CN205450259U - High integration receiving and dispatching subassembly based on many function chip framework - Google Patents
High integration receiving and dispatching subassembly based on many function chip framework Download PDFInfo
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- CN205450259U CN205450259U CN201620276905.6U CN201620276905U CN205450259U CN 205450259 U CN205450259 U CN 205450259U CN 201620276905 U CN201620276905 U CN 201620276905U CN 205450259 U CN205450259 U CN 205450259U
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Abstract
The utility model relates to a high integration receiving and dispatching subassembly. Its purpose is in order to provide a simple structure, to control convenience, small high integration receiving and dispatching subassembly based on many function chip framework. The utility model discloses a circulator, isolator, clipper -limiter and many function chip. The antenna end mouth is gone into to the signal termination of circulator, the signal output part of circulator and the signal input part of isolator are connected, the signal output part of isolator and the signal input part of clipper -limiter are connected, the signal output part of clipper -limiter and low -noise amplifier's signal input part are connected, low -noise amplifier's signal output part and many function chip's signal input part are connected, many function chip's signal output part and a power amplifier's signal input part are connected, a power amplifier's signal output part and the 2nd power amplifier's signal input part are connected, the 2nd power amplifier's the signal output part and the signal input part of circulator are connected. Many function chip's common port inserts the excitation port of receiving and dispatching subassembly.
Description
Technical field
This utility model relates to radio-frequency receiving-transmitting field, particularly relates to a kind of high integration transmitting-receiving subassembly based on multifunction chip framework.
Background technology
In modern Connectors for Active Phased Array Radar technology, transmitting-receiving subassembly is one of critical component, and the quality of its design determines cost and the degree of reliability of radar to a great extent.nullTraditional single channel transmitting-receiving subassembly is as shown in Figure 1，Transmitting-receiving subassembly mainly includes digital phase shifter P1、Digital pad S1、Amplitude limiter L1、First low-noise amplifier A3、Second low-noise amplifier A6、Circulator C1、Isolator G1 and transmit-receive switch，The signal end of circulator C1 accesses antenna port X02G，The signal output part of circulator C1 is connected with the signal receiving end of isolator G1，The signal output part of isolator G1 is connected by the signal input part of amplitude limiter L1 and low-noise amplifier A3，The signal output part of low-noise amplifier A3 is connected with the signal input part of digital pad S1，The signal output part of digital pad S1 and the signal input part of the second low-noise amplifier A6 connect，The signal output part of the second low-noise amplifier A6 accesses excitation port X01G of transmitting-receiving subassembly after passing sequentially through transmit-receive switch K1 and digital phase shifter P1.Excitation port X01G of transmitting-receiving subassembly is connected with the signal receiving end of the first power amplifier A1 after passing sequentially through digital phase shifter P1 and transmit-receive switch K1, the signal output part of the first power amplifier A1 and the signal receiving end of the second power amplifier A2 connect, and the signal output part of the second power amplifier A2 is connected with antenna port X02G by circulator C1.Being required for discrete work between this each parts of single channel transmitting-receiving subassembly, control circuit is complicated, and the numerical control phase shifting accuracy of transmitting-receiving subassembly itself and numerical-controlled attenuation precision are poor, and amplitude and phase equalization between transmitting-receiving subassembly are bigger.A kind of high accuracy TR assembly improving low-noise amplifier structure as disclosed in CN104362985A, receive signal and transmitting signal divides two-way to complete on demand, control process is loaded down with trivial details, circuit structure is complicated, and the connected mode of this circuit also will necessarily cause the size of transmitting-receiving subassembly and volume relatively big, all there is inconvenience in the upper level system integration and dismounting maintenance process.
Utility model content
The high integration transmitting-receiving subassembly based on multifunction chip framework that the technical problems to be solved in the utility model is to provide a kind of simple in construction, manipulation is convenient, volume is little.
nullThis utility model high integration based on multifunction chip framework transmitting-receiving subassembly，Including circulator、Isolator、Amplitude limiter、Transmission channel power amplifier and low-noise amplifier，The signal end of circulator accesses antenna port，The signal output part of circulator is connected with the signal input part of low-noise amplifier after passing sequentially through isolator and amplitude limiter，The signal output part of transmission channel power amplifier is connected with the signal input part of circulator，Wherein: also include multifunction chip，Multifunction chip includes again numerical-control attenuator、Digital phase shifter、4th power amplifier、3rd power amplifier and multiple transmit-receive switch，The signal output part of low-noise amplifier and the first of the 4th transmit-receive switch not moved end connects，The moved end of the 4th transmit-receive switch is connected with the signal input part of digital pad，The signal output part of digital pad and the signal input part of the 4th power amplifier connect，The signal output part of the 4th power amplifier is connected with the signal input part of digital phase shifter，The signal output part of digital phase shifter and the signal input part of the 3rd power amplifier connect，The signal output part of the 3rd power amplifier and the moved end of the 3rd transmit-receive switch connect，The first of the first of 3rd transmit-receive switch not moved end and the first transmit-receive switch not moved end is connected，The second of the second of first transmit-receive switch not moved end and the 4th transmit-receive switch not moved end is connected，The excitation port of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch，The second of 3rd transmit-receive switch not moved end is connected with the signal input part of transmission channel power amplifier.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, it is provided with the second transmit-receive switch between wherein said 3rd transmit-receive switch and the first transmit-receive switch, the first of the first of second transmit-receive switch not moved end and the 3rd transmit-receive switch not moved end is connected, the first of the moved end of the second transmit-receive switch and the first transmit-receive switch not moved end is connected, and the second of the second transmit-receive switch motionless terminates into zero potential point.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, is provided with build-out resistor between wherein said second transmit-receive switch and zero potential point.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, wherein said first transmit-receive switch, the second transmit-receive switch, the 3rd transmit-receive switch and the 4th transmit-receive switch are all single-pole double-throw switch (SPDT).
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, wherein said transmission channel power amplifier includes again the first power amplifier and the second power amplifier, the signal input part of the first power amplifier and the second of the 3rd transmit-receive switch not moved end connects, the signal output part of the first power amplifier and the signal input part of the second power amplifier connect, and the signal output part of the second power amplifier is connected with the signal input part of circulator.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, wherein said high integration transmitting-receiving subassembly based on multifunction chip framework is provided with cuboid external shell, the length of external shell, width and height are respectively 85mm, 18mm and 8mm, and the material of external shell is alusil alloy.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly difference from prior art is: discrete numerical-control attenuator, digital phase shifter, the 4th power amplifier and the 3rd power amplifier are integrated into one piece of multifunction chip by this utility model, it is greatly reduced the size of circuit, improve the integrated level of assembly, size is significantly less than traditional transmitting-receiving subassembly, it is possible to be applied to the antenna plane of junior unit spacing.The first transmit-receive switch, the second transmit-receive switch, the 3rd transmit-receive switch and the 4th transmit-receive switch it is additionally provided with inside multifunction chip, by respectively the state controlling each transmit-receive switch being controlled, complete signal and receive passage and the switching of signal sendaisle, simplify circuit, make the work process of transmitting-receiving subassembly more rationalize while reducing physical size.Digital pad and digital phase shifter carry out amplitude to signal and phase place adjusts, it is ensured that the degree of accuracy of signal.This utility model, during carrying out two-way switch operating, carries out time division modulation, reduces the electromagnetic coupled between two paths as far as possible, thus improves the isolation between two paths, it is ensured that the normal work of two paths.
High integration transmitting-receiving subassembly based on multifunction chip framework to this utility model is described further below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the circuit structure block diagram of tradition transmitting-receiving subassembly；
Fig. 2 is the circuit structure block diagram of this utility model high integration based on multifunction chip framework transmitting-receiving subassembly.
Detailed description of the invention
As shown in Figure 2, circuit structure block diagram for this utility model high integration based on multifunction chip framework transmitting-receiving subassembly, including circulator C1, isolator G1, amplitude limiter L1, the first power amplifier A1, the second power amplifier A2, low-noise amplifier A3 and multifunction chip 1, wherein multifunction chip 1 includes again numerical-control attenuator S1, digital phase shifter P1, the 4th power amplifier A5, the 3rd power amplifier A4 and multiple transmit-receive switch.The signal end of circulator C1 accesses antenna port X02G, the signal output part of circulator C1 is connected with the signal input part of isolator G1, the signal output part of isolator G1 is connected with the signal input part of amplitude limiter L1, the signal output part of amplitude limiter L1 is connected with the signal input part of low-noise amplifier A3, the signal output part of low-noise amplifier A3 and the first of the 4th transmit-receive switch K4 not moved end connects, the moved end of the 4th transmit-receive switch K4 is connected with the signal input part of digital pad S1, the signal that low-noise amplifier A3 sends passes sequentially through the moved end of the first of the 4th transmit-receive switch K4 the not moved end and the 4th transmit-receive switch K4 and is transferred to digital pad S1.nullThe signal output part of digital pad S1 and the signal input part of the 4th power amplifier A5 connect，The signal output part of the 4th power amplifier A5 is connected with the signal input part of digital phase shifter P1，The signal output part of digital phase shifter P1 and the signal input part of the 3rd power amplifier A4 connect，The signal output part of the 3rd power amplifier A4 and the moved end of the 3rd transmit-receive switch K3 connect，The first of the first of 3rd transmit-receive switch K3 not moved end and the second transmit-receive switch K2 not moved end is connected，The second of second transmit-receive switch K2 motionless terminates into zero potential point GND，It is provided with build-out resistor R between second transmit-receive switch K2 and zero potential point GND，The first of the moved end of the second transmit-receive switch K2 and the first transmit-receive switch K1 not moved end is connected，The second of the second of first transmit-receive switch K1 not moved end and the 4th transmit-receive switch K4 not moved end is connected，Excitation port X01G of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch K1.The second of 3rd transmit-receive switch K3 not moved end is connected with the signal input part of the first power amplifier A1, the signal output part of the first power amplifier A1 and the signal input part of the second power amplifier A2 connect, and the signal output part of the second power amplifier A2 is connected with the signal input part of circulator C1.First transmit-receive switch K1, the second transmit-receive switch K2, the 3rd transmit-receive switch K3 and the 4th transmit-receive switch K4 are single-pole double-throw switch (SPDT).
Being provided with external shell in an embodiment of the present utility model, external shell is cuboid structure, and a length of 85mm of external shell, width are 18mm, height is 8mm, and the material of external shell is alusil alloy.
Operation principle of the present utility model is:
During receiving echo-signal, the echo-signal that antenna receives inputs from antenna port X02G, reception passage is converted a signal into through circulator C1, reflected signal is eliminated by isolator G1, signal through isolator G1 enters amplitude limiter L1, the amplitude of signal is controlled by amplitude limiter L1, the signal limiting amplitude too high passes through, but normal echo-signal is presented low decay state, can effectively ensure that signal passes through the low-noise amplifier A3 at rear portion, prevent low-noise amplifier A3 abnormal due to antenna, the low-noise amplifier A3 that echo-signal is too strong or the situation such as strong jamming causes overdrives the generation burning phenomenon.nullNow，The moved end of the 4th transmit-receive switch K4 with the first of the 4th transmit-receive switch K4 not moved end be connected，Echo-signal is transferred to digital pad S1 by the 4th transmit-receive switch K4，Digital pad S1 carries out equal proportion adjustment to the amplitude of echo-signal，It is amplified into digital phase shifter P1 again through the 4th power amplifier A5，The phase place of echo-signal is adjusted by digital phase shifter P1，It is amplified through the 3rd power amplifier A4 again，Now，The moved end of the 3rd transmit-receive switch K3 with the first of the 3rd transmit-receive switch K3 not moved end be connected，The first of the moved end of the second transmit-receive switch K2 and the second transmit-receive switch K2 not moved end is connected，The first of the moved end of the first transmit-receive switch K1 and the first transmit-receive switch K1 not moved end is connected，Finally，The echo-signal amplified through the 3rd power amplifier A4 sequentially passes through the 3rd transmit-receive switch K3、Export from excitation port X01G of transmitting-receiving subassembly after second transmit-receive switch K2 and the first transmit-receive switch K1，This process is the work process receiving signal of this utility model high integration based on multifunction chip framework transmitting-receiving subassembly.
nullDuring launching pumping signal，The pumping signal that receiver sends inputs from excitation port X01G of transmitting-receiving subassembly，Now，The second of the moved end of the second transmit-receive switch K2 and the second transmit-receive switch K2 not moved end is connected，The second of the moved end of the first transmit-receive switch K1 and the first transmit-receive switch K1 not moved end is connected，The moved end of the 4th transmit-receive switch K4 with the second of the 4th transmit-receive switch K4 not moved end be connected，Pumping signal sequentially passes through the first transmit-receive switch K1 and the 4th transmit-receive switch K4 and is transferred to digital pad S1，The amplitude of pumping signal is adjusted by digital pad S1，It is amplified into digital phase shifter P1 again through the 4th power amplifier A5，The phase place of pumping signal is adjusted by digital phase shifter P1，It is amplified through the 3rd power amplifier A4 again，Now，The moved end of the 3rd transmit-receive switch K3 with the second of the 3rd transmit-receive switch K3 not moved end be connected，Pumping signal after amplifying is exported by the 3rd transmit-receive switch K3 and is amplified to the first power amplifier A1，Signal is again amplified by pumping signal after the first power amplifier A1 amplifies again through the second power amplifier A2，Second power amplifier A2 externally exports high-power pumping signal，Finally，High-power pumping signal is transformed into antenna port X02G by circulator C1 and externally inputs.
This utility model high integration based on multifunction chip framework transmitting-receiving subassembly, discrete numerical-control attenuator S1, digital phase shifter P1, the 4th power amplifier A5 and the 3rd power amplifier A4 are integrated into one piece of multifunction chip, it is greatly reduced the size of circuit, improve the integrated level of assembly, size is significantly less than traditional transmitting-receiving subassembly, it is possible to be applied to the antenna plane of junior unit spacing.The first transmit-receive switch K1, the second transmit-receive switch K2, the 3rd transmit-receive switch K3 and the 4th transmit-receive switch K4 it is additionally provided with inside multifunction chip, by respectively the state controlling each transmit-receive switch being controlled, complete signal and receive passage and the switching of signal sendaisle, simplify circuit, make the work process of transmitting-receiving subassembly more rationalize while reducing physical size.Digital pad S1 and digital phase shifter P1 carries out amplitude to signal and phase place adjusts, it is ensured that the degree of accuracy of signal.This utility model, during carrying out two-way switch operating, carries out time division modulation, reduces the electromagnetic coupled between two paths as far as possible, thus improves the isolation between two paths, it is ensured that the normal work of two paths.This utility model simple in construction, manipulation convenience, volume are little, compared with prior art have clear advantage.
Embodiment described above is only to be described preferred implementation of the present utility model; not scope of the present utility model is defined; on the premise of without departing from this utility model design spirit; various deformation that the technical solution of the utility model is made by those of ordinary skill in the art and improvement, all should fall in the protection domain that this utility model claims determine.
Claims (6)
- null1. a high integration transmitting-receiving subassembly based on multifunction chip framework，Including circulator (C1)、Isolator (G1)、Amplitude limiter (L1)、Transmission channel power amplifier and low-noise amplifier (A3)，The signal end of circulator (C1) accesses antenna port (X02G)，The signal output part of circulator (C1) passes sequentially through isolator (G1) and amplitude limiter (L1) signal input part afterwards with low-noise amplifier (A3) and is connected，The signal output part of transmission channel power amplifier is connected with the signal input part of circulator (C1)，It is characterized in that: go back multifunction chip (1)，Multifunction chip (1) includes again numerical-control attenuator (S1)、Digital phase shifter (P1)、4th power amplifier (A5)、3rd power amplifier (A4) and multiple transmit-receive switch，The signal output part of low-noise amplifier (A3) and the first of the 4th transmit-receive switch (K4) not moved end connects，The moved end of the 4th transmit-receive switch (K4) is connected with the signal input part of digital pad (S1)，The signal output part of digital pad (S1) and the signal input part of the 4th power amplifier (A5) connect，The signal output part of the 4th power amplifier (A5) is connected with the signal input part of digital phase shifter (P1)，The signal output part of digital phase shifter (P1) and the signal input part of the 3rd power amplifier (A4) connect，The signal output part of the 3rd power amplifier (A4) and the moved end of the 3rd transmit-receive switch (K3) connect，The first of the first of 3rd transmit-receive switch (K3) not moved end and the first transmit-receive switch (K1) not moved end is connected，The second of the second of first transmit-receive switch (K1) not moved end and the 4th transmit-receive switch (K4) not moved end is connected，The excitation port (X01G) of transmitting-receiving subassembly is accessed in the moved end of the first transmit-receive switch (K1)，The second of 3rd transmit-receive switch (K3) not moved end is connected with the signal input part of transmission channel power amplifier.
- High integration transmitting-receiving subassembly based on multifunction chip framework the most according to claim 1, it is characterized in that: between described 3rd transmit-receive switch (K3) and the first transmit-receive switch (K1), be provided with the second transmit-receive switch (K2), the first of the first of second transmit-receive switch (K2) not moved end and the 3rd transmit-receive switch (K3) not moved end is connected, the first of the moved end of the second transmit-receive switch (K2) and the first transmit-receive switch (K1) not moved end is connected, and the second of the second transmit-receive switch (K2) motionless terminates into zero potential point (GND).
- High integration transmitting-receiving subassembly based on multifunction chip framework the most according to claim 2, it is characterised in that: it is provided with build-out resistor (R) between described second transmit-receive switch (K2) and zero potential point (GND).
- High integration transmitting-receiving subassembly based on multifunction chip framework the most according to claim 2, it is characterised in that: described first transmit-receive switch (K1), the second transmit-receive switch (K2), the 3rd transmit-receive switch (K3) and the 4th transmit-receive switch (K4) they are all single-pole double-throw switch (SPDT).
- High integration transmitting-receiving subassembly based on multifunction chip framework the most according to claim 1, it is characterized in that: described transmission channel power amplifier includes again the first power amplifier (A1) and the second power amplifier (A2), the signal input part of the first power amplifier (A1) and the second of the 3rd transmit-receive switch (K3) not moved end connects, the signal output part of the first power amplifier (A1) and the signal input part of the second power amplifier (A2) connect, the signal output part of the second power amplifier (A2) is connected with the signal input part of circulator (C1).
- High integration transmitting-receiving subassembly based on multifunction chip framework the most according to claim 1, it is characterized in that: described high integration transmitting-receiving subassembly based on multifunction chip framework is provided with cuboid external shell, the length of external shell, width and height are respectively 85mm, 18mm and 8mm, and the material of external shell is alusil alloy.
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| CN201620276905.6U CN205450259U (en) | 2016-04-01 | 2016-04-01 | High integration receiving and dispatching subassembly based on many function chip framework |
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| CN201620276905.6U CN205450259U (en) | 2016-04-01 | 2016-04-01 | High integration receiving and dispatching subassembly based on many function chip framework |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105676188A (en) * | 2016-04-01 | 2016-06-15 | 中国电子科技集团公司第三十八研究所 | High-integration transmit-receive assembly based on multifunctional chip architecture |
| CN112600585A (en) * | 2021-03-03 | 2021-04-02 | 理工全盛(北京)科技有限公司 | TR (transmitter-receiver) assembly, signal processing method and related equipment |
-
2016
- 2016-04-01 CN CN201620276905.6U patent/CN205450259U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105676188A (en) * | 2016-04-01 | 2016-06-15 | 中国电子科技集团公司第三十八研究所 | High-integration transmit-receive assembly based on multifunctional chip architecture |
| CN112600585A (en) * | 2021-03-03 | 2021-04-02 | 理工全盛(北京)科技有限公司 | TR (transmitter-receiver) assembly, signal processing method and related equipment |
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