CN105807652A - Smart control system and control method for smart solid-state relay - Google Patents
Smart control system and control method for smart solid-state relay Download PDFInfo
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- CN105807652A CN105807652A CN201610127427.7A CN201610127427A CN105807652A CN 105807652 A CN105807652 A CN 105807652A CN 201610127427 A CN201610127427 A CN 201610127427A CN 105807652 A CN105807652 A CN 105807652A
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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Abstract
The invention relates to a smart control system and control method for a smart solid-state relay. The system includes smart solid-state relays having unique codes, a data bus and a control center establishing communication with the smart solid-state relays through the data bus. The smart solid-state relays obtain control signals from the control center through the data bus and feed a comprehensive protection function of the smart solid-state relays and the working state of a load back to the control center via an I/P interface through the data bus. Therefore, a bidirectional communication function of bidirectional data input and output between the smart solid-state relays and the control center is realized.
Description
Technical field
The present invention relates to the intelligent control technology depending on computer, the Intelligent control system of especially a kind of intelligent solid-state relay and control method, the base layer data being applied in industrial automatic control well to dock with manufacture execution system (MES), can produce in enormous quantities and existing Multi-varieties and Small-batch Production have again the mixed type manufacturing enterprise of production in enormous quantities to provide good control method and enterprise information management single, be also applied for networking, big data message feedback provides good information basis.
Background technology
Currently possess the Intelligent single-phase ac solid relay (pressure regulator) of automatic protection functions, intelligent three-phase ac solid relay (power regulating eqiupment), intelligent DC solid-state relay, be widely used in the occasion such as industrial motor, controlled resistive heater.This kind of intelligent solid-state relay passes through setpoint power output, is accurately controlled bearing power, for the regulation and control of the temperature in Industry Control, rotating speed, flow, brightness etc..
Intelligent solid-state relay is distinctive in that with normal conventional solid-state relay is maximum: normal conventional solid-state relay only opens (conducting) or (cut-off) two states of closing, and intelligent solid-state relay is except having out (conducting) or (cut-off) two states of closing, also have one to open, intermediateness between pass, namely intelligently the objective condition worked is carried out electric current, voltage, temperature rationally senses analysis, judge and effectively fast react and effectively process, and possess and fill part protection intelligent solid-state relay device and payload security itself, the integration capability of highly reliable operation.Additionally, also have one group to export intelligent solid-state relay and the signal of the load operating condition driven to Data Control Center, to meet the needs that industrial automation produces.
Summary of the invention
It is an object of the invention to: Intelligent control system and the control method of a kind of intelligent solid-state relay are provided, it is applied to intelligent solid-state relay and well docks base layer data with manufacture execution system (MES) in industrial automatic control, it is possible to have again the mixed type manufacturing enterprise of production in enormous quantities to provide good control method and enterprise information management with existing Multi-varieties and Small-batch Production single producing in enormous quantities；Be alternatively Internet of Things, big data message feedback system provides good information basis.
They are two years old, it is provided that a kind of intelligent solid-state relay suitable in above-mentioned control system.
The foregoing invention purpose of the present invention is achieved through the following technical solutions:
The Intelligent control system of this intelligent solid-state relay that the present invention proposes, including possessing the single intelligent solid-state relay individuality of unique code, data/address bus and being set up the control centre of signal communicating by data/address bus and intelligent solid-state relay individuality；Described intelligent solid-state relay obtains the mandatory control signal of control centre from data/address bus and further through, data/address bus, by I/O interface, the duty of intelligent solid-state relay synthetic defencive function Yu load is fed back to control centre, is achieved in the two-way communication manipulation function of the bi-directional data input between intelligent solid-state relay and control centre, output.
Described control centre is the PLC industry control center built, or terminal.
The present invention provides the Intelligent control system of a kind of intelligent solid-state relay, and the single intelligent solid-state relay individuality of employing possesses unique code, input service signals collecting, output services signals collecting, working state signal collection and the performance of various collection signal logic and processing method.
The Intelligent control system of above-mentioned in actual use intelligent solid-state relay is according to the difference of working power, it is possible to be divided into: blow-up (directly) stream intelligent solid-state relay control method and three-phase alternating current intelligent solid-state relay control method
When adopting blow-up (directly) stream power supply, its control method is as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay.
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
In reality manipulates, when intelligent solid-state relay is in output services signals D stage, this output services signal except being carried out the judgement of the correctness of output services signal by intelligent solid-state relay；Being also carried out short-circuit protection detection simultaneously, show malfunction once short-circuit detecting, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Additionally, when intelligent solid-state relay is in working signal E-stage, these output services status signal E except being carried out the judgement of the correctness of the working state signal to output by intelligent solid-state relay；Being also carried out overtemperature protection detection simultaneously, be in overheating fault state once judgement, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Wherein when adopting three-phase alternating-current supply, its control method is as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay.
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
In reality manipulates, when intelligent solid-state relay is in output control signal C-stage, this output control signal C except being carried out the judgement of the correctness of output control signal C by intelligent solid-state relay；Being also carried out phase of three-phase voltage detection, once there is open-phase fault state, this output control signal C exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work simultaneously.
Additionally, when intelligent solid-state relay is in output services signals D stage, these output services signal D except being carried out the judgement of the correctness of output services signal D by intelligent solid-state relay；Being also carried out three phase short circuit fault detection, once there is short trouble state, these output services signal D exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work simultaneously.
Additionally, when intelligent solid-state relay is in working signal E-stage, these output services status signal E except being carried out the judgement of the correctness of the working state signal to output by intelligent solid-state relay；Being also carried out overtemperature protection detection simultaneously, be in overheating fault state once judgement, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
As to further improvement of the present invention, the present invention provides Intelligent control system and the control method of a kind of intelligent solid-state relay, it is also possible to take following several improvement:
Work input Gather and input signal at intelligent solid-state relay.
Working outputs collection at intelligent solid-state relay exports signal.
Signal is exported in intelligent solid-state relay duty end collection.
Single intelligent solid-state relay individuality is utilized to possess the various data collected such as unique code data, input service signals collecting data, output services signals collecting data, working state signal collection data, by Logical presentation and AD conversion, by the feedback output of I/O interface to data/address bus, to guarantee instantaneous operating conditions and to process in time.
Utilize intelligent solid-state relay collection output signal to be docked with data/address bus by USB2.0 interface, and obtain the data feedback of control centre's signal from data/address bus.
This intelligent solid-state relay, including: integral Al-alloy heat-dissipating casing, installation base plate, metal guide hot plate, function sensing pcb board, panel, electric current inductive transducer, power semiconductor device；Wherein power semiconductor device has leading-out terminal；Described power semiconductor device is fixed on installation base plate；Described installation base plate is directly welded on integral Al-alloy heat-dissipating casing；Described electric current inductive transducer is sleeved on leading-out terminal；Described function sensing pcb board is fixed on described leading-out terminal；Described leading-out terminal and sensing pcb board lead-out wire are all connected with described panel；Described integral Al-alloy heat-dissipating casing metal guide hot plate described with above described power semiconductor device is connected, and constitutes a conduction of heat closed-loop path, and has good electromagnetic compatibility (EMC) capacity of resisting disturbance；Described installation base plate is ceramic copper-clad plate, and installation base plate is directly welded on integral Al-alloy heat-dissipating casing；Described power semiconductor device is enhancement mode controlled silicon chip group or High Performance Insulation transistor npn npn chipset；Described function sensing pcb board is provided with excess voltage protection, thermal-shutdown circuit and working state signal output circuit.
Described electric current sensing sensing circuit includes: regulate resistance, output resistance, small-sized rectifier bridge stack, unidirectional triggering controllable silicon, electric current inductive transducer and optocoupler；Described adjustment resistor coupled in parallel is at the two ends of the coil of electric current inductive transducer；The described input of small-sized rectifier bridge stack is connected with the two ends of coil, and outfan is connected with the input of optocoupler；One outfan of described unidirectional triggering silicon controlled positive pole and the first outfan, optocoupler is connected；Negative pole and the second outfan are connected, trigger electrode is connected with another outfan of optocoupler through output resistance.
Described excess voltage protection includes varistor, current-limiting resistance, bidirectional trigger diode and light emitting diode；Described varistor is connected in parallel on described power semiconductor device；Described current-limiting resistance, described bidirectional trigger diode, described light emitting diode positive pole series connection after, in parallel with described varistor.
Described thermal-shutdown circuit includes two temperature sensors, and next-door neighbour's power semiconductor device is arranged.
Described described light emitting diode is in parallel with the small-sized rectifier bridge stack of one, by exporting a DC operation status signal after rectification, feeds back to control centre.
The Intelligent control system of this intelligent solid-state relay proposed according to above technical scheme and control method, and it is applicable to the intelligent solid-state relay of above-mentioned TT&C system, intelligent solid-state relay is utilized to be provided with out outside (conducting) or (cut-off) two states of closing, also have one to open, intermediateness between pass, namely intelligence the objective condition worked is carried out electric current, voltage, temperature rationally senses analysis, judge and effectively fast react and effectively process, and possess and fill part protection intelligent solid-state relay device and payload security itself, the integration capability of highly reliable operation.And have one group to export intelligent solid-state relay and the signal of the load operating condition driven to control centre, to meet the needs that industrial automation produces.
Accompanying drawing explanation
Fig. 1 is the control system schematic diagram of the intelligent solid-state relay that the present invention relates to；
Fig. 2 is blow-up (directly) stream intelligent solid-state relay operation method flow schematic diagram；
Fig. 3 is three-phase alternating current intelligent solid-state relay operation method flow schematic diagram；
Fig. 4 is applied to the structural representation of a kind of intelligent solid-state relay of the present invention；
Fig. 5 is the circuit diagram of the AC single phase intelligent solid-state relay being applied to the present invention.
Fig. 6 is the structural representation of the AC three-phase intelligent solid-state relay being applied to the present invention.
Fig. 7 is applied to the circuit diagram of the DC intelligent solid-state relay of the present invention.
Detailed description of the invention
The present invention is expanded on further below in conjunction with accompanying drawing, and the present invention is expanded on further in conjunction with embodiments of the invention.
This including as shown in Figure 1 is possessed the single intelligent solid-state relay individuality of unique code, data/address bus and is set up the control centre of signal communicating by data/address bus and intelligent solid-state relay individuality；Described intelligent solid-state relay obtains control centre's control signal from data/address bus and further through, data/address bus, by I/O interface, the duty of intelligent solid-state relay synthetic defencive function Yu load is fed back to control centre, is achieved in the bi-directional communication function of the bi-directional data input between intelligent solid-state relay and control centre, output.
Described control centre is the PLC industry control center built, or terminal.
The intelligent solid-state relay control method schematic flow sheet for adopting blow-up (directly) stream power supply that Fig. 2 provides.
The intelligent solid-state relay control method of this employing blow-up (directly) stream power supply is as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay.
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Additionally, when intelligent solid-state relay is in output services signals D stage, this output services signal except being carried out the judgement of the correctness of output services signal by intelligent solid-state relay；Being also carried out short-circuit protection detection simultaneously, show malfunction once short-circuit detecting, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Additionally, when intelligent solid-state relay is in working signal E-stage, these output services status signal E except being carried out the judgement of the correctness of the working state signal to output by intelligent solid-state relay；Being also carried out overtemperature protection detection simultaneously, be in overheating fault state once judgement, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Fig. 3 is the intelligent solid-state relay control method adopting three-phase alternating-current supply.
Intelligent solid-state relay operation method during this employing three-phase alternating-current supply is as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay.
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
Additionally, when intelligent solid-state relay is in output control signal C-stage, this output control signal C except being carried out the judgement of the correctness of output control signal C by intelligent solid-state relay；Being also carried out phase of three-phase voltage detection, once there is open-phase fault state, this output control signal C exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work simultaneously.
The intelligent solid-state relay construction that Fig. 4-Fig. 7 provides includes: integral Al-alloy heat-dissipating casing 1, soldering-tin layer 2, installation base plate (DBC) 3, metal guide hot plate 4, function sensing pcb board 5, leading-out terminal 6, panel 7, electric current inductive transducer 8, semiconductor electric chip group 9 form.
Semiconductor electric chip group 9 solidified welding is on installation base plate (DBC) 3, semiconductor electric chip group 9 can be great power bidirectional controllable silicon, can also be the enhancement power control device of two high-power one-way SCR reverse parallel connections formation, more than be all applied to AC control circuit.Can also is that high-power High Performance Insulation transistor npn npn (IGBT) or high-power FET (MOS), be applied to DC control circuit.Semiconductor electric chip group 9 can form single group (exchanging unidirectional or DC application), twin-core group (exchanging unidirectional enhancement mode), three core group (three-phase alternating current) and six core groups (three-phase alternating current enhancement mode) by difference in functionality.In order to strengthen the calorific intensity of installation base plate (DBC) 3, unsuitable multicore is with one piece of substrate, no more than three core.The soldering-tin layer 2 that the welded installation base plate of chipset (DBC) 3 is formed by middle temperature stannum slurry is directly welded on integral Al-alloy heat-dissipating casing 1, can increase area of dissipation, raising power density.
Being provided above a nugget genus heat-conducting plate 4 in semiconductor electric chip group 9, two ends are closely coupled with integral Al-alloy heat-dissipating casing 1, constitute a conduction of heat closed-loop path.So very effective operating temperature in semiconductor electric chip group 9 of energy, we are called junction temperature, are quickly transmitted to integral Al-alloy heat-dissipating casing 1, make junction temperature Tong Bu with shell temperature.Improve the electrical power density of intelligent solid-state relay.And effectively shield the electromagnetic interference produced when semiconductor electric chip group 9 works and not by external electromagnetic wave action, there is good electromagnetic compatibility (EMC) function.
Using the leading-out terminal 6 of semiconductor electric chip group 9 as support, electric current inductive transducer 8 is set in.According to different job requirements, function needs, can making different function sensing pcb boards 5 again, in the present embodiment, excess voltage protection, thermal-shutdown circuit and short-circuit protection circuit are just arranged on function sensing pcb board 5.Function sensing pcb board 5 is also using the leading-out terminal 6 of semiconductor electric chip group 9 as support; can multilamellar polylith; three-dimensional installation; in the present embodiment; sensing pcb board 5 is two-layer three pieces; respectively thermal-shutdown circuit (5-1) and excess voltage protection, control signal export (5-2) is one layer two pieces, and short-circuit (crossing stream) protection circuit (8) is that independently one piece of function senses pcb board.Finally mix High-heat-conductiviinsulation insulation material by silica dioxide granule and IC special glue to have encapsulated.
Fig. 5 is the circuit diagram of AC single phase intelligent solid-state relay.
As shown in Figure 5, connecting with the circuit of semiconductor electric chip group (AC single phase enhancement mode controlled silicon chip group) and illustrate, semiconductor electric chip group 9 (AC single phase enhancement mode controlled silicon chip group) is made up of two high-power unidirectional controllable silicon S CR1, SCR2 reverse parallel connection.
Thermal-shutdown circuit (5-1) includes the first temperature sensor R1 and the second temperature sensor R2.First temperature sensor R1 is PCT temperature sensor, and one end is connected with panel 7 first input end Vin1, and the other end is connected with the trigger electrode of the unidirectional controllable silicon S CR1 of enhancement mode controlled silicon chip.
Second temperature sensor R2 is also PCT temperature sensor, and one end is connected with panel 7 second input Vin2, and the other end is connected with the trigger electrode of the unidirectional controllable silicon S CR2 of enhancement mode controlled silicon chip.First temperature sensor R1, the second temperature sensor R2 are separately positioned on the top of unidirectional controllable silicon S CR1, SCR2.
Excess voltage protection and control signal output (5-2) including: varistor R3, current-limiting resistance R4, bidirectional trigger diode D1, light emitting diode D2 and small-sized rectifier bridge stack D3.
Varistor R3 is connected in parallel on enhancement mode controlled silicon chip, and two ends are connected with two outfan junction points of two high-power unidirectional controllable silicon S CR1, SCR2 respectively.
Current-limiting resistance R4, bidirectional trigger diode D1, light emitting diode D2 positive pole series connection after, in parallel with varistor R3, namely in parallel with enhancement mode controlled silicon chip.
Light emitting diode D2 is connected with small-sized rectifier bridge stack D3 input, exports DC operation status signal Vout3, a Vout4 after over commutation.
Electric current sensing sensing circuit 8 includes: regulate resistance R5, output resistance R6, small-sized rectifier bridge stack D4, unidirectional triggering controllable silicon SCR 3, electric current inductive transducer L and optocoupler IC.
The coil of electric current inductive transducer L is enclosed within the leading-out terminal of enhancement mode controlled silicon chip.Regulate resistance R5 and be connected in parallel on the two ends of coil.The small-sized input of rectifier bridge stack D4 is connected with the two ends of coil, and outfan is connected with the input of optocoupler IC.One outfan of the positive pole of unidirectional triggering controllable silicon SCR 3 and the first output end vo ut1, optocoupler IC is connected；Negative pole and the second output end vo ut2 are connected, trigger electrode is connected through another outfan of output resistance R6 and optocoupler IC.
In circuit diagram, all of input control signal Vin1, Vin2 are connected with panel 7 with output signal Vout1, Vout2, Vout3, Vout4.
Two leading-out terminals 6 are connected with the junction point of two unidirectional controllable silicon S CR1 of enhancement mode controlled silicon chip, SCR2 and are connected panel respectively.
The work process of the general protective circuit of AC single phase intelligent solid-state relay:
The signal of telecommunication controlling switch is obtained by panel, a control signal being switched on or off is inputted from first input end Vin1 and the second input Vin2 end, by the first temperature sensor R1, second temperature sensor R2, trigger two unidirectional controllable silicon S CR1, SCR2, namely enhancement mode controlled silicon chip, obtain signal and drive on or off work main circuit, PTC temperature sensor R1, R2 is respectively arranged at two unidirectional controllable silicon S CR1, the top of SCR2, it is mixed into High-heat-conductiviinsulation insulation material encapsulation by silica dioxide granule and IC special glue, the instant real-time chip operating temperature of conduction of heat of energy, the resistance value making the first temperature sensor R1 and the second temperature sensor R2 produces respective change with the operating temperature of chip.It it is 120 DEG C typically up to design temperature.As exceeded this design temperature point, unidirectional controllable silicon S CR1, SCR2 just turn off work main circuit.This is also the process of an Automatic-searching thermal balance operating current.Namely ensure that semiconductor electric chip will not cross cause thermal damage, autobalance can find a best operating point again.
The Special display absorbing circuit that excess voltage protection is made up of varistor R3, current-limiting resistance R4, diac D1 and light emitting diode D2 is constituted; too high voltage and the noise (lightning surge) of external environment condition generation can be absorbed, also have the shutoff crest voltage etc. that inductive load occurs.Also can show the duty of power semiconductor device in real time.
Crossing stream (short circuit) protection circuit is be enclosed within SCR1, SCR2 leading-out terminal by electric current inductive transducer L coil, available one, it is possible to two.Regulate the output voltage of the induction coil of resistance R5 adjustable current inductive transducer L, a DC voltage is obtained by small-sized rectifier bridge stack D3, drive optocoupler IC output, a switching signal Vout1 and Vout2 is obtained by output resistance R6 and unidirectional triggering controllable silicon SCR 3, this is one and is forced shutdown signal, this signal is by the unidirectional triggering SCR control of unidirectional triggering controllable silicon SCR 3, operating characteristic according to this device is reached a conclusion, once there is stream (short circuit) state, must to controlling load maintenance down after crossing stream (short circuit) protection circuit start work in device, and turn off input control signal could work, there is a restarting process, guarantee safety.Cross stream (short circuit) to start operating current and can be set as 150%, 200%, 300% etc. according to different semiconductor electric chip rated capacities, to avoid being likely to produce too much misoperation.
Fig. 6 is the structural representation of AC three-phase intelligent solid-state relay.
As shown in Figure 6, AC three-phase intelligent solid-state relay construction is similar with the structural representation of intelligent solid-state relay, including: integral Al-alloy heat-dissipating casing 1, soldering-tin layer 2, installation base plate (DBC) 3, metal guide hot plate 4, function sensing pcb board 5, leading-out terminal 6, panel 7, electric current inductive transducer 8, semiconductor electric chip group 9 form.But semiconductor electric chip group 9 is made up of semiconductor electric chip group three groups identical and independent.
AC three-phase intelligent solid-state relay is made up of AC single phase intelligent solid-state relay three groups identical.Sharing one piece of panel, circuit diagram is just not repeated.It should be mentioned that three groups identical and independent semiconductor electric chip group 9 of three-phase intelligent solid-state relay is operationally owing to generating heat simultaneously.Three groups of chip heat interfere simultaneously, the chipset of centre can be made to be subject under the heat effect on adjacent two sides and be in worst state.Often other prior to two chip is early than cause thermal damage.At this moment under the effect of metal guide hot plate 4, well the heat balance of intermediate chip is diffused into integral Al-alloy heat-dissipating casing 1, and can well shield the High energy electromagnetic interference of generation.
Fig. 7 is the circuit diagram of DC intelligent solid-state relay.
As it is shown in fig. 7, the circuit diagram of DC intelligent solid-state relay, sensed sensing circuit 8 by thermal-shutdown circuit 5-1, excess voltage protection 5-2 and electric current equally and constitute.
Thermal-shutdown circuit 5-1 includes the first temperature sensor R1 and the second temperature sensor R2.First temperature sensor R1 is PCT temperature sensor, and the second temperature sensor R2 is NTC temperature sensor.
One end of first temperature sensor R1 is connected with first input end Vin1, the base stage of the other end and High Performance Insulation transistor npn npn IGBT.One end of second temperature sensor R2 is connected with earth terminal GND, the other end also with the base stage of High Performance Insulation transistor npn npn IGBT.
A PWM switch or PLC industry control message is inputted by first input end Vin1, High Performance Insulation transistor npn npn (IGBT) work is driven by PTC temperature sensor R1 and the NTC temperature sensor R2 temperature-control circuit formed, when producing excess temperature phenomenon, generally it is also set to 120 DEG C.The resistance value of PTC temperature sensor R1 and NTC temperature sensor R2 can produce respective change with the temperature that senses, and PTC is positive temperature sensor R1, increases resistance value with the increase of temperature, and NTC temperature sensor R2 is the increase with temperature and resistance value reduces.So, the grid of High Performance Insulation transistor npn npn IGBT can obtain a more sensitive protection.A thermal balance function can be automatically generated.Intelligent is operated in a suitable operating current.Due to setting up of NTC temperature sensor R2, the grid for ensureing High Performance Insulation transistor npn npn IGBT is quite not useful by electrostatic breakdown yet.So that the protection that power semiconductor device is more sophisticated.
Excess voltage protection and control signal output (5-2) including: varistor R3, current-limiting resistance R4, light emitting diode D2.
Varistor R3 is connected in parallel on High Performance Insulation transistor npn npn igbt chip colelctor electrode and emitter stage, and two ends are connected with two outfan junction points of High Performance Insulation transistor npn npn IGBT respectively.
Current-limiting resistance R4, light emitting diode D2 positive pole series connection after, in parallel with varistor R3, namely in parallel with High Performance Insulation transistor npn npn igbt chip.
Light emitting diode D2 bis-end output one DC operation status signal Vout3, Vout4.
Electric current sensing sensing circuit 8 includes: measuring shunt resistance R5, adjustment resistance R6, output resistance R7, unidirectional triggering controllable silicon SCR 1 and optocoupler IC.
Crossing stream (short circuit) protection circuit is obtained a running voltage by with High Performance Insulation transistor npn npn IGBT emitter stage with meeting the measuring shunt resistance R5 that gnd electrode connects.Optocoupler IC output is driven by regulating the running voltage of resistance R6 adjustable measuring shunt resistance R5.Other circuit operation principle is identical with Fig. 5 embodiment one, and explanation is not repeated.
Effect and the operation principle of intelligent solid-state relay are as follows:
The general disabling damage form of intelligent solid-state relay is excess temperature, short circuit and overvoltage.For intelligent solid-state relay, it is simply that the temperature of device inside, electric current and voltage will be had one relatively rapid, measure accurately, and be effectively controlled at device inside rapidly, to complete the integrated protection to intelligent solid-state relay.According to our product test at present both at home and abroad some solid-state relays professional production company, the performance that excess temperature phenomenon is typically in shell is relatively slower, but actually excess temperature can produce heat exhaustion, has temperature cycle model and power cycle pattern two kinds.Under temperature cycle model, referring to that solid-state relay finally quits work from starting to start to, device outer case surface has one to compare temperature changing process (shell temperature) slowly.Under power cycle pattern, in device, the variations injunction temperature of chip is frequent, the acute variation of each junction temperature all closely related with changed power (junction temperature).This will cause one of factor that solid-state relay excess temperature disabling damage must consider.If as far as possible make junction temperature consistent with shell temperature, this is for decisive significance that the service life of solid-state relay, prolongation was.It is accomplished by except semiconductor electric chip is by installation base plate (DBC) heat radiation, in addition it is also necessary to be provided above metal guide hot plate at chip, constitute a conduction of heat closed-loop path.Two, measuring junction temperature in addition overheat protector from semiconductor electric chip minimum distance.Experiment according to us, overheat protector also can produce a thermally equilibrated phenomenon, namely automatically the electric current of output is declined, is limited in certain scope.This is highly beneficial.This also in a disguised form improves the power density of intelligent solid-state relay.
In order to meet industrial 4.0 requirements, the intelligent solid-state relay adopted must have good Electro Magnetic Compatibility (EMC), and electronic equipment neither disturbs other equipment, simultaneously also not by the impact of other equipment, especially also not by the impact of other equipment；Particularly under computer light current working condition.According to test, relative to with under the comparable operating conditions without metal guide hot plate, amount of electromagnetic radiation 85% after having used metal heat-conducting, can be reduced.
Short-circuit failure is protected, although the probability of generation is not high, but the consequence produced is disastrous, it is necessary to protected within the us level time, otherwise will make device permanent damage.This is also the reason needing just to obtain fastest response in intelligent solid-state relay device.
Overvoltage fail safe is fairly simple, and the schemes such as TVS, varistor and Special display absorbing circuit that can use solve.
The effect of intelligent solid-state relay device is often superposition by three of the above disabling damage form, if the junction temperature of chip of device is when 120 DEG C, when producing overcurrent or short circuit again, the material being connected with each other employing between power semiconductor device chip is different, there are the chip of silicon materials, copper or aluminum connecting line, the tin layers of welding and the copper composite surface of insulated substrate, the thermal coefficient of expansion of they various materials is different, will produce stress inconsistent.And overcurrent or short circuit phenomenon exacerbate the frequent temperature rise of device.Easily cause power semiconductor device internal injury.So in order to avoid this synergistic effect, it is necessary to effectively controlled inside intelligent solid-state relay device.
Overheat protector all passes through current related with intelligent solid-state relay with short circuit (crossing stream) protection; we are set by temperature sensor and current sensor in device; in 150% scope of the rated operational current of intelligent solid-state relay, belong to overheat protector scope, exceed the scope that this rated current short circuit exactly (crossing stream) is protected.The work of device must be stopped immediately.Intelligent solid-state relay must from being entirely conducting to shutoff (cut-off) state within the us second level time.The power density that so can improve intelligent solid-state relay can ensure that again device safety.
Also just like intelligent solid-state relay overvoltage phenomenon effectively not being protected, most possible is exactly produce partial breakdown, and this puncturing can make intelligent solid-state relay operationally extremely unstable, accelerates the damage of intelligent solid-state relay.In order to reach this special requirement of intelligent solid-state relay, work highly reliable, steady in a long-term.Above three comprehensively precisely defencive function must chip-scale must with reliably protecting in intelligent solid-state relay device.Reach intellectualized module (IPM) to control.
The power semiconductor devices such as enhancement mode controllable silicon, bidirectional triode thyristor or High Performance Insulation transistor npn npn (IGBT) chip are welded on the installation base plate DBC (ceramic copper-clad plate) of power semiconductor device.A suitable inductive spacing is reserved between two or multiple chip.On the top of enhancement mode controllable silicon (GTO) or High Performance Insulation transistor npn npn (IGBT) chip, one thermally conductive insulating layer is set, install with 3D form solid single or multiple lift superposition again and there is the function such as temperature, overcurrent, overvoltage sensing sensing pcb board, so can with do not increase on former chip package area basis with nearest location sensitive to electric semiconductor power chip temperature, electric current, change in voltage.
Above-mentioned functions sensing pcb board, is a kind of function sensing pcb board that can arbitrarily arrange function, it is possible to being the function sensing pcb board of one piece of simple function, as temperature has detection function, that just uses temperature sensor.Need in this way temperature, electric current are required, it is possible to power up influenza induction sensor with temperature sensor.Can certainly being Full Featured, that just arranges temperature sensor, electric current inductive transducer, overvoltage protection sensor, also can the Special display absorbing circuit device of inductive load protection be included even.This is to determine with the purposes of intelligent solid-state relay.At the device of some specific uses, use as capacitive load (reactive power compensator) is upper, it is possible to setting soft starting mode, the prolongation startup time achieves the goal.This is a kind of according to purposes in a word, very flexile compound mode.
In intelligent solid-state relay, on power semiconductor device exit sub-line set, small current induction coil completes the curent change to overcurrent or short circuit and detects, and can arrange single or two electric current induction coils and be serially connected, to improve detection sensitivity.And the input of feedback control power semiconductor device, so can reach us second order reaction speed.Simultaneously at power semiconductor device outfan parallel connection TVS (transient overvoltage protection) or varistor, Special display absorbing circuit.
The Special display absorbing circuit of the present invention is made up of current-limiting resistance R4, bidirectional trigger diode D1, light emitting diode D2.It is parallel to power semiconductor device outfan.When power semiconductor device place ends (being not turned on) state, light emitting diode obtains running voltage, all light by current-limiting resistance, bidirectional trigger diode.When power semiconductor device is in the conduction state, owing to the tube voltage drop of power semiconductor device is at a fairly low, only below 2V, it is not enough to the running voltage of supply light emitting diode, does not work.When power semiconductor device is in over-temperature condition, due to the effect of temperature sensor.Make the rising progressively of electric semiconductor tube voltage drop, due also to the effect of bidirectional trigger diode and current-limiting resistance.Not enough driving bidirectional trigger diode conducting at lower voltages.Light emitting diode does not still work, only when power semiconductor device tube voltage drop exceedes more than certain value.This light emitting diode just starts from faint beginning up to very bright.This is the effective ways that very intuitive judgment intelligent solid-state relay is overheated.This circuit also can very effectively absorb work main circuit various high-pressure sharp pulses that may be present simultaneously, such as the irregular burst of pulses of lightning induction etc..
The luminosity of light emitting diode represents duty.Output can be fed back to control centre, complete the collection of information.
After overall intelligence solid-state relay has been tested, installation base plate (DBC) is directly welded on radiator.In order to reach best radiating effect, we devise integral Al-alloy heat-dissipating casing, electronic semiconductor components is directly welded at the bottom surface of integral Al-alloy heat-dissipating casing, such radiator has multiple side externally to dispel the heat simultaneously, and finally fill adopts silica dioxide granule to mix highly heat-conductive material encapsulation with IC special glue again.Ensure the heat conductivity of power semiconductor device and not by the environment impact on device.Can improving the power density of 30～40%, under Same Efficieney working condition, volume can reduce 50%.
The intelligent solid-state relay integrated level of this patent is high, can be applicable to operating current from several peaces to several kilo-amperes, running voltage from the device of several hectovolts to several kilovolts on a large scale in application.Can be widely used at three-phase circuit (technical grade), relatively effective real from the protection of chip-scale.Guarantee the safe and reliable of load and device.
The intelligent solid-state relay of this patent is maximum with normal conventional solid-state relay is distinctive in that normal conventional solid-state relay only opens (conducting) or (cut-off) two states of closing, and intelligent solid-state relay is except having out (conducting) or (cut-off) two states of closing, also have one to open, intermediateness between pass, namely intelligence the objective condition worked is carried out electric current, voltage, temperature rationally senses analysis, judge and effectively fast react and effectively process, and possess and fill part protection intelligent solid-state relay device and payload security itself, the integration capability of highly reliable operation.And have one group to export intelligent solid-state relay and the signal of the load operating condition driven to control centre, to meet the needs that industrial automation produces.
Methods and apparatus of the present invention may apply to improve on many dissimilar intelligent solid-state relays and change, and all of improvement and change are believed to be within the spirit and scope of the present invention.Such as defined in the claim of patent of the present invention.
Claims (17)
1. an Intelligent control system for intelligent solid-state relay, including possessing the single intelligent solid-state relay individuality of unique code, data/address bus and being set up the control centre of signal communicating by data/address bus and intelligent solid-state relay individuality；Described intelligent solid-state relay obtains control centre's control signal from data/address bus and further through, data/address bus, by I/O interface, the duty of intelligent solid-state relay synthetic defencive function Yu load is fed back to control centre, is achieved in the bi-directional communication function of the bi-directional data input between intelligent solid-state relay and control centre, output.
2. the Intelligent control system of a kind of intelligent solid-state relay as claimed in claim 1, it is characterised in that: described control centre is the PLC industry control center built, or terminal.
3. the Intelligent control system of a kind of intelligent solid-state relay as claimed in claim 1, it is characterised in that: the single intelligent solid-state relay individuality of employing possesses unique code, input service signals collecting, output services signals collecting, working state signal collection and the performance of various collection signal logic and processes function.
4. the Intelligent control system of the intelligent solid-state relay as described in claim 1-4, it is characterised in that: it flows power supply for working power with blow-up (directly)；This with blow-up (directly) flow power supply be working power its control method of intelligent solid-state relay as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay；
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
5. the Intelligent control system of intelligent solid-state relay as claimed in claim 4, it is characterized in that: when being working power adopting blow-up (directly) stream power supply, when intelligent solid-state relay is in output services signals D stage, this output services signal except being carried out the judgement of the correctness of output services signal by intelligent solid-state relay；Being also carried out short-circuit protection detection simultaneously, show malfunction once short-circuit detecting, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work；
When intelligent solid-state relay is in working signal E-stage, these output services status signal E except being carried out the judgement of the correctness of the working state signal to output by intelligent solid-state relay；Being also carried out overtemperature protection detection simultaneously, be in overheating fault state once judgement, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
6. the Intelligent control method of the intelligent solid-state relay as described in claim 1-4, it is characterised in that: it is with three-phase alternating-current supply for working power；This with three-phase alternating-current supply be working power its control method of intelligent solid-state relay as follows:
First, control centre (PLG industry control center or PC computer data center) send operational order, and by data/address bus, instruction inputted intelligent solid-state relay；
Subsequently, intelligent solid-state relay is sequentially output device code A, input control signal B, output control signal C, output services signal D, working state signal E respectively according to instruction；When above-mentioned five signals sequentially exported are when judging errorless, directly represent that this intelligent solid-state relay is in normal operating conditions, and represent that the whole system by intelligent solid-state Control is in normal operating conditions；Input once a certain signal goes wrong, and this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
7. the Intelligent control method of intelligent solid-state relay as claimed in claim 6, it is characterized in that: when being working power adopting three single phase alternating current power supplies, when intelligent solid-state relay is in output control signal C-stage, this output control signal C except being carried out the judgement of the correctness of output control signal C by intelligent solid-state relay；Being also carried out phase of three-phase voltage detection, once there is open-phase fault state, this output control signal C exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work simultaneously；
When intelligent solid-state relay is in output services signals D stage, these output services signal D except being carried out the judgement of the correctness of output services signal D by intelligent solid-state relay；Being also carried out three phase short circuit fault detection, once there is short trouble state, these output services signal D exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work simultaneously；
When intelligent solid-state relay is in working signal E-stage, these output services status signal E except being carried out the judgement of the correctness of the working state signal to output by intelligent solid-state relay；Being also carried out overtemperature protection detection simultaneously, be in overheating fault state once judgement, this signal exported then directly returns intelligent solid-state relay, orders about intelligent relay and quits work.
8. the Intelligent control method of intelligent solid-state relay as claimed in claim 4, it is characterised in that: at the work input Gather and input signal of intelligent solid-state relay.
9. the Intelligent control system of intelligent solid-state relay as claimed in claim 4, it is characterised in that: the working outputs collection at intelligent solid-state relay exports signal.
10. the Intelligent control method of intelligent solid-state relay as claimed in claim 4, it is characterised in that: export signal in intelligent solid-state relay duty end collection.
11. the Intelligent control method of intelligent solid-state relay as claimed in claim 4, it is characterized in that: utilize single intelligent solid-state relay individuality to possess the various data collected such as unique code data, input service signals collecting data, output services signals collecting data, working state signal collection data, by Logical presentation and AD conversion, by the feedback output of I/O interface to data/address bus, to guarantee instantaneous operating conditions and to process in time.
12. the Intelligent control method of intelligent solid-state relay as claimed in claim 4, it is characterised in that: utilize intelligent solid-state relay collection output signal to be docked with data/address bus by USB2.0 interface, and obtain the data feedback of control centre's signal from data/address bus.
13. an intelligent solid-state relay, including: integral Al-alloy heat-dissipating casing, installation base plate, metal guide hot plate, function sensing pcb board, panel, electric current inductive transducer, power semiconductor device；Wherein power semiconductor device has leading-out terminal；Described power semiconductor device is fixed on installation base plate；Described installation base plate is directly welded on integral Al-alloy heat-dissipating casing；Described electric current inductive transducer is sleeved on leading-out terminal；Described function sensing pcb board is fixed on described leading-out terminal；Described leading-out terminal and sensing pcb board lead-out wire are all connected with described panel；Described integral Al-alloy heat-dissipating casing metal guide hot plate described with above described power semiconductor device is connected, and constitutes a conduction of heat closed-loop path, and has good electromagnetic compatibility (EMC) capacity of resisting disturbance；Described installation base plate is ceramic copper-clad plate, and installation base plate is directly welded on integral Al-alloy heat-dissipating casing；Described power semiconductor device is enhancement mode controlled silicon chip group or High Performance Insulation transistor npn npn chipset；Described function sensing pcb board is provided with excess voltage protection, thermal-shutdown circuit and working state signal output circuit.
14. a kind of intelligent solid-state relay as claimed in claim 13, it is characterised in that: described electric current sensing sensing circuit includes: regulate resistance, output resistance, small-sized rectifier bridge stack, unidirectional triggering controllable silicon, electric current inductive transducer and optocoupler；Described adjustment resistor coupled in parallel is at the two ends of the coil of electric current inductive transducer；The described input of small-sized rectifier bridge stack is connected with the two ends of coil, and outfan is connected with the input of optocoupler；One outfan of described unidirectional triggering silicon controlled positive pole and the first outfan, optocoupler is connected；Negative pole and the second outfan are connected, trigger electrode is connected with another outfan of optocoupler through output resistance.
15. a kind of intelligent solid-state relay as claimed in claim 13, it is characterised in that: described excess voltage protection includes varistor, current-limiting resistance, bidirectional trigger diode and light emitting diode；Described varistor is connected in parallel on described power semiconductor device；Described current-limiting resistance, described bidirectional trigger diode, described light emitting diode positive pole series connection after, in parallel with described varistor.
16. a kind of intelligent solid-state relay as claimed in claim 13, it is characterised in that: described thermal-shutdown circuit includes two temperature sensors, and next-door neighbour's power semiconductor device is arranged.
17. a kind of intelligent solid-state relay as claimed in claim 13, it is characterised in that: described described light emitting diode is in parallel with the small-sized rectifier bridge stack of one, by exporting a DC operation status signal after rectification, feeds back to control centre.
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