CN105823974B - A method of improving LED chip testing needle trace - Google Patents
A method of improving LED chip testing needle trace Download PDFInfo
- Publication number
- CN105823974B CN105823974B CN201610280258.0A CN201610280258A CN105823974B CN 105823974 B CN105823974 B CN 105823974B CN 201610280258 A CN201610280258 A CN 201610280258A CN 105823974 B CN105823974 B CN 105823974B
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- Prior art keywords
- needle
- bistrique
- needle point
- grinding
- testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/08—Measuring arrangements characterised by the use of mechanical techniques for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A method of improving LED chip testing needle trace, includes the following steps：（1）Grinding tool is made, which includes bistrique, monitoring window and grip shank, and grip shank is fixedly connected on bistrique, and taper hole is provided in bistrique, and abrasive material is attached on the inner wall of bistrique taper hole, and monitoring window is provided on bistrique, and monitoring window is equipped with scale；（2）Whether the needle point for observing testing needle is intact, if needle point is intact, step is used if be difficult to clean off with hairbrush or the clast removed on needle point of blowing（1）The abrasive needle point of making；（3）Needle point after grinding is tested into hand-manipulating of needle trace.This method can make testing needle grind the clast being difficult to clean off adhered on needle point under the premise of not dismantling; shorten milling time; it improves grinding efficiency and protects testing needle; and the grinding situation of needle point can be monitored in real time; to efficiently ensure that grinding quality, testing needle trace is improved, ensure that test quality; the testing needle service life is improved, production cost is reduced.
Description
Technical field
The present invention relates to a kind of methods for improving LED chip testing needle trace, belong to the technology neck of LED core built-in testing
Domain.
Background technology
Core component of the LED chip as semiconductor lighting, after ensureing that its basic photoelectric properties and appearance requirement are
The basis of continuous processing.It after the completion of the production and processing of LED chip, needs to test chip, so as to according to its photoelectric parameter
Carry out grade separation.With encapsulation technology and the development of application, photoelectric properties, appearance zero of the markets LED to LED chip at this stage
Defect etc. is proposed the tightened up requirement of higher, especially proposes high request to testing needle trace in recent years.As LED core
The final key link that piece machines, testing needle trace is excessive, the long appearance that can influence product, and can be to subsequently encapsulating weldering
The links such as line cause to directly affect.
Mainly chip is tested using full inspection test machine in LED chip measuring technology at this stage, as shown in Figure 1,
By pricking two testing needles on the positive electrode 1 and negative electrode 2 of LED chip, to which turning circuit is tested.And it is surveying entirely
In chip processes, due to during continuance test testing needle constantly frequently can lead to chip engaged test on testing needle glue it is different
Object (gold bits, aluminium skimmings) influences test effect.If the especially clear needle not in time in test gold, aluminium electrode chip, can cause to test
There is situations such as shallow needle trace 3 as shown in Figure 2, minute hand trace 4, broken needle trace 5, and it sometimes appear that test voltage floating feelings
Shape.Often there is such case when testing the chip containing gold electrode, the measure taken generally directed to this situation is to use hair
Brush or the clear needle of blowing are to remove the foreign matter on testing needle, even and if often sometimes taking aforesaid way thoroughly clear
Except the foreign matter on testing needle, and this situation measurement needle positive pressure is normal.
The shape of testing needle is as shown in figure 3, (head) arc transition at its needle point, with being at fillet, that is, needle point
It is hemispherical.It is 6 μm of * 3.3mm*120 degree, i.e. a diameter of 6 μm of needle point fillet such as to test gauge, and needle bores diameter 3.3mm, looper angle
Degree is 120 degree.
Disclosed in Chinese patent literature CN201271825《Probe grinding device》, it is suitable for the making of liquid crystal display panel
In the process, the probe base being fixed on objective table is lifted by throw rod, in the horizontal direction with sand paper to the needle point of probe into
Row grinding, to grind the complex root probe on a probe needle stand, and it is upright probe to require complex root needle, is not suitable for
LED chip testing needle is tested during use.
Disclosed in Chinese patent literature CN202088061U《Grinding device of power chip probe》, including fixed mechanism, grind
Grinding machine structure, the first control mechanism, the second control mechanism and waterproof abrasive paper etc., it is complicated, it is mainly used for probe card and manufactures
Grinding in the process is to improve the Stability and dependability of product processing quality.Mistake suitable for production of integrated circuits probe card
Journey is the needle point that probe is ground during making probe card, is not suitable for during the test use of LED chip testing needle.
And at this stage in LED chip test process often occurs in LED tests industry, prick survey due to surveying chip testing needle entirely
The metal fragment for gluing and being difficult to clean off on needle is frequently resulted in, and this hour hand is intact, testing needle trace is undesirable.For this
Situation, which replaces the normal testing needle of appearance, causes the lost of life of needle, cost to improve；If it is changed without testing needle, it can be because of testing needle
Trace causes chip appearance to downshift, and loses more than gain.
Invention content
In view of the deficiencies of the prior art, the present invention provide it is a kind of it is simple in structure, can remove the metal fragment being difficult to clean off,
Improve testing needle trace and improve testing needle service life, reduce production cost improvement LED chip testing needle trace method.
The method of the improvement LED chip testing needle trace of the present invention, includes the following steps：
(1) grinding tool is made, which includes bistrique, monitoring window and grip shank, and grip shank is fixedly connected on bistrique, bistrique
It is inside provided with taper hole, abrasive material is attached on the inner wall of bistrique taper hole, monitoring window is provided on bistrique, monitoring window is equipped with scale,
Whether the tip diameter to monitor grinding in real time meets the requirements；
(2) if there is needle trace abnormal conditions in LED chip test process, whether the needle point for observing testing needle is intact,
If needle point is intact, made of step (1) of hairbrush or the clast removed on needle point of blowing if be difficult to clean off
Abrasive needle point；
(3) needle point after grinding is tested into hand-manipulating of needle trace, checks whether needle trace meets the requirements.
In the step (2), the detailed process of the abrasive needle point made of step (1) is：
Testing needle is fixed, the needle point that the taper hole of bistrique is directed at testing needle by grip shank is held, the needle point of testing needle is made to insert
Enter in the taper hole of bistrique, bistrique is rotated, by abrasive material to needle point grinding；In process of lapping on needle point bur fall,
The fillet diameter of needle point becomes smaller, and is moved down in the taper hole of bistrique, monitors the diameter of needle point in real time by the scale on monitoring window 8,
If monitoring the diameter of needle point within required value error ± 1 μm, exactly meet the requirements, grinding terminates.With 6 μm of example needle point
For, the tip diameter error ground meets the requirements at ± 1 μm, i.e., between 5-7 μm.
The method of the present invention, can make testing needle under the premise of not dismantling (testing needle is fixed on the needle stand of test machine)
The clast being difficult to clean off adhered on grinding needle point, removes repeated disassembled and assembled and the trouble of measurement from, shortens milling time, improve
Grinding efficiency and testing needle is protected, and the grinding situation of needle point can be monitored in real time, to efficiently ensure that grinding quality, changed
Testing needle trace has been apt to it, has ensure that test quality, has improved the testing needle service life, reduce production cost.
Description of the drawings
Fig. 1 is existing LED chip test philosophy schematic diagram.
Fig. 2 is that the appearance of existing LED core built-in testing exception needle trace illustrates.
Fig. 3 is the structural schematic diagram of LED chip testing needle.
Fig. 4 is the structural schematic diagram of grinding tool in the present invention.
Fig. 5 is the testing needle trace schematic diagram after the method for the present invention improves.
Wherein：1, positive electrode, 2, negative electrode, 3, shallow needle trace, 4, minute hand trace, 5, broken needle trace, 6, bistrique, 7, abrasive material, 8, prison
Survey window, 9, grip shank.
Specific implementation mode
During testing LED chip, test a period of time will appear needle trace abnormal conditions, shallow needle trace as shown in Figure 2
3, minute hand trace 4, broken needle trace 5 and voltage are spent.It is intact that testing needle needle point is observed under needle trace abnormal conditions, and needle point is used
Hairbrush or blowing are difficult to clean off clast, according to analysis, cause to be stained with metal fragment on needle this is because pricking survey chip for a long time
It is caused.Chip appearance can be caused to downshift because needle trace is unqualified if continuing test.If directly using sand paper card grinding with conventional method
Needle point can be caused thicker, being in the light so as to cause test influences the accuracy of optical parameter；If renewing needle, testing needle can be caused in this way
The lost of life, cost improve.
The present invention makes grinding tool according to the case where test LED chip syringe needle bent angle, i.e., the feelings of needle stand are fixed in testing needle
Card grinding under shape, and after card grinding can monitoring and test needle point in real time diameter, that is, ensureing not influencing test parameter and improving testing needle
Continue to test under the basis of trace.
The method of the improvement LED chip testing needle trace of the present invention, includes the following steps：
(1) grinding tool as shown in Figure 4 is made according to the size and shape of required testing needle, which includes bistrique 6, mill
Material 7, monitoring window 8 and grip shank 9, grip shank 9 are fixedly connected on the outside of bistrique 6, for gripping entire grinding tool, in convenience
Under pick and place and rotate left and right grinding tool, to grind the needle point of testing needle.It is provided with taper hole in bistrique 6, the needle of the taper hole and testing needle
Wimble fraction shape is consistent, and there are certain gap, testing needle is encountered when preventing from picking and placeing.Abrasive material 7 is attached to 6 taper hole bottom end of bistrique
Inner wall on, abrasive material 7 plays the role of grinding testing needle needle point when rotation using the waterproof abrasive paper of 2000 mesh or so.On bistrique 6
It is provided with monitoring window 8, monitoring window 8 makes for transparent material, a vertical elongated slot can be opened on bistrique 6, monitoring window 8 is adhered to length
Groove location, monitoring window 8 mark scale (according to the taper hole cross-sectional diameter mark of bistrique 6 according to the angles testing needle R test order above
Note), whether the tip diameter of the convenient grinding of monitoring in real time meets the requirements.
Above-mentioned grinding tool be equipped with measure tip diameter scale, tip diameter can immediately be judged in process of lapping be
No to meet the requirements, being slightly in the light to avoid needle influences the accuracy of optical parameter test.And eliminate repeated disassembled and assembled and the step of measurement
Suddenly, milling time is shortened, grinding efficiency is improved and protects testing needle, and is extended on the basis of ensureing test quality
Service life of testing needle.
(2) occur shallow needle trace 3 as shown in Figure 2, minute hand trace 4, broken needle trace 5, voltage in LED chip test process to spend
Whether the needle point that testing needle is observed under needle trace abnormal conditions is intact, if needle point is intact, with hairbrush or blows on removing needle point
Clast, if be difficult to clean off, the abrasive needle point made of step (1), detailed process is：
It keeps testing needle to be fixed on needle stand and (fix testing needle by needle stand), holds grip shank 9 by the cone of bistrique 6
Hole is directed at the needle point of testing needle, so that the needle point of testing needle is inserted into the taper hole of bistrique 6, bistrique 6 is rotated, by abrasive material 7 to needle point
Grinding.In process of lapping on needle point bur fall, the fillet diameter of needle point becomes smaller, moved down in the taper hole of bistrique 6,
Monitor the diameter of needle point in real time by the scale on monitoring window 8, if monitoring needle point diameter required value error ± 1 μm with
It is interior, it exactly meets the requirements, grinding terminates.By taking 6 μm of example needle point as an example, the tip diameter error ground is in ± 1 μm, i.e. 5-
It meets the requirements between 7 μm.
(3) needle point after grinding is tested into hand-manipulating of needle trace, checks whether needle trace meets the requirements, be as shown in Figure 5
Reach requirement.
Claims (2)
1. a kind of method improving LED chip testing needle trace, characterized in that include the following steps：
（1）Grinding tool is made, which includes bistrique, monitoring window and grip shank, and grip shank is fixedly connected on bistrique, is set in bistrique
It is equipped with taper hole, abrasive material is attached on the inner wall of bistrique taper hole, is provided with monitoring window on bistrique, according to testing needle R above monitoring window
Angle test order mark scale marks scale according to the taper hole cross-sectional diameter of bistrique, to monitor the needle point of grinding in real time
Whether diameter meets the requirements；
（2）If there is needle trace abnormal conditions in LED chip test process, whether the needle point for observing testing needle is intact, if
Needle point is intact, then uses hairbrush or the clast removed on needle point of blowing uses step if be difficult to clean off（1）The grinding tool of making
Grind needle point；
（3）Needle point after grinding is tested into hand-manipulating of needle trace, checks whether needle trace meets the requirements.
2. improving the method for LED chip testing needle trace according to claim 1, characterized in that the step（2）In, it uses
Step（1）The detailed process of the abrasive needle point of making is：
Testing needle is fixed, the needle point that the taper hole of bistrique is directed at testing needle by grip shank is held, the needle point of testing needle is made to be inserted into mill
In the taper hole of head, bistrique is rotated, by abrasive material to needle point grinding；In process of lapping on needle point bur fall, needle point
Fillet diameter become smaller, moved down in the taper hole of bistrique, monitor the diameter of needle point in real time by the scale on monitoring window, if prison
The diameter of stylus point exactly meets the requirements, grinding terminates within required value error ± 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280258.0A CN105823974B (en) | 2016-04-28 | 2016-04-28 | A method of improving LED chip testing needle trace |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280258.0A CN105823974B (en) | 2016-04-28 | 2016-04-28 | A method of improving LED chip testing needle trace |
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| Publication Number | Publication Date |
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| CN105823974A CN105823974A (en) | 2016-08-03 |
| CN105823974B true CN105823974B (en) | 2018-08-17 |
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| CN201610280258.0A Active CN105823974B (en) | 2016-04-28 | 2016-04-28 | A method of improving LED chip testing needle trace |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986412A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of surface treatment method for improving LED wafer grinding and scratching |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| CN115407176B (en) * | 2022-10-31 | 2023-01-03 | 长春光华微电子设备工程中心有限公司 | Calibration method for needle cleaning height difference and probe station |
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|---|---|---|---|---|
| CN1252745A (en) * | 1997-04-22 | 2000-05-10 | 美国3M公司 | Abrasive material for needle point of probe card |
| CN201728570U (en) * | 2010-05-19 | 2011-02-02 | 上海依然半导体测试有限公司 | Probe grinding device |
| CN202088061U (en) * | 2011-04-28 | 2011-12-28 | 上海依然半导体测试有限公司 | Grinding device of power chip probe |
| CN203265099U (en) * | 2013-04-19 | 2013-11-06 | 惠特科技股份有限公司 | Probe cleaning device |
| CN103878150A (en) * | 2014-03-05 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | Probe cleaning method and probe cleaning device |
| CN204711702U (en) * | 2015-04-14 | 2015-10-21 | 辽宁科技大学 | A kind of magnetic grinding finishing device of cone object |
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496342A (en) * | 1990-08-13 | 1992-03-27 | Nec Corp | Inspecting device for resistance |
| JPH05209896A (en) * | 1992-01-30 | 1993-08-20 | Sony Corp | Probe pin polisher of mounting board inspection device |
-
2016
- 2016-04-28 CN CN201610280258.0A patent/CN105823974B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1252745A (en) * | 1997-04-22 | 2000-05-10 | 美国3M公司 | Abrasive material for needle point of probe card |
| CN201728570U (en) * | 2010-05-19 | 2011-02-02 | 上海依然半导体测试有限公司 | Probe grinding device |
| CN202088061U (en) * | 2011-04-28 | 2011-12-28 | 上海依然半导体测试有限公司 | Grinding device of power chip probe |
| CN203265099U (en) * | 2013-04-19 | 2013-11-06 | 惠特科技股份有限公司 | Probe cleaning device |
| CN103878150A (en) * | 2014-03-05 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | Probe cleaning method and probe cleaning device |
| CN204711702U (en) * | 2015-04-14 | 2015-10-21 | 辽宁科技大学 | A kind of magnetic grinding finishing device of cone object |
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
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| CN105823974A (en) | 2016-08-03 |
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