CN105823974A - Method for improving LED chip testing needle mark - Google Patents
Method for improving LED chip testing needle mark Download PDFInfo
- Publication number
- CN105823974A CN105823974A CN201610280258.0A CN201610280258A CN105823974A CN 105823974 A CN105823974 A CN 105823974A CN 201610280258 A CN201610280258 A CN 201610280258A CN 105823974 A CN105823974 A CN 105823974A
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- China
- Prior art keywords
- needle
- needle point
- grinding
- bistrique
- testing
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/08—Measuring arrangements characterised by the use of mechanical techniques for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a method for improving a LED chip testing needle mark. The method comprises the following steps: (1) making a grinding tool, the grinding tool including a grinding head, a monitoring window and a clamping handle, the clamping handle being secured to the grinding head, the grinding head being provided therein with a taper hole, the inner wall of the taper hole of the grinding head being attached with an abrasive, the grinding head being provided with a monitoring window which is provided with a scale; (2) observing whether a needle point of a testing needle is complete and well, and if the needle point is complete and well, removing scraps on the needle point with a brush or a blow, and if the scraps are hard to remove, then adopting grinding tool made in the step (1) to grind the needle point; (3) conducting needle mark test on the ground needle point. The method enables the grinding of the scraps that are attached to the needle point and are hard to remove provided that the testing needle is not dismounted, which shortens grinding time, increases grinding efficiency and protects the testing needle. The method can conduct real-time monitoring on the grinding conditions of the needle point, which efficiently guarantees grinding quality, improves testing needle mark, guarantees testing quality, increases service life of the testing needle, and lowers production cost.
Description
Technical field
The present invention relates to a kind of method for improving LED chip testing needle trace, belong to the technical field of LED chip test.
Background technology
LED chip is as the core component of semiconductor lighting, it is ensured that its basic photoelectric properties and appearance requirement are the bases of following process.After the production and processing of LED chip completes, need chip is tested, in order to carry out grade separation according to its photoelectric parameter.Along with encapsulation technology and the development of application, present stage LED market the aspects such as the photoelectric properties of LED chip, outward appearance zero-fault are proposed the highest tightened up requirement, the most in recent years testing needle trace was proposed high request.The final key link machined as LED chip, the testing needle trace outward appearance that can affect product excessive, long, and the links such as follow-up encapsulation bonding wire can be caused and directly affect.
In present stage LED chip measuring technology, chip is tested by main employing full detection test-run a machine, as it is shown in figure 1, by two testing needles being pricked on anelectrode 1 and the negative electrode 2 of LED chip, thus turning circuit is tested.And survey in chip processes complete, owing to during continuance test, testing needle is constantly and chip engaged test frequently can lead to viscous foreign body on testing needle (gold bits, aluminum bits) impact test effect.If the especially clear pin not in time when test gold, aluminum electrode chip, can cause test that the situations such as shallow pin trace 3 as shown in Figure 2, minute hand trace 4, broken pin trace 5 occur, and it sometimes appear that the situation grown dim of test voltage.Test contains the chip of gold electrode when, this situation often occurs, being generally directed to the measure that this situation takes is to remove the foreign body on testing needle with the clear pin of hairbrush or blowing, even and if take the foreign body that aforesaid way can not thoroughly remove on testing needle the most sometimes, and this situation to measure pin positive pressure normal.
The shape of testing needle is as it is shown on figure 3, (head) arc transition at its needle point, with fillet, namely in hemispherical at needle point.If testing needle specification is 6 μm * 3.3mm*120 degree, i.e. a diameter of 6 μm of needle point fillet, pin cone diameter 3.3mm, looper angle is 120 degree.
Chinese patent literature CN201271825 is disclosed " probe grinding device ", be applicable to the manufacturing process of display panels, the probe base being fixed on object stage is lifted by throw rod, with sand paper, the needle point of probe is ground in the horizontal direction, in order to grind the complex root probe on a probe needle stand, and require that complex root pin is upright probe, during not being suitable for the test use of LED chip testing needle.
Chinese patent literature CN202088061U is disclosed " grinding device of power chip probe ", including fixed mechanism, grinding mechanism, the first controlling organization, the second controlling organization and waterproof abrasive paper etc., its structure is complicated, is mainly used in grinding with the Stability and dependability of raising product processing quality during probe card is manufactured.It is applicable to the process of production of integrated circuits probe card, is the needle point grinding probe during making probe card, during not being suitable for the test use of LED chip testing needle.
And present stage often occurs in LED chip test process in LED test industry, pricking survey due to full survey chip testing pin and frequently result in the viscous metal fragment being difficult to clean off on pin, and these hour hands are intact, testing needle trace is the most undesirable.Changing the normal testing needle of outward appearance for this situation and cause the lost of life of pin, cost improves；If being changed without testing needle, chip outward appearance can be caused to downshift because of testing needle trace, losing more than gain.
Summary of the invention
For the deficiencies in the prior art, the present invention provide a kind of simple in construction, can remove be difficult to clean off metal fragment, improve testing needle trace and improve testing needle life-span, reduce production cost the method improving LED chip testing needle trace.
The method improving LED chip testing needle trace of the present invention, comprises the following steps:
(1) grinding tool is made, this grinding tool includes bistrique, monitoring window and grip shank, grip shank is fixedly connected on bistrique, taper hole it is provided with in bistrique, it is attached with abrasive material on the inwall of bistrique taper hole, being provided with monitoring window on bistrique, monitoring window is provided with scale, in order to whether the tip diameter that monitoring is ground in real time meets the requirements；
(2) if there is pin trace abnormal conditions in LED chip test process, the needle point observing testing needle is the most intact, if needle point is intact, then with hairbrush or the chip removed on needle point of blowing, if be difficult to clean off, then use the abrasive needle point that step (1) makes；
(3) needle point ground after terminating is carried out pin trace test, check whether pin trace meets the requirements.
In described step (2), the detailed process of the abrasive needle point that employing step (1) makes is:
Fixing testing needle, the taper hole of bistrique is directed at the needle point of testing needle by hand-held grip shank, makes the needle point of testing needle insert in the taper hole of bistrique, rotates bistrique, by abrasive material to needle point grinding；Along with the dropping of bur on needle point in process of lapping, the fillet diameter of needle point diminishes, and moves down in the taper hole of bistrique, the diameter of needle point is monitored in real time by the scale on monitoring window 8, if the diameter of monitoring needle point is within the μm of required value error ± 1, it is simply that meeting the requirements, grinding terminates.As a example by example needle point 6 μm, the tip diameter error ground in ± 1 μm, i.e. meets the requirements between 5-7 μm.
The method of the present invention; testing needle can be made to grind the chip being difficult to clean off of attachment on needle point on the premise of not dismantling (testing needle is fixed on the needle stand of test machine); remove the trouble of repeated disassembled and assembled and measurement from, shorten milling time, improve grinding efficiency and protect testing needle; and the grinding situation of needle point can be monitored in real time; thus ensure that Grinding Quality efficiently, improve testing needle trace, it is ensured that test quality; improve the testing needle life-span, reduce production cost.
Accompanying drawing explanation
Fig. 1 is existing LED chip test philosophy schematic diagram.
Fig. 2 is the outward appearance diagram of the abnormal pin trace of existing LED chip test.
Fig. 3 is the structural representation of LED chip testing needle.
Fig. 4 is the structural representation of grinding tool in the present invention.
Fig. 5 is the testing needle trace schematic diagram after the inventive method is improved.
Wherein: 1, anelectrode, 2, negative electrode, 3, shallow pin trace, 4, minute hand trace, 5, broken pin trace, 6, bistrique, 7, abrasive material, 8, monitoring window, 9, grip shank.
Detailed description of the invention
During test LED chip, test a period of time there will be pin trace abnormal conditions, shallow pin trace 3, minute hand trace 4, broken pin trace 5 and voltage flower etc. as shown in Figure 2.It is intact for observing testing needle needle point under pin trace abnormal conditions, and needle point hairbrush or blowing are difficult to clean off chip, according to analysis, this is because long-time survey chip of pricking causes being stained with caused by metal fragment on pin.Chip outward appearance can be caused to downshift because pin trace is defective if continuing test.If directly needle point can be caused thicker with sand paper card grinding by traditional method, thus cause that testing is in the light affects the accuracy of optical parameter；If renewing pin, so can cause the testing needle lost of life, cost improves.
The present invention makes grinding tool according to the situation of test LED chip syringe needle bent angle, the i.e. card grinding when testing needle is fixed on needle stand, and after card grinding can the diameter of monitoring and test needle point in real time, i.e. under ensureing the basis not affecting test parameter and improving testing needle trace, continue test.
The method improving LED chip testing needle trace of the present invention, comprises the following steps:
(1) grinding tool as shown in Figure 4 is made according to the size and dimension of required testing needle, this grinding tool includes bistrique 6, abrasive material 7, monitoring window 8 and grip shank 9, grip shank 9 is fixedly connected on the outside of bistrique 6, for gripping whole grinding tool, conveniently pick and place up and down and left rotation and right rotation grinding tool, to grind the needle point of testing needle.Being provided with taper hole in bistrique 6, this taper hole is consistent with the pin wimble fraction shape of testing needle, and leaves certain gap, encounters testing needle during to prevent from picking and placeing.Abrasive material 7 is attached on the inwall of bistrique 6 taper hole bottom, and abrasive material 7 uses the waterproof abrasive paper about 2000 mesh, plays the effect grinding testing needle needle point during rotation.Monitoring window 8 it is provided with on bistrique 6, monitoring window 8 makes for transparent material, a vertical elongated slot can be opened on bistrique 6, monitoring window 8 sticks to long groove location, monitoring window 8 is above according to testing needle R angle test order mark scale (marking according to the taper hole cross-sectional diameter of bistrique 6), and whether the convenient in real time tip diameter that monitoring is ground meets the requirements.
Above-mentioned grinding tool is provided with the scale measuring tip diameter, can immediately determine whether tip diameter to meet the requirements in process of lapping, affects the accuracy of optical parameter test to avoid pin to be slightly in the light.And eliminate the step of repeated disassembled and assembled and measurement, shorten milling time, improve grinding efficiency and protect testing needle, and on the basis of ensureing test quality, extend the life-span of testing needle.
(2) in LED chip test process, occur that the needle point observing testing needle under the pin trace abnormal conditions such as shallow pin trace 3 as shown in Figure 2, minute hand trace 4, broken pin trace 5, voltage flower is the most intact, if needle point is intact, then with hairbrush or the chip removed on needle point of blowing, if be difficult to clean off, then using the abrasive needle point that step (1) makes, detailed process is:
Keeping testing needle to be fixed on needle stand (being fixed by needle stand by testing needle), the taper hole of bistrique 6 is directed at the needle point of testing needle by hand-held grip shank 9, makes the needle point of testing needle insert in the taper hole of bistrique 6, rotates bistrique 6, by abrasive material 7 to needle point grinding.Along with the dropping of bur on needle point in process of lapping, the fillet diameter of needle point diminishes, and moves down in the taper hole of bistrique 6, the diameter of needle point is monitored in real time by the scale on monitoring window 8, if the diameter of monitoring needle point is within the μm of required value error ± 1, it is simply that meeting the requirements, grinding terminates.As a example by example needle point 6 μm, the tip diameter error ground in ± 1 μm, i.e. meets the requirements between 5-7 μm.
(3) needle point ground after terminating is carried out pin trace test, check whether pin trace meets the requirements, be as shown in Figure 5 and reach requirement.
Claims (2)
1. the method improving LED chip testing needle trace, is characterized in that, comprises the following steps:
(1) grinding tool is made, this grinding tool includes bistrique, monitoring window and grip shank, grip shank is fixedly connected on bistrique, taper hole it is provided with in bistrique, it is attached with abrasive material on the inwall of bistrique taper hole, being provided with monitoring window on bistrique, monitoring window is provided with scale, in order to whether the tip diameter that monitoring is ground in real time meets the requirements；
(2) if there is pin trace abnormal conditions in LED chip test process, the needle point observing testing needle is the most intact, if needle point is intact, then with hairbrush or the chip removed on needle point of blowing, if be difficult to clean off, then use the abrasive needle point that step (1) makes；
(3) needle point ground after terminating is carried out pin trace test, check whether pin trace meets the requirements.
The most according to claim 1, the method improving LED chip testing needle trace, is characterized in that, in described step (2), the detailed process of the abrasive needle point that employing step (1) makes is:
Fixing testing needle, the taper hole of bistrique is directed at the needle point of testing needle by hand-held grip shank, makes the needle point of testing needle insert in the taper hole of bistrique, rotates bistrique, by abrasive material to needle point grinding；Along with the dropping of bur on needle point in process of lapping, the fillet diameter of needle point diminishes, and moves down in the taper hole of bistrique, the diameter of needle point is monitored in real time by the scale on monitoring window 8, if the diameter of monitoring needle point is within the μm of required value error ± 1, it is simply that meeting the requirements, grinding terminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280258.0A CN105823974B (en) | 2016-04-28 | 2016-04-28 | A method of improving LED chip testing needle trace |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610280258.0A CN105823974B (en) | 2016-04-28 | 2016-04-28 | A method of improving LED chip testing needle trace |
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| Publication Number | Publication Date |
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| CN105823974A true CN105823974A (en) | 2016-08-03 |
| CN105823974B CN105823974B (en) | 2018-08-17 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986412A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of surface treatment method for improving LED wafer grinding and scratching |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| CN115407176A (en) * | 2022-10-31 | 2022-11-29 | 长春光华微电子设备工程中心有限公司 | Calibration method for needle cleaning height difference and probe station |
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| CN103878150A (en) * | 2014-03-05 | 2014-06-25 | 上海华虹宏力半导体制造有限公司 | Probe cleaning method and probe cleaning device |
| CN204711702U (en) * | 2015-04-14 | 2015-10-21 | 辽宁科技大学 | A kind of magnetic grinding finishing device of cone object |
| CN105182208A (en) * | 2015-08-13 | 2015-12-23 | 山东浪潮华光光电子股份有限公司 | LED chip test method |
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2016
- 2016-04-28 CN CN201610280258.0A patent/CN105823974B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496342A (en) * | 1990-08-13 | 1992-03-27 | Nec Corp | Inspecting device for resistance |
| JPH05209896A (en) * | 1992-01-30 | 1993-08-20 | Sony Corp | Probe pin polisher of mounting board inspection device |
| CN1252745A (en) * | 1997-04-22 | 2000-05-10 | 美国3M公司 | Abrasive material for needle point of probe card |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986412A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of surface treatment method for improving LED wafer grinding and scratching |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| CN115407176A (en) * | 2022-10-31 | 2022-11-29 | 长春光华微电子设备工程中心有限公司 | Calibration method for needle cleaning height difference and probe station |
| CN115407176B (en) * | 2022-10-31 | 2023-01-03 | 长春光华微电子设备工程中心有限公司 | Calibration method for needle cleaning height difference and probe station |
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| Publication number | Publication date |
|---|---|
| CN105823974B (en) | 2018-08-17 |
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