CN105699706A - Test socket - Google Patents
Test socket Download PDFInfo
- Publication number
- CN105699706A CN105699706A CN201410698657.XA CN201410698657A CN105699706A CN 105699706 A CN105699706 A CN 105699706A CN 201410698657 A CN201410698657 A CN 201410698657A CN 105699706 A CN105699706 A CN 105699706A
- Authority
- CN
- China
- Prior art keywords
- cover body
- upper cover
- base
- groove
- test jack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a test socket. The test socket comprises an upper cover body and a foundation in matching with the upper cover body, wherein one end of the upper cover body is in hinge connection with one end of the foundation through a connection member and a guide pin, a 3-5mm vertical movement gap is formed between the upper cover body and the foundation, two adjacent ends of the upper cover body and a foundation connection end are respectively provided with a buckle, the foundation is provided with a slot corresponding to the foundation, periphery of a lower end of the upper cover body is provided with positioning columns, and periphery of an upper end of the foundation is provided with positioning holes in matching with the positioning columns. The test socket has advantages of simple structure, clamping prevention, high production efficiency and low cost.
Description
Technical field
The invention belongs to test apparatus field, especially relate to a kind of test jack。
Background technology
Now in order to make electronic product meet multifunctionality and the light and handy propensity to consume of appearance and modeling, semiconductor packages tends to the technical development of wafer-level chip scale package (WaferLevelChipSizePackage/WLCSP) gradually, wafer-level chip scale package is different from traditional chip size packages to be in that, wafer-level chip scale package is directly to carry out packaging technology on wafer, then cut again, namely become, after cutting, the IC products that single encapsulation completes。The advantage of wafer-level chip scale package is in that, the finished-product volume encapsulated is less, it is possible to save the making of filler, lead frame and substrate, omits the techniques such as viscous brilliant and routing, therefore it is greatly decreased outside material and cost of labor, also shortens the process time of encapsulation and production yield and production capacity can be improved。But, wafer-level chip scale package is the encapsulating structure of a kind of size microminiaturization, and its package dimension is close or equal with chip size, and when therefore carrying out wafer-level chip scale package test, the size of chip and quantity also result in the difficulty of test。
Traditional test socket is generally two-layer opening-closing structure, test one chip, but very easily there is anti-card phenomenon in such structure, causes detection efficiency lowly, even to damage socket or chip, it is unfavorable for detection, it is impossible to meet the test request of the screening of the quality to device and performance indications。And domestic demand in reliability engineering field is very big, including the detection of universal electric product chips, also includes the Precision measurement of Aero-Space aspect。And the test jack used relies on external import in a large number, supplier is mostly Japan, Taiwan aspect, and price is prohibitively expensive, and country to spend writing foreign exchange imported product every year, and the order cycle time is longer, and the product of special requirement cannot be ordered goods, and impact produces。
Summary of the invention
It is an object of the invention to provide a kind of simple in construction, counnter attack card, production efficiency is high, cost is low test jack, be particluarly suitable in chip detection and use。
The technical scheme is that a kind of test jack, including upper cover body and base with matching, described upper cover body one end and base one end are hinged by connector and pilot pin, and between upper cover body and base, have 3-5mm's to move up and down gap, two abutting ends of described upper cover body and base link are connected to buckle, base is provided with corresponding draw-in groove, and described upper cover body lower end is formed around locating dowel, and described base upper end is formed around the hole, location matched with locating dowel。
Further, described upper cover body is passed through pivot pin and is snapped connection, and is provided with spring between buckle and base。Further, described upper cover body upper middle position is connected to briquetting by slide bar。
Further, described upper cover body centre position is provided with the stepped accommodation space that space increases gradually downward, described briquetting is corresponding with its shape, it is placed in holding in space, described briquetting upper middle position is through there being slide bar, described upper cover body top is provided with two opposite side of buckle and is provided with through hole, and described slide bar is placed in through hole。
Further, described connector bottom is connected with base by screw rod, and top is provided with groove, and described pilot pin is through groove, and can move up and down in groove。
Further, described base centre position is provided with " work " shape mounting groove, and its top is provided with float plate, and bottom is provided with base plate, and be provided with between the two be positioned at work " holding plate in the middle part of shape mounting groove。
The present invention has the advantage that and has the benefit effect that test jack usually needs detection numerous parts, the setting of locating dowel, facilitates quick location；And the setting of double card button and mobile space makes easier for installation, avoid the generation of anti-card phenomenon simultaneously；Briquetting has certain free gap in accommodation space so that the chip that detect can be carried out the adjustment of trace by briquetting, is unlikely to because chip slightly injustice causes wafer damage or affects Detection results。While improving detection efficiency, it also avoid the infringement of the damage of chip and test jack, reduce cost, improve degree of accuracy。
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the present invention
Fig. 2 is the mounting structure schematic diagram of upper cover body of the present invention
Fig. 3 is the mounting structure schematic diagram of base of the present invention
Fig. 4 is the sectional view of the present invention
The off working state that Fig. 5 is the present invention opens schematic diagram
In figure:
| 1, upper cover body | 2, base | 1-1, buckle |
| 1-2, locating dowel | 1-3, briquetting | 1-4, slide bar |
| 1-5, through hole | 1-6, pilot pin | 1-7, pivot pin |
| 1-8, spring | 2-1, draw-in groove | 2-2, hole, location |
| 2-3, " work " shape mounting groove | 2-4, float plate | 2-5, base plate |
| 2-6, holding plate | 2-7, connector | 2-7-1, groove |
| 2-8, screw rod |
Detailed description of the invention
As Figure 1-5, the technical scheme is that a kind of test jack, including upper cover body 1 and base with matching 2, described upper cover body 1 one end and base 2 one end are hinged by connector 2-7 and pilot pin 1-6, and between upper cover body 1 and base 2, have 3-5mm's to move up and down gap, two abutting ends of described upper cover body 1 and base 2 link are connected to buckle 1-1, base 2 is provided with corresponding draw-in groove 2-1, described upper cover body 1 lower end is formed around locating dowel 1-2, described base 2 upper end is formed around hole, the location 2-2 matched with locating dowel 1-2, described upper cover body 1 centre position is provided with the stepped accommodation space that space increases gradually downward, briquetting 1-3 is corresponding with its shape, it is placed in holding in space, described briquetting 1-3 upper middle position is through there being slide bar 1-4, two opposite side that described upper cover body 1 top is provided with buckle 1-1 are provided with through hole 1-5, described slide bar 1-4 is placed in through hole 1-5, described base 2 centre position is provided with " work " shape mounting groove 2-3, its top is provided with float plate 2-4, bottom is provided with base plate 2-5, and be provided with between the two be positioned at work " holding plate 2-6 in the middle part of shape mounting groove 2-3。
In this enforcement, described connector 2-7 bottom is connected with base 2 by screw rod 2-8, and top is provided with groove 2-7-1, described pilot pin 1-6 through groove 2-7-1, and can move up and down in groove 2-7-1；Described upper cover body 1 is connected with buckle 1-1 by pivot pin 1-7, and is provided with spring 1-8 between buckle 1-1 and base 2。
The work process of this example: test chip is placed on float plate 2-4, then test jack is connected in the middle of whole circuit and carries out reliability testing。When opening test jack, extruding buckle 1-1, drive upper cover body 1 to move up, locating dowel 1-2 leaves location hole 2-2, according to the setting of pilot pin 1-6, can rotate to a direction, can install or take off chip；During closedown, rotating upper cover body 1, locating dowel 1-2 enters location hole 2-2, by card buckle 1-1 to draw-in groove 2-1。
Above one embodiment of the present of invention is described in detail, but described content has been only presently preferred embodiments of the present invention, it is impossible to be considered the practical range for limiting the present invention。All equalizations made according to the present patent application scope change and improvement etc., all should still belong within the patent covering scope of the present invention。
Claims (6)
1. a test jack, including upper cover body and base with matching, it is characterized in that: described upper cover body one end and base one end are hinged by connector and pilot pin, and between upper cover body and base, have 3-5mm's to move up and down gap, two abutting ends of described upper cover body and base link are connected to buckle, base is provided with corresponding draw-in groove, and described upper cover body lower end is formed around locating dowel, and described base upper end is formed around the hole, location matched with locating dowel。
2. a kind of test jack according to claim 1, it is characterised in that: described upper cover body is passed through pivot pin and is snapped connection, and is provided with spring between buckle and base。
3. a kind of test jack according to claim 1, it is characterised in that: described upper cover body upper middle position is connected to briquetting by slide bar。
4. a kind of test jack according to claim 3, it is characterized in that: described upper cover body centre position is provided with the stepped accommodation space that space increases gradually downward, described briquetting is corresponding with its shape, it is placed in holding in space, described briquetting upper middle position is through there being slide bar, described upper cover body top is provided with two opposite side of buckle and is provided with through hole, and described slide bar is placed in through hole。
5. a kind of test jack according to claim 1, it is characterised in that: described connector bottom is connected with base by screw rod, and top is provided with groove, and described pilot pin is through groove, and can move up and down in groove。
6. a kind of test jack according to claim 1, it is characterised in that: described base centre position is provided with " work " shape mounting groove, and its top is provided with float plate, and bottom is provided with base plate, and be provided with between the two be positioned at work " holding plate in the middle part of shape mounting groove。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410698657.XA CN105699706A (en) | 2014-11-27 | 2014-11-27 | Test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410698657.XA CN105699706A (en) | 2014-11-27 | 2014-11-27 | Test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105699706A true CN105699706A (en) | 2016-06-22 |
Family
ID=56295430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410698657.XA Pending CN105699706A (en) | 2014-11-27 | 2014-11-27 | Test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105699706A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116654555A (en) * | 2023-07-28 | 2023-08-29 | 成都高新蜂鸟先进智造科技有限公司 | Annular pilot scale production line for electrified test |
-
2014
- 2014-11-27 CN CN201410698657.XA patent/CN105699706A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116654555A (en) * | 2023-07-28 | 2023-08-29 | 成都高新蜂鸟先进智造科技有限公司 | Annular pilot scale production line for electrified test |
| CN116654555B (en) * | 2023-07-28 | 2023-10-31 | 成都高新蜂鸟先进智造科技有限公司 | Annular pilot scale production line for electrified test |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160622 |
|
| WD01 | Invention patent application deemed withdrawn after publication |