CN105655498B - A kind of OLED display and method for packing - Google Patents
A kind of OLED display and method for packing Download PDFInfo
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- CN105655498B CN105655498B CN201410714360.8A CN201410714360A CN105655498B CN 105655498 B CN105655498 B CN 105655498B CN 201410714360 A CN201410714360 A CN 201410714360A CN 105655498 B CN105655498 B CN 105655498B
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Abstract
The invention discloses a kind of OLED display and method for packing, OLED display includes first substrate, second substrate, the first encapsulating structure and the second encapsulating structure, first encapsulating structure is arranged between the first substrate and the second substrate, an at least organic luminescence display unit is sealed in the space that the first substrate, the second substrate and first encapsulating structure are surrounded.Second encapsulating structure is arranged at the presumptive area between the first substrate and second substrate and first encapsulating structure.The present invention is easy to the spray range and quantity for spray of accurate control encapsulating material, while ensure that OLED display sealing, mechanical strength, reduces the dosage and production cost of encapsulating material.
Description
Technical field
It is espespecially a kind of to be used for OLED display and OLED encapsulation sides the present invention relates to a kind of display device and method for packing
Method.
Background technology
OLED display device is a kind of current mode light emitting semiconductor device based on organic material.Its typical structure be
The luminous organic material that one layer of tens nanometer thickness is made on ito glass makees luminescent layer, the gold for having one layer of low-power consumption above luminescent layer
Belong to electrode.When on electrode added with voltage, luminescent layer just produces light radiation.OLED luminescence mechanism and process is from yin, yang two
Pole is injected separately into electronics and hole, and the electronics and hole being injected into transmit in organic layer, and compound in luminescent layer, so as to swash
Send out luminescent layer molecule and produce singlet exciton, singlet exciton attenuation and light.The luminous organic material used in OLED
Especially sensitive to water and oxygen with cathode material, excessively moist or oxygen content is too high all to use the longevity by influence OLED
Life.Extend to reach the service life of design, this just proposes higher requirement to the encapsulation of OLED.
The outer frame glue of existing coating substantially uses immersion.As shown in figure 1, it is the knot that will have tentatively been encapsulated by glass cement
Structure 20 is immersed into encapsulating material 151, and encapsulating material 151 is covered to the base to glass cement with immersion way (siphon principle)
Region between plate and cover plate, but immersion way needs extra increase photoresistance protection to avoid encapsulating material from polluting luminous zone.
The content of the invention
The problem of existing for prior art, an object of the present invention are to provide a kind of good airproof performance, mechanical strength
High OLED display.
Another object of the present invention is to the OLED encapsulation method for providing a kind of good airproof performance, saving encapsulating material.
The OLED display of the present invention, including：
One first substrate；
One second substrate；
One first encapsulating structure, is arranged between the first substrate and the second substrate, will at least one organic hair
Light display unit is sealed in the space that the first substrate, the second substrate and first encapsulating structure are surrounded
In；
One second encapsulating structure, it is arranged at the outer of the first substrate, the second substrate and first encapsulating structure
Presumptive area between surface.
Further, first encapsulating structure and second encapsulating structure are annularly disposed in the first substrate and institute
Between stating second substrate, second encapsulating structure is in close proximity to first encapsulating structure.
Further, second encapsulating structure is arranged at the presumptive area by ink-jetting style.
Further, the presumptive area is the first substrate, the second substrate and first encapsulating structure
The recess region that outer surface is formed；Second encapsulating structure is full of the recess region by the ink-jetting style, makes institute
The outer surface and the edge of the first substrate, second substrate for stating the second encapsulating structure are flush.
The OLED encapsulation method of the present invention, comprises the following steps：
1) one first encapsulating structure is set between a first substrate and a second substrate, at least an organic light emission will be shown
Show that unit is sealed in the space that the first substrate, the second substrate and first encapsulating structure are surrounded；
2) using ink-jetting style the outer surface of the first substrate, the second substrate and first encapsulating structure it
Between presumptive area set one second encapsulating structure.
Further, one first encapsulating structure of setting between a first substrate and a second substrate is specially：Institute
State coated glass glue between first substrate and the second substrate, and described in irradiating above with laser in the second substrate
Glass cement, make the glass cement and the first substrate and the second substrate sealed sintering.
Further, the glass cement is annularly disposed between the first substrate and the second substrate, and described second
Encapsulating structure is in close proximity to first encapsulating structure.
Further, it is described using ink-jetting style in the outer of the first substrate, second substrate and first encapsulating structure
Presumptive area between surface sets one second encapsulating structure to be specially：Distance of the shower nozzle at a distance of the presumptive area is adjusted, to
The presumptive area sprays the encapsulating material of a scheduled volume, it is filled the presumptive area and is tied with forming second encapsulation
Structure.
Further, the presumptive area is the first substrate, the second substrate and first encapsulating structure
The recess region that outer surface is formed, second encapsulating structure are full of the recess region by the ink-jetting style, make institute
The outer surface and the edge of the first substrate, second substrate for stating the second encapsulating structure are flush.
Further, the scheduled volume for spraying encapsulating material depends on distance of the shower nozzle at a distance of the presumptive area.
The present invention is easy to the spray range and quantity for spray of accurate control encapsulating material, ensure that OLED display seals
While property, mechanical strength, the dosage and production cost of encapsulating material are reduced.
Brief description of the drawings
Fig. 1 is the existing schematic diagram that outer frame glue is coated with by immersion way；
Fig. 2 is the schematic diagram of the OLED encapsulation method of the present invention；
Fig. 3 is A portions enlarged diagram in Fig. 2；
Fig. 4 is the schematic diagram of two layers of encapsulating structure of the OLED display of the present invention.
Embodiment
As shown in figure 4, the OLED display 10 of the present invention, including：First substrate 11, second substrate 12, first encapsulate
The encapsulating structure 15 of structure 14 and second, first encapsulating structure 14 are arranged at the first substrate 11 and the second substrate 12
Between, an at least organic luminescence display unit 13 is sealed in the first substrate 11, the second substrate 12 and described
In the space that first encapsulating structure 14 is surrounded.Second encapsulating structure 14 is arranged at the base of first substrate 11 and second
Presumptive area 16 between plate 12 and first encapsulating structure 14.
First encapsulating structure 14 and second encapsulating structure 15 can be arranged at the first substrate in a ring
Between 11 and the second substrate 12, and second encapsulating structure 15 is in close proximity to first encapsulating structure 14.Described
Two encapsulating structures 15 are arranged at the presumptive area 16 by ink-jetting style, to improve the thrust for spraying encapsulating material.So may be used
Accurately to control the spraying position of encapsulating material and dosage, and then ensure that the second encapsulating structure 15 can be with the described first encapsulation
Structure 14 close to.Therefore, the gap stayed in encapsulating structure between the first encapsulating structure and the second encapsulating structure can be eliminated, is carried
The mechanical strength of OLED display device is favorably improved while high leakproofness.
As shown in figure 3, the presumptive area 16 for the first substrate 11 a part 111, one of second substrate 12
Points 121 and the recess region that is formed of outer surface 141 of first encapsulating structure 14；Second encapsulating structure 15 passes through
Control shower nozzle in the ink-jetting style to be full of the recess region at a distance of the distance and flow of presumptive area 16, make described
The outer surface of second encapsulating structure 15 and the edge of the first substrate 11, second substrate 12 are flush, so as to further save
Follow-up cleaning.
The OLED display of the present embodiment has the advantages that good airproof performance, high mechanical strength.
The OLED encapsulation method of the present invention, as shown in Fig. 2 comprising the following steps：
1) the first encapsulating structure 14 is set between first substrate 11 and second substrate 12, at least an organic light emission will be shown
Show that unit 13 is sealed in the sky that the first substrate 11, the second substrate 12 and first encapsulating structure 14 are surrounded
Between in；
2) using ink-jetting style between the first substrate 11 and second substrate 12 and first encapsulating structure 14
Presumptive area 16 sets the second encapsulating structure 15.
The first encapsulating structure 14 is selectively glass cement in the present embodiment, in the first substrate 11 and second base
Coated glass glue between plate 12, and the glass cement is irradiated using laser above the second substrate 12, make the glass
Glue and the first substrate 11 and the sealed sintering of the second substrate 12.Wherein, the glass cement is annularly disposed in described
Between one substrate 11 and the second substrate 12.
Need to adjust distance of the shower nozzle 22 at a distance of the presumptive area 16 before being sprayed, to the presumptive area 16
The encapsulating material of a scheduled volume is sprayed, can ensure that encapsulating material fills up the presumptive area 16 just, make in presumptive area 16
Edge of the edge of second encapsulating structure 15 of interior formation just with substrate 11, cover plate 12 flushes, and can cause the first envelope
The outer surface of assembling structure 14 is in close proximity to the inner surface of the second encapsulating structure 15, obtains display device 10 as shown in Figure 4.Wherein,
Presumptive area 16 is a part 111, a part 121 for second cover plate 12 and first envelope of the first substrate 11
The recess region that the outer surface 141 of assembling structure is formed, due to the first encapsulating structure be annularly disposed in substrate 11, cover plate 12 it
Between, presumptive area 16 is also correspondingly an annular groove.Distance and spraying encapsulating material of the shower nozzle 22 at a distance of the presumptive area 16
The spray speed of scheduled volume and shower nozzle 22 is related, and encapsulating material can be accurately controlled by the three above parameter for adjusting shower nozzle 22
Spray range and dosage.
The method for packing of the present embodiment is easy to the spray range and quantity for spray of accurate control encapsulating material, ensure that OLED
While display panel sealing, the dosage and production cost of encapsulating material are reduced.
The illustrative embodiments of the present invention are particularly shown and described above.It should be understood that the invention is not restricted to institute
Disclosed embodiment, on the contrary, it is intended to cover comprising various modifications within the scope of the appended claims and equivalent put
Change.
Claims (7)
- A kind of 1. OLED display, it is characterised in that including：One first substrate；One second substrate；One first encapsulating structure, is arranged between the first substrate and the second substrate, at least an organic light emission will show Show that unit is sealed in the space that the first substrate, the second substrate and first encapsulating structure are surrounded；With AndOne second encapsulating structure, it is arranged at the outer surface of the first substrate, the second substrate and first encapsulating structure Between presumptive area；Wherein, second encapsulating structure is arranged at the presumptive area by ink-jetting style；The presumptive area is described the The recess region that the outer surface of one substrate, the second substrate and first encapsulating structure is formed；Second encapsulation Structure is full of the recess region by the ink-jetting style, makes the outer surface of second encapsulating structure and first base Plate, the edge of second substrate are flush.
- 2. OLED display as claimed in claim 1, it is characterised in that first encapsulating structure and second encapsulation Structure is circlewise arranged between the first substrate and the second substrate, and second encapsulating structure is in close proximity to described first Encapsulating structure.
- 3. a kind of OLED encapsulation method, it is characterised in that comprise the following steps：1) one first encapsulating structure is set between a first substrate and a second substrate, will an at least organic light emitting display list Member is sealed in the space that the first substrate, the second substrate and first encapsulating structure are surrounded；2) using ink-jetting style between the outer surface of the first substrate, the second substrate and first encapsulating structure Presumptive area sets one second encapsulating structure；Wherein, the presumptive area is the outer surface of the first substrate, the second substrate and first encapsulating structure The recess region formed, second encapsulating structure are full of the recess region by the ink-jetting style, make described second The outer surface of encapsulating structure and the edge of the first substrate, second substrate are flush.
- 4. OLED encapsulation method as claimed in claim 3, it is characterised in that it is described a first substrate and a second substrate it Between set one first encapsulating structure be specially：The coated glass glue between the first substrate and the second substrate, and The second substrate irradiates the glass cement above with laser, makes the glass cement and the first substrate and second base Plate sealed sintering.
- 5. OLED encapsulation method as claimed in claim 4, it is characterised in that the glass cement is annularly disposed in described first Between substrate and the second substrate, second encapsulating structure is set to be in close proximity to first encapsulating structure.
- 6. OLED encapsulation method as claimed in claim 3, it is characterised in that described to utilize ink-jetting style in the first substrate And the presumptive area between the outer surface of the second substrate and first encapsulating structure sets one second encapsulating structure specific For：Distance of the shower nozzle at a distance of the presumptive area is adjusted, the encapsulating material of a scheduled volume is sprayed to the presumptive area, fills out it The presumptive area is filled to form second encapsulating structure.
- 7. OLED encapsulation method as claimed in claim 6, it is characterised in that the scheduled volume for spraying encapsulating material depends on Distance of the shower nozzle at a distance of the presumptive area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714360.8A CN105655498B (en) | 2014-11-28 | 2014-11-28 | A kind of OLED display and method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714360.8A CN105655498B (en) | 2014-11-28 | 2014-11-28 | A kind of OLED display and method for packing |
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| CN105655498A CN105655498A (en) | 2016-06-08 |
| CN105655498B true CN105655498B (en) | 2017-11-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158667B2 (en) * | 1991-08-01 | 2001-04-23 | セイコーエプソン株式会社 | Method of manufacturing liquid crystal display element and method of reproducing liquid crystal display element |
| EP1240808B1 (en) * | 1999-12-17 | 2003-05-21 | Osram Opto Semiconductors GmbH | Encapsulation for organic led device |
| CN1200465C (en) * | 2001-10-24 | 2005-05-04 | 翰立光电股份有限公司 | Packaged structure of display element and its packaging method |
| CN100355110C (en) * | 2002-12-03 | 2007-12-12 | 铼宝科技股份有限公司 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
| JP2010135163A (en) * | 2008-12-04 | 2010-06-17 | Hitachi Displays Ltd | Method of manufacturing display device, manufacturing device, and display device |
| TWI389271B (en) * | 2009-04-10 | 2013-03-11 | Ind Tech Res Inst | Package of environmental sensitive element and packaging method using the same |
| CN101931058B (en) * | 2010-07-06 | 2013-03-13 | 电子科技大学 | Packaging structure and packaging method of organic electroluminescent device |
| CN102231427B (en) * | 2011-06-30 | 2013-02-20 | 四川虹视显示技术有限公司 | OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |
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