CN105671526A - Polymer material plated with metal film - Google Patents
Polymer material plated with metal film Download PDFInfo
- Publication number
- CN105671526A CN105671526A CN201610042107.1A CN201610042107A CN105671526A CN 105671526 A CN105671526 A CN 105671526A CN 201610042107 A CN201610042107 A CN 201610042107A CN 105671526 A CN105671526 A CN 105671526A
- Authority
- CN
- China
- Prior art keywords
- polymeric material
- solution
- metal film
- polymer material
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a polymer material plated with a metal film. A preparation method of the polymer material plated with the metal film comprises the following steps that (1) the polymer material serves as a base plate, holes are evenly punched in the base plate, and the base plate is placed in a solution A for 5-6 h and then taken out and aired; and (2) the surface of the material obtained after being aired in the step (1) is made to make contact with a solution B by an inclination angle of 15-45 degrees, and then non-electrolytic metal plating is conducted on the surface of the material, so that the polymer material plated with the metal film is obtained. The metal film plated on the polymer material plated with the metal film is excellent in fit degree and good in quality, a metal mold has extremely high adhesive force and shows good repeatability; and furthermore, the preparation cost of the polymer material plated with the metal film is low.
Description
Technical field
The present invention relates to a kind of polymeric material, particularly to the polymeric material of a kind of plating.
Background technology
Compared with metal material, polymeric material has lot of advantages, cheap including it, light, rigidity and machinability is good, chemical stability and corrosion resistance good etc., therefore, be utilized as a kind of substitution material of metal material in recent years in multiple application. Especially, metal function can be increased owing to surface of polymer material is coated with metal film, so the application of polymeric material greatly extends. This material had both had the advantage of metal, including hardness, better rigidity, electric conductivity etc., it may have the advantage of polymer, including light, machinability, productivity etc., therefore, held promise as very much metal working material, such as the substitute material of copper etc.
At surface of polymer material metal-coated membrane, think the method that polymeric material provides the metallic characters such as conductivity, electric screen and briliancy, be commonly divided into wet plating method and dry plating method two kinds. Owing to polymeric material is non-conductor, therefore can not pass through electro-plating method on surface of polymer material, deposit metal film.
There is the addition of excessive inorganic filler and cause the character of polymeric material and the decline of adhesion of coating film in wet plating method, and causes into the local problem increased, and this makes its commercialization extremely difficult. It addition, for the adhesive force improving coating, it should retaining jog, this causes the decline of product appearance quality. Due to filling surface pore, reducing metal, its adhesive strength must be low, and due to needs excess deposition metal, it should use substantial amounts of metal and reducing agent, therefore produce a large amount of waste water and cause environmental problem.
Dry plating method also has some shortcomings, poor including the adhesive force of plated film, corrosion resistance and wearability, and the part being not directly exposed to gaseous sources or target metal is uneven by plating, and is difficult to prepare thick plated film etc. It addition, dry plating method is only applicable to some specific products, and it is dfficult to apply to other material, because to keep high-caliber vacuum to promote metal evaporation, it is necessary to significantly high cost.
It is disclosed in the information of this background section and is merely intended to increase the understanding of the general background to the present invention, and be not construed as admitting or imply in any form that this information structure is for prior art that persons skilled in the art are known.
Summary of the invention
It is an object of the invention to provide the polymeric material of a kind of plating, thus overcoming the shortcoming that in prior art, plating cost is high on polymer surfaces, products obtained therefrom quality is not good.
For achieving the above object, technical scheme provided by the invention is as follows:
The polymeric material of a kind of plating, is prepared by following operational approach:
(1) with polymeric material for substrate, substrate uniformly punches, put into placement 5~6h in solution A, take out, dry;
(2) surface drying rear resulting materials in step (1) is contacted with 15~45 ° of the inclined angle of solution B, then carry out plating without electrolytic metal at material surface, to obtain final product.
Wherein, the punching described in step (1) is for being 1mm × 1mm according to pitch of holes, and hole depth 0.5mm punches.
Wherein, the solution A described in step (1) is include the aqueous solution of dodecylbenzene sodium sulfonate of PAMA (APAM) that mass percent is 0.01~0.2% and 0.05%.
Wherein, the solution A described in step (1) puts into temperature is re-use after cold preservation 1~2h in 1~5 DEG C.
Wherein, the solution B described in step (2) to be mass percent be 65~95% glycine aqueous solution.
Wherein, the solution B described in step (2) to be mass percent be 70~80% glycine aqueous solution.
Compared with prior art, there is advantages that
The metal film laminating degree that the polymeric material of gained metal-coated membrane of the present invention plates is good, and quality is good, and metal pattern has extremely strong adhesive force, shows good repeatability; Further product preparation cost of the present invention is low.
Detailed description of the invention
It is described in detail below in conjunction with detailed description of the invention, it is to be understood that protection scope of the present invention is not by the restriction of detailed description of the invention.
Embodiment 1
The polymeric material of a kind of plating, is prepared by following operational approach:
(1) with polymeric material for substrate, substrate is 1mm × 1mm according to pitch of holes, hole depth 0.5mm uniformly punches, put into include PAMA (APAM) that mass percent is 0.01% and 0.05% dodecylbenzene sodium sulfonate aqueous solution in place 6h, take out, dry, wherein, aqueous solution containing the PAMA (APAM) that mass percent is 0.01% and the dodecylbenzene sodium sulfonate of 0.05% is that in 1 DEG C, cold preservation 2h just uses in temperature in advance before using;
(2) surface drying rear resulting materials in step (1) is contacted with 15 ° of the inclined angle of glycine aqueous solution that mass percent is 65%, then carry out plating without electrolytic metal at material surface, to obtain final product.
Embodiment 2
The polymeric material of a kind of plating, is prepared by following operational approach:
(1) with polymeric material for substrate, substrate is 1mm × 1mm according to pitch of holes, hole depth 0.5mm uniformly punches, put into include PAMA (APAM) that mass percent is 0.2% and 0.05% dodecylbenzene sodium sulfonate aqueous solution in place 5h, take out, dry, wherein, aqueous solution containing the PAMA (APAM) that mass percent is 0.2% and the dodecylbenzene sodium sulfonate of 0.05% is that in 5 DEG C, cold preservation 1h just uses in temperature in advance before using;
(2) surface drying rear resulting materials in step (1) is contacted with 45 ° of the inclined angle of glycine aqueous solution that mass percent is 95%, then carry out plating without electrolytic metal at material surface, to obtain final product.
Embodiment 3
The polymeric material of a kind of plating, is prepared by following operational approach:
(1) with polymeric material for substrate, substrate is 1mm × 1mm according to pitch of holes, hole depth 0.5mm uniformly punches, put into include PAMA (APAM) that mass percent is 0.11% and 0.05% dodecylbenzene sodium sulfonate aqueous solution in place 6h, take out, dry, wherein, aqueous solution containing the PAMA (APAM) that mass percent is 0.11% and the dodecylbenzene sodium sulfonate of 0.05% is that in 3 DEG C, cold preservation 1h just uses in temperature in advance before using;
(2) surface drying rear resulting materials in step (1) is contacted with 30 ° of the inclined angle of glycine aqueous solution that mass percent is 70%, then carry out plating without electrolytic metal at material surface, to obtain final product.
Embodiment 4
The polymeric material of a kind of plating, is prepared by following operational approach:
(1) with polymeric material for substrate, substrate is 1mm × 1mm according to pitch of holes, hole depth 0.5mm uniformly punches, put into include PAMA (APAM) that mass percent is 0.09% and 0.05% dodecylbenzene sodium sulfonate aqueous solution in place 6h, take out, dry, wherein, aqueous solution containing the PAMA (APAM) that mass percent is 0.09% and the dodecylbenzene sodium sulfonate of 0.05% is that in 2 DEG C, cold preservation 2h just uses in temperature in advance before using;
(2) surface drying rear resulting materials in step (1) is contacted with 20 ° of the inclined angle of glycine aqueous solution that mass percent is 80%, then carry out plating without electrolytic metal at material surface, to obtain final product.
The aforementioned description to the specific illustrative embodiment of the present invention illustrates that and the purpose of illustration. These describe and are not wishing to limit the invention to disclosed precise forms, and it will be apparent that according to above-mentioned instruction, it is possible to carry out much changing and change. Purpose exemplary embodiment selected and describe is in that to explain the certain principles of the present invention and practical application thereof, so that those skilled in the art is capable of and utilizes the various different exemplary of the present invention and various different selection and change. The scope of the present invention is intended to be limited by claims and equivalents thereof.
Claims (6)
1. the polymeric material of a plating, it is characterised in that prepared by following operational approach:
(1) with polymeric material for substrate, substrate punches, put into placement 5~6h in solution A, take out, dry;
(2) surface drying rear resulting materials in step (1) is contacted with 15~45 ° of the inclined angle of solution B, then carry out plating without electrolytic metal at material surface, to obtain final product.
2. the polymeric material of plating according to claim 1, it is characterised in that: the punching described in step (1) is for being 1mm × 1mm according to pitch of holes, and hole depth 0.5mm punches.
3. the polymeric material of plating according to claim 1, it is characterised in that: the solution A described in step (1) is include the aqueous solution of dodecylbenzene sodium sulfonate of PAMA (APAM) that mass percent is 0.01~0.2% and 0.05%.
4. the polymeric material of plating according to claim 1, it is characterised in that: it is re-use after cold preservation 1~2h in 1~5 DEG C that the solution A described in step (1) puts into temperature.
5. the polymeric material of plating according to claim 1, it is characterised in that: the solution B described in step (2) is mass percent be 65~95% glycine aqueous solution.
6. the polymeric material of plating according to claim 1, it is characterised in that: the solution B described in step (2) is mass percent be 70~80% glycine aqueous solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610042107.1A CN105671526B (en) | 2016-01-22 | 2016-01-22 | A kind of polymer material of metal-coated membrane |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610042107.1A CN105671526B (en) | 2016-01-22 | 2016-01-22 | A kind of polymer material of metal-coated membrane |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105671526A true CN105671526A (en) | 2016-06-15 |
CN105671526B CN105671526B (en) | 2018-05-22 |
Family
ID=56302095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610042107.1A Active CN105671526B (en) | 2016-01-22 | 2016-01-22 | A kind of polymer material of metal-coated membrane |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105671526B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0158890A2 (en) * | 1984-04-11 | 1985-10-23 | International Business Machines Corporation | Activating a substrate for electroless plating |
JPH02301568A (en) * | 1989-05-15 | 1990-12-13 | Nisshinbo Ind Inc | Method for coating synthetic resin structure with metal |
JPH04198486A (en) * | 1990-06-18 | 1992-07-17 | Hitachi Chem Co Ltd | Pretreating solution for electroless plating |
CN1481448A (en) * | 2001-03-06 | 2004-03-10 | О | Plating method of metal film on surface of polymer |
CN101994105A (en) * | 2009-08-18 | 2011-03-30 | 罗门哈斯电子材料有限公司 | Preparing substrates containing polymers for metallization |
US20110195567A1 (en) * | 2010-02-08 | 2011-08-11 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
-
2016
- 2016-01-22 CN CN201610042107.1A patent/CN105671526B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0158890A2 (en) * | 1984-04-11 | 1985-10-23 | International Business Machines Corporation | Activating a substrate for electroless plating |
JPH02301568A (en) * | 1989-05-15 | 1990-12-13 | Nisshinbo Ind Inc | Method for coating synthetic resin structure with metal |
JPH04198486A (en) * | 1990-06-18 | 1992-07-17 | Hitachi Chem Co Ltd | Pretreating solution for electroless plating |
CN1481448A (en) * | 2001-03-06 | 2004-03-10 | О | Plating method of metal film on surface of polymer |
CN101994105A (en) * | 2009-08-18 | 2011-03-30 | 罗门哈斯电子材料有限公司 | Preparing substrates containing polymers for metallization |
US20110195567A1 (en) * | 2010-02-08 | 2011-08-11 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN105671526B (en) | 2018-05-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8205021A1 (en) | Process for plating polymeric substrates | |
WO2007118875A3 (en) | Electroplating device and method | |
DE59904390D1 (en) | AQUEOUS ALKALINE CYANIDE-FREE BATH FOR GALVANIC DEPOSITION OF ZINC OR ZINC ALLOY COATINGS | |
CN103756472B (en) | One can laser activation LDS antenna coating | |
CN101054698A (en) | Method of pre-electrodepositing copper on zinc surface by ion liquid | |
CN103459676A (en) | Porous metal foil and production method therefor | |
CN103833231B (en) | A kind of have glass of graphene oxide nickel-phosphorus composite deposit and preparation method thereof | |
TW200833879A (en) | Deposition of conductive polymer and metallization of non-conductive substrates | |
CN105141725A (en) | Method for manufacturing mobile phone middle frame and structure of mobile phone middle frame | |
CN105603477A (en) | Novel process for pretreatment of chemical copper plating of ABS (acrylonitrile butadiene styrene) plastics | |
CN107670941A (en) | A kind of method for lifting stamping parts resistance to chemical corrosion | |
CN103255450A (en) | Aluminum brushing electroplating method by using ionic liquid | |
JP2004509230A5 (en) | ||
CN105671526A (en) | Polymer material plated with metal film | |
CN205556812U (en) | Compound plating layer structure of black chromium is electroplated to high corrosion resistance trivalent chromium | |
JP2017101300A (en) | Method for manufacturing wiring board | |
CN105064128A (en) | Local laser direct plating paper production process | |
CN106086946A (en) | A kind of holding plating solution stable in properties electroplating additive | |
CN109572262B (en) | Laser mother film for film pressure transfer film and preparation method and application method thereof | |
CN109023446A (en) | A kind of method of neodymium-iron boron permanent magnetic material electroplating copper | |
CN201036959Y (en) | Wood block with decorating pattern | |
CN201219007Y (en) | Colorful electroforming patch | |
CN103741148A (en) | Metallization process for honeycomb epoxy glass fiber reinforced plastic antenna | |
CN104962960A (en) | Copper electroplating liquid | |
CN203238341U (en) | Electroplating device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PP01 | Preservation of patent right | ||
PP01 | Preservation of patent right |
Effective date of registration: 20190613 Granted publication date: 20180522 |
|
PD01 | Discharge of preservation of patent | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20220613 Granted publication date: 20180522 |
|
PP01 | Preservation of patent right | ||
PP01 | Preservation of patent right |
Effective date of registration: 20220817 Granted publication date: 20180522 |