CN105702385B - A kind of production method of laminated bus bar - Google Patents
A kind of production method of laminated bus bar Download PDFInfo
- Publication number
- CN105702385B CN105702385B CN201610200976.2A CN201610200976A CN105702385B CN 105702385 B CN105702385 B CN 105702385B CN 201610200976 A CN201610200976 A CN 201610200976A CN 105702385 B CN105702385 B CN 105702385B
- Authority
- CN
- China
- Prior art keywords
- conductive plate
- dielectric film
- bus bar
- film
- hot pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Abstract
The invention discloses a kind of production method of laminated bus bar, comprise the following steps：(1) deburring is carried out to the conductive plate.(2) the welded gasket post on the conductive plate：Tin plating processing is carried out to pad post first, then heating soldering is carried out with conductive plate junction to the pad post, weld grinding is smooth, then it is corrected, finally carries out whole conductive board component tin plating.(3) band glue dielectric film is made：Using biaxially oriented polyester film (PET) as base material, required geomery is cut to, hot melt adhesive film of the cutting with release liners is then corresponded to, is heated and pressed with hot press.(4) the band glue dielectric film and conductive plate are pressed using hot pressing die, can be rapidly cooled down by fluid circulation system in hot pressing, make the band glue dielectric film and conductive plate good bonding.The stray electrical inductance value of the invention for effectively reducing bus bar, technique one-shot forming, compact overall structure, product quality and production efficiency greatly improve.
Description
【Technical field】
The present invention relates to distribution system electric conductor technical field, more particularly to a kind of production method of laminated bus bar.
【Background technology】
Electric current in distribution system is conducted by electric conductor, such as copper, aluminum conductor, copper bar etc., powerful
In electrical equipment, electric current is typically bigger, and energy can be all produced in the presence of various factors by the conductor of high current
Loss.
Tradition carries out distribution using wire, and in the case of equipment complexity, wire can be relatively more, thus increase on the whole
The weight of system is added, and the assembling of wire is also more time-consuming；Using copper bar carry out conduct electric current can exist it is larger
Reactance and surge current.When the power frequency of conduction is larger, due to the presence of kelvin effect, electric current all can be to conductor surface
Concentrate, the conduction current utilization rate for so actually causing electric conductor is very low；Traditional busbar needs repeatedly peace when making
Dress, it is easy to malfunction, and structure is not compact, and equipment cost value is higher, and stray electrical inductance value is big, and the life-span is also short, using traditional
The electric conductor not only excessive occupancy device space, and in terms of reliability and security there is also it is certain the problem of.
Laminated bus bars obtain in industry fields such as track traffic, electric power, new energy, ship, communication, industrial frequency conversions at present
Relatively broad application, but just from the point of view of domestic whole industry form, technology and process aspect are all not mature enough, conventional laminated bus bar
The punching of conductive plate generally use copper plate general NC after simply to go after flash removed the tin plating processing of external coordination just directly to carry out stacking female
Row pressure system, conductive plate burrs on edges is more, and processing dimension error is larger.In the manufacture craft of bus bar and the selection of making material
On also have that larger difference, service life, production chains etc. is different, there is larger difference in technical sophistication degree, production
And it is still inconvenient on care and maintenance, particularly very big difficulty be present in the production of the trial-production large-scale laminate of research and development single-piece.
【The content of the invention】
In view of this, it is overcome the deficiencies in the prior art, the present invention provides a kind of manufacturing for laminated bus bar conductive plate
Method, by the manufacture craft of improved laminated bus bar and flexibly from the insulating materials combination hot melt adhesive film for meeting technological requirement
Made by oneself, greatly reduce production cost and production cycle, improve the globality of laminated bus bar, reduce the peace of bus bar
Difficulty is filled, so as to the reliability for improving the service life of bus bar He adding system.
To achieve the above object, technical scheme is as follows：
A kind of production method of laminated bus bar, the laminated bus bar are made up of conductive plate and dielectric film pressing, including
Following steps：
(1) deburring is carried out to the conductive plate：Conductive plate entirety outer surface is removed using special flash trimmer
Burr formation wire-drawing effect；
(2) the welded gasket post on the conductive plate：Tin plating processing is carried out to pad post first, then with high frequency fibre welding machine to described
Pad post carries out heating soldering with conductive plate junction, using circular fiber wheel that weld grinding is smooth, then by the conductive plate
Entirety, which is put into hot pressing die, to be corrected, and is finally carried out whole conductive board component tin plating；
(3) band glue dielectric film is made：Using biaxially oriented polyester film (PET) as base material, required shape is cut to
Size, hot melt adhesive film of the cutting with release liners is then corresponded to, is heated and pressed with hot press, after waiting overall cool down, take out insulation
Film, release liners of tearing, band glue insulation film production finish；
(4) the band glue dielectric film and conductive plate are pressed using hot pressing die：It is embedding to the hot pressing die bolster
It air stream enter runner, can rapidly be cooled down by mould and by pressure laminated bus bar by fluid circulation system in hot pressing, reduce dielectric film
Shrinkage, make the band glue dielectric film and conductive plate good bonding.
Above-mentioned steps (1) are removed burr formation wire drawing effect to conductive plate entirety outer surface using special flash trimmer
Fruit, the conductive plate integral smoothness is improved, further increases the cementitiousness of dielectric film, reduce stray inductance influence factor,
Reduce overall laminate breakdown risk.
Further, when tin plating to pad post in the step (2), according to the thickness requirement of tin coating, closed using centerless grinder
Control pad post outside diameter is managed, makes the pad post and conductive plate mating holes just interference fits.
High frequency fibre welding machine described in the step (2) makes pad post and conductive plate junction form local add using kelvin effect
Heat, control the power of the high frequency brazing machine so that untill solder stick just melts.
Machine is cut to base material cutting stock using mechanical contact numerical control film in the step (3), with the blanking such as traditional cutting die
Mode is compared, and its blank size precision is high, machine universal strong, and edge quality is good.
The integrated shape chamber of hot pressing die in the step (4), bolster are all integral type, greatly reduce scattered part
Quantity, it is simple to operate, while in each self-embedding runner of bolster, fluid circulation system can be passed through in hot pressing
Rapidly cooled down by mould and by pressure laminated bus bar, reduce the shrinkage of dielectric film, avoided dielectric film from deforming and bubble, greatly improve
Production efficiency, while mold-break operations are convenient, will not be burned, it is safe.
The invention has the advantages that it is excellent that depth is carried out in the selection of laminated bus bar making material and in manufacture craft
Change, Deepen Design is carried out to technical process, reduce the stray electrical inductance value of bus bar as much as possible, the last shaping of technique is overall
It is upper compact-sized, by independently making with integral heat pressure after glue dielectric film and connection gasket post soldering, dramatically reduce folded
The manufacture difficulty of layer busbar, while shorten the production cycle.
【Brief description of the drawings】
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation that the present invention pads post using high frequency fibre welder.
Fig. 2 makes the structural representation with glue dielectric film for the present invention.
In figure, 1, mould on hot press, 2, mould under hot press, 3, top board, 4, lower platen, 5, dielectric film, 6, hot melt adhesive film,
7th, high frequency fibre welding machine, 8, conductive plate, 9, pad post.
【Embodiment】
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Embodiment：
A kind of production method of laminated bus bar, the laminated bus bar are made up of conductive plate and dielectric film pressing, including
Following steps：
(1) deburring is carried out to the conductive plate：Conductive plate entirety outer surface is removed using special flash trimmer
Burr formation wire-drawing effect；
(2) the welded gasket post on the conductive plate：Tin plating processing is carried out to pad post first, then with high frequency fibre welding machine to described
Pad post carries out heating soldering with conductive plate junction, using circular fiber wheel that weld grinding is smooth, then by the conductive plate
Entirety, which is put into hot pressing die, to be corrected, and is finally carried out whole conductive board component tin plating；
(3) band glue dielectric film is made：Using biaxially oriented polyester film (PET) as base material, required shape is cut to
Size, hot melt adhesive film of the cutting with release liners is then corresponded to, is heated and pressed with hot press, after waiting overall cool down, take out insulation
Film, release liners of tearing, band glue insulation film production finish；
(4) the band glue dielectric film and conductive plate are pressed using hot pressing die：It is embedding to the hot pressing die bolster
It air stream enter runner, can rapidly be cooled down by mould and by pressure laminated bus bar by fluid circulation system in hot pressing, reduce dielectric film
Shrinkage, make the band glue dielectric film and conductive plate good bonding.
Above-mentioned steps (1) are removed burr formation wire drawing effect to conductive plate entirety outer surface using special flash trimmer
Fruit, the conductive plate integral smoothness is improved, further increases the cementitiousness of dielectric film, reduce stray inductance influence factor,
Reduce overall laminate breakdown risk.
Referring to Fig. 1, when the present invention uses high frequency fibre welding machine 7 tin plating to pad post 9 in above-mentioned steps (2), according to tin coating
Thickness requirement, using the reasonable control pad post outside diameter of centerless grinder, make the pad post 9 and the mating holes of conductive plate 8 just mistake
Cross cooperation.Pad post 9 and the junction of conductive plate 8 is formed local heating using kelvin effect using high frequency fibre welding machine 7 again, control institute
State the power of high frequency brazing machine 7 so that untill solder stick just melts.Pad after the completion of post 9 welds, with circular fiber wheel by weld seam
Polish flat, overall be put into hot pressing die of conductive plate 8 is corrected after the completion of polishing, ensures the flat of whole conductive board component
Face degree error.It is after the completion of correction that whole conductive board component progress external coordination is tin plating, further optimize the surface quality of conductive plate 8,
And consolidate weld seam welding quality.
Referring to Fig. 2, when above-mentioned steps (3) make band glue dielectric film, the hot press of use is included on hot press the present invention
Mould 2, specific method are under mould 1 and hot press：
Using biaxially oriented polyester film (PET) as base material, (mainly heatproof condition) is required with reference to different use conditions,
Autonomous selection hot melt adhesive film 6, voluntarily hot-pressing strip glue dielectric film, specific method are：Base material is cut into required geomery, so
Corresponding hot melt adhesive film 6 of the cutting with release liners afterwards, then the two split, one with glue is glued facing to dielectric film 5, principle
Film profile is needed to offset certain surplus slightly outwards, and the two then is put into top board 3 made of the heat-transfer matcrial of surfacing
Between lower platen 4, heated and pressed with hot press, the characteristic adjustment of specific temperature and pressure of hot pressing, the time glued membrane selected by,
After to be laminated, by top board 3 and the overall taking-up of lower platen 4, it not take out at once, prevent dielectric film 5 from deforming, band pressure is cold
But, after waiting overall cool down, dielectric film 5, release liners of tearing are taken out, band glue insulation film production finishes.
The advantages of above-mentioned steps (3) technique is：The base material biaxially oriented polyester film (PET) and PUR that the present invention selects
Film 6 is purchased respectively and then homemade holistic cost is far below directly purchase band glue dielectric film.Flexibility is strong, according to different insulative
And mechanical property requirements, it can flexibly select base material and hot melt adhesive film to be matched, produce different band glue dielectric film, Yi Zhongji
Material, which can suppress one-side band glued membrane, can also suppress double-sides belt glued membrane, be produced suitable for different number of plies laminated bus bars, flexibility
By force, selectivity is more, is unlikely to interrupt laminating bus bar production suddenly because certain insulating materials is inapplicable or lacks material, can
Ensure manufacturing schedule well；
Stock utilization is higher, can first cut into base material after required shape according to compact dimensions blanking PUR
Film, can be with the dosage of a certain degree of saving hot melt adhesive film, while the use of hot melt adhesive film is more flexible, can piece together use,
It is substantially not present tailing.
The integrated shape chamber of hot pressing die in the step (4), bolster are all integral type, greatly reduce scattered part
Quantity, it is simple to operate, while in each self-embedding runner of bolster, fluid circulation system can be passed through in hot pressing
Rapidly cooled down by mould and by pressure laminated bus bar, reduce the shrinkage of dielectric film, avoided dielectric film from deforming and bubble, greatly improve
Production efficiency, while mold-break operations are convenient, will not be burned, it is safe.
The present invention in the selection of laminated bus bar making material and carries out depth optimization in manufacture craft, and technical process is entered
Row Deepen Design, reduces the stray electrical inductance value of bus bar as much as possible, and the last shaping of technique is compact-sized on the whole.Improve
The globality of laminated bus bar, reduce the installation difficulty of bus bar, so as to improve the service life of bus bar and add
The reliability of system.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (3)
1. a kind of production method of laminated bus bar, the laminated bus bar is made up of conductive plate and dielectric film pressing, its feature
It is, comprises the following steps：
(1) deburring is carried out to the conductive plate：Burr is removed to conductive plate entirety outer surface using special flash trimmer
Form wire-drawing effect；
(2) the welded gasket post on the conductive plate：Tin plating processing is carried out to pad post first, then with high frequency fibre welding machine to the pad post
Heating soldering is carried out with conductive plate junction, it is using circular fiber wheel that weld grinding is smooth, it is then that the conductive plate is overall
It is put into hot pressing die and is corrected, finally carries out whole conductive board component tin plating；
(3) band glue dielectric film is made：Using biaxially oriented polyester film (PET) as base material, required geomery is cut to,
Then hot melt adhesive film of the cutting with release liners is corresponded to, is heated and pressed with hot press, after waiting overall cool down, dielectric film is taken out, tears
Lower release liners, band glue insulation film production finish；
(4) the band glue dielectric film and conductive plate are pressed using hot pressing die：The hot pressing die bolster is embedded in and flowed
Road, it can rapidly be cooled down by mould and by pressure laminated bus bar by fluid circulation system in hot pressing, reduce the receipts of dielectric film
Contracting, make the band glue dielectric film and conductive plate good bonding；
When tin plating to pad post in the step (2), make the pad post and conductive plate mating holes just interference fits；
High frequency fibre welding machine described in the step (2) makes pad post and conductive plate junction form local heating using kelvin effect,
Control the power of the high frequency brazing machine so that untill solder stick just melts.
2. the production method of a kind of laminated bus bar according to claim 1, it is characterised in that in the step (3)
Machine is cut to base material cutting stock using mechanical contact numerical control film.
3. the production method of a kind of laminated bus bar according to claim 1, it is characterised in that in the step (4)
The integrated shape chamber of hot pressing die, bolster are all integral type, and each self-embedding runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610200976.2A CN105702385B (en) | 2016-04-01 | 2016-04-01 | A kind of production method of laminated bus bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610200976.2A CN105702385B (en) | 2016-04-01 | 2016-04-01 | A kind of production method of laminated bus bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105702385A CN105702385A (en) | 2016-06-22 |
| CN105702385B true CN105702385B (en) | 2017-11-24 |
Family
ID=56218172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610200976.2A Active CN105702385B (en) | 2016-04-01 | 2016-04-01 | A kind of production method of laminated bus bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105702385B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10440828B2 (en) * | 2017-04-14 | 2019-10-08 | The Diller Corporation | Integrated electrical component within laminate |
| CN107767991A (en) * | 2017-09-22 | 2018-03-06 | 稳利达电源技术有限公司 | PET busbars and its production technology |
| CN108580675B (en) * | 2018-02-13 | 2023-10-03 | 株洲维通利电气有限公司 | Cold-pressing assembly mold and cold-pressing assembly method for busbar |
| CN111775453A (en) * | 2020-06-01 | 2020-10-16 | 苏州杜伦复合新材料有限公司 | Production process of composite sponge and adhesive film |
| CN112562917B (en) * | 2020-11-16 | 2022-09-16 | 苏州西典机电有限公司 | Power battery integrated busbar pressing method |
| CN114454514A (en) * | 2022-01-28 | 2022-05-10 | 株洲博雅科技股份有限公司 | Busbar hot-pressing process and hot-pressing equipment |
| CN114828389B (en) * | 2022-05-07 | 2023-07-28 | 深圳市易迅达电子科技有限责任公司 | OIS motor soft and hard combination board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101388264A (en) * | 2008-09-28 | 2009-03-18 | 株洲南车时代电气股份有限公司 | Composite bus bar manufacturing method |
| CN201259806Y (en) * | 2008-09-28 | 2009-06-17 | 株洲南车时代电气股份有限公司 | Improved composite bus bar |
| CN102694357A (en) * | 2011-03-23 | 2012-09-26 | 上海荣格电子科技有限公司 | Multi-layer bus-bar structure and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011124075A (en) * | 2009-12-10 | 2011-06-23 | Sekisui Chem Co Ltd | Insulating sheet, laminated structure, and manufacturing method of laminated structure |
-
2016
- 2016-04-01 CN CN201610200976.2A patent/CN105702385B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101388264A (en) * | 2008-09-28 | 2009-03-18 | 株洲南车时代电气股份有限公司 | Composite bus bar manufacturing method |
| CN201259806Y (en) * | 2008-09-28 | 2009-06-17 | 株洲南车时代电气股份有限公司 | Improved composite bus bar |
| CN102694357A (en) * | 2011-03-23 | 2012-09-26 | 上海荣格电子科技有限公司 | Multi-layer bus-bar structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105702385A (en) | 2016-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105702385B (en) | A kind of production method of laminated bus bar | |
| CN106426950B (en) | A kind of method of conveyer belt blind joint | |
| CN101728026A (en) | Method for manufacturing laminated busbar and laminated busbar manufactured by the method | |
| CN108495487A (en) | A kind of production method of multilayer heavy copper circuit board | |
| CN106449883A (en) | Laminating and welding machine | |
| CN201015233Y (en) | Heating coil disk | |
| CN103551721A (en) | Method for preparing joint made of dissimilar material by firstly ultrasonically prefabricating and secondly welding transition belt | |
| CN110202859B (en) | Carbon fiber reinforced resin laminated board adhesive joint and preparation method thereof | |
| CN102969254A (en) | Dual-interface card packaging method | |
| CN110064899B (en) | Tungsten-copper-clad electrical contact material and preparation method thereof | |
| CN104103391A (en) | Method adopting stereoscopic metal belt technology for producing thermal pressure-sensitive resistor and products thereof | |
| CN107186308A (en) | Weld the manufacturing process of honeycomb core | |
| CN102592712A (en) | Method for preparing integral type multi-branch structure copper-bus busbar and busbar | |
| CN1243777A (en) | High-frequency heating and pressurizing technology and equipment for soldering ring and planar parts made of different metals | |
| CN110534593B (en) | Processing system, processing method and application method of copper mesh for non-main-grid battery plate | |
| CN206465602U (en) | Electrothermal-film double-side laminating machine | |
| CN201051417Y (en) | Low inductance stacking voltage bus bar | |
| CN103286945B (en) | The welder that a kind of welding effect is good | |
| CN202623420U (en) | Conductive automobile vibration damping plate | |
| CN209111701U (en) | A kind of metal composite decorative engineering plate production equipment | |
| CN103934760B (en) | A kind of diamond tool and its manufacture method | |
| CN103521751A (en) | Method for machining metal matrix thin-wall diamond bit | |
| CN105633417B (en) | A kind of cylindrical lithium battery group collector | |
| CN204504501U (en) | Symmetrical wavelength combined ultrasonic wave soldering system | |
| CN209365511U (en) | A kind of epidermis and PP cellular board end flanging blanking structure and its processing unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |