the rearward end of left space 58.
Thus, the 1st space 10 connects with the 4th space 26 via the 3rd space 25.Specifically, the 1st space 10 connects with two the 4th spaces 26 via two front grooves 81, front space 55, right front groove 86 and left front groove 87.It addition, the 1st space 10 connects with two the 4th spaces 26 via two pits 82, rear space 56, right pit 88 and left back groove 89.
In the 3rd embodiment, sealant 43 and optical semiconductor 46 are arranged in the 1st space 10, afterwards, make when they are pressurizeed remaining encapsulant α (with reference to Fig. 5 A and Figure 12 B) first pass through front groove 81 and pit 82, the 3rd space 25 receive.Afterwards, when the 3rd space 25 is filled with by remaining encapsulant α, remaining encapsulant α, by right front groove 86, left front groove 87, right pit 88 and left back groove 89, is received less than the 4th space 26 of the aperture area in the 3rd space 25 by aperture area.
Therefore, in the 3rd embodiment, it is possible to by remaining encapsulant α according to the 3rd space 26, space the 25 and the 4th sequential stages receive.
＜ variation ＞
It also is able to appropriately combined to the 1st embodiment～the 3rd embodiment.
Additionally, the embodiment illustrated as the present invention provides described above, but these are only to illustrate, and being defined property is not explained.The variation of the obvious present invention is included in the scope of described claims to those skilled in the art.

Claims (11)

1. a frame component, it carrys out encapsulating optical semiconductor element for utilizing the sealant formed by encapsulant, it is characterised in that
This frame component includes:
1st frame portion, it is constituted in the way of forming the 1st space；
2nd frame portion, it configures in the way of forming the 2nd space in the outside in described 1st frame portion and described 1st frame portion interval between itself and described 1st frame portion, and configures in the way of surrounding described 1st frame portion；
Linking part, it is for linking up described 1st frame portion and described 2nd frame portion,
Described 1st space configures for described sealant and described optical semiconductor,
Described 2nd space remaining part outside the part receiving the described sealant that the formation in described encapsulant seals described optical semiconductor.
Frame component the most according to claim 1, it is characterised in that
Described 1st frame portion has the 1st groove connected in described 1st space with described 2nd space.
Frame component the most according to claim 1, it is characterised in that
Described 2nd space is provided with multiple,
Described linking part has the 2nd groove of described 2nd space connection adjacent one another are.
4. according to the frame component described in Claims 2 or 3, it is characterised in that
Described linking part is provided with multiple,
Described 2nd space is divided into multiple by multiple described linking parts.
Frame component the most according to claim 4, it is characterised in that
Multiple described 2nd spaces have the 3rd space and aperture area the 4th space less than the aperture area in described 3rd space.
Frame component the most according to claim 2, it is characterised in that
Described linking part is provided with multiple,
Described 2nd space is divided into multiple by multiple described linking parts,
Multiple described 2nd spaces have the 3rd space and aperture area the 4th space less than the aperture area in described 3rd space,
Described 1st space is connected by described 1st groove with described 3rd space.
Frame component the most according to claim 6, it is characterised in that
Described 2nd space is provided with multiple,
Described linking part has the 2nd groove of described 2nd space connection adjacent one another are.
Frame component the most according to claim 3, it is characterised in that
Described linking part is provided with multiple,
Described 2nd space is divided into multiple by multiple described linking parts,
Multiple described 2nd spaces have the 3rd space and aperture area the 4th space less than the aperture area in described 3rd space,
Described 3rd space is connected by described 2nd groove with described 4th space.
Frame component the most according to claim 8, it is characterised in that
Described 1st frame portion has the 1st groove connected in described 1st space with described 2nd space.
Frame component the most according to claim 9, it is characterised in that
Described 1st space is connected by described 1st groove with described 3rd space.
The manufacture method of 11. 1 kinds of encapsulating optical semiconductor elements, it is characterised in that
The manufacture method of this encapsulating optical semiconductor element includes following operation:
Preparing lower plate, upper plate and the frame component described in claim 1, wherein, this upper plate can be oppositely disposed with described lower plate at spaced intervals in the upside of described lower plate；
Described frame component is configured at upside relative to the upper surface of described lower plate；
It is configured at upside relative to the upper surface of described lower plate in the way of described sealant described sealant in time projecting along above-below direction is configured at described 1st space；
Described optical semiconductor is configured at downside relative to the lower surface of described upper plate；
Described upper plate is arranged as opposed in the upside of described lower plate with described lower plate in the way of optical semiconductor described when projecting along above-below direction is contained in described sealant；And
By described upper plate and described lower plate are pressurizeed, described sealant is pressurizeed and utilizes described sealant to seal described optical semiconductor,
Utilizing described sealant to seal in the operation of described optical semiconductor, the remaining part outside the part of the described sealant that the formation in described encapsulant seals described optical semiconductor is accommodated in described 2nd space.
CN201610045311.9A 2015-01-23 2016-01-22 Frame member and manufacturing method of sealed photosemiconductor element Pending CN105826446A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015011100 2015-01-23
JP2015-011100 2015-01-23
JP2015-243559 2015-12-14
JP2015243559A JP2016139791A (en) 2015-01-23 2015-12-14 Frame member and method of manufacturing sealed semiconductor element

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CN201610045311.9A Pending CN105826446A (en) 2015-01-23 2016-01-22 Frame member and manufacturing method of sealed photosemiconductor element

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114250433A (en) * 2020-09-22 2022-03-29 东莞令特电子有限公司 Masking tray assembly for arc spray applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114250433A (en) * 2020-09-22 2022-03-29 东莞令特电子有限公司 Masking tray assembly for arc spray applications

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JP2016139791A (en) 2016-08-04
TWM532655U (en) 2016-11-21
KR20160091273A (en) 2016-08-02
CN205542871U (en) 2016-08-31

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Application publication date: 20160803