CN105810620B - Chip transmits arm, wafer transfer device and chip retaining cushion - Google Patents
Chip transmits arm, wafer transfer device and chip retaining cushion Download PDFInfo
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- CN105810620B CN105810620B CN201410839869.5A CN201410839869A CN105810620B CN 105810620 B CN105810620 B CN 105810620B CN 201410839869 A CN201410839869 A CN 201410839869A CN 105810620 B CN105810620 B CN 105810620B
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Abstract
The present invention discloses a kind of chip transmission arm, wafer transfer device and chip retaining cushion, the transmission chip for fast and stable.The chip transmission arm includes shell, link mechanism, movable support division and load plate；The link mechanism includes that one group of connecting rod, one group of pivot and one group of S type band body connecting with the connecting rod, the link mechanism are coupled in the shell by the pivot；The S type band body is disposed around on the pivot, so that the pivot relatively rotates；Bulge-structure is provided on the pivot；The movable support division includes support block and interlocks push rod, and the gearing push rod is disposed in the housing by a coupling part, and its first end contradicts on the pivot；The second end for interlocking push rod is arranged in the support block；It is described when pivoting, it enables to the bulge-structure to contradict in the first end for interlocking push rod, pushes the gearings push rod to move to first position, and the support block is made to contact the chip on the load plate.
Description
Technical field
The present invention relates to wafer fabrication field more particularly to a kind of chip transmission arms, wafer transfer device and crystalline substance
Piece holding mechanism.
Background technique
With the fast development of science and technology, high-tech electronic product has been widely used in daily life, such as mobile phone, master
The electronic products such as plate, digital camera.It include many IC semiconductors inside these electronic products, and IC semiconductor
Material source be exactly chip.In order to meet the wilderness demand of high-tech electronic product, how chip manufacturing industry is making
The manufacturing process of chip more quickly, efficiently aspect, constantly carry out research and development and improvement.
The processing program of chip is sufficiently complex and accurate, generally comprises: positioning, lithographic, etching, impurity diffusion, ion
The technical process such as implantation, film deposition, cleaning.Transmission of the chip in each technical process is all made of mechanical arm completion.Machine
Tool arm transmits chip by the combination of the manner of execution such as flexible, lifting and rotation.Therefore mechanical arm transmission chip when
Between efficiency and the yield of board it is closely bound up, become influence chip manufacturing industry production cost an important factor for.
In addition, due to the effect of centrifugal force, it is be easy to cause wafer shift when the mobile fast speed of mechanical arm, into
And it may cause position of the chip in next process out of position, it is possible to create defective products.Meanwhile chip also may be used
It can be detached from mechanical arm, cause breakage.
Summary of the invention
Based on this, it is necessary to a kind of chip transmission arm for capableing of fast and stable transmission chip is provided,
A kind of chip transmits arm, for from a chip one side or the contact aside chip to transmit the chip, including
Shell, link mechanism, movable support division and load plate；One end of the load plate is fixedly connected with the shell, and the load plate is used
In placement chip；
The link mechanism includes one group of connecting rod, one group of pivot, one group of S type band body and one group of bulge-structure, the connecting rod
Mechanism is coupled in the shell by the pivot；The bulge-structure is arranged on the pivot；The S type band body, which encloses, to be set
On the pivot, and it is able to drive the pivot and is rotated to relative direction；The connecting rod is connect with the S type band body；
The movable support division includes the support block being connected and interlocks push rod, and the gearing push rod is set by a coupling part
It sets in the shell, and the first end for interlocking push rod contradicts on the pivot；The support block is arranged in the gearing
The second end of push rod；
It is described when pivoting, enable to the bulge-structure to contradict in the first end for interlocking push rod, and push
The gearing push rod is mobile to first position, and the support block is made to contact the chip placed on the load plate.
The other end of the load plate is provided with stopper section in one of the embodiments,.
The connecting rod is connect by spring with the S type band body in one of the embodiments,.
The movable support division further includes reset assembly in one of the embodiments, and the reset assembly setting exists
In the coupling part, for the gearing push rod to be moved to the second position.
The reset assembly is elastic material in one of the embodiments,.
The present invention also proposes a kind of wafer transfer device, can be simultaneously to extremely for holding up the chip from the back side of chip
A few chip is transmitted operation, transmits arm, the driving device and the crystalline substance including driving device and above-mentioned chip
Piece transmits arm connection, for driving the chip transmission arm mobile.
It the invention also proposes a kind of chip retaining cushion, is mounted on chip transmission arm, including shell, connecting rod machine
Structure and movable support division；
The link mechanism includes one group of connecting rod, one group of pivot, one group of S type band body and one group of bulge-structure, the connecting rod
Mechanism is coupled in the shell by the pivot；The bulge-structure is arranged on the pivot；The S type band body, which encloses, to be set
On the pivot, and it is able to drive the pivot and is rotated to relative direction；The connecting rod is connect with the S type band body；
The movable support division includes the support block being connected and interlocks push rod, and the gearing push rod is set by a coupling part
It sets in the shell, and the first end for interlocking push rod contradicts on the pivot；The support block is arranged in the gearing
The second end of push rod；
It is described when pivoting, enable to the bulge-structure to contradict in the first end for interlocking push rod, and push
The gearing push rod is mobile to first position.
The connecting rod is connect by spring with the S type band body in one of the embodiments,.
The movable support division further includes reset assembly in one of the embodiments, and the reset assembly setting exists
In the coupling part, for the gearing push rod to be moved to the second position.
The reset assembly is elastic material in one of the embodiments,.
Above-mentioned chip transmission arm, wafer transfer device and chip retaining cushion, can be in quick rotation, fast and stable
Transmission chip, the case where preventing the wafer shift occurred due to quick rotation or chip from falling off ensure that chip transmission
Stability and reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that chip of the present invention transmits arm one embodiment；
Fig. 2 is the schematic diagram of internal structure that chip of the present invention transmits arm one embodiment；
Fig. 3 is that movable when being located at the second position of gearing push rod in chip of the present invention transmission arm one embodiment is supported
Hold the schematic diagram in portion；
Fig. 4 is that the gearing push rod that chip of the present invention transmits in arm one embodiment is movable when mobile to first position
The schematic diagram of support division；
Fig. 5 is the signal that chip of the present invention transmits stopper section when the chip in arm one embodiment is not contacted with support block
Figure；
Fig. 6 be chip in chip of the present invention transmission arm one embodiment near to or in contact with stopper section when stopper section show
It is intended to；
Fig. 7 is the schematic diagram of connecting rod and S type with body connection type in chip of the present invention transmission arm one embodiment；
Fig. 8 is the structural schematic diagram of wafer transfer device one embodiment of the present invention；
Fig. 9 is the structural schematic diagram of chip retaining cushion one embodiment of the present invention；
Figure 10 is located at the schematic diagram when second position for the gearing push rod of chip retaining cushion one embodiment of the present invention；
Figure 11 is schematic diagram of the gearing push rod of chip retaining cushion one embodiment of the present invention to first position when mobile.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing to chip of the present invention
The specific embodiment of transmission arm, eyeglass transmission device and chip retaining cushion is illustrated.It should be appreciated that described herein
Specific embodiment be only used to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, in one embodiment, chip of the present invention transmits arm 100, for the one side or contact aside from chip
Chip is to transmit chip, including shell 110, link mechanism 120, movable support division 130 and load plate 140.One end of load plate 140
It is fixedly connected with shell 110, load plate 140 is for placing chip 300.
Referring to fig. 2, link mechanism 120 includes that one group of 121, one groups of connecting rod, 122, one groups of pivot S type band body 123 and one group are convex
Play structure 124.Link mechanism 120 is coupled within the case 110 by pivot 122.Bulge-structure 124 is arranged on pivot 122.S
Type band body 123 is disposed around on pivot 122, and is able to drive pivot 122 and is rotated to relative direction.Connecting rod 121 and S type band body 123
Connection.
Referring to Fig. 3, movable support division 130 includes the gearing push rod 131 being connected and support block 132.It is logical to interlock push rod 131
Cross a coupling part 134 setting within the case 110, and the first end 1311 for interlocking push rod 131 contradicts on pivot 122.Support block 132
The second end for interlocking push rod 131 is set.
Referring to fig. 4, above-mentioned chip transmits arm 100, when S type band body 123 drives pivot 122 to rotate to relative direction,
Bulge-structure 124 can be contradicted in the first end 1311 for interlocking push rod 131, pushed and interlocked push rod 131 to first position movement.Make
It obtains support block 132 and touches the chip 300 placed on load plate 140.Wherein, when gearing push rod 131 is located at the first position, support block
132 contact with chip 300.When gearing push rod 131 is located at the second position, support block 132 returns to the initial position before movement, not
It is contacted with chip 300.Above-mentioned chip transmits arm 100, is capable of the transmission chip 300 of fast and stable.
In the present embodiment, pivot 122 includes a ball bearing.In addition, S type band body 123 is steel band.Steel band is unlikely to deform,
Stability is good.But the present invention is not limited thereto, and in other embodiments, S type band body 123 can also be belt or chain belt.
Further, movable support division 130 further includes reset assembly 133, is arranged in coupling part 134.Reset assembly
133 for making gearing push rod 131 be moved to the second position.In the present embodiment, reset assembly 133 is elastic material.Specifically, multiple
Hyte part 133 can be spring, and but it is not limited to this.
Referring to figs. 5 and 6, the other end of load plate 140 is provided with stopper section 141.S type band 123 band of body of link mechanism 120
Dynamic pivot 122 is rotated to relative direction, so that bulge-structure 124 is contradicted to the first end 1311 for interlocking push rod 131.Interlock push rod
131 first end 1311, which pushes, interlocks push rod 131 to first position movement, so that support block 132 contacts on load plate 140
Chip 300.Chip 300 approaches or is resisted against stopper section 141 under the action of support block 132, it is possible to reduce chip 300 and backstop
The gap in portion 141.Chip 300 relatively firm can be clamped in load plate 140 by the chip transmission arm 100 in the present embodiment
On, it prevents chip 300 from shifting or falling off from load plate 140, can apply in the board for needing high speed rotation mobile.
Referring to Fig. 7, in one embodiment, connecting rod 121 and S type band body 123 are connected by spring 125.Spring 125 is set
It can pulling force with balanced connecting rod 121 to S type with body 123.In 140 quick moving in rotation of load plate, can allow chip 300 more
Stable is placed on load plate 140.
In the present embodiment, the material for interlocking push rod 131 is titanium alloy, and lighter in weight, intensity is high, and corrosion-resistant.At it
In his embodiment, the material of connecting rod push rod 131 can also be aluminium or stainless steel.In addition, in other embodiments, link mechanism
120 and movable support division 130 can also be ceramic material, to eroding chemical have preferable corrosion resistance.
In addition, interlocking push rod 131 is that dry type gearing push rod can be to avoid lubricant contamination chip 300 without lubricant.
In the present embodiment, the number of connecting rod 121, pivot 122, S type with body 123 and bulge-structure 124 is two.
The working principle of chip of the present invention transmission arm 100 is illustrated below.
After chip 300 is placed on load plate 140, an active force is applied on connecting rod 121.Connecting rod 121 drives S type band body
123 movements, so that pivot 122 is rotated to relative direction.Bulge-structure 124 is contradicted with the rotation of pivot 122 to gearing
In the first end 1311 of push rod 131.It is mobile to first position under the action of bulge-structure 124 to interlock push rod 131.Support block 132
Chip 300 is contacted, so that chip 130 is resisted against on stopper section 141.Start to transmit chip 300.
After chip 300 is sent to destination locations, the active force disappears.Under the action of reset assembly 133, gearing is pushed away
Bar 131 is moved to the second position.It is transmitted with preparing chip next time.
Referring to Fig. 8, the present invention also proposes a kind of wafer transfer device, can for holding up the chip from the back side of chip
Operation, including above-mentioned chip transmission arm 100 and driving device 200 are transmitted at least one chip simultaneously.Driving device
200 connect with chip transmission arm 100, to drive chip transmission arm 100 mobile.And the structure of chip transmission arm 100
Feature is as previously mentioned, details are not described herein.
Based on the same inventive concept, the present invention also proposes a kind of chip retaining cushion.Referring to Fig. 9, a kind of chip holding machine
Structure is mounted on chip transmission arm 100, for transmitting chip 300, including shell 110, link mechanism 120 and movable is supported
Hold portion 130.
Referring to Figure 10 and Figure 11, link mechanism 120 includes one group of 121, one groups of connecting rod, 122, one groups of pivot S type band body 123
With one group of bulge-structure 124.Link mechanism 120 is coupled within the case 110 by pivot 122.Bulge-structure 124 is arranged in pivot
On 122.S type band body 123 is disposed around on pivot 122, and is able to drive pivot 122 and is rotated to relative direction.Connecting rod 121 and S type
Band body 123 connects.
Movable support division 130 includes the gearing push rod 131 being connected and support block 132.It interlocks push rod 131 and passes through a coupling
The coupling setting of portion 134 within the case 110, and interlocks the conflict of first end 1311 of push rod 131 on pivot 122.Support block 132 is arranged
In the second end for interlocking push rod 131.
When S type band body 123 drives pivot 122 to rotate to relative direction, bulge-structure 124, which can contradict, is interlocking push rod
131 first end 1311 interlocks push rod 131 to first position movement to push.
In the present embodiment, S type band body 123 is steel band.Steel band is unlikely to deform, and stability is good.But the present invention is not limited thereto,
In other embodiments, S type band body 123 can also be belt or chain belt.
Further, movable support division 130 further includes reset assembly 133, is arranged in coupling part 134.Reset assembly
133 for making gearing push rod 131 be moved to the second position.In the present embodiment, reset assembly 133 is elastic material.Specifically, multiple
Hyte part 133 can be spring, but be not limited thereto.
Preferably, connecting rod 121 and S type band body 123 are connected by spring 125.Spring 125 is arranged can be with balanced connecting rod 121
Pulling force to S type with body 123.
In the present embodiment, the material for interlocking push rod 131 is titanium alloy, and weight is small, and intensity is high, and corrosion-resistant.At other
In embodiment, the material for interlocking push rod 131 can also be aluminium or stainless steel.In addition, in other embodiments, 120 He of link mechanism
Movable support division 130 can be ceramic material, have preferable corrosion resistance to eroding chemical.
In addition, interlocking push rod 131 is that dry type gearing push rod can be to avoid lubricant contamination chip 300 without lubricant.
In the present embodiment, the number of connecting rod 121, pivot 122, S type with body 123 and bulge-structure 124 is two.
Above-mentioned chip transmission arm, wafer transfer device and chip retaining cushion, can with the transmission chip of fast and stable, and
The case where capable of preventing the wafer shift occurred due to quick rotation or chip from falling off, ensure that chip transmission stability and
Reliability.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of chip transmits arm, for from a chip one side or the contact aside chip to transmit the chip, feature
It is, including shell, link mechanism, movable support division and load plate；One end of the load plate is fixedly connected with the shell, institute
Load plate is stated for placing chip；
The link mechanism includes one group of connecting rod, one group of pivot, one group of S type band body and one group of bulge-structure, the link mechanism
It is coupled in the shell by the pivot；The bulge-structure is arranged on the pivot；The S type band body is disposed around institute
It states on pivot, and is able to drive the pivot and is rotated to relative direction；The connecting rod is connect with the S type band body；
The movable support division includes the support block being connected and interlocks push rod, and the gearing push rod is arranged by a coupling part
In the shell, and the first end for interlocking push rod contradicts on the pivot；The support block is arranged in the gearing push rod
Second end；
It is described to enable to the bulge-structure to contradict in the first end for interlocking push rod when pivoting, and described in pushing
It is mobile to first position to interlock push rod, and the support block is made to contact the chip placed on the load plate.
2. chip according to claim 1 transmits arm, which is characterized in that the other end of the load plate is provided with backstop
Portion.
3. chip according to claim 1 transmits arm, which is characterized in that the connecting rod passes through spring and the S type band
Body connection.
4. chip according to claim 1 transmits arm, which is characterized in that the movable support division further includes reset group
Part, the reset assembly is arranged in the coupling part, for the gearing push rod to be moved to the second position.
5. chip according to claim 4 transmits arm, which is characterized in that the reset assembly is elastic material.
6. a kind of wafer transfer device can simultaneously pass at least one chip for holding up chip from the back side of chip
Send operation, including driving device, which is characterized in that further include chip transmission arm described in any one of claim 1 to 5, institute
It states driving device to connect with chip transmission arm, for driving the chip transmission arm mobile.
7. a kind of chip retaining cushion, it is mounted on chip transmission arm, which is characterized in that including shell, link mechanism and can
Dynamic formula support division；
The link mechanism includes one group of connecting rod, one group of pivot, one group of S type band body and one group of bulge-structure, the link mechanism
It is coupled in the shell by the pivot；The bulge-structure is arranged on the pivot；The S type band body is disposed around institute
It states on pivot, and is able to drive the pivot and is rotated to relative direction；The connecting rod is connect with the S type band body；
The movable support division includes the support block being connected and interlocks push rod, and the gearing push rod is arranged by a coupling part
In the shell, and the first end for interlocking push rod contradicts on the pivot；The support block is arranged in the gearing push rod
Second end；
It is described to enable to the bulge-structure to contradict in the first end for interlocking push rod when pivoting, and described in pushing
It is mobile to first position to interlock push rod.
8. chip retaining cushion according to claim 7, which is characterized in that the connecting rod passes through spring and the S type band
Body connection.
9. chip retaining cushion according to claim 7, which is characterized in that the movable support division further includes reset group
Part, the reset assembly is arranged in the coupling part, for the gearing push rod to be moved to the second position.
10. chip retaining cushion according to claim 9, which is characterized in that the reset assembly is elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410839869.5A CN105810620B (en) | 2014-12-30 | 2014-12-30 | Chip transmits arm, wafer transfer device and chip retaining cushion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410839869.5A CN105810620B (en) | 2014-12-30 | 2014-12-30 | Chip transmits arm, wafer transfer device and chip retaining cushion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105810620A CN105810620A (en) | 2016-07-27 |
| CN105810620B true CN105810620B (en) | 2018-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410839869.5A Active CN105810620B (en) | 2014-12-30 | 2014-12-30 | Chip transmits arm, wafer transfer device and chip retaining cushion |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078087A (en) * | 2021-03-25 | 2021-07-06 | 中国电子科技集团公司第四十八研究所 | Substrate conveying device suitable for epitaxial furnace |
| CN217903092U (en) * | 2022-09-02 | 2022-11-25 | 台湾积体电路制造股份有限公司 | Positioning device and wafer clamping system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204361068U (en) * | 2014-12-30 | 2015-05-27 | 亦立科技有限公司 | Wafer transmits arm, wafer transfer device and chip retaining cushion |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5955858A (en) * | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
| US6817640B2 (en) * | 2001-06-28 | 2004-11-16 | Applied Materials, Inc. | Four-bar linkage wafer clamping mechanism |
| JP2005118913A (en) * | 2003-10-14 | 2005-05-12 | Hemmi Slide Rule Co Ltd | Holding device for thin disk |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204361068U (en) * | 2014-12-30 | 2015-05-27 | 亦立科技有限公司 | Wafer transmits arm, wafer transfer device and chip retaining cushion |
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| CN105810620A (en) | 2016-07-27 |
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