CN105676188A - High-integration transmit-receive assembly based on multifunctional chip architecture - Google Patents
High-integration transmit-receive assembly based on multifunctional chip architecture Download PDFInfo
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- CN105676188A CN105676188A CN201610208219.XA CN201610208219A CN105676188A CN 105676188 A CN105676188 A CN 105676188A CN 201610208219 A CN201610208219 A CN 201610208219A CN 105676188 A CN105676188 A CN 105676188A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/28—Details of pulse systems
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Abstract
The invention relates to a high-integration transmit-receive assembly, and is to provide a simple-structure convenient-to-operate and small-size high-integration transmit-receive assembly based on a multifunctional chip architecture. The high-integration transmit-receive assembly comprises a circulator, an isolator, an amplitude limiter and a multifunctional chip. The signal input end of the circulator is connected to an antenna port, and the signal output end of the circulator is connected with the signal input end of the isolator; the signal output end of the isolator is connected with the signal input end of the amplitude limiter; the signal output end of the amplitude limiter is connected with the signal input end of a low-noise amplifier; the signal output end of the low-noise amplifier is connected with the signal input end of the multifunctional chip; the signal output end of the multifunctional chip is connected with the signal input end of a first power amplifier; the signal output end of the first power amplifier is connected with the signal input end of a second power amplifier; the signal output end of the second power amplifier is connected with the signal input end of the circulator; and the common end of the multifunctional chip is connected to an excitation port of the transmit-receive assembly.
Description
Technical field
The present invention relates to radio-frequency receiving-transmitting field, particularly relate to a kind of high integration transmitting-receiving subassembly based on multifunction chip framework.
Background technology
In modern Connectors for Active Phased Array Radar technology, transmitting-receiving subassembly is one of critical component, and the quality of its design determines cost and the degree of reliability of radar to a great extent. traditional single channel transmitting-receiving subassembly is as shown in Figure 1, transmitting-receiving subassembly mainly includes digital phase shifter P1, digital pad S1, amplitude limiter L1, first low-noise amplifier A3, second low-noise amplifier A6, circulator C1, isolator G1 and transmit-receive switch, the signal end of circulator C1 accesses antenna port X02G, the signal output part of circulator C1 is connected with the signal receiving end of isolator G1, the signal output part of isolator G1 is connected by the signal input part of amplitude limiter L1 and low-noise amplifier A3, the signal output part of low-noise amplifier A3 is connected with the signal input part of digital pad S1, the signal output part of digital pad S1 and the signal input part of the second low-noise amplifier A6 connect, the signal output part of the second low-noise amplifier A6 accesses the excitation port X01G of transmitting-receiving subassembly after passing sequentially through transmit-receive switch K1 and digital phase shifter P1. the excitation port X01G of transmitting-receiving subassembly is connected with the signal receiving end of the first power amplifier A1 after passing sequentially through digital phase shifter P1 and transmit-receive switch K1, the signal output part of the first power amplifier A1 and the signal receiving end of the second power amplifier A2 connect, and the signal output part of the second power amplifier A2 is connected with antenna port X02G by circulator C1. being required for discrete work between this each parts of single channel transmitting-receiving subassembly, control circuit is complicated, and the numerical control phase shifting accuracy of transmitting-receiving subassembly itself and numerical-controlled attenuation precision are poor, and amplitude and phase equalization between transmitting-receiving subassembly are bigger. such as a kind of high accuracy TR assembly improving low-noise amplifier structure disclosed in CN104362985A, receive signal and transmitting signal divides two-way to complete on demand, control process is loaded down with trivial details, circuit structure is complicated, and the connected mode of this circuit also will necessarily cause the size of transmitting-receiving subassembly and volume relatively big, all there is inconvenience in a upper system integration and handling maintenance process.
Summary of the invention
The high integration transmitting-receiving subassembly based on multifunction chip framework that the technical problem to be solved in the present invention is to provide a kind of simple in construction, manipulation is convenient, volume is little.
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, including circulator, isolator, amplitude limiter, transmission channel power amplifier and low-noise amplifier, the signal end of circulator accesses antenna port, the signal output part of circulator is connected with the signal input part of low-noise amplifier after passing sequentially through isolator and amplitude limiter, the signal output part of transmission channel power amplifier is connected with the signal input part of circulator, wherein: also include multifunction chip, multifunction chip includes again numerical-control attenuator, digital phase shifter, 4th power amplifier, 3rd power amplifier and multiple transmit-receive switch, the signal output part of low-noise amplifier and the first of the 4th transmit-receive switch not moved end connects, the moved end of the 4th transmit-receive switch is connected with the signal input part of digital pad, the signal output part of digital pad and the signal input part of the 4th power amplifier connect, the signal output part of the 4th power amplifier is connected with the signal input part of digital phase shifter, the signal output part of digital phase shifter and the signal input part of the 3rd power amplifier connect, the signal output part of the 3rd power amplifier and the moved end of the 3rd transmit-receive switch connect, the first of the first of 3rd transmit-receive switch not moved end and the first transmit-receive switch not moved end is connected, the second of the second of first transmit-receive switch not moved end and the 4th transmit-receive switch not moved end is connected, the excitation port of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch, the second of 3rd transmit-receive switch not moved end is connected with the signal input part of transmission channel power amplifier.
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, it is provided with the second transmit-receive switch between wherein said 3rd transmit-receive switch and the first transmit-receive switch, the first of the first of second transmit-receive switch not moved end and the 3rd transmit-receive switch not moved end is connected, the first of the moved end of the second transmit-receive switch and the first transmit-receive switch not moved end is connected, and the second of the second transmit-receive switch motionless terminates into zero potential point.
The present invention, based on the high integration transmitting-receiving subassembly of multifunction chip framework, is provided with build-out resistor between wherein said second transmit-receive switch and zero potential point.
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, and wherein said first transmit-receive switch, the second transmit-receive switch, the 3rd transmit-receive switch and the 4th transmit-receive switch are all single-pole double-throw switch (SPDT).
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, wherein said transmission channel power amplifier includes again the first power amplifier and the second power amplifier, the signal input part of the first power amplifier and the second of the 3rd transmit-receive switch not moved end connects, the signal output part of the first power amplifier and the signal input part of the second power amplifier connect, and the signal output part of the second power amplifier is connected with the signal input part of circulator.
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, the wherein said high integration transmitting-receiving subassembly based on multifunction chip framework is provided with cuboid external shell, the length of external shell, width and highly respectively 85mm, 18mm and 8mm, the material of external shell is alusil alloy.
The present invention is in that based on the high integration transmitting-receiving subassembly difference from prior art of multifunction chip framework: discrete numerical-control attenuator, digital phase shifter, the 4th power amplifier and the 3rd power amplifier are integrated into one piece of multifunction chip by the present invention, it is greatly reduced the size of circuit, improve the integrated level of assembly, size is significantly less than traditional transmitting-receiving subassembly, it is possible to be applied to the antenna plane of junior unit spacing. The first transmit-receive switch, the second transmit-receive switch, the 3rd transmit-receive switch and the 4th transmit-receive switch it is additionally provided with inside multifunction chip, by respectively the state controlling each transmit-receive switch being controlled, complete signal and receive the switching of passage and signal sendaisle, simplify circuit, make the work process of transmitting-receiving subassembly more rationalize while reducing physical size. Signal is carried out amplitude and phase place adjustment by digital pad and digital phase shifter, it is ensured that the degree of accuracy of signal. The present invention, in carrying out two-way switch operating process, carries out time division modulation, reduces the electromagnetic coupled between two paths as far as possible, thus the isolation improved between two paths, it is ensured that the normal operation of two paths.
Below in conjunction with accompanying drawing, the present invention is described further based on the high integration transmitting-receiving subassembly of multifunction chip framework.
Accompanying drawing explanation
Fig. 1 is the circuit structure block diagram of tradition transmitting-receiving subassembly;
Fig. 2 is the present invention circuit structure block diagram based on the high integration transmitting-receiving subassembly of multifunction chip framework.
Detailed description of the invention
As shown in Figure 2, for the present invention circuit structure block diagram based on the high integration transmitting-receiving subassembly of multifunction chip framework, including circulator C1, isolator G1, amplitude limiter L1, the first power amplifier A1, the second power amplifier A2, low-noise amplifier A3 and multifunction chip 1, wherein multifunction chip 1 includes again numerical-control attenuator S1, digital phase shifter P1, the 4th power amplifier A5, the 3rd power amplifier A4 and multiple transmit-receive switch. the signal end of circulator C1 accesses antenna port X02G, the signal output part of circulator C1 is connected with the signal input part of isolator G1, the signal output part of isolator G1 is connected with the signal input part of amplitude limiter L1, the signal output part of amplitude limiter L1 is connected with the signal input part of low-noise amplifier A3, the signal output part of low-noise amplifier A3 and the first of the 4th transmit-receive switch K4 not moved end connects, the moved end of the 4th transmit-receive switch K4 is connected with the signal input part of digital pad S1, the signal that low-noise amplifier A3 sends passes sequentially through the moved end of the first of the 4th transmit-receive switch K4 the not moved end and the 4th transmit-receive switch K4 and is transferred to digital pad S1. the signal output part of digital pad S1 and the signal input part of the 4th power amplifier A5 connect, the signal output part of the 4th power amplifier A5 is connected with the signal input part of digital phase shifter P1, the signal output part of digital phase shifter P1 and the signal input part of the 3rd power amplifier A4 connect, the signal output part of the 3rd power amplifier A4 and the moved end of the 3rd transmit-receive switch K3 connect, the first of the first of 3rd transmit-receive switch K3 not moved end and the second transmit-receive switch K2 not moved end is connected, the second of second transmit-receive switch K2 motionless terminates into zero potential point GND, it is provided with build-out resistor R between second transmit-receive switch K2 and zero potential point GND, the first of the moved end of the second transmit-receive switch K2 and the first transmit-receive switch K1 not moved end is connected, the second of the second of first transmit-receive switch K1 not moved end and the 4th transmit-receive switch K4 not moved end is connected, the excitation port X01G of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch K1. the second of 3rd transmit-receive switch K3 not moved end is connected with the signal input part of the first power amplifier A1, the signal output part of the first power amplifier A1 and the signal input part of the second power amplifier A2 connect, and the signal output part of the second power amplifier A2 is connected with the signal input part of circulator C1. first transmit-receive switch K1, the second transmit-receive switch K2, the 3rd transmit-receive switch K3 and the four transmit-receive switch K4 are single-pole double-throw switch (SPDT).
Being provided with external shell in one embodiment of the present of invention, external shell is cuboid structure, and the length of external shell is 85mm, width is 18mm, highly for 8mm, and the material of external shell is alusil alloy.
The operation principle of the present invention is:
In the process receiving echo-signal, the echo-signal that antenna receives inputs from antenna port X02G, reception passage is converted a signal into through circulator C1, reflected signal is eliminated by isolator G1, signal through isolator G1 enters amplitude limiter L1, the amplitude of signal is controlled by amplitude limiter L1, the signal limiting amplitude too high passes through, but normal echo-signal is presented low decay state, can effectively ensure that signal passes through the low-noise amplifier A3 at rear portion, prevent low-noise amplifier A3 abnormal due to antenna, echo-signal is crossed the low-noise amplifier A3 blasting that the situations such as strong or strong jamming cause and is burnt the generation of phenomenon.Now, the moved end of the 4th transmit-receive switch K4 with the first of the 4th transmit-receive switch K4 not moved end be connected, echo-signal is transferred to digital pad S1 by the 4th transmit-receive switch K4, the amplitude of echo-signal is carried out equal proportion adjustment by digital pad S1, it is amplified into digital phase shifter P1 then through the 4th power amplifier A5, the phase place of echo-signal is adjusted by digital phase shifter P1, it is amplified then through the 3rd power amplifier A4, now, the moved end of the 3rd transmit-receive switch K3 with the first of the 3rd transmit-receive switch K3 not moved end be connected, the first of the moved end of the second transmit-receive switch K2 and the second transmit-receive switch K2 not moved end is connected, the first of the moved end of the first transmit-receive switch K1 and the first transmit-receive switch K1 not moved end is connected, finally, the 3rd transmit-receive switch K3 is sequentially passed through through the 3rd power amplifier A4 echo-signal amplified, export from the excitation port X01G of transmitting-receiving subassembly after second transmit-receive switch K2 and the first transmit-receive switch K1, this process is the present invention work process receiving signal based on the high integration transmitting-receiving subassembly of multifunction chip framework.
In the process launching pumping signal, the pumping signal that receiver sends inputs from the excitation port X01G of transmitting-receiving subassembly, now, the second of the moved end of the second transmit-receive switch K2 and the second transmit-receive switch K2 not moved end is connected, the second of the moved end of the first transmit-receive switch K1 and the first transmit-receive switch K1 not moved end is connected, the moved end of the 4th transmit-receive switch K4 with the second of the 4th transmit-receive switch K4 not moved end be connected, pumping signal sequentially passes through the first transmit-receive switch K1 and the four transmit-receive switch K4 and is transferred to digital pad S1, the amplitude of pumping signal is adjusted by digital pad S1, it is amplified into digital phase shifter P1 then through the 4th power amplifier A5, the phase place of pumping signal is adjusted by digital phase shifter P1, it is amplified then through the 3rd power amplifier A4, now, the moved end of the 3rd transmit-receive switch K3 with the second of the 3rd transmit-receive switch K3 not moved end be connected, pumping signal after amplifying is exported by the 3rd transmit-receive switch K3 and is amplified to the first power amplifier A1, signal is again amplified by the pumping signal after the first power amplifier A1 amplifies then through the second power amplifier A2, second power amplifier A2 externally exports high-power pumping signal, finally, high-power pumping signal is transformed into antenna port X02G by circulator C1 and externally inputs.
The present invention is based on the high integration transmitting-receiving subassembly of multifunction chip framework, discrete numerical-control attenuator S1, digital phase shifter P1, the 4th power amplifier A5 and the three power amplifier A4 are integrated into one piece of multifunction chip, it is greatly reduced the size of circuit, improve the integrated level of assembly, size is significantly less than traditional transmitting-receiving subassembly, it is possible to be applied to the antenna plane of junior unit spacing. The first transmit-receive switch K1, the second transmit-receive switch K2, the 3rd transmit-receive switch K3 and the four transmit-receive switch K4 it is additionally provided with inside multifunction chip, by respectively the state controlling each transmit-receive switch being controlled, complete signal and receive the switching of passage and signal sendaisle, simplify circuit, make the work process of transmitting-receiving subassembly more rationalize while reducing physical size. Signal is carried out amplitude and phase place adjustment by digital pad S1 and digital phase shifter P1, it is ensured that the degree of accuracy of signal. The present invention, in carrying out two-way switch operating process, carries out time division modulation, reduces the electromagnetic coupled between two paths as far as possible, thus the isolation improved between two paths, it is ensured that the normal operation of two paths.Present configuration is simple, manipulation is convenient, volume is little, compared with prior art has clear advantage.
Embodiment described above is only that the preferred embodiment of the present invention is described; not the scope of the present invention is defined; under the premise designing spirit without departing from the present invention; various deformation that technical scheme is made by those of ordinary skill in the art and improvement, all should fall in the protection domain that claims of the present invention is determined.
Claims (6)
1. the high integration transmitting-receiving subassembly based on multifunction chip framework, including circulator (C1), isolator (G1), amplitude limiter (L1), transmission channel power amplifier and low-noise amplifier (A3), the signal end of circulator (C1) accesses antenna port (X02G), the signal output part of circulator (C1) passes sequentially through isolator (G1) and amplitude limiter (L1) is connected with the signal input part of low-noise amplifier (A3) afterwards, the signal output part of transmission channel power amplifier is connected with the signal input part of circulator (C1), it is characterized in that: go back multifunction chip (1), multifunction chip (1) includes again numerical-control attenuator (S1), digital phase shifter (P1), 4th power amplifier (A5), 3rd power amplifier (A4) and multiple transmit-receive switch, the signal output part of low-noise amplifier (A3) and the first of the 4th transmit-receive switch (K4) not moved end connects, the moved end of the 4th transmit-receive switch (K4) is connected with the signal input part of digital pad (S1), the signal output part of digital pad (S1) and the signal input part of the 4th power amplifier (A5) connect, the signal output part of the 4th power amplifier (A5) is connected with the signal input part of digital phase shifter (P1), the signal output part of digital phase shifter (P1) and the signal input part of the 3rd power amplifier (A4) connect, the signal output part of the 3rd power amplifier (A4) and the moved end of the 3rd transmit-receive switch (K3) connect, the first of the first of 3rd transmit-receive switch (K3) not moved end and the first transmit-receive switch (K1) not moved end is connected, the second of the second of first transmit-receive switch (K1) not moved end and the 4th transmit-receive switch (K4) not moved end is connected, the excitation port (X01G) of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch (K1), the second of 3rd transmit-receive switch (K3) not moved end is connected with the signal input part of transmission channel power amplifier.
2. the high integration transmitting-receiving subassembly based on multifunction chip framework according to claim 1, it is characterized in that: between described 3rd transmit-receive switch (K3) and the first transmit-receive switch (K1), be provided with the second transmit-receive switch (K2), the first of the first of second transmit-receive switch (K2) not moved end and the 3rd transmit-receive switch (K3) not moved end is connected, the first of the moved end of the second transmit-receive switch (K2) and the first transmit-receive switch (K1) not moved end is connected, and the second of the second transmit-receive switch (K2) motionless terminates into zero potential point (GND).
3. the high integration transmitting-receiving subassembly based on multifunction chip framework according to claim 2, it is characterised in that: it is provided with build-out resistor (R) between described second transmit-receive switch (K2) and zero potential point (GND).
4. the high integration transmitting-receiving subassembly based on multifunction chip framework according to claim 2, it is characterised in that: described first transmit-receive switch (K1), the second transmit-receive switch (K2), the 3rd transmit-receive switch (K3) and the 4th transmit-receive switch (K4) they are all single-pole double-throw switch (SPDT).
5. the high integration transmitting-receiving subassembly based on multifunction chip framework according to claim 1, it is characterized in that: described transmission channel power amplifier includes again the first power amplifier (A1) and the second power amplifier (A2), the signal input part of the first power amplifier (A1) and the second of the 3rd transmit-receive switch (K3) not moved end connects, the signal output part of the first power amplifier (A1) and the signal input part of the second power amplifier (A2) connect, the signal output part of the second power amplifier (A2) is connected with the signal input part of circulator (C1).
6. the high integration transmitting-receiving subassembly based on multifunction chip framework according to claim 1, it is characterized in that: the described high integration transmitting-receiving subassembly based on multifunction chip framework is provided with cuboid external shell, the length of external shell, width and highly respectively 85mm, 18mm and 8mm, the material of external shell is alusil alloy.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610208219.XA CN105676188A (en) | 2016-04-01 | 2016-04-01 | High-integration transmit-receive assembly based on multifunctional chip architecture |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610208219.XA CN105676188A (en) | 2016-04-01 | 2016-04-01 | High-integration transmit-receive assembly based on multifunctional chip architecture |
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| CN201610208219.XA Pending CN105676188A (en) | 2016-04-01 | 2016-04-01 | High-integration transmit-receive assembly based on multifunctional chip architecture |
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Cited By (4)
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| CN107505600A (en) * | 2017-09-30 | 2017-12-22 | 天津中科海高微波技术有限公司 | Multifunction chip circuit |
| CN109239673A (en) * | 2018-09-29 | 2019-01-18 | 扬州海科电子科技有限公司 | A kind of width phase control multifunction chip of 6-18GHz |
| CN112532559A (en) * | 2020-10-15 | 2021-03-19 | 北京无线电测量研究所 | Numerical control amplitude-phase multifunctional chip and method for transmitting signals in chip |
| CN117498888A (en) * | 2024-01-03 | 2024-02-02 | 珠海紫燕无人飞行器有限公司 | Device multiplexing radio frequency transceiver circuit and control method thereof |
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Cited By (5)
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| CN112532559A (en) * | 2020-10-15 | 2021-03-19 | 北京无线电测量研究所 | Numerical control amplitude-phase multifunctional chip and method for transmitting signals in chip |
| CN117498888A (en) * | 2024-01-03 | 2024-02-02 | 珠海紫燕无人飞行器有限公司 | Device multiplexing radio frequency transceiver circuit and control method thereof |
| CN117498888B (en) * | 2024-01-03 | 2024-04-26 | 珠海紫燕无人飞行器有限公司 | Device multiplexing radio frequency transceiver circuit and control method thereof |
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Application publication date: 20160615 |