CN105699834A - Probe card detection method - Google Patents
Probe card detection method Download PDFInfo
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- CN105699834A CN105699834A CN201610024779.XA CN201610024779A CN105699834A CN 105699834 A CN105699834 A CN 105699834A CN 201610024779 A CN201610024779 A CN 201610024779A CN 105699834 A CN105699834 A CN 105699834A
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- probe card
- probe
- card detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe card detection method. The method comprises the following steps of step1, using a tester, a probe bench and a smooth aluminum sheet to construct a probe card detection hardware environment; storing probe card channel information to be detected into a probe card detection database, establishing determination standard of a good probe card characteristic to be detected, a conformed specification standard, an abnormal standard and an OD amount change scope; step2, through the tester, controlling changes of a probe bench OD amount from small to large, after each change, carrying out acupuncture test so as to obtain a contact resistance result of each probe; and step3, using a probe card detection program to analyze a test result and provide a corresponding conclusion and a suggestion. By using the method in the invention, an acupuncture trace can be effectively confirmed.
Description
Technical field
The present invention relates to semiconductor test field, particularly relate to a kind of probe card detection method for wafer sort。
Background technology
Shown in Fig. 1, in test semiconductor wafer field, during On-Wafer Measurement, first install probe card at probe station, after installing wafer, according to default acupuncture treatment OD (OverDrive, the degree of depth of having an acupuncture treatment) amount acupuncture treatment, by manually estimating whether within the specific limits confirmation probe pricks the vestige on pad (PAD)。If not being adjusted again within the specific limits, confirming to adjust if final, then taking off probe card and check, if it is confirmed that in certain limit, then start the test of product。After testing portion crystal, exist after contact problems cause that tester is abnormal if it find that there is probe card probe with pad, then wafer can only be carried out fortification test again, thus having influence on the efficiency of test, the pricking times on pad。Because in certain situation, the pricking times of pad exists strict requirement, when there is contact test problem in testing, then have influence on the yield of product。
Current test semiconductor wafer, in order to improve testing efficiency, adopts many DUT (DeviceUnderTest, tested device) method simultaneously tested in general probe card designs, such as 16DUT, 32DUT, 64DUT, or even 128,256DUT, more than 1024DUT。So, probe card contact problem in testing is more easy to generation, and is more difficult to accomplish synchronization monitoring at test process。Homonymy DUT how after, confirm that the limitation that the means of acupuncture treatment vestige are brought more is shown in substantially by manually estimating, the most serious is exactly substantially to have confirmed that each probe is on pad, even if confirming that vestige does not note abnormalities, there is no problem to cannot guarantee that contact test in testing。
Additionally, when being ReW (rhenium tungsten) pin for the probe material of probe card, its vestige of having an acupuncture treatment on pad still can be seen substantially, when probe material is softer than ReW pin, its acupuncture treatment vestige on pad can not significantly be seen, so, by manually estimate confirm acupuncture treatment vestige method then become unreliable。
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of probe card detection method, it is possible to effectively confirm acupuncture treatment vestige。
For solving above-mentioned technical problem, the probe card detection method of the present invention, comprise the steps:
Step 1, utilizes tester, probe station, and bright finish aluminium flake builds probe card detection hardware environment；The exploration card channel information to check being stored in probe card detection storehouse, sets up the criterion that the exploration card characteristic to check is good in probe card detection program, standard up to specification, Anomaly standard, OD measures excursion；
Step 2, is changed from small to large by instrument control manufacturing probe platform OD amount, every time after change, carries out acupuncture treatment test, obtains the contact resistance result of each probe；
Step 3, test result is analyzed by probe card detection program, and provides corresponding conclusion and suggestion。
The present invention is the method for testing confirming probe card contact in a kind of On-Wafer Measurement, can effectively solve the problem that and existing have an acupuncture treatment the difficult problem that vestige cannot effectively confirm that probe card contact is whether good through hand inspection, and it is abnormal to confirm that probe card contact tests whether before test in advance, accomplish to give warning in advance, promoted testing efficiency and wafer sort quality。
Exploration card is safeguarded in time by the present invention by early warning, it is possible to increase the service life of probe card。
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further detailed explanation with detailed description of the invention:
Fig. 1 confirms flow chart in the test of current probe card；
Fig. 2 is described exploration card detection method flow chart。
Detailed description of the invention
For making the goal of the invention of the present invention, feature, the advantage can be more obvious and understandable, below in conjunction with the accompanying drawing in the present invention, the technical scheme in the present invention be clearly and completely described。
Shown in Fig. 2, described exploration card detection method implements process in the following embodiments and includes:
Step 1, utilizing existing tester, probe station, bright finish aluminium flake builds probe card detection hardware environment。Described bright finish aluminium flake is 6 inches, 8 inches, 12 inches or more than。
Step 2, the probe card channel information to check is stored in probe card detection storehouse in, probe card detection storehouse in also storage have DUT (DeviceUnderTest) information。
The criterion that step 3, the probe card characteristic that foundation to be checked in probe card detection program are good, standard up to specification, Anomaly standard, OD measures excursion。Such as probe card aisle resistance is calculated well between 0～3 ohm, and 3～6 ohm up to specification, and the calculation more than 6 ohm is abnormal；OD measures excursion according to designing requirement target setting。
Step 4, being changed from small to large by instrument control manufacturing probe platform OD amount, every time after change, carry out the acupuncture treatment test of bright finish aluminium flake, probe card detection program, by automatically calculating, obtains the contact resistance result of each probe。
Test result is analyzed by step 5, probe card detection program, if OD measures when arranging maximum, still has abnormal probe card passage (probe), then display alarm in test result, provides and produce line use after maintenance。
If step 6 OD amount setting is to maximum, it has been found that probe card passage up to specification exceedes some, display alarm maintenance in test result, provides and produce line use after maintenance。
If step 7 OD amount is set to non-maximum, the probe card passage meeting the good specification of characteristic exceedes some；Or OD amount is arranged when arriving maximum, and it is good that all probe card passages meet characteristic, show that probe card is used directly for volume production in test result, directly provide and produce line use。
Above by detailed description of the invention, the present invention is described in detail, but these have not been construed as limiting the invention。Without departing from the principles of the present invention, those skilled in the art it may also be made that many deformation and improvement, and these also should be regarded as protection scope of the present invention。
Claims (6)
1. a probe card detection method, it is characterised in that comprise the steps:
Step 1, utilizes tester, probe station, and bright finish aluminium flake builds probe card detection hardware environment；The probe card channel information to check being stored in probe card detection storehouse, sets up the criterion that the probe card characteristic to check is good in probe card detection program, standard up to specification, Anomaly standard, OD measures excursion；
Step 2, is changed from small to large by instrument control manufacturing probe platform OD amount, every time after change, carries out acupuncture treatment test, obtains the contact resistance result of each probe；
Step 3, test result is analyzed by probe card detection program, and provides corresponding conclusion and suggestion。
2. the method for claim 1, it is characterised in that: described bright finish aluminium flake is 6 inches, 8 inches, 12 inches or more than 12 inches。
3. the method for claim 1, it is characterised in that: in described probe card detection storehouse, also storage has DUT information。
4. the method for claim 1, it is characterised in that: if OD amount arranges maximum, still have abnormal probe card passage, then display alarm in test result, after maintenance, provide product line to use。
5. the method for claim 1, it is characterised in that: if OD amount setting is to maximum, it has been found that probe card passage up to specification exceedes some, display alarm maintenance in test result, provides and produce line use after maintenance。
6. the method for claim 1, it is characterised in that: if OD amount is set to non-maximum, the probe card passage meeting the good specification of characteristic exceedes some；Or OD amount is arranged when arriving maximum, and it is good that all probe card passages meet characteristic, show that probe card is directly used in volume production in test result, directly provide and produce line use。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610024779.XA CN105699834A (en) | 2016-01-15 | 2016-01-15 | Probe card detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610024779.XA CN105699834A (en) | 2016-01-15 | 2016-01-15 | Probe card detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105699834A true CN105699834A (en) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610024779.XA Pending CN105699834A (en) | 2016-01-15 | 2016-01-15 | Probe card detection method |
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| CN (1) | CN105699834A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113506755A (en) * | 2021-06-28 | 2021-10-15 | 上海华虹宏力半导体制造有限公司 | Checking graph structure for automatically detecting test channel and test method |
| WO2023173512A1 (en) * | 2022-03-18 | 2023-09-21 | 长鑫存储技术有限公司 | Probe condition monitoring method, test system, computer device, and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63166242A (en) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | Needle pressure adjusting method in wafer prober |
| CN103135022A (en) * | 2011-11-23 | 2013-06-05 | 上海华虹Nec电子有限公司 | Method for automatically detecting contact characteristic of probe card in test program |
| CN103855049A (en) * | 2014-03-27 | 2014-06-11 | 上海华力微电子有限公司 | Intelligent probe card stylus pressure control system and method |
| CN104407264A (en) * | 2014-11-10 | 2015-03-11 | 上海华虹宏力半导体制造有限公司 | Test method for confirming contact of probe cards in wafer test |
-
2016
- 2016-01-15 CN CN201610024779.XA patent/CN105699834A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63166242A (en) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | Needle pressure adjusting method in wafer prober |
| CN103135022A (en) * | 2011-11-23 | 2013-06-05 | 上海华虹Nec电子有限公司 | Method for automatically detecting contact characteristic of probe card in test program |
| CN103855049A (en) * | 2014-03-27 | 2014-06-11 | 上海华力微电子有限公司 | Intelligent probe card stylus pressure control system and method |
| CN104407264A (en) * | 2014-11-10 | 2015-03-11 | 上海华虹宏力半导体制造有限公司 | Test method for confirming contact of probe cards in wafer test |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113506755A (en) * | 2021-06-28 | 2021-10-15 | 上海华虹宏力半导体制造有限公司 | Checking graph structure for automatically detecting test channel and test method |
| WO2023173512A1 (en) * | 2022-03-18 | 2023-09-21 | 长鑫存储技术有限公司 | Probe condition monitoring method, test system, computer device, and storage medium |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |