CN105637334A - Phosphor-sheet evaluation method and manufacturing method - Google Patents

Phosphor-sheet evaluation method and manufacturing method Download PDF

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Publication number
CN105637334A
CN105637334A CN201480056881.7A CN201480056881A CN105637334A CN 105637334 A CN105637334 A CN 105637334A CN 201480056881 A CN201480056881 A CN 201480056881A CN 105637334 A CN105637334 A CN 105637334A
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Prior art keywords
fluid composition
phosphor plates
evaluation methodology
base material
composition
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Inventor
三谷宗久
藤井宏中
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Nitto Denko Corp
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Nitto Denko Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N2021/6491—Measuring fluorescence and transmission; Correcting inner filter effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/065—Integrating spheres
    • G01N2201/0655—Hemispheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Led Device Packages (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Luminescent Compositions (AREA)

Abstract

This phosphor-sheet evaluation method, a method for evaluating a phosphor sheet made from a liquid composition containing a phosphor and a resin, has a spacer layout step in which spacers are laid out on top of a substrate, an injection step in which the aforementioned liquid composition is injected inside the spacers to a prescribed height, and a measurement step in which the chromaticity of the liquid composition at said prescribed height is measured.

Description

The evaluation methodology of phosphor plates and manufacture method thereof
Technical field
The present invention relates to the evaluation methodology of phosphor plates and manufacture method thereof, in particular to evaluation methodology and the manufacture method thereof of the phosphor plates used in optical applications.
Background technology
So far, as the light-emitting device that can send high-octane light, it is known to white light semiconductor device.
White light semiconductor device such as possesses the optical semiconductor of light sending blueness and optical semiconductor is packaged and is converted to by blue light (wavelength) encapsulating material of light of yellow, realizes the luminescence of white by mixing blue and yellow etc.
Encapsulating material as this white light semiconductor device, for instance propose the case chip (for example, see patent documentation 1) being heating and curing by the resin combination containing organic siliconresin and fluorophor and obtain.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2013-140848 publication
Summary of the invention
The problem that invention to solve
But, in order to show good white, case chip requires that its chroma control has high precision.
Therefore, in order to show desired colourity, change raw material composition (content etc. of fluorophor) of case chip, the operation of the case chip repeatedly implementing making trial-production on one side the evaluation implementing its colourity. Then, determine to realize the optimum feed stock composition of desired colourity.
But, case chip is such as by coating base material by the compositions of the liquid containing fluorophor, then, utilizes heating etc. to make it solidify (being fully cured or semi-solid preparation) and obtain. Therefore, when trial-production, it is necessary to the curing process such as heating, or require time for Blister pack sheet. Further, owing to the case chip for trial-production is cured, therefore can produce to carry out rough sledding that is discarded or that need recycling to process.
It is an object of the invention to provide the manufacture method of the evaluation methodology of the phosphor plates of the colourity that can evaluate phosphor plates easily and phosphor plates.
For solving the scheme of problem
The evaluation methodology of the phosphor plates of the present invention is characterised by, it is the method evaluating the phosphor plates formed by the fluid composition containing fluorophor and resin, and described evaluation methodology possesses following operation: spacer arrangement operation, configuration space part on base material; Injection process, injects aforementioned liquid compositions until reaching specified altitude to the inner side of aforesaid spacer; And, measure operation, measure the colourity of the fluid composition of aforementioned specified altitude.
Additionally, the evaluation methodology of the phosphor plates for the present invention, desirably, aforementioned substrates possesses optical semiconductor on its surface, in injection process, injects aforementioned liquid compositions in the way of coating aforementioned optical semiconductor.
Additionally, the evaluation methodology of the phosphor plates for the present invention, desirably, after injection process, before aforementioned phosphors precipitates in fluid composition, implement aforementioned mensuration operation.
In addition, evaluation methodology for the phosphor plates of the present invention, desirably, aforementioned substrates is transparent base, measure before operation after injection process and be also equipped with covering arrangement step, by transparent cover by with the upper surface of the fluid composition of aforementioned specified altitude in the way of configure.
Additionally, the manufacture method of the phosphor plates of the present invention is characterised by, described manufacture method possesses following operation: evaluates operation, implements above-mentioned evaluation methodology; Determine operation, determine the composition of aforementioned liquid compositions based on aforementioned evaluation methodology; Preparation section, prepares fluid composition according to the composition of the fluid composition determined; And, formation process, aforementioned liquid compositions is formed as lamellar.
In addition, in the manufacture method of the phosphor plates of the present invention, desirably, aforementioned decision operation includes following operation: tentatively determine the composition of aforementioned liquid compositions based on aforementioned evaluation methodology, the fluid composition of the aforementioned preliminary decision of probe, determines the composition of aforementioned liquid compositions.
The effect of invention
The evaluation methodology of the phosphor plates of the present invention and manufacture method thereof can measure the colourity of phosphor plates in the compositions containing fluorophor and resin with liquid. Therefore, it can not need the curing process etc. of fluid composition, it is possible to easy and evaluation in short time or manufacture phosphor plates. Additionally, the material (compositions) for evaluation methodology can recycle, therefore yield rate is good.
Accompanying drawing explanation
[Fig. 1] Figure 1A��Fig. 1 C is the process chart (top view) of the 1st embodiment of the evaluation methodology of the phosphor plates illustrating the present invention, and Figure 1A illustrates base material preparatory process, and Figure 1B illustrates weir portion arrangement step, and Fig. 1 C illustrates injection process.
[Fig. 2] Fig. 2 A��Fig. 2 C is the A-A sectional view of the process chart of the evaluation methodology of Fig. 1, and Fig. 2 A illustrates that the sectional view corresponding to Figure 1A, Fig. 2 B illustrate the sectional view corresponding to Figure 1B, and Fig. 2 C illustrates the sectional view corresponding to Fig. 1 C.
[Fig. 3] Fig. 3 A��Fig. 3 E is the process chart (side view) of the 2nd embodiment of the evaluation methodology of the phosphor plates illustrating the present invention, Fig. 3 A illustrates base material preparatory process, Fig. 3 B illustrates spacer arrangement operation, Fig. 3 C illustrates injection process, Fig. 3 D illustrates covering arrangement step, and Fig. 3 E illustrates mensuration operation.
[Fig. 4] Fig. 4 A��Fig. 4 C is the process chart of an embodiment of the manufacture method of the phosphor plates illustrating the present invention, and Fig. 4 A illustrates demoulding base material preparatory process, and Fig. 4 B illustrates painting process, and Fig. 4 C illustrates sheet formation process.
[Fig. 5] Fig. 5 is the schematic diagram of the mensuration operation that the colourity in the 1st embodiment is described.
Detailed description of the invention
In Figure 1A��Fig. 1 C, for front side (side in the 1st direction) on the upside of paper, for rear side (opposite side in the 1st direction) on the downside of paper, for left side (side in the 2nd direction) on the left of paper, for right side (opposite side in the 2nd direction) on the right side of paper, with paper near the side of reader for upside the side of thickness direction (side in the 3rd direction), with paper away from the side of reader for downside the opposite side of thickness direction (opposite side in the 3rd direction). For the accompanying drawing in Fig. 2 A��Fig. 5, also it is as the criterion with the direction of Figure 1A��Fig. 1 C.
[evaluation methodology of phosphor plates]
(the 1st embodiment)
1st embodiment of the evaluation methodology of the phosphor plates in the present invention possesses base material preparatory process, confirmation operation, weir portion arrangement step, injection process, planarization process and measures operation.
First, as shown in Figure 1A and Fig. 2 A, prepare base material 1 (base material preparatory process).
Base material 1 is made up of insulated substrate, as shown in Figure 1A, is formed as overlooking substantially rectangular writing board shape. It is formed with the notch part being recessed into substantially U-shaped to the inside in the front, right side of base material 1 and rear, left side.
Base material 1 surface thereon (uper side surface) possesses multiple (9) optical semiconductor 2 and multiple (2) electrode 3.
Optical semiconductor 2 is such as the light-emitting component (being specially blue led etc.) sending the light such as blue light. It is substantially rectangular that optical semiconductor 2 is formed as vertical view, is installed on base material 1. Optical semiconductor 2 proper alignment is in the vertical view substantially central portion of the upper surface of base material 1, and difference is (3 row) and left and right directions (3 row) proper alignment spaced apart from each other along the longitudinal direction.
The height of optical semiconductor 2 is such as more than 50 ��m, it is preferred to more than 100 ��m, additionally, be such as less than 500 ��m, it is preferred to less than 400 ��m. Interval between each optical semiconductor 2 is such as more than 0.1mm, it is preferred to more than 1mm, additionally, be such as below 10mm, it is preferred to below 5mm.
It is substantially rectangular that electrode 3 is formed as extending in left-right direction. 2 electrodes 3 are oppositely disposed along the longitudinal direction with optical semiconductor 2 interval in the way of clipping whole optical semiconductor 2.
The height of electrode 3 is such as more than 1 ��m, it is preferred to more than 3 ��m, additionally, be such as less than 50 ��m, it is preferred to less than 30 ��m.
Optical semiconductor 2 is connected with electrode 3 wire bonding. Specifically, lead-in wire 4 connects between the terminal (not shown) set by the upper surface of optical semiconductor 2 adjacent along the longitudinal direction, and is connected with the electrode 3 adjoining this optical semiconductor 2 at fore-and-aft direction by the terminal of optical semiconductor 2. Thus, optical semiconductor 2 is electrically connected with electrode 3 by lead-in wire 4.
Then, as shown in the dummy line of Figure 1A and Fig. 2 A, after base material preparatory process, confirm or determine packaging area 5 (confirmation operation).
Packaging area 5, as shown in the dummy line of Figure 1A and Fig. 2 A, is the region making phosphor plates 6 when optical semiconductor 2 being packaged by phosphor plates (the accompanying drawing labelling 6 in Fig. 4 C described later) with the upper surface of base material 1.
Packaging area 5 is divided into substantially rectangular in the vertical view substantially central portion of the upper surface of base material 1, when through-thickness projects, to include the model split of a part for whole optical semiconductor 2 and electrode 3.
Then, as shown in fig. ib and fig. 2b, the upper surface that base material 1 will be arranged in as the weir portion material 7 of distance piece.
Weir portion material 7 is formed as overlooking substantially rectangular frame-shaped, when being configured at the upper surface of base material 1, is formed as surrounding the shape of packaging area 5 in vertical view. Specifically, the inner shape of weir portion material 7 be formed as in vertical view with packaging area 5 same shape or more than the shape of packaging area 5.
Weir portion material 7 is such as formed by transparent or semitransparent rubber etc. such as silicone rubber, acrylic rubber, butyl rubber, nitrile rubber, neoprene, polyurethane rubber, natural rubber, butadiene-styrene rubber.
Weir portion material 7 is arranged in the upper surface of base material 1 in the way of surrounding packaging area 5. Now, weir portion material 7 by the upper surface of base material 1, electrode 3 upper surface and side between do not produce gap in the way of configure.
The height (above-below direction length) of weir portion material 7 suitably determines according to height of optical semiconductor 2 etc., for instance, relative to the height of optical semiconductor 2, it is such as more than 1 times, it is preferred to more than 1.5 times, in addition, it is such as less than 20 times, it is preferred to less than 15 times. Specifically, for instance be more than 100 ��m, it is preferred to more than 150 ��m, additionally, be such as less than 2000 ��m, it is preferred to less than 1500 ��m.
The width of the frame of weir portion material 7 is such as more than 0.5mm, it is preferred to more than 1mm, additionally, be such as below 10mm, it is preferred to below 5mm.
The area (internal area) that weir portion material 7 surrounds is such as 1.0��1.2 times relative to the area of packaging area 5.
Then, as shown in figures 1 c and 2 c, fluid composition 8 to specified altitude (injection process) is injected in the inner side of dam part material.
In this operation, first, fluid composition 8 is prepared.
Fluid composition 8 is containing fluorophor and resin.
As fluorophor, for instance the yellow fluorophor etc. that can convert blue light into sodium yellow can be listed. As this fluorophor, for instance the fluorophor being doped with the such as metallic atom such as cerium (Ce), europium (Eu) in metal composite oxide, metal sulfide etc. can be listed.
Specifically, as fluorophor, can list: such as Y3Al5O12: Ce (YAG (yttrium-aluminium-garnet): Ce), (Y, Gd)3Al5O12:Ce��Tb3Al3O12:Ce��Ca3Sc2Si3O12:Ce��Lu2CaMg2(Si,Ge)3O12: Ce etc. have the carbuncle type fluorophor of garnet crystal structure, for instance (Sr, Ba)2SiO4:Eu��Ca3SiO4Cl2:Eu��Sr3SiO5:Eu��Li2SrSiO4:Eu��Ca3Si2O7: the silicate phosphors such as Eu, for instance CaAl12O19:Mn��SrAl2O4: the chlorate MClO 3 fluorescent substances such as Eu, for instance ZnS:Cu, Al, CaS:Eu, CaGa2S4:Eu��SrGa2S4: Eu sulfides fluorophor, for instance CaSi2O2N2:Eu��SrSi2O2N2:Eu��BaSi2O2N2: the nitrogen oxides fluorophor such as Eu, Ca-��-SiAlON, for instance CaAlSiN3:Eu��CaSi5N8: the nitride phosphors such as Eu, for instance K2SiF6:Mn��K2TiF6: the fluorides fluorophor etc. such as Mn. Preferably list carbuncle type fluorophor, it is preferred that list Y3Al5O12: Ce.
This fluorophor can be used alone or can also combine use.
Fluorophor is graininess, and its shape is not particularly limited, for instance can list: approximately spherical, substantially plate shaped, substantially needle-like etc.
The mean diameter (meansigma methods of greatest length) of fluorophor is such as more than 0.1 ��m, it is preferred to more than 0.2 ��m, more preferably more than 1 ��m, additionally, be such as less than 500 ��m, it is preferred to less than 200 ��m, more preferably less than 50 ��m. The mean diameter of phosphor particle is measured by particle size distribution device.
The density of fluorophor is such as 1.0g/cm3Above, it is preferred to 2.0g/cm3Above, additionally, be such as 8.0g/cm3Below, it is preferred to 6.0g/cm3Below.
Content ratio for fluorophor, carry out suitably adjusting so that being sent by optical semiconductor 2 and being white by the light of phosphor plates 6, relative to fluid composition 8, it is such as more than 1 mass %, it is preferably more than 2 mass %, additionally, be such as below 50 mass %, it is preferred to below 30 mass %.
For resin, include, for example out the potting resin of the transparency used as the encapsulating material for encapsulating optical semiconductor 2, as potting resin, can list: the thermoplastic resin such as plastified by heating, the thermosetting resin such as solidified by heating, the active energy ray-curable resin etc. that such as solidified by the irradiation of active energy beam (such as ultraviolet, electron ray etc.).
As thermoplastic resin, for instance can list: vinyl acetate resin, vinyl-vinyl acetate copolymer (EVA), vinyl chloride resin, EVA-vinyl chloride resin copolymer etc.
As curable resins such as thermosetting resin and active energy ray-curable resins, for instance can list: organic siliconresin, epoxy resin, polyimide resin, phenolic resin, urea resin, melmac, unsaturated polyester resin etc.
As these potting resins, it is preferable that list the curable resin such as thermosetting resin, active energy ray-curable resin, more preferably list thermosetting resin, it is preferred that list organic siliconresin.
Additionally, as containing the organic siliconresin potting resin compositions as potting resin, for instance the thermosetting silicone resin compositions etc. such as 2 stage solidification type organosilicon resin compositions, 1 stage solidification type organosilicon resin composition can be listed.
2 stage solidification type organosilicon resin compositions have the reaction mechanism in 2 stages, are carry out B-staged (semi-solid preparation) in the reaction in the 1st stage, carry out the thermosetting silicone resin of C rank (being fully cured) in the reaction in the 2nd stage. And 1 stage solidification type organic siliconresin has the reaction mechanism in 1 stage, it it is completely crued thermosetting silicone resin in the reaction in the 1st stage.
Additionally, B rank are thermosetting silicone resin compositionss is in the state between the A rank of liquid and completely crued C rank, it is solidify and gelation slightly carries out, elastic modelling quantity is less than the state of the elastic modelling quantity on C rank.
Uncured bulk (before the solidification in the 1st stage) as 2 stage solidification type organosilicon resin compositions, for instance condensation reaction additive reaction curing type silicone resin combination can be listed.
Condensation reaction additive reaction curing type silicone resin combination is able to be undertaken the thermosetting silicone resin compositions of condensation reaction and additive reaction by heating, more specifically, it is able to be undertaken condensation reaction by heating form B rank (semi-solid preparation), be then able to carry out additive reaction (specifically such as silicon hydrogenation) by further heating and form the thermosetting silicone resin compositions on C rank (being fully cured).
As this condensation reaction additive reaction curing type silicone resin combination, can list: such as contain silanol two end polysiloxanes, trialkoxy silane containing alkenyl, organohydrogensiloxanes, 1st condensation reaction additive reaction curing type silicone resin combination of condensation catalyst and hydrosilylation catalysts, such as contain silanol group two end polysiloxanes, containing ethylenically unsaturated hydrocarbons radical silicide, containing epoxy radicals silicon compound, organohydrogensiloxanes, 2nd condensation reaction additive reaction curing type silicone resin combination of condensation catalyst and addition catalyst (hydrosilylation catalysts), such as contain two terminal silane alcohol type silicone oil, dialkoxyalkyl silane containing alkenyl, organohydrogensiloxanes, 3rd condensation reaction additive reaction curing type silicone resin combination of condensation catalyst and hydrosilylation catalysts, such as contain the organopolysiloxane in 1 molecule with at least 2 alkenyl silyl, 1 molecule has the organopolysiloxane of at least 2 silicon hydrogen-based, 4th condensation reaction additive reaction curing type silicone resin combination of hydrosilylation catalysts and cure retarder, such as contain the 1st organopolysiloxane in 1 molecule simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and at least 2 silicon hydrogen-based, without the 2nd organopolysiloxane in ethylenically unsaturated hydrocarbons base and 1 molecule with at least 2 silicon hydrogen-based, 5th condensation reaction additive reaction curing type silicone resin combination of hydrosilylation catalysts and hydrosilation inhibitor, such as contain the 1st organopolysiloxane in 1 molecule simultaneously with at least 2 ethylenically unsaturated hydrocarbons bases and the silanol group of at least 2, without the 2nd organopolysiloxane in ethylenically unsaturated hydrocarbons base and 1 molecule with at least 2 silicon hydrogen-based, 6th condensation reaction additive reaction curing type silicone resin combination of hydrosilation inhibitor and hydrosilylation catalysts, such as contain the 7th condensation reaction additive reaction curing type silicone resin combination of silicon compound and boron compound or aluminium compound, such as contain the 8th condensation reaction additive reaction curing type silicone resin combination etc. of polyaluminosiloxane and silane coupler.
These condensation reaction additive reaction curing type silicone resin combinations can be used alone or combine and use two or more.
As 1 stage solidification type organosilicon resin composition, for instance additive reaction curing type silicone resin combination etc. can be listed.
Additive reaction curing type silicone resin combination such as contain as host containing ethylenically unsaturated hydrocarbons based polysiloxane with as the organohydrogensiloxanes of cross-linking agent.
Resin is such as more than 30 mass % relative to fluid composition 8 containing ratio, it is preferred to more than 50 mass %, additionally, be such as below 85 mass %, it is preferred to below 75 mass %.
It addition, in fluid composition 8, it is possible to contain filler as desired in appropriate proportions.
As filler, include, for example out: organic silicone microparticle, glass, aluminium oxide, silicon dioxide (fused silica, crystallinity silicon dioxide, superfine powder amorphous silica, hydrophobicity superfine powder silicon dioxide etc.), titanium dioxide, zirconium oxide, Talcum, clay, barium sulfate etc., these filleies can be used alone or combine and use two or more. Preferably list organic silicone microparticle.
Organic silicone microparticle is the microgranule of the polysiloxanes (after solidification) with cross-linked structure, for instance can list polysilsesquioxane microgranule, it is considered to the words of hardness (stiffening effect), it is preferable that list poly methyl silsesquioxane microgranule. Thereby, it is possible to improve the hardness of fluid composition 8, and improve the brightness of optical semiconductor device.
The refractive index of organic silicone microparticle is such as more than 1.39, it is preferred to more than 1.40, additionally, be such as less than 1.43, it is preferred to less than 1.42.
The mean diameter (greatest length average) of filler is such as more than 0.2 ��m, it is preferred to more than 0.5 ��m, additionally, be such as less than 40 ��m, it is preferred to less than 10 ��m.
The mean diameter of filler is measured by particle size distribution device.
About filler containing ratio, relative to fluid composition 8, for instance be more than 10 mass %, it is preferred to more than 20 mass %, additionally, be such as below 50 mass %, it is preferred to below 40 mass %.
Additionally, the known additives such as such as modifying agent, surfactant, dyestuff, pigment, anti-blushing agent, UV absorbent can be added in fluid composition 8 in the proper ratio.
In fluid composition 8, it is possible to add the known additives such as silane coupler, age resistor, modifying agent, surfactant, dyestuff, pigment, anti-blushing agent, UV absorbent as desired in the proper ratio.
Want to prepare fluid composition 8, by compounding in above-mentioned compounding ratio for mentioned component and mix.
As mixing condition, temperature is such as more than 10 DEG C, it is preferred to more than 15 DEG C, additionally, be such as less than 40 DEG C, it is preferred to less than 35 DEG C.
Additionally, fluid composition 8 can deaeration after its preparation as desired.
As defoaming method, for instance can list: known defoaming methods such as stirring deaeration, vacuum deaerator (vacuum defoamation), evacuation and centrifugal degassing, ultrasound wave deaerations.
The viscosity of fluid composition 8 is such as more than 0.1Pa s at such as 25 DEG C, it is preferred to 1Pa more than s, additionally, be such as below 10Pa s, it is preferred to 6Pa below s.
The density of fluid composition 8 is such as 0.8g/cm3Above, it is preferred to 1.0g/cm3Above, additionally, be such as 5.0g/cm3Below, it is preferred to 4.0g/cm3Below.
Then, fluid composition 8 is injected the inner side of weir portion material 7. Specifically, in the way of reaching specified altitude in packaging area 5, fluid composition 8 is injected.
The method for implanting of fluid composition 8 include, for example out coating, spraying, dropping etc.
Fluid composition 8 preferably injects in the way of coating optical semiconductor 2 and lead-in wire 4.
The thickness that the height (from the upper surface of base material 1 to the distance of the upper surface of fluid composition 8) of the fluid composition 8 being injected into is desired phosphor plates. Specifically, with the height of weir portion material 7 same or below its height, for instance be more than 300 ��m, it is preferred to more than 500 ��m, additionally, be such as less than 5000 ��m, it is preferred to less than 2000 ��m.
The height of this fluid composition 8 can be measured with laser displacement gauge (LT-9030M, Keyemce company manufacture) etc.
Then, the upper surface (uper side surface) that makes fluid composition 8 smooth (planarization process, not shown).
For planarization process, for instance the method etc. of the upper surface can list the method that fluid composition 8 is stood the stipulated time, using the smooth fluid compositions 8 of fixture such as pliers. Preferably list the method that fluid composition 8 is stood the stipulated time.
The time that time of repose is such as required less than the precipitation of fluorophor in fluid composition 8. That is, after injection process, implement to measure operation before the fluorophor precipitation in fluid composition 8.
Time of repose be preferably smaller than in fluid composition 8 fluorophor from the upper surface of fluid composition 8 and precipitate the distance of 100 ��m needed for time (that is, less than the time needed for the supernatant layer forming 100 ��m). Hereinafter, using this time as " allow time of repose Tmax ".
The time of fluorophor precipitation suitably can determine according to the kind of fluorophor and fluid composition 8 etc., for instance can pass through following RANS and determine.
[mathematical expression 1]
v s = D P 2 ( ρ P - ρ f ) g 18 η
Vs: terminal velocity (m/s)
Dp: the particle diameter (m) of fluorophor
�� p: the density (kg/m of fluorophor3)
�� f: the density (kg/m of fluid composition 83)
��: the viscosity (Pa s) of fluid composition 8
G: weight acceleration (m/s2)
Then, about allowing time of repose Tmax, following formula can be calculated according to above-mentioned formula.
Tmax=0.000184 ��/{ Dp2(��p-��f)}
Specifically, time of repose preferably sets to be shorter than permission time of repose Tmax, for instance be more than 1 minute, it is preferred to more than 5 minutes, additionally, be such as less than 10 hours, it is preferred to less than 1 hour.
It addition, injection process can disposable injection fluid composition 8 to specified altitude, it is also possible to mark time injects also to be implemented to stand operation between each injection process.
Thus, it is possible to obtain possessing base material 1, be configured at the weir portion material 7 of base material 1 and be infused in the mensuration sample 20 of fluid composition 8 of inner side of weir portion material 7.
Then, the colourity (mensuration operation) of the fluid composition 8 of specified altitude is measured.
Such as, the optical semiconductor 2 by making mensuration sample 20 is luminous, measure the light through fluid composition 8 measures the chrominance C IE value of fluid composition 8.
Assay method as the colourity of fluid composition 8, for instance the assay method measuring system based on the total light flux using integration hemisphere can be listed. Specifically explanation in embodiment below.
Chrominance C IE value suitably determines according to the kind etc. of the fluorophor used, for instance when using red-emitting phosphors as fluorophor, for instance be 0.300��0.400.
Then, the colourity of the fluid composition 8 obtained by said determination operation is considered as the colourity of phosphor plates 6 (aftermentioned), thus evaluates the colourity of phosphor plates 6. That is, the colourity colourity as phosphor plates 6 of fluid composition 8 is adopted.
This evaluation methodology can aptly with the evaluation methodology acting on the phosphor plates directly forming phosphor plates on the substrate installing optical semiconductor.
(variation of the 1st embodiment)
In the embodiment of Figure 1A, optical semiconductor 2 is connected with electrode 3 wire bonding, and although not shown, but such as optical semiconductor 2 can also be installed on base material 1 by flip-chip.
In the embodiment of Figure 1A��Fig. 1 C, implement planarization process, although not shown, but such as can not also implement planarization process and implement immediately to measure operation after injection process.
In the evaluation methodology of the 1st embodiment, it is preferable that implement planarization process. Thereby, it is possible to measure the colourity of the uniform fluid composition 8 in surface, it is possible to evaluate the colourity of phosphor plates 6 more accurately.
In the embodiment of Figure 1A��Fig. 1 C, after weir portion arrangement step, it is also possible to measure the injection process after the weight of base material 1 is implemented and measure operation.
In the evaluation methodology of the 1st embodiment, it is preferable that the weight measuring base material 1 is implemented injection process and measures operation. According to this embodiment, it is possible to measure the weight of the fluid composition 8 injected by injection process exactly. Therefore, in the enforcement of upper evaluation methodology once, when preparing fluid composition 8, it is possible to the weight of the fluid composition 8 recorded in this last time is as reference, it is possible to continuously perform evaluation methodology accurately.
Assay method as the weight of base material 1, for instance the method etc. being placed on the gravimetry devices such as Libra by base material 1 can be listed.
In the evaluation methodology of the 1st embodiment, although not shown, but such as can also implement in the way of coating fluid composition 8, be arranged in transparent cover the covering arrangement step of the upper surface of weir portion material 7 before being about to carry out planarization process or after just having carried out planarization process.
The writing board shape that transparent cover is transparent, its outer rim is formed as the shape identical with the outer rim of weir portion material 7 when thickness direction projects. Transparent cover is such as formed by glass etc.
(the 2nd embodiment)
In Fig. 3 A��Fig. 3 E, identical accompanying drawing labelling is marked with for the component same with the 1st embodiment of Figure 1A��Fig. 1 C, omits its details.
2nd embodiment of the evaluation methodology of the phosphor plates 6 in the present invention possesses base material preparatory process, spacer arrangement operation, injection process, covering arrangement step and measures operation.
First, as shown in Figure 3A, base material 1a (base material preparatory process) is prepared.
Base material 1a is the base material not installing optical semiconductor, transparent writing board shape, for instance formed by glass etc.
Then, as shown in Figure 3 B, distance piece 14 is arranged in the upper surface of base material 1a. Base material 1a can process through the demoulding.
The distance piece 14 of the 2nd embodiment can be the weir portion material 7 of the 1st embodiment, it is also possible to be the non-frame-shaped different from the weir portion material 7 of the 1st embodiment. Namely, for instance, the distance piece 14 of the 2nd embodiment can be clip 2 rod member that fluid composition 8 is opposite each other.
The height (above-below direction length) of distance piece 14 is such as more than 100 ��m, it is preferred to more than 150 ��m, additionally, be such as less than 2000 ��m, it is preferred to less than 1500 ��m. The width of distance piece 14 is such as more than 0.5mm, it is preferred to more than 1mm, additionally, be such as below 10mm, it is preferred to below 5mm.
Distance piece 14 is formed by the transparent or semitransparent rubber etc. illustrated in weir portion material 7.
Then, as shown in Figure 3 C, fluid composition 8 is injected until reaching specified altitude (injection process) to the inner side of distance piece 14.
The method for implanting of fluid composition 8 and the fluid composition 8 of the 1st embodiment are identical.
Preferably fluid composition 8 is injected in the way of reaching the height of the height or higher identical with distance piece 14 inner side of distance piece 14.
The thickness that the height (from the upper surface of base material 1a to the distance of the upper surface of fluid composition 8) of the fluid composition 8 injected is desired phosphor plates. Specifically, for instance be more than 300 ��m, it is preferred to more than 500 ��m, additionally, be such as less than 5000 ��m, it is preferred to less than 2000 ��m.
Then, as shown in Figure 3 D, transparent cover 9 is configured (covering arrangement step) in the way of the upper surface with the fluid composition 8 of specified altitude.
Specifically, by transparent cover 9 by with the upper surface of distance piece 14 in the way of configure. Thus, the upper surface of fluid composition 8 contacts with the lower surface of transparent cover 9.
The writing board shape that transparent cover 9 is transparent, is formed as the shape identical with base material 1a when through-thickness projects. Transparent cover 9 is such as formed by glass etc.
Thus, it is possible to the mensuration sample 20a of the transparent cover 9 of upper surface obtaining possessing base material 1a, being configured at the distance piece 14 of base material 1a, the fluid composition 8 injected to the inner side of distance piece 14 and be arranged in distance piece 14.
Then, as shown in FIGURE 3 E, the colourity (mensuration operation) of the fluid composition 8 of specified altitude is measured.
Such as, by measuring the light of sample 20a irradiation regulation, measuring the chrominance C IE-y value measuring fluid composition 8 through the light measuring sample 20a.
Specifically, at the light-projecting portion configured above 10 of transparent cover 9, at the light accepting part configured under 11 of base material 1a. Then, exciting light 12 is irradiated from light-projecting portion 10 to fluid composition 8. Then, measure by fluid composition 8 exciting light 12 that accepted by light accepting part 11, thus can measure.
Then, by by this mensuration operation to the value (particularly CIE-y value) of chrominance C IE of fluid composition 8 be considered as the value (particularly CIE-y value) of chrominance C IE of phosphor plates 6, thus evaluate the value of the chrominance C IE of phosphor plates 6. That is, the value of the chrominance C IE of employing fluid composition 8 is as the value of the chrominance C IE of phosphor plates 6.
This evaluation methodology can aptly with acting on the evaluation methodology being transferred to the substrate installing optical semiconductor the transfer phosphor plates that optical semiconductor is packaged.
Additionally, this evaluation methodology can also be used as the evaluation methodology possessing the encapsulation phosphor plates of optical semiconductor and phosphor plates that optical semiconductor is packaged aptly. Encapsulation phosphor plates can manufacture by being transferred to substrate and optical semiconductor be installed on substrate and phosphor plates by the optical semiconductor device of optical-semiconductor element encapsulation.
(variation of the 2nd embodiment)
In the embodiment of Fig. 3 A��Fig. 3 E, implement covering arrangement step, although not shown, for instance covering arrangement step can not be implemented and implement to measure operation after injection process.
In the evaluation methodology of the 2nd embodiment, it is preferable that implement covering arrangement step. Thereby, it is possible to measure the colourity of the uniform fluid composition 8 in surface, it is possible to evaluate the colourity of phosphor plates 6 more accurately.
[manufacture method of phosphor plates]
The manufacture method of the phosphor plates 6 in the present invention possesses evaluation operation, determines operation, preparation section and formation process.
First, above-mentioned evaluation methodology (evaluation operation) is implemented.
Then, the composition (decision operation) of fluid composition 8 is determined based on above-mentioned evaluation methodology (the 1st embodiment or the 2nd embodiment). That is, while changing the composition (content etc. of fluorophor) of fluid composition 8, this evaluation methodology is repeatedly implemented. Then, determine to realize the best composition (content etc. of fluorophor) of desired colourity.
Each composition of fluid composition 8 and formula, fluid composition 8 colourity as above.
Then, fluid composition 8 (preparation section) is again prepared according to the composition of the fluid composition 8 determined. The preparation method of fluid composition 8 is identical with above-mentioned preparation method.
Then, fluid composition is formed as lamellar (formation process).
Formation process such as possesses the operation (Fig. 4 A) of preparation demoulding base material 13, the operation (Fig. 4 B) being coated with fluid composition 8 on this demoulding base material 13 and the operation (Fig. 4 C) that fluid composition 8 is solidified. Thus, it is possible to manufactured phosphor plates 6 by fluid composition 8.
As demoulding base material 13, for instance can list: mylar (such as pet film), polycarbonate film, polyolefin film (such as polyethylene film, polypropylene film), polystyrene film, acrylate film, organic siliconresin thin film, fluorine resin film etc.
It addition, for the upper surface (forming the surface of phosphor plates 6 side) of demoulding base material 13, implement the demoulding in order to improve the release property of autofluorescence body sheet 6 as required and process.
The thickness of demoulding base material 13 is not particularly limited, for instance, from the angle of operability, cost, for instance be 20��100 ��m.
As coating process, for instance can list: known coating processes such as coating device, casting, rotary coating, roller coat cloth.
Curing (semi-solid preparation or be fully cured) determines according to the kind of the resin contained in fluid composition 8, for instance, when resin is thermosetting resin for heating.
Heating condition determines according to the kind of thermosetting resin. Such as, when resin is the 2nd stage solidification type organosilicon resin composition, the phosphor plates 6 manufacturing semi-cured state (B rank), for instance, temperature is more than 80 DEG C, it is preferred to more than 110 DEG C, in addition, it is such as less than 200 DEG C, it is preferred to less than 180 DEG C. Additionally, heat time heating time is more than 1 minute, it is preferred to more than 5 minutes, additionally, be such as less than 1 hour, it is preferred to less than 0.5 hour.
Additionally, when resin is the 1st stage solidification type organosilicon resin composition, manufactures the phosphor plates being fully cured state (C rank), heating-up temperature is such as more than 80 DEG C, it is preferably more than 100 DEG C, additionally, be such as less than 200 DEG C, it is preferred to less than 180 DEG C. Additionally, heat time heating time is such as more than 5 minutes, it is preferred to more than 10 minutes, additionally, be such as less than 10 hours, it is preferred to less than 5 hours.
The thickness of gained phosphor plates 6 is such as more than 100 ��m, it is preferred to more than 200 ��m, additionally, be such as less than 2000 ��m, it is preferred to less than 1500 ��m.
This phosphor plates 6 is such as purposes such as optical electronic devices, specifically, it is possible to be used as the case chip that optical semiconductor 2 is packaged. Especially, it is possible to be suitably used for possessing blue led, send the white light semiconductor device of the light of white by being undertaken changing by blue light.
Then, the evaluation methodology according to this phosphor plates 6, by measuring the colourity of fluid composition 8, it is possible to evaluate the colourity of the phosphor plates 6 formed by fluid composition 8. I.e., it is possible to the value of the colourity of fluid composition 8 is considered as identical with the value of the colourity of phosphor plates 6.
This is based on following reason, by utilize heating etc. make fluid composition 8 semi-solid preparation or be fully cured manufacture phosphor plates 6 time, the present inventor etc. finds that the colourity (such as CIE-y value) of semi-cured state that fluid composition 8 obtains with making it solidify or both phosphor plates 6 of being fully cured state is essentially without change. That is, this is because be found that the colourity that the colourity of fluid composition 8 can be considered as phosphor plates 6.
Therefore, when evaluating phosphor plates 6, it is possible to evaluate the phosphor plates 6 curing process without fluid composition 8, it is possible to simplicity and in short time evaluation phosphor plates 6. Additionally, the material (compositions) for evaluation methodology can directly recycle, therefore yield rate is good.
Additionally, the manufacture method according to this phosphor plates 6, determining the composition of fluid composition 8 based on this evaluation methodology, the fluid composition 8 being made up of this manufactures phosphor plates 6, therefore can manufacture phosphor plates 6 easy and in short time. Additionally, the yield rate of phosphor plates 6 is good.
(evaluating the variation of operation)
In the above-described embodiment, the composition of fluid composition 8 is directly determined based on above-mentioned evaluation methodology (the 1st embodiment or the 2nd embodiment) (namely in determining operation, carry out finally determining), although not shown, but such as can also be determined the composition of aforementioned liquid compositions by the probe operation of fluid composition based on above-mentioned evaluation methodology. Namely, it is also possible to tentatively determine the composition of fluid composition based on above-mentioned evaluation methodology, the fluid composition of the aforementioned preliminary decision of probe determines the composition of aforementioned liquid compositions.
In this variation, first, the composition (tentatively determining operation) of fluid composition is tentatively determined based on above-mentioned evaluation methodology. Specifically, change the composition (content etc. of fluorophor) of fluid composition 8, repeatedly implement above-mentioned evaluation methodology on one side. Then, the preliminary best composition (content etc. of fluorophor) determining to realize desired colourity.
Each composition of fluid composition 8 and formula, fluid composition 8 colourity as above.
Then, the fluid composition (probe operation) that probe tentatively determines. Specifically, according to the composition of the fluid composition 8 tentatively determined, this fluid composition 8 manufacture experimently phosphor plates 6 (preproduction) and evaluate the colourity of this preproduction.
When fluid composition 8 is the compositions that can be fully cured (C rank), the preproduction on trial-production (manufacture) C rank.
Then, based on the evaluation of preproduction, the composition (finally determining operation) of fluid composition 8 is determined. Specifically, if the measured value of the colourity of preproduction is in target zone, then it is determined as the composition of this fluid composition 8 tentatively determined. And if the measured value of the colourity of preproduction is outside target zone, then forms according to it and evaluate the composition revising and determining fluid composition 8 colourity to reach target.
It addition, finally determine in operation, it is also possible to the relation of thickness with colourity by considering phosphor plates 6 determines the composition of fluid composition 8. Specifically, make more than 2 preproductions (such as the 1st preproduction and the 2nd preproduction), thickness based on the 1st preproduction and the 2nd preproduction makes standard curve with colourity, obtains the thickness of the phosphor plates 6 corresponding to target colorimetric based on this standard curve. Next, it is determined that the phosphor plates 6 of manufacturing objective colourity can be carried out by regulating the thickness of phosphor plates, it is judged that time feasible, determine that it forms. More specifically, for instance, it is possible to determine with reference to middle methods recorded such as Japanese Unexamined Patent Publication 2014-96491 publications.
In this variation, actually manufacture experimently phosphor plates 6 (preproduction), therefore, it is possible to the phosphor plates 6 of manufacturing objective colourity more accurately.
Embodiment
The present invention is specifically described by embodiment described below and comparative example further, but the present invention is not limited to this completely. The numerical value of embodiment described below can be replaced in above-mentioned embodiment record numerical value (that is, higher limit or lower limit).
(embodiment 1)
As base material 1, prepare the insulating substrate 1 (overall dimensions 22mm �� 20mm) shown in Figure 1A and Fig. 2 A. Additionally, in the substantially central portion of base material 1 with 39 blue leds of installation at equal intervals (optical semiconductor 2, height 150 ��m) arranging �� 3 row, in the way of clipping these 9 blue leds, configure 2 electrodes 3 (height 1 ��m) along the longitudinal direction.
Then, as shown in the dummy line of Figure 1A and Fig. 2 A, packaging area 5 is determined as the vertical view rectangle of fore-and-aft direction length 13.5mm �� left and right directions length 12.5mm in the way of including a part for 9 blue leds and electrode 3.
Then, as weir portion material 7, prepare that inside casing is of a size of 13.5mm (fore-and-aft direction length) �� 12.5mm (left and right directions length) �� 700 ��m (highly), housing is of a size of the silicone rubber of 15.5mm (fore-and-aft direction length) �� 14.5mm (left and right directions length) �� 700 ��m (highly). As shown in fig. ib and fig. 2b, this weir portion material 7 is configured in the way of inside casing is consistent with the outer rim of packaging area 5 so that do not produce gap in the upper surface of base material 1, the upper surface of electrode 3 and side.
Then, compounding YAG fluorophor (" YAG432 ", particle diameter 8.9 ��m, density 4.5 (g/cm3), NemotoLumi-MaterialsCompanyLimited manufactures) 0.38g, organic siliconresin (in the embodiment 1 of Japanese Unexamined Patent Publication 2010-265436 publication record organic siliconresin) 6.62g and organic silicone microparticle (" TOSPEARL2000B ", MomentivePerformanceMaterialsJapanLLC manufacture) 3.00g, stir 5 minutes with spatula, then, implement the stirring deaeration of 3 minutes with Mazerustar (KuraboIndustriesLtd. manufacture), thus prepare fluid composition 8. The viscosity (25 DEG C) of fluid composition 8 is 2Pa s, and density is 1.2g/cm3��
Then, as shown in figures 1 c and 2 c, fluid composition 8 is injected the packaging area 5 of the inner side of weir portion material 7, until it reaches the height of the upper surface 600 ��m from base material 1 with syringe.
Now, stand 10 minutes, until the upper surface of fluid composition 8 flattens smooth. It should be noted that allowing time of repose Tmax to calculate according to above-mentioned RANS is 369 hours, therefore time of repose is in permission time of repose. Using the base material 1 of fluid composition 8 is injected weir portion material 7 inner side to this height of 600 ��m as measuring sample 20.
Then, use total light flux to measure system and implement the determination of colority of this mensuration sample 20.
That is, as it is shown in figure 5, bottom surface is positioned at upside by fluid composition 8, base material 1 configures mensuration sample 20 in the way of being positioned at downside integration hemispherical elements 22 (the common small sized integrating sphere of trade name: 150mm, Labsphere, Inc. manufacture) most.
The diameter of integration hemispherical elements 22 is 150mm, and its hemispherical portion 22a inner face is carried out the minute surface of surface treatment with barium sulfate, and cap 22b inner face is carried out the minute surface of surface treatment with aluminum. The light fenestella 23 being positioned at the position from its center 7.5mm it is provided with at cap 22b.
Then, make mensuration sample 20 luminous when voltage 9V, electric current 0.02A. The light sent from mensuration sample 20 passes through light fenestella 23 by by bare headed 24 light. By detecting the light of this acceptance with the spectrophotometer (trade name: MC-9800, big Electronics Co., Ltd manufacture) (not shown) being subject to shaven head 24 to be connected, obtain chrominance C IE-y value. Chrominance C IE-y value now is 0.319.
Embodiment 2
For the fluid composition 8 of embodiment 1, compounding fluorophor 0.48g, organic siliconresin 6.52g and organic silicone microparticle 3.00g, in addition carry out preparing the fluid composition 8 of embodiment 2 similarly to Example 1.
Use the fluid composition 8 of this embodiment 2, in addition implement operation similarly to Example 1, obtain the chrominance C IE-y value of fluid composition 8. Chrominance C IE-y value is 0.352.
Embodiment 3
For the fluid composition 8 of embodiment 1, compounding fluorophor 0.58g, organic siliconresin 6.42g and organic silicone microparticle 3.00g, in addition carry out preparing the fluid composition 8 of embodiment 3 similarly to Example 1.
Use the fluid composition 8 of this embodiment 3, in addition implement operation similarly to Example 1, obtain the chrominance C IE-y value of fluid composition 8. Chrominance C IE-y value is 0.387.
Comparative example 1
Use coating device by the lamellar that fluid composition 8 film forming is thickness 600 ��m of embodiment 1. Then, implement the heat treated of 135 DEG C, 20 minutes, form semi-cured state. The phosphor plates 6 of this semi-cured state is cut into the size of 13.5mm �� 12.5mm. The packaging area 5 of the base material 1 that the phosphor plates 6 that makes to cut is identical with embodiment 1 is closely sealed, and optical semiconductor 2 is packaged. Then, the mensuration of colourity is implemented similarly to Example 1. Chrominance C IE-y value is 0.319.
Comparative example 2
Use coating device by the lamellar that fluid composition 8 film forming is thickness 600 ��m of embodiment 2. Then, implement the heat treated of 135 DEG C, 20 minutes, form semi-cured state. The phosphor plates 6 of this semi-cured state is cut into the size of 13.5mm �� 12.5mm. The packaging area 5 of the base material 1 that the phosphor plates 6 that makes to cut is identical with embodiment 1 is closely sealed, and optical semiconductor 2 is packaged. Then, the mensuration of colourity is implemented similarly to Example 1. Chrominance C IE-y value is 0.352.
Comparative example 3
Use coating device by the lamellar that fluid composition 8 film forming is thickness 600 ��m of embodiment 3. Then, implement the heat treated of 135 DEG C, 20 minutes, form semi-cured state. The phosphor plates 6 of this semi-cured state is cut into the size of 13.5mm �� 12.5mm. The packaging area 5 of the base material 1 that the phosphor plates 6 that makes to cut is identical with embodiment 1 is closely sealed, and optical semiconductor 2 is packaged. Then, the mensuration of colourity is implemented similarly to Example 1. Chrominance C IE-y value is 0.387.
<investigation>
By result above it can be seen that the colourity of fluid composition is identical with the colourity under its semi-cured state. It is thus identified that evaluate the colourity of the phosphor plates 6 of semi-cured state to the evaluation methodology that can pass through the present invention.
Embodiment 4
As base material 1a, prepare microscope slide (Fig. 3 A).
Then, as distance piece 14, preparation inside casing is 30mm �� 30mm �� 175 ��m (highly), housing is the silicone rubber of 31mm �� 31mm �� 175 ��m (highly). This distance piece 14 is arranged in the way of not producing gap the upper surface (Fig. 3 B) of transparent base 1a.
Compounding YAG fluorophor (" YAG432 ", particle diameter 8.9 ��m, density 4.5 (g/cm3), NemotoLumi-MaterialsCompanyLimited manufactures) 2.5g and organic siliconresin (" LR7665 ", additive reaction curing type silicone resin combination, WACKERASAHIKASEISILICONECo., Ltd. manufacture) 7.5g, stir 5 minutes with spatula, then, implement the stirring deaeration of 3 minutes with Mazerustar (KuraboIndustriesLtd. manufacture), thus prepare the fluid composition 8 of embodiment 4.
Then, fluid composition 8 taken out with syringe and inject the inside straight of distance piece 14 to highly reaching 175 ��m of m (Fig. 3 C).
Then, as transparent cover 9, prepare the microscope slide identical with transparent base 1a, in the way of the upper surface of contact spacer 14, configure (Fig. 3 D). Using the transparent base 1a of fluid composition 8 is injected distance piece 14 inner side to this height of 175 ��m as measuring sample 20a.
Then, the determination of colority of this mensuration sample 20a is implemented.
Specifically, as shown in FIGURE 3 E, at the light-projecting portion configured above 10 of transparent cover 9, at the light accepting part configured under 11 (by shaven head) of transparent base 1a. As excitation source, use and check with LED (CCSInc. manufacture). At light-projecting portion 10 place as the determinator measuring the exciting light 12 accepted, use spectrophotometer (trade name: MC-9800, big Electronics Co., Ltd manufacture). The spot size of light-projecting portion 10 is set as 1mm, and the distance from light-projecting portion 10 to fluid composition 8 upper surface is set as 1mm.
Then, exciting light 12 (447nm, half breadth 20nm) is irradiated from light-projecting portion 10 towards fluid composition 8. Then, fluid composition 8 exciting light 12 accepted by light accepting part 11 are passed through with spectrophotometer measurement. Chrominance C IE-y value is 0.358.
Comparative example 4
In example 4, before determination of colority, on the hot plate of 105 DEG C, carry out 10 minutes be heating and curing to measuring sample 20a, thus fluid composition 8 is made the phosphor plates 6 (thickness 175 ��m) of the state of being fully cured (C rank).
This is implemented to the mensuration sample 20a being heating and curing, implement determination of colority similarly to Example 4. Chrominance C IE-y value is 0.355.
<investigation>
By result above it can be seen that the colourity in fluid composition is compared with the colourity of the phosphor plates 6 of solid state, its difference is within 1%, and both colourity is almost identical. It is thus identified that to by the evaluation methodology of the present invention colourity of phosphor plates 6 of solid state can be evaluated.
It should be noted that give technique scheme with the form of embodiment illustrated of the present invention, but this is only simple illustration, should not do limited explanation. Those skilled in the art of this technical field the variation of the clearly present invention fall into scope of the presently claimed invention.
Industrial applicability
The evaluation methodology of the phosphor plates of the present invention and manufacture method thereof can apply to various industrial products, for instance may be used for the optical applications etc. such as white light semiconductor device.
Description of reference numerals
1 base material
1a base material
2 optical semiconductors
6 phosphor plates
7 weir portion materials
8 fluid compositions
9 transparent cover
14 distance pieces

Claims (6)

1. the evaluation methodology of a phosphor plates, it is characterised in that being the method evaluating the phosphor plates formed by the fluid composition containing fluorophor and resin, described evaluation methodology possesses following operation:
Spacer arrangement operation, configuration space part on base material;
Injection process, injects described fluid composition until reaching specified altitude to the inner side of described distance piece; And,
Measure operation, measure the colourity of the fluid composition of described specified altitude.
2. the evaluation methodology of phosphor plates according to claim 1, it is characterised in that described base material possesses optical semiconductor on its surface,
In injection process, in the way of coating described optical semiconductor, inject described fluid composition.
3. the evaluation methodology of phosphor plates according to claim 1, it is characterised in that after injection process, implemented described mensuration operation before described fluorophor precipitates in fluid composition.
4. the evaluation methodology of phosphor plates according to claim 1, it is characterised in that described base material is transparent base,
Measure before operation after injection process and be also equipped with covering arrangement step, by transparent cover by with the upper surface of the fluid composition of described specified altitude in the way of configure.
5. the manufacture method of a phosphor plates, it is characterised in that described manufacture method possesses following operation:
Evaluate operation, implement the evaluation methodology of the phosphor plates formed by the fluid composition containing fluorophor and resin;
Determine operation, determine the composition of described fluid composition based on described evaluation methodology;
Preparation section, prepares fluid composition according to the composition of the fluid composition determined; And,
Formation process, is formed as lamellar by described fluid composition,
Described evaluation methodology possesses following operation:
Spacer arrangement operation, configuration space part on base material;
Injection process, injects described fluid composition until reaching specified altitude to the inner side of described distance piece; And,
Measure operation, measure the colourity of the fluid composition of described specified altitude.
6. the manufacture method of phosphor plates according to claim 5, it is characterized in that, described decision operation includes following operation: tentatively determine the composition of described fluid composition based on described evaluation methodology, described in probe, the preliminary fluid composition determined, determines the composition of described fluid composition.
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