CN105656446B - A kind of SAW filter and preparation method thereof - Google Patents
A kind of SAW filter and preparation method thereof Download PDFInfo
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- CN105656446B CN105656446B CN201510963300.4A CN201510963300A CN105656446B CN 105656446 B CN105656446 B CN 105656446B CN 201510963300 A CN201510963300 A CN 201510963300A CN 105656446 B CN105656446 B CN 105656446B
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- 238000002360 preparation method Methods 0.000 title description 3
- 239000011159 matrix material Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 15
- 238000003672 processing method Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 abstract description 15
- 238000010586 diagram Methods 0.000 description 6
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000010358 mechanical oscillation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6406—Filters characterised by a particular frequency characteristic
- H03H9/6413—SAW comb filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The embodiment of the invention discloses a kind of SAW filter and its processing method, the band-pass filtering function for realizing multiband using single SAW filter filter is conducive to the miniaturization of device and integrated.Present invention method includes：Substrate is provided, substrate is the material with piezoelectric effect；Processing forms transmitting interdigitated electrodes and receives interdigitated electrodes on substrate；It processes to form matrix on the surface of substrate, matrix is between transmitting interdigitated electrodes and reception interdigitated electrodes；Predefined processing is carried out to matrix, forms through-hole；Scatterer is formed in through-holes, obtains SAW filter, and the acoustic impedance of matrix is more than the acoustic impedance of scatterer.
Description
Technical field
The present invention relates to field electronic technology fields more particularly to a kind of SAW filter and preparation method thereof.
Background technology
SAW filter is a kind of radio-frequency signal filters being usually used in the communication terminals such as mobile phone.As shown in Figure 1, existing
By SAW filter be generally made of a pair of of interdigital electrode and piezoelectric ceramic piece.When transmitting interdigital electrode is believed plus load
It after number voltage, forming electric field between interdigital electrode, makes piezoelectric ceramic piece that mechanical oscillation occur, i.e. surface wave, surface wave is propagated to the right,
And after being received by reception interdigital electrode, it is converted into electric signal output.Due to interdigital electrode only to the signal of particular frequency range into
Row response, therefore bandpass filter can be formed,
But the bandpass characteristics of existing SAW filter is determined by the geometric parameter of interdigital electrode, due to specific
The interdigital electrode of geometric parameter can only respond particular frequency range, so existing SAW filter can only be realized
Simple band-pass filtering function, if to realize the band-pass filtering property of multiband, it is necessary to utilize multiple SAW filters
Combination is realized, the device miniaturization and integrated of modern crafts requirement is cannot be satisfied.
Invention content
An embodiment of the present invention provides a kind of SAW filter and its processing methods, for utilizing single surface acoustic wave
Filter filtering device realizes the band-pass filtering function of multiband, is conducive to the miniaturization of device and integrated.
In view of this, first aspect present invention provides a kind of processing method of SAW filter, including：
Substrate is provided, the substrate is the material with piezoelectric effect；
Processing forms transmitting interdigitated electrodes and receives interdigitated electrodes on the substrate；
It processes to form matrix on the surface of the substrate, described matrix is in the transmitting interdigitated electrodes and the reception
Between interdigitated electrodes；
Predefined processing is carried out to described matrix, forms through-hole；
Scatterer is formed in the through-hole, obtains SAW filter, the acoustic impedance of described matrix is more than described dissipate
The acoustic impedance of beam.
It is described to process on the substrate in first aspect present invention first embodiment in conjunction with first aspect present invention
It forms transmitting interdigitated electrodes and receives interdigitated electrodes and include：
Thin metal layer is formed in the substrate surface；
The thin metal layer is processed by light etching process, form transmitting interdigitated electrodes and receives interdigitation electricity
Pole.
It is described to pass through in first aspect present invention second embodiment in conjunction with first aspect present invention first embodiment
Light etching process is processed the thin metal layer, after forming transmitting interdigitated electrodes and receiving interdigitated electrodes, also wraps
It includes：
It processes to form absorbed layer in the border surface of the substrate.
It is described on the surface of the substrate in first aspect present invention third embodiment in conjunction with first aspect present invention
Processing forms matrix and includes：
By electroplating technology matrix is formed in the substrate surface.
In conjunction with first aspect present invention, first aspect first embodiment, first aspect second embodiment or first party
Face third embodiment, in the 4th embodiment of first aspect present invention, the processing method further includes：
Input electrode and output electrode are made on the matrix, and the input electrode connects with the transmitting interdigitated electrodes
It connects, the output electrode is connect with the reception interdigitated electrodes.
Second aspect of the present invention provides a kind of SAW filter, including：
Substrate, transmitting interdigitated electrodes, reception interdigitated electrodes, matrix and scatterer, the acoustic impedance of described matrix are more than
The acoustic impedance of the scatterer；
The transmitting interdigitated electrodes and the reception interdigitated electrodes are on the substrate；
Described matrix is in the substrate surface, and is in the transmitting interdigitated electrodes and the reception interdigitated electrodes
Between；
There is the scatterer through-hole, the scatterer to be in the through-hole.
In conjunction with second aspect of the present invention, in second aspect of the present invention first embodiment, the substrate is to be imitated with piezoelectricity
The material answered.
In conjunction with second aspect of the present invention or second aspect first embodiment, second aspect of the present invention second embodiment
In, the SAW filter further includes：
Input electrode and output electrode；
The input electrode is connect with the transmitting interdigitated electrodes, the output electrode and the reception interdigitated electrodes
Connection.
In conjunction with second aspect of the present invention or second aspect first embodiment, second aspect of the present invention third embodiment
In, the SAW filter further includes：
Absorbed layer, the absorbed layer are on the border surface of the substrate.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages：
Between matrix is in substrate surface and transmitting interdigitated electrodes and receives interdigitated electrodes, scatterer is in matrix
Within through-hole, the acoustic impedance of matrix is more than the acoustic impedance of scatterer, is obtained according to practical application, and the structure of matrix and scatterer is special
Property, the surface wave of specific frequency can be prevented to reach and receive interdigitated electrodes, so that receiving the letter of interdigitated electrodes reduction
In number, the corresponding frequency band of surface wave of specific frequency is filtered out, and realizes the band-pass filtering function of multiband, and in the prior art
It is combined using multiple SAW filters and realizes that the band-pass filtering function of multiband is compared, reduced volume, be conducive to device
Miniaturization and integrated.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is that a kind of structural diagrams of SAW filter in the prior art are intended to；
Fig. 2 is the flow diagram of the processing method of SAW filter in the present invention；
Fig. 3 a to Fig. 3 g are the schematic diagram of the process of SAW filter in the present invention；
Fig. 4 is an a kind of schematic diagram of attenuation characteristic of SAW filter in the prior art；
Fig. 5 is a schematic diagram of the attenuation characteristic of SAW filter in the present invention；
Fig. 6 is another schematic diagram of the attenuation characteristic of SAW filter in the present invention.
Specific implementation mode
An embodiment of the present invention provides a kind of SAW filter and its processing methods, for utilizing single surface acoustic wave
Filter filtering device realizes the band-pass filtering function of multiband, is conducive to the miniaturization of device and integrated.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model that the present invention protects
It encloses.
Below by specific embodiment, it is described in detail respectively.
Referring to Fig. 2, the embodiment of the present invention provides a kind of processing method of SAW filter, including：
201, substrate is provided；
In the present embodiment, substrate 301 as shown in Figure 3a is provided, the material of substrate 301 is the material with piezoelectric effect,
Can be quartz, lithium niobate or pricker lead titanates etc..
202, processing forms transmitting interdigitated electrodes and receives interdigitated electrodes on substrate；
In the present embodiment, after being polished to 301 surface of substrate, in the surface evaporation layer of metal film of substrate 301, formed
Thin metal layer is processed thin metal layer by light etching process, obtains transmitting interdigitated electrodes 302 as shown in figure 3b
And receive interdigitated electrodes 303.
Optionally, as shown in Figure 3c, it is processed on the surface on the boundary of substrate 301, forms absorbed layer 304, absorbed layer
304 material is with the material for absorbing acoustic wave character.
203, it processes to form matrix on the surface of substrate；
In the present embodiment, as shown in Figure 3d, process to form matrix 305, matrix on the surface of substrate 301 by electroplating technology
305 in transmitting interdigitated electrodes 302 and between receiving interdigitated electrodes 303, and the material of matrix 305 is the larger material of acoustic impedance
Material, such as copper or aluminium metal material.
204, predefined processing is carried out to matrix, forms through-hole；
In the present embodiment, as shown in Figure 3 e, predefined processing is carried out to matrix 305, i.e., the band logical reached as needed
Filtering characteristic determines the position for needing that scatterer is arranged and size, is drilled, is led to matrix 305 according to position and size
Hole 306.
205, scatterer is formed in through-holes, obtains SAW filter.
In the present embodiment, as illustrated in figure 3f, scatterer 307, the material of scatterer 307 are formed in the through-hole 306 of matrix 305
Material is the smaller flexible material of acoustic impedance, such as rubber or epoxy resin, and the acoustic impedance of matrix 305 is more than the sound of scatterer 307
Impedance obtains SAW filter.
Optionally, as shown in figure 3g, input electrode 308 and output electrode 309, input electrode 308 are made on matrix 307
It is connect with transmitting interdigitated electrodes 302, output electrode 309 is connect with interdigitated electrodes 303 are received.
It should be noted that the form and dimension of through-hole 306 is obtained according to pre-defined, scatterer 307 and through-hole
306 are not specifically limited to matching, the size and shape of scatterer 307.
It should be noted that before obtaining SAW filter, it is filtered the encapsulation of device, specific outer enclosure
Shape does not limit.
In the embodiment of the present invention, matrix 305 is in 301 surface of substrate and transmitting interdigitated electrodes 302 and receives interdigitation
Between electrode 303, scatterer 307 is within the through-hole 306 of matrix 305, and the acoustic impedance of matrix 305 is more than scatterer 307
Acoustic impedance is obtained according to practical application, and the architectural characteristic of matrix 305 and scatterer 307 can prevent the surface wave of specific frequency
It reaches and receives interdigitated electrodes 303, so that receiving in the signal that interdigitated electrodes 303 restore, the surface wave of specific frequency
Corresponding frequency band is filtered out, and realizes the band-pass filtering function of multiband, is filtered with the multiple surface acoustic waves of utilization in the prior art
Device combination realizes that the band-pass filtering function of multiband is compared, and reduces volume, is conducive to the miniaturization of device and integrated.
Fig. 3 g are please referred to, the embodiment of the present invention provides a kind of SAW filter, including：
Substrate 301, receives interdigitated electrodes 303, matrix 305 and scatterer 307, matrix at transmitting interdigitated electrodes 302
305 acoustic impedance is more than the acoustic impedance of scatterer 307；
Transmitting interdigitated electrodes 302 and reception interdigitated electrodes 303 are on substrate 301；
Matrix 305 is in 301 surface of substrate, and in transmitting interdigitated electrodes 302 and receive interdigitated electrodes 303 it
Between；
There is scatterer 307 through-hole 3, scatterer 307 to be in through-hole.
Optionally, substrate 301 is the material with piezoelectric effect.
Optionally, SAW filter further includes：
Input electrode 308 and output electrode 309；
Input electrode 308 is connect with transmitting interdigitated electrodes 302, and output electrode 309 connects with interdigitated electrodes 303 are received
It connects.
Optionally, SAW filter further includes：
Absorbed layer 304, absorbed layer 304 are on the border surface of substrate 301.
In the embodiment of the present invention, matrix 305 is in 301 surface of substrate and transmitting interdigitated electrodes 302 and receives interdigitation
Between electrode 303, scatterer 307 is within the through-hole 306 of matrix 305, and the acoustic impedance of matrix 305 is more than scatterer 307
Acoustic impedance is obtained according to practical application, and the architectural characteristic of matrix 305 and scatterer 307 can prevent the surface wave of specific frequency
It reaches and receives interdigitated electrodes 303, so that receiving in the signal that interdigitated electrodes 303 restore, the surface wave of specific frequency
Corresponding frequency band is filtered out, and realizes the band-pass filtering function of multiband, is filtered with the multiple surface acoustic waves of utilization in the prior art
Device combination realizes that the band-pass filtering function of multiband is compared, and reduces volume, is conducive to the miniaturization of device and integrated.
For ease of understanding, the SAW filter in the embodiment of the present invention is carried out with a concrete application scene below
Detailed description：
In the present embodiment, SAW filter is applied in the communication terminals such as mobile phone, for carrying out band to radiofrequency signal
Pass filter, as shown in figure 3g, the wherein arrangement of scatterer 307 can be periodic to structure, can also be disorderly arranged, this reality
Scatterer 307 in example is applied to arrange in a matrix fashion.
When radiofrequency signal generates, alternating voltage is applied to transmitting interdigitated electrodes by radiofrequency signal by input terminal 308
302, transmitting interdigitated electrodes 302 form electric field between the electrodes, make the piezoelectric material of substrate 301 that mechanical oscillation occur, are formed
Surface wave, the frequency of surface wave is identical as the frequency of radiofrequency signal, and the absorption sound wave that surface wave propagates absorbed layer 304 to the left is special
Property material absorb, surface wave propagates to the right, encounters the larger matrix 305 of acoustic impedance, has acoustic impedance is smaller to dissipate on matrix 305
Beam 307, matrix 305 prevents the transmission of surface wave, and the acoustic impedance of scatterer 307 is smaller, and surface wave can be allowed to pass through, and
And resonance is generated with surface wave, it, can be by characteristics such as size, shape and the materials of adjusting scatterer, to make according to this theory
Obtaining the surface wave of specific frequency cannot pass through, and after receiving the acquisition surface wave of interdigitated electrodes 303, be translated into radio frequency letter
Number, as shown in figure 4, the frequency field that interdigitated electrodes can respond in obtained radiofrequency signal is f1, stopband is f2 and f3, this
Two stopbands are generated with level-one resonance by the zero level resonance of scatterer respectively.Fig. 5 is the decay pattern of the prior art.
It can be seen that compared with prior art, the SAW filter in the present embodiment is the band logical for having multi-frequency
Filtering characteristic, and the prior art then needs to be combined the band logical that could realize multi-frequency using multiple SAW filters
Filter function, therefore the embodiment of the present invention can reduce the volume of device is conducive to the miniaturization of device and integrated.
In addition, as shown in fig. 6, after the geometric parameter of change scatterer, the frequency field f2 and f3 of forbidden band can be made to become
Must be wider, illustrate that the size and shape for adjusting scatterer can change the attenuation characteristic of SAW filter；If it is desired to
The frequency field of more forbidden bands is generated in f1, then scatterer can be kept total with two level by the design of change scatterer
Vibration frequency can also design a variety of scatterers simultaneously, generate a plurality of stopband using the resonance characteristics of a variety of scatterers, therefore can realize
A plurality of types of customizing SAW filters.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (9)
1. a kind of processing method of SAW filter, which is characterized in that including：
Substrate is provided, the substrate is the material with piezoelectric effect；
Processing forms transmitting interdigitated electrodes and receives interdigitated electrodes on the substrate；
It processes to form matrix on the surface of the substrate, described matrix is in the transmitting interdigitated electrodes and the reception is interdigital
Between type electrode；
Predefined processing is carried out to described matrix, forms through-hole；
Scatterer is formed in the through-hole, obtains SAW filter, the acoustic impedance of described matrix is more than the scatterer
Acoustic impedance.
2. processing method according to claim 1, which is characterized in that it is interdigital that the processing on the substrate forms transmitting
Type electrode and reception interdigitated electrodes include：
Thin metal layer is formed in the substrate surface；
The thin metal layer is processed by light etching process, form transmitting interdigitated electrodes and receives interdigitated electrodes.
3. requiring processing method described in 2 according to power, which is characterized in that it is described by light etching process to the thin metal layer into
Row processing forms after transmitting interdigitated electrodes and reception interdigitated electrodes, further includes：
It processes to form absorbed layer in the border surface of the substrate.
4. processing method according to claim 1, which is characterized in that described to process to form matrix on the surface of the substrate
Including：
By electroplating technology matrix is formed in the substrate surface.
5. processing method according to any one of claim 1 to 4, which is characterized in that the processing method further includes：
It makes input electrode on the matrix and output electrode, the input electrode is connect with the transmitting interdigitated electrodes,
The output electrode is connect with the reception interdigitated electrodes.
6. a kind of SAW filter, which is characterized in that including：
Substrate, transmitting interdigitated electrodes receive interdigitated electrodes, matrix and scatterer, and the acoustic impedance of described matrix is more than described
The acoustic impedance of scatterer；
The transmitting interdigitated electrodes and the reception interdigitated electrodes are on the substrate；
Described matrix is in the substrate surface, and in the transmitting interdigitated electrodes and the reception interdigitated electrodes it
Between；
There is the scatterer through-hole, the scatterer to be in the through-hole.
7. SAW filter according to claim 6, which is characterized in that the substrate is the material with piezoelectric effect
Material.
8. the SAW filter described according to claim 6 or 7, which is characterized in that the SAW filter also wraps
It includes：
Input electrode and output electrode；
The input electrode is connect with the transmitting interdigitated electrodes, and the output electrode connects with the reception interdigitated electrodes
It connects.
9. the SAW filter described according to claim 6 or 7, which is characterized in that the SAW filter also wraps
It includes：
Absorbed layer, the absorbed layer are on the border surface of the substrate.
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| CN201510963300.4A CN105656446B (en) | 2015-12-17 | 2015-12-17 | A kind of SAW filter and preparation method thereof |
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| CN201510963300.4A CN105656446B (en) | 2015-12-17 | 2015-12-17 | A kind of SAW filter and preparation method thereof |
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| CN105656446B true CN105656446B (en) | 2018-09-04 |
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| JP6790907B2 (en) * | 2017-02-23 | 2020-11-25 | 株式会社村田製作所 | Multiplexer, transmitter and receiver |
| CN109327200A (en) * | 2018-11-27 | 2019-02-12 | 中电科技德清华莹电子有限公司 | A kind of surface acoustic wave resonance Structure Filter |
| CN112688658B (en) * | 2020-12-25 | 2021-11-26 | 济南晶正电子科技有限公司 | Piezoelectric substrate, preparation method and electronic component |
| CN116322270A (en) * | 2021-12-18 | 2023-06-23 | 中国科学院深圳先进技术研究院 | Micron-sized sound field generating device based on artificial structure and preparation method thereof |
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| US7889025B1 (en) * | 2008-06-10 | 2011-02-15 | The United States Of America As Represented By The Secretary Of The Army | Anti-reflective acoustic diffuser for SAW and BAW devices |
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| US7889025B1 (en) * | 2008-06-10 | 2011-02-15 | The United States Of America As Represented By The Secretary Of The Army | Anti-reflective acoustic diffuser for SAW and BAW devices |
| CN102841138A (en) * | 2011-06-24 | 2012-12-26 | 新疆求是信息科技有限公司 | Surface acoustic wave gas sensor based on two-dimensional phonon crystal reflecting grating |
| CN103296994A (en) * | 2013-05-31 | 2013-09-11 | 中科微声（天津）传感技术有限公司 | Surface-acoustic-wave resonator with lattice structure |
| CN104683906A (en) * | 2013-11-28 | 2015-06-03 | 中国科学院声学研究所 | Photonic crystal filtering device for high-directivity audio frequency loudspeaker measuring system |
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