CN105739245B - A kind of immersion lithographic machine submergence unit collision prevention device and method - Google Patents
A kind of immersion lithographic machine submergence unit collision prevention device and method Download PDFInfo
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- CN105739245B CN105739245B CN201410758603.8A CN201410758603A CN105739245B CN 105739245 B CN105739245 B CN 105739245B CN 201410758603 A CN201410758603 A CN 201410758603A CN 105739245 B CN105739245 B CN 105739245B
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Abstract
The present invention discloses a kind of immersion lithographic machine submergence unit collision prevention device, for preventing submergence unit from colliding with silicon wafer stage, it is characterized in that, it include: sensor, the sensor and the submergence unit keep relative position to fix, and the sensor along the optical axis of the immersion lithographic machine emits an electromagnetic beam to measure the submergence unit at a distance from silicon wafer stage or speed or acceleration；The electric signal that the sensor measurement obtains is converted into digital signal by measuring device；Controller, for receiving the digital signal, the relative position for judging the submergence unit and silicon wafer stage or speed issue corresponding control command with the presence or absence of risk of collision；Driver drives the submergence unit according to the control command that the controller issues.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing fields more particularly to a kind of immersion lithographic machine to submerge unit anti-collision
Collision device and method.
Background technique
Litho machine be manufacture super large-scale integration one of Core equipment, modern lithographic machine based on optical lithography,
It accurately projects the figure on mask plate using optical system and is exposed on the silicon wafer of coated photoresist.It includes one
Laser light source, an optical system, one piece of projection mask being made of graphics chip, one light is coated with to Barebone and one
The silicon wafer of quick photoresist.
Liquid immersion lithography (Immersion Lithography) equipment passes through between last a piece of projection objective and silicon wafer
The liquid for filling certain high refractive index is the dry lithography machine of gas relative to intermediate medium, improves the numerical value of projection objective
Aperture (NA), to improve the resolution ratio and depth of focus of lithographic equipment.In the Next Generation Lithographies machine having proposed, liquid immersion lithography
Minimum is changed to existing equipment, there is good inheritance to present dry lithography machine.It can be by substrate or substrate and substrate
Platform is immersed in immersion liquid bath.The example of a this arrangement is disclosed in United States Patent (USP) NO.4509852, herein by the patent
It is hereby incorporated by reference.Immersion liquid can provide the regional area and optical projection system to substrate by liquid-supplying system
The last one element and substrate between, the usual substrate has the surface district bigger than the last one element of optical projection system
Domain.The example of a this arrangement is disclosed in international application No.99/49504, herein introduces document full text
As reference.It is provided the liquid into substrate by least one entrance, preferably along substrate relative to the last of optical projection system
The moving direction of one element provides, and at least one outlet removal liquid by connecting with low pressure source.Around the last one
The various orientations and quantity of the entrance and exit of component ambient positioning are all possible.In addition, liquid-supplying system can have
At least part of sealing element, the boundary in the space between the last one element and base station of optical projection system extends.
The sealing element is generally static relative to optical projection system in the xy plane, but at Z-direction (optical axis direction of optical projection system)
There can be some relative movements.Sealing is formed between sealing element and substrate surface.Preferably, which is non-contact close
Envelope, such as hermetic seal can be further used as a gas bearing.
At present frequently with scheme be local immersion method, i.e., liquid is limited in above silicon wafer and last a piece of projection objective
Lower surface between regional area in, and the liquid of steady and continuous is kept to flow.In stepping-scan-type lithographic equipment, silicon
Piece carries out the scanning motion of high speed in exposure process, and the liquid in exposure area can be taken away flow field by this movement, to draw
Leakage is played, the liquid of leakage can form water mark on a photoresist, influence exposure quality.Therefore, necessary in immersion lithography
The sealing problem of emphasis solution gap flow field.
In current existing solution, patent US6954256B2 is disclosed using hermetic seal, and Dry-gas Sealing Technology is in ring
On the periphery in filling flow field, annular air curtain is formed by applying high pressure gas, filling liquid is limited to certain circle
In shape region.
Existing hermetic is applied to around filling fluid using air curtain, but to guarantee that silicon wafer stage is horizontal in high speed
Immersion liquid leakage does not occur under movement, it is desirable that submergence unit is very close at a distance from object lens, silicon wafer stage or silicon wafer, wherein requiring
Submerging unit and the distance between silicon wafer stage or silicon wafer is and other component to be equipped on silicon wafer stage less than 200um, leads to silicon wafer
There are the fluctuating patterns of 0-160um on platform surface, and silicon wafer stage is moving component, and catenary motion stroke is ± 0.5mm, there is leaching
The risk for not having unit and object lens, silicon wafer stage or silicon wafer to collide and influencing lithography performance, damaging lithographic equipment.
In European patent application EP 03257072.3, a kind of double or two platform immersion lithography apparatus are disclosed, herein
The document is hereby incorporated by reference.There are two the platforms of support substrate for this device tool.It is carried out in first position with a platform,
Measurement does not use immersion liquid, and is exposed in the second position for wherein providing immersion liquid using a platform.Institute as above
It states in the implementation using the known lithographic apparatus of submergence, provides immersion liquid by gas bearing, liquid-supplying system is with respect to base
Bottom or base station movement, gas bearing can provide air-flow in the gap between liquid-supplying system and substrate or base station.Have
Effect ground, liquid-supplying system may remain on this gas blanket flowed in gap.By utilizing this gas bearing, due to
Gas bearing can usually provide minimum spacing between liquid-supplying system and substrate or base station, therefore can obtain certain
Safety.In addition, in order to avoid substrate surface and around difference in height of the base station between the surface in portion of substrate, it can be with
Implement a selection mechanism to select the thickness of substrate.It will not be allowed to enter light when the thickness that substrate has is excessive or too small
Engraving device, because this will make liquid-supplying system strike substrate and base when liquid-supplying system passes through substrate to substrate
Bottom stage.Difference in height between substrate surface and base station surface around substrate reaches substrate and base station and liquid supply
Clearance height between system or it is bigger in the case where, it is possible to this collision occurs.
In order to avoid the generation of this collision, a kind of damage control system of lithographic equipment is disclosed in patent CN1892435B
System, which includes calculator, is used to calculate fluid supply from the position quantity of base station and the position quantity of fluid feed system
The size quantity in the gap between system and the base station for keeping substrate.The damage when size quantity is more than scheduled level of security
Control system can generate alarm signal.But the position quantity of this detection base station and the position quantity of fluid feed system control
The distance between liquid-supplying system and base station, time response is longer, more demanding to the travelling speed of calculator.
Summary of the invention
In order to overcome defect existing in the prior art, the present invention provide in a kind of detection modern lithographic device base station with
The apparatus and method of the relative position of fluid feed system pass through the opposite position of direct detection base station and fluid feed system
It sets, to prevent base station fluid feed system from colliding.
In order to achieve the above-mentioned object of the invention, the present invention discloses a kind of immersion lithographic machine submergence unit collision prevention device, is used for
Prevent submergence unit from colliding with silicon wafer stage characterized by comprising sensor, the sensor and the submergence unit
Relative position is kept to fix, the sensor emits an electromagnetic beam along the parallel direction of the optical axis of the immersion lithographic machine to survey
The submergence unit is measured at a distance from silicon wafer stage or relative velocity or relative acceleration；Measuring device, by the sensor measurement
Obtained electric signal is converted into digital signal；Controller judges the submergence unit and silicon wafer for receiving the digital signal
The relative position of platform or speed whether there is risk of collision, and issue corresponding control command；Driver, according to the controller
The control command of sending drives the submergence unit.
Further, which is located at four vertex or the line on vertex and the center of circle of the bottom surface of the submergence unit
On.
Further, which is laser displacement sensor or microwave detector, ultrasonic detector, capacitor detection
Device.
Further, the quantity of the sensor is at least three.
Further, the least significant end of the sensor is flushed with the submergence unit lowermost end.
Present invention simultaneously discloses a kind of immersion lithographic machines to submerge unit collision-proof method characterized by comprising utilizes one
Sensor keeps relative position to fix with the submergence unit, which emits along the parallel direction of the optical axis of the immersion lithographic machine
One electromagnetic beam measures the submergence unit at a distance from silicon wafer stage or relative velocity or relative acceleration；For according to the sensing
The detection data control driver of device drives the submergence unit.
Compared with prior art, the present invention, which has abandoned, introduces third reference coordinate in the prior art to calculate base station
With the technological means of the relative position of fluid feed system, pass through the opposite position of direct detection base station and fluid feed system
It sets, to prevent base station fluid feed system from colliding.Substrate is calculated compared to existing introducing third reference coordinate
The relative position response speed of platform and fluid feed system faster, while can break existing patent block.
Detailed description of the invention
It can be obtained further by detailed description of the invention below and institute's accompanying drawings about the advantages and spirit of the present invention
Solution.
Fig. 1 is the structural schematic diagram of litho machine common in the art；
Fig. 2 is air seal submergence cell schematics；
Fig. 3 is the structural schematic diagram of submergence unit collision prevention device according to the present invention；
Fig. 4 is the detection method schematic diagram of the relative position of base station and fluid feed system；
Fig. 5 is sensor mounting location top view；
Fig. 6 is sensor mounting location front view.
Specific embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
The purpose of the present invention is to provide in a kind of detection modern lithographic device base station and fluid feed system it is opposite
The apparatus and method of position, by the relative position of direct detection base station and fluid feed system, to prevent base station fluid
Feed system collides.
Fig. 1 is the structural schematic diagram of litho machine, discloses an existing litho machine structure.In the litho machine, main frame
A lighting system 20, a projection objective 10 and a silicon wafer stage 40 are supported, one is placed on silicon wafer stage 40 and is coated with light sensitive photoresist
Silicon wafer 50.Figure on mask 30 is transferred to and is coated in a manner of Imagewise exposure by lighting system 20 and projection objective 10
On the silicon wafer 50 of light sensitive photoresist, to complete to expose.
Fig. 2 is the structural schematic diagram that air seal submerges unit, by inlet/outlet delivery pipe 13, by projection objective PL
Pass through full of the liquid 11 with relatively high refractive index, such as water positioned at the last of projection arrangement PL between silicon wafer stage W
Under component or the sealing element 12 of surrounding forms storing apparatus, by the bottom of sealing element 12 and the surface of substrate W it
Between formed air seal 16, by hydraulic seal submergence maintain device in.The gas can be air or synthetic gas, but preferably
Be N2 or other inert gases.Gas passes under pressure through entrance 15 and provides to the gap between sealing element 12 and substrate,
And it is drawn by first outlet 14.Excess pressure at gas access 15, the vacuum level at first outlet 14 and gap are set
Geometry, to provide the air-flow of inside high-speed to limit liquid.
Fig. 3 is submergence unit collision prevention device of the present invention, including sensor 305, for directly measurement submergence list
Member 302 and the relative position of silicon wafer stage 310 or speed or acceleration.In Fig. 3, immersion lithography apparatus includes object lens 301, immersion liquid
303, the silicon wafer 304, the installation of sensor 305 on silicon wafer stage 310 on submergence unit 302, pop one's head in along optical axis by sensor 305
Parallel direction emit electromagnetism downwards or laser comes direct detection silicon wafer stage or silicon wafer at a distance from submergence unit or relative velocity
Or relative acceleration.
Submergence unit collision prevention device further comprises a measuring device 306, controller 308, driver 309 and executes
Device M, measuring device 306 are used to the electric signal that measurement obtains being converted into the acceptable digital signal of controller.Controller
308, the relative position or speed for judging to submerge unit and silicon wafer stage issue corresponding control with the presence or absence of risk of collision
Order.Driver 309 and actuator M, for executing the control command of controller transmission, driving submergence unit 302 is far from silicon wafer
Platform 310 prevents the generation of collision.
Fig. 4 is the detection method schematic diagram of the relative position of base station 310 and fluid feed system, and this method mainly describes
The detection mode of the relative position of submergence unit 302 and base station 310.The submergence maintenance device bottom face of the embodiment is
Quadrangle.The movement of base station is easiest to cause on the four edges that the place collided is submergence unit, therefore substrate in order to prevent
Platform collides with submergence unit, we only need the four edges for controlling submergence unit not occur with base station in spatial position
Collision, sensor are mounted on the line in four vertex or vertex and the center of circle, by calculate indirectly obtain four vertex with
The distance of substrate.Submergence four vertex of unit are detected by sensor to calculate to vertical range S1, S2, S3, S4 of base station
Submerge the boundary of unit and the relative tertiary location signal of base station.The relative tertiary location signal of acquisition is transferred to execution system
It makes adjustment, to avoid the collision of submergence unit and base station.
The present embodiment uses laser displacement sensor, and sensor probe emits downwards electromagnetism along the parallel direction of optical axis or swashs
Light comes the relative position of direct detection silicon wafer stage or silicon wafer and submergence unit, speed, acceleration.That is the sensor end face spy that goes out light
Head uses right angle setting, and the probe that sensors sides go out light, which uses, to be horizontally mounted.Sensor is not limited to laser displacement sensor,
It can be microwave detector, ultrasonic detector, capacitance probe etc. can be realized short distance detection and measurand is to be coated with light
The instrument of the silicon wafer of photoresist.The quantity of sensor is at least 3, and there are the tops of risk of collision according to submergence unit for specific number
Number is put to determine.
Fig. 5 is sensor mounting location top view, which is the top view of lithographic equipment submergence unit, main as shown in the figure
Include submergence unit 21, silicon wafer stage 40, object lens 10, silicon wafer 50 and sensor 25.40 supporting silicon chip 50 of silicon wafer stage, apart from silicon
Certain distance is submergence unit 21 above piece, and submergence unit is centered around object lens surrounding and is formed with closing structure.Sensor 25 is installed
It is single according to sensor and submergence in the outside of submergence unitary gas sealing area, and on the line in four vertex and center
Proportionate relationship of first vertex away from submergence unit center, is calculated four vertex at a distance from substrate, i.e. submergence unit and silicon wafer
The relative tertiary location of platform or silicon wafer.When any one sensor detects the opposite of submergence unit and silicon wafer stage or silicon wafer
When spatial position is greater than the set value less than setting value or relative velocity, acceleration, controller issues control command to actuator, should
Control command is lifted up submergence unit with maximum speed, i.e., moves to the direction far from silicon wafer stage.Control command can be with
It is turned off submergence unit actuator or silicon wafer stage actuator power supply, makes to submerge unit or silicon wafer stage stop motion at once.
Fig. 6 is sensor mounting location front view, which marked on the basis of Fig. 2 air seal submerges cell schematics
The specific location that sensor 25 is mounted on submergence unit is illustrated, sensor lowermost end is flushed with submergence unit lowermost end.When two
Person's lowermost end is uneven usually, and difference in height will compensate in software as offset.
It is preferred embodiment of the invention described in this specification, above embodiments are only to illustrate the present invention
Technical solution rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical solution of experiment, it all should be within the scope of the present invention.
Claims (5)
1. a kind of immersion lithographic machine submerges unit collision prevention device, special for preventing submergence unit from colliding with silicon wafer stage
Sign is, comprising:
Sensor, the sensor keep relative position to fix with the submergence unit, and the sensor is along the immersion lithographic
The parallel direction of the optical axis of machine emit an electromagnetic beam measure the submergence unit at a distance from silicon wafer stage or relative velocity or
Relative acceleration；
The electric signal that the sensor measurement obtains is converted into digital signal by measuring device；
Controller, for receiving the digital signal, judge the submergence unit and silicon wafer stage relative position or speed whether
There are risk of collision, and issue corresponding control command；
Driver drives the submergence unit according to the control command that the controller issues；
The sensor is on the line of four vertex of the bottom surface of the submergence unit or vertex and bottom surface geometric center.
2. immersion lithographic machine as described in claim 1 submerges unit collision prevention device, which is characterized in that the sensor is sharp
Optical displacement sensor or microwave detector, ultrasonic detector, capacitance probe.
3. immersion lithographic machine as described in claim 1 submerges unit collision prevention device, which is characterized in that the number of the sensor
Amount is at least three.
4. immersion lithographic machine as described in claim 1 submerges unit collision prevention device, which is characterized in that the sensor is most
Low side is flushed with the submergence unit lowermost end.
5. a kind of immersion lithographic machine submerges unit collision-proof method, which is characterized in that using as described in claim any one of 1-4
Collision prevention device, comprising: keep relative position to fix using a sensor and the submergence unit, the sensor is described in
The parallel direction of the optical axis of immersion lithographic machine emits an electromagnetic beam to measure the submergence unit at a distance from silicon wafer stage or phase
To speed or relative acceleration；The submergence unit is driven for controlling driver according to the detection data of the sensor.
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| CN201410758603.8A CN105739245B (en) | 2014-12-12 | 2014-12-12 | A kind of immersion lithographic machine submergence unit collision prevention device and method |
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| CN201410758603.8A CN105739245B (en) | 2014-12-12 | 2014-12-12 | A kind of immersion lithographic machine submergence unit collision prevention device and method |
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| KR100585476B1 (en) * | 2002-11-12 | 2006-06-07 | 에이에스엠엘 네델란즈 비.브이. | Lithographic Apparatus and Device Manufacturing Method |
| TWI295414B (en) * | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US7583357B2 (en) * | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7170583B2 (en) * | 2005-06-29 | 2007-01-30 | Asml Netherlands B.V. | Lithographic apparatus immersion damage control |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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