CN105676111A - ICT test jig - Google Patents
ICT test jig Download PDFInfo
- Publication number
- CN105676111A CN105676111A CN201610053297.7A CN201610053297A CN105676111A CN 105676111 A CN105676111 A CN 105676111A CN 201610053297 A CN201610053297 A CN 201610053297A CN 105676111 A CN105676111 A CN 105676111A
- Authority
- CN
- China
- Prior art keywords
- layer
- test
- jig
- ict
- measurement jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses an ICT test jig, which comprises a test box, a test board, a jig layer and support columns. The test board is arranged on the upper portion of the inner side of the test box. The jig layer comprises a special shape layer, intermediate layers, a bearing layer and a mesh layer. Positioning pins are arranged between the intermediate layers and the special shape layer; the test board is connected with an electronic analyzer; the support columns penetrate from the bottom portion of the mesh layer and runs above the upper plane of the special shape layer; and the four opposite corners of the test box are respectively provided with a positioning clamp. Through the mode above, the ICT test jig is low in cost, simple in structure, low in manufacture and maintenance cost and good in universal performance, can be suitable for the test of a plurality of PCBs, greatly reduces overall cost of the ICT test jig and reduces production cost of enterprises.
Description
Technical field
The present invention relates to measurement jig, particularly relate to a kind of ICT measurement jig.
Background technology
Bare board test is only applied to the field tests of military and that reliability requirement is very high product the earliest. A large amount of tests of the product for civilian use are tested by client oneself. And early stage universal test equipment price is very expensive. And the detection method error of bore hole range estimation among the people is relatively big, the reliable performance of electronic product cannot be ensured. And if utilize universal test to control tool test, the detection of different special pcb boards also must adopt testing jig special complete detection. And testing jig special cost is expensive, fabrication cycle length, making and maintenance aspect all need those skilled in the art to complete, and its personal expenditures and testing cost are quite high, and the bigger production cost that improve product, affects product competitiveness in the market.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of ICT measurement jig, have with low cost, structure simple, make and maintenance cost is low, universal performance is good, applicable in the test of multiple pcb board, greatly reduce the whole cost of ICT measurement jig, reduce the production cost of enterprise.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of ICT measurement jig, comprise test box, survey plate, control tool layer and pillar, described survey plate is arranged on test box inside upper part, described tool layer of controlling comprises special-shaped layer, middle layer, bearing stratum and clathrum, it is provided with pilot pin between described middle layer and special-shaped layer, described survey plate is connected with electronic analyzer, described pillar wear bottom clathrum into, extending through plane top on abnormity layer, described test box four diagonal angles place is respectively equipped with positioning fixture.
In the present invention's preferred embodiments, described electronic analyzer is crow pin or qin steel wire.
In the present invention's preferred embodiments, described middle layer is at least provided with 10 layers.
In the present invention's preferred embodiments, the thickness in described middle layer is 3-6mm.
The invention has the beneficial effects as follows: a kind of ICT measurement jig of the present invention, have with low cost, structure simple, make and maintenance cost is low, universal performance is good, applicable in the test of multiple pcb board, greatly reduce the whole cost of ICT measurement jig, reduce the production cost of enterprise.
Accompanying drawing explanation
In order to the technical scheme being illustrated more clearly in the embodiment of the present invention, below the accompanying drawing used required in embodiment being described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of better embodiment of ICT measurement jig one of the present invention.
Embodiment
It is clearly and completely described to the technical scheme in the embodiment of the present invention below, it is clear that described embodiment is only a part of embodiment of the present invention, instead of whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Referring to Fig. 1, the embodiment of the present invention provides following technical scheme.
A kind of ICT measurement jig, comprise test box 1, survey plate 2, control tool layer and pillar 3, described survey plate 2 is arranged on test box 1 inside upper part, described tool layer of controlling comprises special-shaped layer 4, middle layer 5, bearing stratum 6 and clathrum 7, be provided with pilot pin 8 between described middle layer 5 and special-shaped layer 4, described survey plate 2 be connected with electronic analyzer 9, described pillar 3 wear bottom clathrum 7 into, extending through plane top on abnormity layer 4, described test box 1 four diagonal angles place is respectively equipped with positioning fixture 10.
Described electronic analyzer 9 is crow pin or qin steel wire.
Described middle layer 5 is at least provided with 10 layers.
The thickness in described middle layer 5 is 3-6mm.
The invention has the beneficial effects as follows: a kind of ICT measurement jig of the present invention, have with low cost, structure simple, make and maintenance cost is low, universal performance is good, applicable in the test of multiple pcb board, greatly reduce the whole cost of ICT measurement jig, reduce the production cost of enterprise.
The foregoing is only embodiments of the invention; not thereby the patent scope of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, all it is included in the scope of patent protection of the present invention with reason.
Claims (4)
1. an ICT measurement jig, it is characterized in that, comprise test box, survey plate, control tool layer and pillar, described survey plate is arranged on test box inside upper part, described in control tool layer and comprise special-shaped layer, middle layer, bearing stratum and clathrum, be provided with pilot pin between described middle layer and special-shaped layer, described survey plate is connected with electronic analyzer, described pillar wear bottom clathrum into, extend through abnormity layer on plane top, described test box four diagonal angles place is respectively equipped with positioning fixture.
2. ICT measurement jig according to claim 1, it is characterised in that, described electronic analyzer is crow pin or qin steel wire.
3. ICT measurement jig according to claim 1, it is characterised in that, described middle layer is at least provided with 10 layers.
4. ICT measurement jig according to claim 1, it is characterised in that, the thickness in described middle layer is 3-6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610053297.7A CN105676111A (en) | 2016-01-27 | 2016-01-27 | ICT test jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610053297.7A CN105676111A (en) | 2016-01-27 | 2016-01-27 | ICT test jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105676111A true CN105676111A (en) | 2016-06-15 |
Family
ID=56303030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610053297.7A Pending CN105676111A (en) | 2016-01-27 | 2016-01-27 | ICT test jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105676111A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743191B (en) * | 2016-10-04 | 2021-10-21 | 美商泰瑞達公司 | Test fixture |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04301781A (en) * | 1991-03-29 | 1992-10-26 | Tanaka Kikinzoku Kogyo Kk | Installing method of wiring test jig on test device |
| CN1302379A (en) * | 1998-11-02 | 2001-07-04 | Atg试验体系两合公司 | Device for testing printed boards |
| CN1477403A (en) * | 2003-07-07 | 2004-02-25 | 上海三冉科技发展有限公司 | Receiver used in electronic testing equpment of printed circuit board |
| CN2660540Y (en) * | 2003-11-07 | 2004-12-01 | 王云阶 | Conducting structure of probe assembly and wire in electronic and detecting implement |
| CN201508403U (en) * | 2009-06-29 | 2010-06-16 | 自然兴电通科技股份有限公司 | General-purpose fixture for tester of printed circuit board |
| CN102680809A (en) * | 2011-03-09 | 2012-09-19 | 瑞统企业股份有限公司 | Electrical testing device for printed circuit board |
| US20130169302A1 (en) * | 2011-12-30 | 2013-07-04 | Stmicroelectronics S.R.L. | System and adapter for testing packaged integrated circuit chips |
| CN103412160A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | ICT testing fixture |
-
2016
- 2016-01-27 CN CN201610053297.7A patent/CN105676111A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04301781A (en) * | 1991-03-29 | 1992-10-26 | Tanaka Kikinzoku Kogyo Kk | Installing method of wiring test jig on test device |
| CN1302379A (en) * | 1998-11-02 | 2001-07-04 | Atg试验体系两合公司 | Device for testing printed boards |
| CN1477403A (en) * | 2003-07-07 | 2004-02-25 | 上海三冉科技发展有限公司 | Receiver used in electronic testing equpment of printed circuit board |
| CN2660540Y (en) * | 2003-11-07 | 2004-12-01 | 王云阶 | Conducting structure of probe assembly and wire in electronic and detecting implement |
| CN201508403U (en) * | 2009-06-29 | 2010-06-16 | 自然兴电通科技股份有限公司 | General-purpose fixture for tester of printed circuit board |
| CN102680809A (en) * | 2011-03-09 | 2012-09-19 | 瑞统企业股份有限公司 | Electrical testing device for printed circuit board |
| US20130169302A1 (en) * | 2011-12-30 | 2013-07-04 | Stmicroelectronics S.R.L. | System and adapter for testing packaged integrated circuit chips |
| CN103412160A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | ICT testing fixture |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743191B (en) * | 2016-10-04 | 2021-10-21 | 美商泰瑞達公司 | Test fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160615 |
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| RJ01 | Rejection of invention patent application after publication |