CN105655271B - A kind of semiconductor cooling device for high vacuum environment - Google Patents
A kind of semiconductor cooling device for high vacuum environment Download PDFInfo
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- CN105655271B CN105655271B CN201410632188.1A CN201410632188A CN105655271B CN 105655271 B CN105655271 B CN 105655271B CN 201410632188 A CN201410632188 A CN 201410632188A CN 105655271 B CN105655271 B CN 105655271B
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Abstract
The present invention relates to semiconductor processing technology fields, specifically disclose a kind of semiconductor cooling device for high vacuum environment.The semiconductor cooling device of the present invention, including wafer support mechanism (1), lifting PIN bracket institutions (2), cooling disc mechanism (3), cooler pan heat insulation support mechanism (4) and pneumatic lifting mechanism (5), the wafer support mechanism (1), lifting PIN bracket institutions (2), cooler pan heat insulation support mechanism (4) are arranged on the cooling disc mechanism (3), and the cooling disc mechanism (3) is arranged on the air-powered lifting mechanism (5).Apparatus of the present invention realize the function of auto-lift of semiconductor, and realize the cooling of semiconductor.The present invention effectively realized high temperature semiconductor cooling but for the realization of the excessively high cooling of temperature after semiconductor machining simultaneously.
Description
Technical field
The present invention relates to wafer processing techniques field, more particularly to a kind of semiconductor for high vacuum environment cools down dress
It puts.
Background technology
At present, global semiconductor consumption market and industry growth rate are very swift and violent, especially domestic semiconductor consumption city
Field and industry growth rate are global 10 times or more.Under semicon industry extremely keen competition, semiconductor industry is more next
More need the integrated of great scale.
Semiconductor collection transports, processes, is packaged in one, due to the requirement of processing technology, such as improves production qualification rate, is adding
Semiconductor can be heated at high temperature in work technique, if the semiconductor of high temperature, which is directly encapsulated, can damage semiconductor package mounted box,
Even damage semiconductor.
Not influence production efficiency, semiconductor cooling device directly is set on semiconductor great scale production platform, is had
Effect reduces conductor temperature to the acceptable temperature of semiconductor package mounted box, improves the production qualification rate of semiconductor and does not reduce production
Efficiency becomes divination by means of the milfoil problem to be solved.
Invention content
The defects of the present invention is directed to overcome existing semiconductor cooling device, provides a kind of semiconductor for high vacuum environment
Cooling device effectively realized high temperature semiconductor cooling but.
To achieve the above object, the present invention uses following technical scheme：
The present invention provides a kind of semiconductor cooling device for high vacuum environment, including wafer support mechanism (1), lifting
PIN bracket institutions (2), cooling disc mechanism (3), cooler pan heat insulation support mechanism (4) and pneumatic lifting mechanism (5), the wafer
Supporting mechanism (1), lifting PIN bracket institutions (2), cooler pan heat insulation support mechanism (4) are arranged on the cooling disc mechanism (3)
On, the cooling disc mechanism (3) is arranged on the air-powered lifting mechanism (5)；The wafer support mechanism (1), is used to support
Wafer without cooling；The lifting PIN bracket institutions (2), for lifting wafer to be cooled；The cooler pan heat insulation support
Mechanism (4), for wafer and the cooling disc mechanism (3) and support wafer to be isolated；The air-powered lifting mechanism (5), is used for
Wafer elevating provides power source.
In some embodiments, the wafer support mechanism (1) includes wafer double pawl supporting rack (18), wafer monodactyle supporting racks
(19) it is set respectively with multiple claw quartz pillars (20), the double pawl supporting racks (18) of the wafer, wafer monodactyle supporting rack (19)
In the both sides of the cooling disc mechanism (3), the multiple claw quartz pillar (20) is separately positioned on the double pawl supporting racks of wafer
(18), on wafer monodactyle supporting rack (19).
In some embodiments, the lifting PIN bracket institutions (2) be arranged on above cooling disc mechanism (3) and with institute
Air-powered lifting mechanism (5) connection is stated, it is described including PIN stents (8), PIN stent grasping devices (9) and PIN quartz pillar (10)
PIN stents (8) and PIN stent grasping devices (9) connection, the PIN quartz pillar (10) be arranged on the PIN stents (8) and
Between PIN stent grasping devices (9).
In some embodiments, the PIN stents (8) are Y types.
In some embodiments, the cooling disc mechanism (3) is including cold dish (6) and is arranged on the water of the cold dish (6) lower part
Road sealing plate (7), the cold dish (6) and waterway seal plate (7) are sealed by O-ring, and the O-ring is arranged on the cold dish
(6) in seal groove, water route flowing of the cooling water between the cold dish (6) and waterway seal plate (7).
In some embodiments, the cooler pan that the cooler pan heat insulation support mechanism (4) has flat surface for one supports quartz
Ball (21), the flat surface of the cooler pan support quartz ball (21) are connected, and the cooler pan branch with the cooling disc mechanism (3)
Support quartz ball (21) is fixed on the cooling disc mechanism (3).
In some embodiments, the air-powered lifting mechanism (5) includes cylinder supports lid (15), cylinder connection pinboard
(14), cylinder (13), cylinder supports frame (12) and jack-up axis (11),
The cylinder supports frame (12) is positioned at the lower section of the cooling disc mechanism (3) and solid with the cooling disc mechanism (3)
Fixed connection；The cylinder supports lid (15) is fixedly connected on the cylinder supports frame (12) bottom, the cylinder supports lid (15)
A cavity is formed with the cylinder supports frame (12)；The cylinder (13) is in the cavity, and the cylinder (13) are consolidated
Fixed end is fixed on cylinder supports lid (15)；The bottom of the cylinder connection pinboard (14) and the telescopic end of the cylinder (13)
It is fixedly connected, the top of the cylinder connection pinboard (14) is fixedly connected with the jack-up axis (11)；The jack-up axis (11)
Disc mechanism (3), and relatively described cooling disc mechanism (3) elevating movement of the jack-up axis (11) are cooled down through described.
In some embodiments, the air-powered lifting mechanism (5) further includes air cylinder support outer cover (16), outside the air cylinder support
It is external that cover (16) is arranged on the cylinder supports frame (12).
In some embodiments, further include sealing connection mechanism, the sealing connection mechanism include seal bellows (22), in
Cardiac skeleton (23), center bearing bracket (24), the seal bellows (22) for the air-powered lifting mechanism (5) jack-up axis (11)
With the sealing and relative motion of the cooling disc mechanism (3)；The bottom of the seal bellows (22) and the bottom for jacking up axis (11)
Portion is sealed by center bearing bracket (24)；The top of the seal bellows (22) and the bottom of cooling disc mechanism (3) pass through center
Stent (23) seals.
The beneficial effects of the present invention are：Apparatus of the present invention realize the function of auto-lift of semiconductor, and realize semiconductor
Cooling.The present invention effectively realized high temperature semiconductors for the realization of the excessively high cooling of temperature after semiconductor machining simultaneously
Cooling.When wafer is transferred to wafer load position by processing technology chamber, wafer is filled first by processing technology chamber through cooling
It puts into wafer load position, wafer is placed on lifting PIN bracket institutions 2, at this point, placing support on lifting PIN bracket institutions 2
Need the wafer cooled down.Meanwhile cooler pan heat insulation support mechanism 4 ensures that wafer is not in direct contact with cooling disc mechanism 3, i.e., it is not straight
Capable cooling is tapped into, avoids inhomogeneous cooling even, wafer is caused to burst；Air-powered lifting mechanism 5 drives lifting PIN bracket institutions 2 to rise
Drop makes wafer realize cooling and support wafer close to far from cooling disc mechanism 3.
Description of the drawings
Fig. 1 is the structure diagram of the semiconductor cooling device of one embodiment of the invention.
Fig. 2 is the vertical view of the semiconductor cooling device of one embodiment of the invention.
Fig. 3 is the cross section view of the semiconductor cooling device of one embodiment of the invention.
Fig. 4 is the PIN stents of one embodiment of the invention and the structure diagram of cooler pan quartz supports ball.
Fig. 5 is the partial enlarged view of the PIN stents of one embodiment of the invention.
Fig. 6 is the partial enlarged view of the cooler pan quartz supports ball of one embodiment of the invention.
Fig. 7 is the position view of the cooling water intake-outlet of one embodiment of the invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with attached drawing and specific implementation
Example, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only explaining this hair
It is bright, without being construed as limiting the invention.
In the description of the present invention, the fingers such as term " interior ", " outer ", " longitudinal direction ", " transverse direction ", " on ", " under ", " top ", " bottom "
The orientation or position relationship shown be based on orientation shown in the drawings or position relationship, be for only for ease of the description present invention rather than
It is required that the present invention must be with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
As shown in Figure 1, the present invention proposes a kind of semiconductor cooling device for high vacuum environment, including wafer support machine
Structure 1, lifting PIN bracket institutions 2, cooling disc mechanism 3, cooler pan heat insulation support mechanism 4 and pneumatic lifting mechanism 5.
Apparatus of the present invention process object not only includes wafer, or the semi-conducting materials such as silicon chip.
The wafer support mechanism 1, lifting PIN bracket institutions 2, cooler pan heat insulation support mechanism 4 are arranged on the cooling
On disc mechanism 3, the cooling disc mechanism 3 is arranged in the air-powered lifting mechanism 5.
Wherein, the wafer support mechanism 1 is used to support the wafer without cooling；The lifting PIN bracket institutions 2, are used
In lifting wafer to be cooled；The cooler pan heat insulation support mechanism 4, for be isolated wafer with it is described cooling disc mechanism 3 and
Support wafer；The air-powered lifting mechanism 5 provides power source for wafer elevating.
In concrete application,
When wafer is transferred to processing technology chamber by " loaded " position, wafer is entered first by " loaded " position through cooling device
Processing technology chamber, wafer are placed on wafer support mechanism 1, at this point, support is placed on wafer support mechanism 1 does not need to cooling
Wafer.
When wafer is transferred to wafer load position by processing technology chamber, wafer is first by processing technology chamber through cooling
Device enters wafer load position, and wafer is placed on lifting PIN bracket institutions 2, at this point, placing branch on lifting PIN bracket institutions 2
Support needs the wafer cooled down.
Meanwhile cooler pan heat insulation support mechanism 4 ensures that wafer is not in direct contact with cooling disc mechanism 3, i.e., does not carry out directly
Cooling, avoids inhomogeneous cooling even, wafer is caused to burst；Air-powered lifting mechanism 5 drives lifting PIN bracket institutions 2 to lift, and makes crystalline substance
Circle realizes cooling and support wafer close to far from cooling disc mechanism 3.
Together refering to shown in Fig. 1-7, in preferred embodiment, the wafer support mechanism 1 is stably connected on cold dish 6, packet
Include the double pawl supporting racks 18 of wafer, wafer monodactyle supporting rack 19 and multiple claw quartz pillars 20.Wherein, wafer support is several points
Contact realizes that point contact makes contact area become smaller, and is more easy to that wafer is protected to be destroyed not in support, and the shape of monodactyle and double pawls was both
It can meet and stablize support wafer, and wafer transfer manipulator can be met and do not interfered in wafer is transmitted with wafer support device.
The double pawl supporting racks 18 of the wafer, wafer monodactyle supporting rack 19 are separately positioned on the both sides of the cooling disc mechanism 3,
The multiple claw quartz pillar 20 is separately positioned on the double pawl supporting rack 18 of wafer, on wafer monodactyle supporting rack 19.
In a preferred embodiment, the lifting PIN bracket institutions 2 be arranged on 3 top of cooling disc mechanism and with it is described
Air-powered lifting mechanism 5 connects, and specifically, lifting PIN bracket institutions 2 are connected on the jack-up axis 11 of air-powered lifting mechanism 5, are installed
Position is in the upper grooves of cold dish 6 are not shown in figure.
It lifts PIN bracket institutions 2 and includes PIN stents 8, PIN stent grasping devices 9 and PIN quartz pillar 10, the PIN
Stent 8 and PIN stent grasping devices 9 connect, and the PIN quartz pillar 10 is arranged on the PIN stents 8 and PIN stent clampings
Between device 9.
The position of PIN quartz pillar 10 can be adjusted according to the size of transmitted wafer, be provided in the embodiment of the present invention
Three installation optional positions, do not limit the quantity for installing optional position.
Further, the PIN stents 8 are Y types.Use Y types that wafer is made to consolidate support, Y types for 3 points with PIN stents 8
So that PIN stents 8 can meet stablize support wafer and meet wafer transfer manipulator in wafer is transmitted not with lifting
PIN holder devices interfere.
The cooling disc mechanism 3 includes cold dish 6 and the waterway seal plate 7 for being arranged on 6 lower part of cold dish, the cold dish 6
It is sealed with waterway seal plate 7 by O-ring, the O-ring is arranged in the seal groove of the cold dish 6, to meet vacuum environment
Seal request；Water route flowing of the cooling water between the cold dish 6 and waterway seal plate 7.
Further, as shown in fig. 7, cold dish 6 further includes inlet and outlet, for cold dish 6 cooling water inflow and
Outflow.
Wherein, in this scenario, the size of cold dish 6 need to meet the crystalline substance that semiconductor integrates the transmission process of production platform institute
Round size；It is enough that the thickness of cold dish 6 need to meet the height of transport plane, 6 cooling water sink depth of cold dish offer cold dish
Cooling capacity and lifting PIN bracket institutions 2 lift required space.
Simultaneously as semiconductor integrates production platform as high vacuum environment, for being easy to get for high vacuum environment, cold dish is needed
Smaller area is occupied, so that vacuum chamber volume is small, is more easy to reach high vacuum environment.
In a preferred embodiment, the cooler pan support quartz that the cooler pan heat insulation support mechanism 4 has flat surface for one
Ball 21, the flat surface of the cooler pan support quartz ball 21 are connected with the cooling disc mechanism 3, and cooler pan support quartz
Ball 21 is fixed on the cooling disc mechanism 3.Quartz ball 21 is supported to be effectively isolated wafer and cold dish by cooler pan so that cold dish
Heat loss through radiation uniformly reduces wafer temperature, avoids cooling temperature unevenness that silicon wafer warpage is made even to rupture.
The air-powered lifting mechanism 5 includes cylinder supports lid 15, cylinder connection pinboard 14, cylinder 13, cylinder supports frame
12 and jack up axis 11.
The cylinder supports frame 12 is located at the lower section of the cooling disc mechanism 3 and is fixedly connected with the cooling disc mechanism 3；
The cylinder supports lid 15 is fixedly connected on 12 bottom of cylinder supports frame, the cylinder supports lid 15 and the cylinder supports
Frame 12 forms a cavity；The cylinder 13 is located in the cavity, and the fixing end of the cylinder 13 is fixed on cylinder supports lid
On 15；The bottom of the cylinder connection pinboard 14 is fixedly connected with the telescopic end of the cylinder 13, the cylinder connection switching
The top of plate 14 is fixedly connected with the jack-up axis 11；The jack-up axis 11 cools down disc mechanism 3, and the jack-up axis through described
11 relatively described cooling 3 elevating movements of disc mechanism.
It realizes that transmission is extremely difficult in high vacuum environment, lifting mechanism lifting is pushed to realize lifting PIN branch by cylinder
The lifting of frame.
Further, the air-powered lifting mechanism 5 further includes air cylinder support outer cover 16, and the air cylinder support outer cover 16 is set
Outside the cylinder supports frame 12.Air-powered lifting mechanism 5 is made to be in a relative closure environment, external interference is avoided, rises simultaneously
To aesthetic effect.
In a preferred embodiment, semiconductor cooling device of the present invention further includes sealing connection mechanism, the sealed connection machine
Structure includes seal bellows 22, center bearing bracket 23, center bearing bracket 24, and the seal bellows 22 is used for the air-powered lifting mechanism
5 sealing and relative motion that jack up axis 11 and the cooling disc mechanism 3；The bottom of the seal bellows 22 is with jacking up axis 11
Bottom sealed by center bearing bracket 24；The top of the seal bellows 22 and the bottom of cooling disc mechanism 3 pass through center branch
Frame 23 seals.High vacuum dynamic sealing is carried out by seal bellows.
In optimum embodiment, a kind of semiconductor cooling device is proposed, as shown in Fig. 1 to 7.
Cold dish 6,6 edge of cold dish are provided with waterway seal plate 7, are carried out between cold dish 6 and waterway seal plate 7 by O-ring
Sealing.Wherein, O-ring is mounted in the seal groove of cold dish 6, water route stream of the cooling water between cold dish 6 and waterway seal plate 7
It is dynamic, realize the cooling of cold dish 6.
6 bottom of cold dish sets cylinder supports frame 12, and cylinder supports frame 12 is fixedly connected with cold dish 6 by screw；Cylinder branch
Support lid 15 is fixedly connected on by screw in cylinder supports frame 12.The fixing end of cylinder 13 is fixed by screws in cylinder supports lid
On 15；The telescopic end of cylinder 13 connect pinboard 14 with cylinder and is fixedly connected by screw, and cylinder connection pinboard 14 passes through spiral shell
Nail is fixedly connected with the bottom for jacking up axis 11.
Pinboard 14 is connected by cylinder and connects the telescopic end of cylinder 13 and 11 bottom of jack-up axis, effectively ensures that wafer passes
The condition of high vacuum degree of defeated environment.The telescopic end of cylinder 13 and 11 bottom of jack-up axis are directly connected to, height of the threaded hole as wafer transfer
The air leakage point of vacuum environment.
The sealing and relative motion jacked up between axis 11 and cold dish 6 is connected by seal bellows 22, seal bellows 22
It can extend and shorten to meet and jack up axis 11 and raise and reduce action.
22 bottom of seal bellows is sealed with jacking up 11 bottom of axis by carrying the center bearing bracket 24 of O-ring, passes through vacuum
Clamp fix seal bellows 22 with jacking up axis 11, so as to fulfill the sealing and movement of axis 11 is jacked up.
The top of seal bellows 22 and the bottom of cold dish 6 are sealed by carrying the center bearing bracket 23 of O-ring, pass through vacuum
Seal bellows 22 is fixed on cold dish 6 by clamp, and jack-up axis is made not only to have realized lifting, but also does not destroy the high vacuum ring of wafer transfer
Border.
PIN stents 8 are fixed by screws in the top for jacking up axis 11, and PIN quartz pillar 10 passes through PIN stent grasping devices
9 are fixedly clamped with PIN stents 8, and the clamping force of PIN quartz pillar 10 connect spiral shell by PIN stent grasping devices 9 with PIN stents 8
The elastic adjusting of nail.
The lifting for jacking up axis 11 drives the lifting of PIN stents 8, so as to fulfill the lifting of PIN quartz pillar 10, realizes PIN
The lifting of wafer supported on quartzy pillar 10.PIN stents are Y types, can meet uniformly carrying wafer and pass wafer
Defeated manipulator A does not interfere when picking and placeing wafer with cooling device.
Wafer to be cooled is placed on by wafer transfer manipulator A on the PIN quartz pillar 10 of rise, and cylinder 13 is shunk
Jack-up axis 11 is driven to decline, the decline of axis 11 is jacked up and PIN stents 8 is driven to decline, PIN stents 8 decline under drive PIN quartz pillar 10
Drop, so as to make needs cool down wafer drop to mounted on 6 surface of cold dish cooler pan support quartz ball 21 contact, wafer and
Cold dish 6 maintains a certain distance, 6 heat loss through radiation of cold dish, the rapid cooling down of wafer for cooling down needs.
After cooling, cylinder 13 jacks up axis 11, jacks up axis 11 and the wafer on PIN quartz pillar 10 is driven to rise.
Wafer transfer manipulator A takes the wafer that cooling is completed away.
Cold dish 6, thereon equipped with the double pawl supporting racks 18 of wafer and wafer monodactyle supporting rack 19, wherein, claw quartz pillar 20
It is separately mounted on the double pawl supporting racks 18 of wafer and wafer monodactyle supporting rack 19.The double pawl supporting racks 18 of wafer and the support of wafer monodactyle
Frame 19 supports the wafer for not needing to cooling by claw quartz pillar 20 thereon, and support contact is point contact, avoids large area
Face contacts, and greatly reduces the breakage rate of wafer.
The present invention jacks up the lifting of axis by the flexible drive of cylinder, and the liter of PIN stents is driven by the lifting for jacking up axis
Drop is realized the rise of wafer by the lifting of PIN stents and is reduced on cold dish.It is close by seal bellows and mounted on cold dish
The O-ring seal of sealing groove reaches high vacuum seal, realizes and maintains high vacuum environment.Cooling water is passed through by cold dish, makes cold dish temperature
Degree reduces, and being radiated by width reduces wafer temperature.
The specific embodiment of present invention described above, is not intended to limit the scope of the present invention..Any basis
Various other corresponding changes and deformation made by the technical concept of the present invention, should be included in the guarantor of the claims in the present invention
In the range of shield.
Claims (9)
1. a kind of semiconductor cooling device for high vacuum environment, including wafer support mechanism (1), lifting PIN bracket institutions
(2), cooling disc mechanism (3), cooler pan heat insulation support mechanism (4) and pneumatic lifting mechanism (5),
The wafer support mechanism (1), lifting PIN bracket institutions (2), cooler pan heat insulation support mechanism (4) be arranged on it is described cold
But on disc mechanism (3), the cooling disc mechanism (3) is arranged on the air-powered lifting mechanism (5)；
The wafer support mechanism (1) is used to support the wafer without cooling；
The lifting PIN bracket institutions (2), for lifting wafer to be cooled；
The cooler pan heat insulation support mechanism (4), for wafer and the cooling disc mechanism (3) and support wafer to be isolated；
The air-powered lifting mechanism (5) provides power source for wafer elevating.
2. semiconductor cooling device as described in claim 1, which is characterized in that the wafer support mechanism (1) is including wafer
Double pawl supporting racks (18), wafer monodactyle supporting rack (19) and multiple claw quartz pillars (20), the double pawl supporting racks of the wafer
(18), wafer monodactyle supporting rack (19) is separately positioned on the both sides of the cooling disc mechanism (3), the multiple claw quartz pillar
(20) it is separately positioned on the double pawl supporting rack (18) of wafer, on wafer monodactyle supporting rack (19).
3. semiconductor cooling device as described in claim 1, which is characterized in that the lifting PIN bracket institutions (2) are arranged on
It is connect above the cooling disc mechanism (3) and with the air-powered lifting mechanism (5), including PIN stents (8), PIN stent clampings
Device (9) and PIN quartz pillar (10), the PIN stents (8) and PIN stent grasping devices (9) connection, the PIN quartz branch
Column (10) is arranged between the PIN stents (8) and PIN stent grasping devices (9).
4. semiconductor cooling device as claimed in claim 3, which is characterized in that the PIN stents (8) are Y types.
5. semiconductor cooling device as described in claim 1, which is characterized in that the cooling disc mechanism (3) includes cold dish (6)
With the waterway seal plate (7) for being arranged on the cold dish (6) lower part, the cold dish (6) and waterway seal plate (7) are close by O-ring
Envelope, the O-ring is arranged in the seal groove of the cold dish (6), cooling water the cold dish (6) and waterway seal plate (7) it
Between water route flowing.
6. semiconductor cooling device as described in claim 1, which is characterized in that the cooler pan heat insulation support mechanism (4) is
One has the cooler pan support quartz ball (21) of flat surface, the flat surface of the cooler pan support quartz ball (21) and the cooling
Disc mechanism (3) is connected, and cooler pan support quartz ball (21) is fixed on the cooling disc mechanism (3).
7. semiconductor cooling device as described in claim 1, which is characterized in that the air-powered lifting mechanism (5) is including cylinder
Supporting cover (15), cylinder connection pinboard (14), cylinder (13), cylinder supports frame (12) and jack-up axis (11),
The cylinder supports frame (12) fixes company positioned at the lower section of the cooling disc mechanism (3) and with the cooling disc mechanism (3)
It connects；The cylinder supports lid (15) is fixedly connected on the cylinder supports frame (12) bottom, the cylinder supports lid (15) and institute
It states cylinder supports frame (12) and forms a cavity；The cylinder (13) is in the cavity, and the fixing end of the cylinder (13)
It is fixed on cylinder supports lid (15)；The bottom of the cylinder connection pinboard (14) and the telescopic end of the cylinder (13) are fixed
Connection, the top of the cylinder connection pinboard (14) are fixedly connected with the jack-up axis (11)；The jack-up axis (11) is run through
The cooling disc mechanism (3), and relatively described cooling disc mechanism (3) elevating movement of the jack-up axis (11).
8. semiconductor cooling device as claimed in claim 7, which is characterized in that the air-powered lifting mechanism (5) further includes gas
Jar support outer cover (16), it is external that the air cylinder support outer cover (16) is arranged on the cylinder supports frame (12).
9. semiconductor cooling device as described in claim 1, which is characterized in that further include sealing connection mechanism, the sealing
Bindiny mechanism includes seal bellows (22), center bearing bracket (23), center bearing bracket (24), and the seal bellows (22) is for institute
State the jack-up axis (11) of air-powered lifting mechanism (5) and the sealing and relative motion of the cooling disc mechanism (3)；The sealing ripple
The bottom for managing (22) is sealed with the bottom for jacking up axis (11) by center bearing bracket (24)；The top of the seal bellows (22) with
The bottom for cooling down disc mechanism (3) is sealed by center bearing bracket (23).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410632188.1A CN105655271B (en) | 2014-11-11 | 2014-11-11 | A kind of semiconductor cooling device for high vacuum environment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410632188.1A CN105655271B (en) | 2014-11-11 | 2014-11-11 | A kind of semiconductor cooling device for high vacuum environment |
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| CN105655271B true CN105655271B (en) | 2018-07-03 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2694164B2 (en) * | 1988-04-18 | 1997-12-24 | 東京エレクトロン株式会社 | Plate-like holding device |
| JP2584927B2 (en) * | 1991-12-27 | 1997-02-26 | 大日本スクリーン製造株式会社 | Substrate cooling method and substrate cooling device |
| JP2003332193A (en) * | 2003-03-20 | 2003-11-21 | Tokyo Electron Ltd | Substrate treatment device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
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