CN105798306B - 一种3d金属打印系统及方法 - Google Patents
一种3d金属打印系统及方法 Download PDFInfo
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- CN105798306B CN105798306B CN201410854573.0A CN201410854573A CN105798306B CN 105798306 B CN105798306 B CN 105798306B CN 201410854573 A CN201410854573 A CN 201410854573A CN 105798306 B CN105798306 B CN 105798306B
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- printing head
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- 238000007639 printing Methods 0.000 title claims abstract description 126
- 239000002184 metal Substances 0.000 title claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000003792 electrolyte Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 12
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 39
- 239000007864 aqueous solution Substances 0.000 claims description 28
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 19
- 239000007769 metal material Substances 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 8
- 230000033228 biological regulation Effects 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 claims 2
- 238000003287 bathing Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 abstract description 4
- 230000005684 electric field Effects 0.000 abstract description 3
- 239000008151 electrolyte solution Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 11
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 8
- 239000002585 base Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011780 sodium chloride Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000013528 metallic particle Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000110 selective laser sintering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920005479 Lucite® Polymers 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410854573.0A CN105798306B (zh) | 2014-12-31 | 2014-12-31 | 一种3d金属打印系统及方法 |
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CN201410854573.0A CN105798306B (zh) | 2014-12-31 | 2014-12-31 | 一种3d金属打印系统及方法 |
Publications (2)
Publication Number | Publication Date |
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CN105798306A CN105798306A (zh) | 2016-07-27 |
CN105798306B true CN105798306B (zh) | 2017-12-19 |
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CN201410854573.0A Active CN105798306B (zh) | 2014-12-31 | 2014-12-31 | 一种3d金属打印系统及方法 |
Country Status (1)
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CN (1) | CN105798306B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107803504B (zh) * | 2016-09-09 | 2018-10-16 | 北京梦之墨科技有限公司 | 一种液态金属三维宏观结构的悬浮打印成形方法 |
CN111069606B (zh) * | 2019-12-06 | 2022-02-22 | 北京航空航天大学 | 一种低熔点金属的连续成型方法 |
CN112191853B (zh) * | 2020-03-31 | 2022-05-10 | 北京航空航天大学 | 一种室温下液态金属镓的快速成型方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4933049A (en) * | 1989-04-03 | 1990-06-12 | Unisys Corporation | Cradle for supporting printed circuit board between plating manifolds |
US7615141B2 (en) * | 2003-10-03 | 2009-11-10 | University Of Washington | Electrochemical micromanufacturing system and method |
CN103481672B (zh) * | 2013-09-30 | 2016-06-22 | 陈泽进 | 电解刻蚀电镀堆积3d打印机 |
CN104148637A (zh) * | 2014-08-01 | 2014-11-19 | 中国科学院重庆绿色智能技术研究院 | 一种熔融挤出快速成型金属部件的系统及其实现方法 |
CN203994732U (zh) * | 2014-08-25 | 2014-12-10 | 北京紫晶立方科技有限公司 | 二维阵列电镀堆积3d打印机 |
CN104191621B (zh) * | 2014-08-28 | 2016-10-05 | 北京智谷技术服务有限公司 | 3d打印辅助方法、装置及3d打印机 |
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2014
- 2014-12-31 CN CN201410854573.0A patent/CN105798306B/zh active Active
Non-Patent Citations (1)
Title |
---|
Liquid phase3D printing for quickly manufacturing conductive metal objects with low melting point alloy ink;Wanglei Liujing;《SCIENCE CHINA Technological Sciences》;20140930;第57卷;第1721-1727页 * |
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Publication number | Publication date |
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CN105798306A (zh) | 2016-07-27 |
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Application publication date: 20160727 Assignee: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Assignor: Technical Institute of Physics and Chemistry Chinese Academy of Sciences Contract record no.: X2021110000040 Denomination of invention: A 3D metal printing system and method Granted publication date: 20171219 License type: Exclusive License Record date: 20210924 |
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Effective date of registration: 20240220 Address after: Room 9009, 9th Floor, No. 65 North Fourth Ring West Road, Haidian District, Beijing, 100190 Patentee after: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Country or region after: China Address before: No. 29 East Zhongguancun Road, Haidian District, Beijing 100190 Patentee before: Technical Institute of Physics and Chemistry Chinese Academy of Sciences Country or region before: China |
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