CN105637029A - Sealing resin composition - Google Patents
Sealing resin composition Download PDFInfo
- Publication number
- CN105637029A CN105637029A CN201480056892.5A CN201480056892A CN105637029A CN 105637029 A CN105637029 A CN 105637029A CN 201480056892 A CN201480056892 A CN 201480056892A CN 105637029 A CN105637029 A CN 105637029A
- Authority
- CN
- China
- Prior art keywords
- resin
- resin composition
- encapsulating
- mass
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 84
- 238000007789 sealing Methods 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 122
- 239000011347 resin Substances 0.000 claims abstract description 122
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 24
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 40
- 229910044991 metal oxide Inorganic materials 0.000 claims description 22
- 150000004706 metal oxides Chemical class 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 21
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 20
- 235000007586 terpenes Nutrition 0.000 claims description 20
- 150000003505 terpenes Chemical class 0.000 claims description 17
- 125000000524 functional group Chemical group 0.000 claims description 16
- 238000011049 filling Methods 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 9
- 239000005977 Ethylene Substances 0.000 claims description 9
- 150000001336 alkenes Chemical class 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 8
- 150000008064 anhydrides Chemical group 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 description 45
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- -1 ethylene, propylene, acrylonitrile Chemical class 0.000 description 30
- 238000000034 method Methods 0.000 description 21
- 239000007788 liquid Substances 0.000 description 20
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 19
- 239000002966 varnish Substances 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 17
- 229910000077 silane Inorganic materials 0.000 description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 15
- 239000010408 film Substances 0.000 description 15
- 239000002253 acid Substances 0.000 description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 239000008601 oleoresin Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 239000004575 stone Substances 0.000 description 11
- 229920001195 polyisoprene Polymers 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000011888 foil Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000005062 Polybutadiene Substances 0.000 description 7
- 230000003750 conditioning effect Effects 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 229920002857 polybutadiene Polymers 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 6
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 235000012222 talc Nutrition 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- VFIJBTVGUHVPPW-UHFFFAOYSA-N [Br].C=C Chemical group [Br].C=C VFIJBTVGUHVPPW-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 229910052599 brucite Inorganic materials 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- NESLVXDUKMNMOG-UHFFFAOYSA-N triethoxy-(propyltetrasulfanyl)silane Chemical compound CCCSSSS[Si](OCC)(OCC)OCC NESLVXDUKMNMOG-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical compound C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- FBYFHODQAUBIOO-UHFFFAOYSA-N 2-(1-carboxyethoxy)propanoic acid Chemical compound OC(=O)C(C)OC(C)C(O)=O FBYFHODQAUBIOO-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- XHHXXUFDXRYMQI-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;titanium Chemical compound [Ti].OCCN(CCO)CCO XHHXXUFDXRYMQI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- AWQFNUMHFNEWGS-UHFFFAOYSA-N 2-methylprop-1-ene;styrene Chemical group CC(C)=C.C=CC1=CC=CC=C1 AWQFNUMHFNEWGS-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- BYIMSFXYUSZVLI-UHFFFAOYSA-N 3-methoxysilylpropan-1-amine Chemical compound CO[SiH2]CCCN BYIMSFXYUSZVLI-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- CYRRYHPFWXNRRH-UHFFFAOYSA-N C(CCCCCCCCCCCCCCCCC)(=O)OOCCCC Chemical compound C(CCCCCCCCCCCCCCCCC)(=O)OOCCCC CYRRYHPFWXNRRH-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Natural products CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- MCEBKLYUUDGVMD-UHFFFAOYSA-N [SiH3]S(=O)=O Chemical compound [SiH3]S(=O)=O MCEBKLYUUDGVMD-UHFFFAOYSA-N 0.000 description 1
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 1
- TWSOFXCPBRATKD-UHFFFAOYSA-N [diphenyl-(triphenylsilylamino)silyl]benzene Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)N[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 TWSOFXCPBRATKD-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920013822 aminosilicone Polymers 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- RZOBLYBZQXQGFY-UHFFFAOYSA-N ammonium lactate Chemical compound [NH4+].CC(O)C([O-])=O RZOBLYBZQXQGFY-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- UCESSOKJDODQLF-UHFFFAOYSA-N butyl-dimethoxy-[2-(oxiran-2-yl)ethoxy]silane Chemical compound C(C1CO1)CO[Si](OC)(OC)CCCC UCESSOKJDODQLF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- VLWUKSRKUMIQAX-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[SiH](OCC)CCCOCC1CO1 VLWUKSRKUMIQAX-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
To provide: a sealing resin composition having good transparency, moisture permeation resistance, and moist heat-resistant adhesion; and a sealing resin composition sheet obtained from the same. [Solution] The present invention comprises: a sealing resin composition which contains a polyisobutylene resin, a modified polyolefin resin, and a tackifier resin; and a sealing resin composition sheet wherein a layer of the resin composition is formed on a support body.
Description
Technical field
The present invention relates to the resin combination of the sealing etc. that can be suitable for organic EL element.
Background technology
Organic EL (Electroluminescence, electroluminescent) element is the light-emitting component employing organic substance in luminescent material, it is possible to obtain the luminescence of high brightness at lower voltages, is therefore the raw material received publicity in recent years. But, there are the following problems: organic EL element is extremely not resistant to moisture, organic material self can go bad because of moisture, and luminance-reduction or not luminous or electrode and organic EL layer interface are peeled off because of the impact of moisture or metal occurs to aoxidize and high resistance.
When use thermally curable resin composition is as the whole face seal material of organic EL element, it is possible to enumerating following advantage: the viscosity of material before solidification is low, therefore stacking operation is easy; The moisture permeability of the solidfied material after heat cure is low. But, on the other hand, heating-up temperature when there is organic EL element because of heat cure and the problem that deteriorates.
Patent Document 1 discloses the encapsulation film containing polyisobutylene resin and hydrogenation of cyclic olefin polymer. However, it is known that this film is generally laminated with protecting film, owing to the viscosity of this film is big, therefore protecting film is difficult to peel off, and, when peeling off protecting film, this film occurs the operability such as significantly deformation extremely difficult.
On the other hand, Patent Document 2 discloses the sealing material use compositions containing isobutylene-based polymer, compound containing epoxy radicals and hardener for epoxy resin, but said composition is for heat seeling coating, therefore can not being coated with as varnish, make slice easily. It addition, also without mentioning adaptation and operability, it does not have study fully.
Additionally, as the method for the heat deterioration avoiding organic EL element, Patent Document 3 discloses containing polyisobutylene resin, having can with the resin combination of the polyisoprene resin of the functional group of epoxy reaction and/or polyisobutylene resin, tackifying resin and epoxy resin. Patent Document 4 discloses be feature containing styreneisobutylene modified resin and (B) tackifying resin resin composition for encapsulating. But, all need to make its operation that long-time heating solidifies under 130 DEG C of such high temperature after drying in coating, existing problems in the flatness such as curling and productivity ratio of film.
On the other hand, if hardness is insufficient, then when using because of other blooming laminating that heat shrinks with polaroid etc., the cohesion producing binding agent after there is High temperature storage destroys, peeling-off such problem.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2009-524705 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2008-248055 publication
Patent documentation 3:WO2011/062167
Patent documentation 4:WO2013/108731
Summary of the invention
Invent problem to be solved
Problem to be solved by this invention is in that the resin composition sheet providing a kind of resin combination and being obtained by this resin combination, this resin combination can carry out varnish coating, sheet can be made easily, without the operation that is heating and curing, the heat deterioration of organic EL element can be greatly reduced, productivity ratio moreover can also be greatly improved, it is possible to realize having concurrently the sheet of good poisture-penetrability transparent, resistance to, adhesive strength, thermostability.
For solving the means of problem
Present inventor has performed further investigation, found that, by using the resin composition for encapsulating to be feature containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C) to can solve the problem that above-mentioned problem, thus completing the present invention.
Namely the present invention relates to:
" (1) a kind of resin composition for encapsulating, it is characterised in that containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C);
(2) resin composition for encapsulating as described in (1), it is characterised in that relative to the nonvolatile component 100 mass % in above-mentioned resin combination, the above-mentioned polyisobutylene resin (A) containing 35��95 mass %;
(3) resin composition for encapsulating as described in (1) or (2), it is characterised in that above-mentioned modified polyolefin resin (B) is containing copolymer as monomer component of alkene and styrene;
(4) resin composition for encapsulating as described in (3), it is characterised in that above-mentioned alkene is ethylene and/or 1-butylene, above-mentioned copolymer is the copolymer with functional group;
(5) resin composition for encapsulating as according to any one of (1)��(4), it is characterised in that above-mentioned modified polyolefin resin (B) has anhydride group as functional group;
(6) resin composition for encapsulating as according to any one of (1)��(5), it is characterized in that, relative to the nonvolatile component 100 mass % in above-mentioned resin combination, the above-mentioned modified polyolefin resin (B) containing 1��40 mass %;
(7) resin composition for encapsulating as according to any one of (1)��(6), it is characterised in that above-mentioned tackifying resin (C) is terpene resin;
(8) resin composition for encapsulating as according to any one of (1)��(7), it is characterised in that above-mentioned tackifying resin (C) is aromatic modified terpene resin;
(9) resin composition for encapsulating as according to any one of (1)��(8), it is characterized in that, relative to the nonvolatile component 100 mass % in above-mentioned resin combination, the above-mentioned tackifying resin (C) containing 1��40 mass %;
(10) a kind of solidfied material, the solidfied material of its resin composition for encapsulating according to any one of (1)��(9);
(11) solidfied material as described in (10), it is characterised in that the transmission of visible light from 380nm to 780nm is 80��100%;
(12) solidfied material as described in (10) or (11), it is characterised in that moisture permeability is 0.1g/m2My god��40g/m2My god;
(13) a kind of resin composition for encapsulating sheet, it is characterised in that comprise the resin composition for encapsulating according to any one of (1)��(9);
(14) the resin composition for encapsulating sheet as described in (13), it is for the sealing of organic EL element;
(15) a kind of organic EL device, it is characterised in that comprise the resin composition for encapsulating according to any one of (1)��(9);
(16) resin composition for encapsulating as according to any one of (1)��(9), it is characterised in that contain inorganic filling material (F) further;
(17) resin composition for encapsulating as according to any one of (1)��(9), it is characterised in that contain hygroscopicity metal-oxide (G) further ".
Invention effect
The present invention can provide a kind of resin composition for encapsulating and the resin composition for encapsulating sheet obtained by said composition, this resin composition for encapsulating is by containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C), varnish coating can be carried out, sheet can be made easily, without the operation that is heating and curing, the heat deterioration of organic EL element can be greatly reduced, productivity ratio moreover can also be greatly improved, it is possible to realize having concurrently the sheet of good poisture-penetrability transparent, resistance to, adhesive strength, thermostability.
Detailed description of the invention
Being characterized mainly in that of the resin combination of the present invention, containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C).
The polyisobutylene resin (A) (hereinafter also referred to as " (A) composition ") used in the present invention keeps the effect of other each physical property with having the Simultaneous Stabilization of the resistance to poisture-penetrability at raising resin combination. It should be noted that should (A) composition be solid, shaped preferably in the state under room temperature (25 DEG C).
(A) as long as composition is formed with the polymer of polyisobutylene skeleton in main body, then be not limited to isobutene. homopolymer or in isobutene. the copolymer (below they being referred to as " isobutylene-based polymer ") of the olefin-based compound such as the 1-butylene of copolymerization appropriate amount, 2-butylene, as long as desired resistance to poisture-penetrability can be obtained, it is also possible to there is the copolymer (block copolymer or graft copolymer) of segment skeleton that the monomer component beyond by isobutene. constitutes for copolymerization in polyisobutylene skeleton. In this copolymer, as the monomer component beyond isobutene., can exemplifying isoprene, styrene, butadiene, ethylene, propylene, acrylonitrile, vinyl chloride, bromine ethylene, hydrogenated styrene, pentadiene, cyclopentadiene, dicyclopentadiene etc., they can use one or more. Wherein, from the view point of improve heatproof poisture-penetrability hot, resistance to, it is preferable that styrene. It addition, in this copolymer, the ratio shared by polyisobutylene skeleton is preferably overall more than the 50 mass % of polymer, is more preferably more than 60 mass %. Preferred copolymerization composition, i.e. polyisobutylene skeleton and the respective ratio of segment skeleton (polyisobutylene skeleton/be made up of the monomer component beyond isobutene. segment skeleton) being made up of the monomer component beyond isobutene. are 60��90 mass %/10��40 mass %, are more preferably 65��80 mass %/20��35 mass %. It addition, this copolymer can also share with isobutylene-based polymer.
Concrete example as (A) composition, as commercially available product, it is possible to enumerate OPPANOLB10, B12, B15, B50, B50SF, B80, B100, B120, B150, B220 (BASF AG's system), JSRBUTYL065,268,365 (JSR company system), VistanexLM-MS, MH, H, MML-80,100,120,140 (ExxonChemical company system), HYCAR (Goodrich company system), SIBSTART102 (Kaneka company system) etc. They can use one or combination to use two or more.
(A) mean molecule quantity of composition is not particularly limited, from the view point of bring good coating and the compatibility, viscosity-average molecular weight is preferably 4, less than 000,000, it is more preferably 2,600, less than 000, more preferably less than 1,000,000. On the other hand, from the view point of prevent the resin combination depression when coating, show the resistance to poisture-penetrability of resin composition sheet, improve mechanical strength, viscosity-average molecular weight is preferably more than 100,000, is more preferably 200, more than 000, more preferably more than 300,000. It addition, (A) composition is preferably in being solid, shaped under room temperature (25 DEG C). It should be noted that the viscosity-average molecular weight in the present invention is conventionally to measure the viscosity of the dilute polymer under set point of temperature, use viscosity formula to obtain according to the value of the limiting viscosity thus obtained. Or, it is also possible to obtained by Florey (Off �� ��) melt viscosity formula according to the melt viscosity of resin.
(A) composition can use one or more. The content of (A) composition in resin combination is not particularly limited, from the view point of bring good coating and the compatibility, the hot and operability (suppressing tacky) that is able to ensure that good heatproof, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 95 mass %, be more preferably below 80 mass %. On the other hand, from the view point of obtain the resistance to poisture-penetrability of necessity, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 35 mass %, be more preferably more than 50 mass %.
The modified polyolefin resin (B) (hereinafter also referred to as " (B) composition ") used in the present invention plays following effect: while making obtained resin composition sheet good with maintenance such as the cementability of base material etc., improve cohesiveness (retentivity), make thermostability good, further, the operability in the manufacturing procedure of sheet is also improved. Raising retentivity described herein refers to: by 80 DEG C, shearing side-play amount behind under 1Kg load 1 hour be reduced to preferably below 0.5mm.
(B) composition used in the present invention is by forming laggard row cross-linking reaction at sheet, it is possible to improves cohesiveness (retentivity) further, makes thermostability good.
(B) composition is the polymer based on olefin skeletal, as long as homopolymer or containing the copolymer of olefin skeletal and there is functional group be just not particularly limited. The form of copolymer is not particularly limited, it is possible to enumerate random copolymer, block copolymer, graft copolymer etc.
Monomer component as above-mentioned alkene, it is possible to illustrating ethylene, propylene, 1-butylene, 2-butylene etc., they can use one or more. Wherein, from the view point of with the compatibility of (A) composition, it is preferable that ethylene, 1-butylene. It addition, as the monomer component beyond above-mentioned alkene, it is possible to illustrate styrene, butadiene, acrylonitrile, vinyl chloride, bromine ethylene, hydrogenated styrene, pentadiene, cyclopentadiene, dicyclopentadiene etc., it is possible to use one or more in them. Wherein, from the view point of improve heatproof is hot, improve resistance to poisture-penetrability, it is preferable that styrene.
Optimal way as this (B) composition, it is possible to enumerate and comprise ethylene and/or 1-butylene and styrene and there is the copolymer of functional group.
In above-mentioned copolymer, ratio shared by each composition of ethylene, 1-butylene, styrene is not particularly limited, the total ratio of ethylene and/or 1-butylene composition is preferably overall more than the 20 mass % of copolymer, is more preferably more than 40 mass %, and the ratio shared by styrene content is preferably overall more than the 10 mass % of copolymer, is more preferably more than 20 mass %.
As above-mentioned functional group, as long as bring harmful effect will not to desired resistance to poisture-penetrability, cementability, it can be then any structure, can enumerate such as: anhydride group [-C (O)-O-C (O)-], carboxyl, epoxy radicals, amino, hydroxyl, azoles quinoline base, oxetanyl, cyanate ester based, phenolic group [-Ph-OH], hydrazide group, amide groups etc., wherein preferred acid anhydride group. It addition, functional group can be either of which kind, it is also possible to for two or more.
Concrete example as this (B) composition, it is possible to enumerate and there is anhydride group comprise ethylene and/or 1-butylene and cinnamic copolymer etc. as above-mentioned functional group.
It addition, comprise in ethylene and/or 1-butylene and cinnamic copolymer etc. what there is anhydride group, it is preferable that acid number is the copolymer of 1��50mgKOH/g, more preferably acid number is the copolymer of 5��30mgKOH/g. It should be noted that acid number described herein is based on JISK2501-2003 oil product and the acid number of lubricating oil-neutralization number test method.
From the view point of improve the compatibility of resin combination, the number-average molecular weight of (B) composition is preferably less than 300,000, is more preferably less than 150,000. It addition, from the view point of show the resistance to poisture-penetrability of resin combination, it is preferred to more than 5,000, be more preferably more than 10,000. It addition, (B) composition is preferably the material of solid under room temperature (25 DEG C).
It should be noted that the number-average molecular weight in the present invention is measured by gel permeation chromatography (GPC) method (polystyrene conversion). About the number-average molecular weight obtained by GPC method, specifically, can use LC-9A/RID-6A that Shimadzu Scisakusho Ltd manufactures as determinator, use Showa electrician company to manufacture ShodexK-800P/K-804L/K-804L as chromatographic column, use oxolane etc. as mobile phase, it is measured under the column temperature of 40 DEG C, uses the standard curve of polystyrene standard to calculate.
As the commercially available product that can act as (B) composition, it is possible to enumerate: SafurenP-1000 (20% solution (acid number 13��16mgKOH/g) of special polyolefin-based resins acid modifier (number-average molecular weight 70000), Mitsubishi Chemical Ind's system) etc.
(B) composition can use one or more. The content of (B) composition in resin combination is not particularly limited, from the view point of be able to ensure that the good resistance to poisture-penetrability of resin combination, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 40 mass %, be more preferably below 30 mass %. It addition, from the view point of show the good cohesion of the sheet obtained by resin combination, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 1 mass %, be more preferably more than 5 mass %.
The tackifying resin (C) (hereinafter also referred to as " (C) composition ") used in the present invention can keep other each physical property at the Simultaneous Stabilization of the cementability improving resin combination. As this (C) composition, it is not particularly limited, it is preferred to use terpene resin, modified terpene resin (hydrogenated terpene resin, terpene phenolic copolymer resins, aromatic modified terpene resin etc.), coumarone resin, indene resin, Petropols (aliphatic through-stone oleoresin, hydrogenated fat ring type Petropols, aromatic series through-stone oleoresin, aliphatic aromatic copolymerization through-stone oleoresin, alicyclic through-stone oleoresin, dicyclopentadiene through-stone oleoresin and hydride thereof etc.). Wherein, from the view point of the compatibility, cementability, resistance to poisture-penetrability, more preferably terpene resin, aromatic modified terpene resin, terpene phenolic copolymer resins, hydrogenated fat ring type Petropols, aromatic series through-stone oleoresin, aliphatic aromatic copolymerization through-stone oleoresin, alicyclic through-stone oleoresin, it is preferred that terpene resin, aromatic modified terpene resin. One or combination should can be used to use two or more by (C) composition.
About the commercially available product that can act as (C) composition, as terpene resin, it is possible to enumerate YSRESINPX, YSRESINPXN (being YasuharaChemical company system) etc.; As aromatic modified terpene resin, it is possible to enumerate YSRESINTO, TR series (being YasuharaChemical company system) etc.; As hydrogenated terpene resin, it is possible to enumerate ClearonP, ClearonM, ClearonK series (being YasuharaChemical company system) etc.; As terpene phenolic copolymer resins, it is possible to enumerate YSPolystar2000, PolystarU, PolystarT, PolystarS, MightyaceG (being YasuharaChemical company system) etc.; As hydrogenated fat ring type Petropols, it is possible to enumerate Escorez5300 series, 5600 series (being ExxonMobil company system); As aromatic series through-stone oleoresin, it is possible to enumerate ENDEX155 (Eastman company system); As aliphatic aromatic copolymerization through-stone oleoresin, it is possible to enumerate QuintoneD100 (Nippon Zeon's system); As alicyclic through-stone oleoresin, it is possible to enumerate Quintone1345 (Nippon Zeon's system) etc.
The content of (C) composition in resin combination is not particularly limited, from the view point of maintain good resistance to poisture-penetrability, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 40 mass %, be more preferably below 30 mass %. It addition, from the view point of have sufficient cementability, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 1 mass %, be more preferably more than 5 mass %.
From the view point of sheet softening occurs and has desired thermostability in the lamination process of resin composition sheet, the softening point of (C) composition is preferably 50��200 DEG C, is more preferably 90��160 DEG C. It should be noted that the mensuration of softening point is measured by ring and ball method according to JISK2207.
It should be noted that, in order to adjust the cohesiveness of the sheet obtained by resin combination, it is possible to share the liquid polybutadiene with the functional group can reacted with NCO and/or liquid polyisoprene ((D) composition) in dysgenic scope bring to resistance to poisture-penetrability, cementability. " liquid polybutadiene " described herein is the butadiene-based polymer of liquid, and " liquid polyisoprene " is the isoprene based polymer of liquid. " liquid " refers to the state under room temperature (25 DEG C). About the commercially available product of the liquid polybutadiene of such functional group having and can reacting with NCO or liquid polyisoprene, as liquid polybutadiene, it is possible to enumerate NIISO-PBG series, GI series (Cao Da company of Japan system) etc.; As liquid polyisoprene, it is possible to enumerate Epol (Chu Guangxingchan company system) etc. They can use one or combination to use two or more.
The content of (D) composition in resin combination is not particularly limited, from the view point of maintain the desired transparency, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 20 mass %, be more preferably below 15 mass %. It addition, from the view point of fully show the effect coordinating this composition, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 1 mass %, be more preferably more than 2 mass %.
The resin combination of the present invention contains firming agent further by the degree not interfere with effect of the present invention, it is possible to increase the curing performance of resin combination. Firming agent (E) in the present invention refers to the compound that the functional group with (B) composition or (D) composition reacts, it is not particularly limited, it is possible to enumerate epoxy compound, isocyanates based compound, metal chelate compound, metal alkoxide, slaine, amines, hydrazine compound or aldehyde based compound etc. The one in them or combination can be used to use two or more. When using isocyanates based compound, it is possible to share stannum based compound as catalyst.
The content of firming agent (E) is not particularly limited, from the view point of prevent the reduction of resistance to poisture-penetrability, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 5 mass %, be more preferably below 1 mass %. On the other hand, from the view point of show good retentivity, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 0.01 mass %, be more preferably more than 0.05 mass %.
In the resin combination of the present invention, contain inorganic filling material (F) further by the degree not interfere with effect of the present invention, it is possible to increase the resistance to poisture-penetrability of solidfied material, it is prevented that film adds the depression in man-hour. As inorganic filling material, it is not particularly limited, it is possible to enumerate: silicon dioxide, aluminium oxide, barium sulfate, Talcum, clay, mica powder, aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, Alborex M 12, Barium metatitanate., strontium titanates, calcium titanate, magnesium titanate, bismuth titanates, titanium dioxide, barium zirconate, calcium zirconate etc. Among these, from the view point of improve the resistance to poisture-penetrability of resin cured matter, it is preferable that Talcum, Muscovitum, it is particularly preferred to Talcum. The one in them or combination can be used to use two or more.
Inorganic filling material carry out surface treatment preferably by surface conditioning agent so that its moisture-proof improve inorganic filling material. as surface conditioning agent, it is possible to enumerate aminopropyl methoxysilane, aminopropyltriethoxywerene werene, ureidopropyltriethoxysilane, N-phenyl amino propyl trimethoxy silane, the amino silicone methane series coupling agents such as N-2 (amino-ethyl) TSL 8330, glycidoxypropyltrime,hoxysilane, glycidoxypropyl group triethoxysilane, glycidoxypropyl diethoxy silane, glycidyl butyl trimethoxy silane, the epoxy silane system coupling agents such as (3,4-epoxycyclohexyl) ethyl trimethoxy silane, mercaptopropyi trimethoxy silane, the hydrosulphonyl silane system coupling agents such as Mercaptopropyltriethoxysilane, MTMS, octadecyl trimethoxysilane, phenyltrimethoxysila,e, methyclyloxypropyl trimethoxy silane, imidizole silane, the silane series coupling agents such as triazine silane, hexamethyldisiloxane, hexaphenyl disilazane, three silazane, ring three silazane, the organosilazane compounds such as 1,1,3,3,5,5-pregnancy basic ring three silazane, butyltitanate dimer, octylene glycolic titanium, double, two (triethanolamine) titanium of diisopropoxy, dihydroxy dilactic acid titanium, double, two (DL-Lactic acid ammonium salt .) titanium of dihydroxy, double, two (dioctylphyrophosphoric acid ester) ethylidene titanate esters, double, two (dioctylphyrophosphoric acid ester) ethoxyacetic acid ester titanate esters, three n-butoxy monostearate titaniums, tetra-n-butyl titanate, metatitanic acid four (2-ethylhexyl) ester, double, two (dioctyl phosphito ester) titanate esters of tetra isopropyl, double, two (two (tridecyl) phosphite ester) titanate esters of four octyl groups, four (2,2-diene propoxy methyl-1-butyl) double, two (two (tridecyl)) phosphite ester titanate esters, isopropyl three caprylyl titanate esters, isopropyl three cumyl phenyl titanate esters, isopropyl three isostearoyl base titanate esters, isopropyl stearyl two acryloyl group titanate esters, isopropyl Dimethylacryloyl isostearoyl base titanate esters, isopropyl three (dioctyl phosphate ester) titanate esters, isopropyl three (dodecyl) benzenesulfonyl titanate esters, isopropyl three (dioctylphyrophosphoric acid ester) titanate esters, the titanate esters system coupling agents etc. such as isopropyl three (N-amide ethylaminoethyl) titanate esters. they can use one or combination to use two or more.
The mean diameter of inorganic filling material is not particularly limited, and never makes the viewpoint that organic EL element is damaged set out, it is preferred to less than 10 ��m, be more preferably less than 5 ��m. On the other hand, from the view point of show resistance to poisture-penetrability, it is preferred to more than 0.05 ��m, be more preferably more than 0.1 ��m.
The mean diameter of above-mentioned inorganic filling material can by being measured based on the laser diffraction/scattering method of Michaelis (Mie) scattering theory. Specifically, it is possible to use laser diffraction formula particle size distribution device, produce the particle size distribution of inorganic filling material with volume reference, using its intermediate value footpath as mean diameter, be thus measured. As measuring sample, it may be preferred to use the sample utilizing ultrasound wave to make inorganic filling material be dispersed in water. As laser diffraction formula particle size distribution device, it is possible to use the LA-500 etc. that Horiba Ltd manufactures.
The content of inorganic filling material is not particularly limited, from the view point of prevent the intensity that the viscosity of resin combination raised, prevented solidfied material from reducing and becoming fragile, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 50 mass %, be more preferably below 40 mass %, more preferably below 30 mass %. On the other hand, from the view point of fully obtain coordinating the effect of inorganic filling material, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 1 mass %, be more preferably more than 5 mass %, more preferably more than 10 mass %.
In order to improve the resistance to poisture-penetrability of solidfied material further, the resin combination of the present invention can contain hygroscopicity metal-oxide (G) further. at this, " hygroscopicity metal-oxide " refer to have the ability absorbing moisture and with the moisture generation chemical reaction absorbed and the metal-oxide that forms hydroxide. specifically, for one or more the mixture in calcium oxide, magnesium oxide, strontium oxide, aluminium oxide, Barium monoxide etc. or soluble solids. wherein, from the view point of the stability of bibulous viewpoint and cost, raw material, it is preferable that calcium oxide, magnesium oxide. as the example of two or more mixture or soluble solids, specifically, it is possible to enumerate and fire dolomite (comprising calcium oxide and magnesian mixture), fire brucite (soluble solids of calcium oxide and aluminium oxide) etc. such hygroscopicity metal-oxide is known as hygroscopic material in various technical fields, it is possible to use commercially available product. specifically, calcium oxide (three " the �� �� �� �� �� �� #10 " that powder process company manufactures altogether etc.) can be enumerated, magnesium oxide (" KYOWAMAGMF-150 " that consonance chemical industrial company manufactures, " KYOWAMAGMF-30 ", " PUREMAGFNMG " that Tateho chemical industrial company manufactures etc.), light calcined magnesia (" #500 " that Tateho chemical industrial company manufactures, " #1000 ", " #5000 " etc.), fire dolomite (" KT " that Ji Ze Calx company manufactures etc.), fire brucite (" Hydrotalcite " that Hu Tian industrial group manufactures etc.) etc. can use in them one or more.
The mean diameter of hygroscopicity metal-oxide is not particularly limited, from the view point of prevent in sealing process coarse granule damage organic EL element, improve and the interface binding power of resinous principle, it is preferred to less than 10 ��m, be more preferably less than 5 ��m, more preferably less than 1 ��m. On the other hand, from the view point of prevent granule to be susceptible to cohesion each other, be difficult to solidfied material is given fully high resistance to poisture-penetrability because dispersion in the composition is bad, it is preferred to more than 0.001 ��m, be more preferably more than 0.01 ��m, more preferably more than 0.1 ��m.
When the mean diameter of the commercially available product of hygroscopicity metal-oxide is below 10 ��m, can directly use this commercially available product, but when the mean diameter of commercially available product is more than 10 ��m, it is preferable that carry out pulverizing, classification etc. and use after preparing into the shot-like particle that mean diameter is less than 10 ��m.
It addition, as hygroscopicity metal-oxide, it is preferable that mean diameter is in above-mentioned proper range and does not contain the hygroscopicity metal-oxide of the big particle that particle diameter is more than 20 ��m. More preferably the big particle of more than 5 ��m is not contained. By not containing such big particle, not easily EL element is caused in sealing process damage in advantageously play a role.
The mean diameter of hygroscopicity metal-oxide can by being measured based on the laser diffraction/scattering method of Michaelis (Mie) scattering theory. Specifically, it is possible to use laser diffraction formula particle size distribution device, produce the particle size distribution of hygroscopicity metal-oxide with volume reference, using its intermediate value footpath as mean diameter, be thus measured. As measuring sample, it may be preferred to use and utilize ultrasound wave to make hygroscopicity metal oxide dispersion sample in water. It addition, as laser diffraction formula particle size distribution device, it is possible to use the LA-500 that Horiba Ltd manufactures.
As hygroscopicity metal-oxide, it is possible to use utilize surface conditioning agent to carry out the hygroscopicity metal-oxide of surface treatment. By using such hygroscopicity metal-oxide having carried out surface treatment, it is possible to improve the bonding stability of solidfied material further, it is possible to prevent the moisture in stage resin before curing from reacting with hygroscopicity metal-oxide.
As the surface conditioning agent for surface treatment, for instance higher fatty acids, alkyl silicon alkanes, silane coupler etc. can be used, wherein, it is preferable that higher fatty acids or alkyl silicon alkanes. They can use one or combination to use two or more.
As higher fatty acids, for instance the carbon numbers such as preferred stearic acid, montanic acid, myristic acid, Palmic acid are the higher fatty acids of more than 18. Wherein, it is preferable that stearic acid. The one in them or combination can be used to use two or more.
As alkyl silicon alkanes, it is possible to enumerate MTMS, ethyl trimethoxy silane, hexyl trimethoxy silane, octyl group trimethoxy silane, decyl trimethoxy silane, octadecyl trimethoxysilane, dimethyldimethoxysil,ne, octyltri-ethoxysilane, n-octadecane base dimethyl (3-(trimethoxysilyl) propyl group) ammonium chloride etc. They can use one or combination to use two or more.
As silane coupler, can enumerate such as: the epoxy silane couplers such as 3-glycidyloxypropyl trimethoxy silane, 3-glycidyloxypropyl triethoxysilane, 3-glycidyloxypropyl (dimethoxy) methyl-monosilane and 2-(3,4-epoxycyclohexyl) ethyl trimethoxy silane; The sulfydryl system silane couplers such as 3-mercaptopropyi trimethoxy silane, 3-Mercaptopropyltriethoxysilane, 3-mercaptopropyi methyl dimethoxysilane and 11-mercapto-undecanoic base trimethoxy silane; The amino system silane couplers such as 3-TSL 8330, APTES, 3-aminopropyldimethoxy methyl-monosilane, N-phenyl-3-TSL 8330, N-dimethylaminopropyl trimethoxy silane, N-(2-amino-ethyl)-3-TSL 8330 and N-(2-amino-ethyl)-3-aminopropyldimethoxy methyl-monosilane; The ethylene base system silane couplers such as uride system silane coupler, vinyltrimethoxy silane, VTES and vinyl methyl diethoxy silane such as 3-ureidopropyltriethoxysilane; To styrene base system silane couplers such as styryl trimethoxy silanes; The acrylic ester silane couplers such as 3-acryloxypropyl trimethoxy silane and 3-methacryloxypropyl trimethoxy silane; The isocyanate-based silane couplers such as 3-isocyanates propyl trimethoxy silicane, double; two (triethoxysilylpropyltetrasulfide) disulphide, double; two (triethoxysilylpropyltetrasulfide) tetrasulfide sulfides system silane coupler; Phenyltrimethoxysila,e, methacryloxypropyl trimethoxy silane, imidizole silane, triazine silane etc. They can use one or combination to use two or more.
Surface treatment such as can by adding surface conditioning agent stirring 5��60 minutes and carry out utilizing mixer that untreated hygroscopicity metal-oxide is stirred scattered spraying simultaneously at normal temperatures. As mixer, it is possible to use known mixer, it is possible to enumerate such as: blender, ball mill, cutting mills etc. such as the mixers such as V-Mixer, spiral ribbon mixer, double-cone mixer, Henschel blender and concrete mixers. It should be noted that can also be utilizing ball mill etc. will to mix above-mentioned higher fatty acids, alkyl silicon alkanes or the silane coupler method to carry out surface treatment when pulverizing as the hygroscopicity metal-oxide of hygroscopic material. The treating capacity of surface conditioning agent is different because of kind of the kind of hygroscopicity metal-oxide or surface conditioning agent etc., is preferably 1��10 weight % relative to hygroscopicity metal-oxide.
The content of hygroscopicity metal-oxide is not particularly limited, from the view point of prevent the viscosity of resin combination from raising, the intensity of solidfied material reduces and becomes fragile, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to below 50 mass %, be more preferably below 40 mass %, more preferably below 30 mass %. On the other hand, from the view point of fully obtain from the effect brought of inorganic filling material, relative to the nonvolatile component 100 mass % in resin combination, it is preferred to more than 1 mass %, be more preferably more than 5 mass %, more preferably more than 10 mass %.
In the resin combination of the present invention, it is possible to the degree not interfere with effect of the present invention at random contains the various resin additives beyond mentioned component. As such resin additive, it is possible to enumerate such as: the thickening agents such as the organic fillers such as rubber grain, Si powder, nylon powder, fluorine powder, ORBEN (bentonite), bentonite, silicon-type, fluorine system, macromolecular the adaptation imparting agent etc. such as defoamer or levelling agent, triazole compounds, thiazolium compounds, triaizine compounds, porphyrin compound.
The preparation method of the resin combination of the present invention is not particularly limited, it is possible to enumerates and is added as needed on solvent etc. and uses impeller etc. that gradation composition carries out the method etc. mixed.
The transparency of the solidfied material of the resin combination of the present invention can utilize spectrophotometer to be measured. From the view point of improve the luminous efficiency of EL element, the transparency is more high more good. Specifically, the absorbance under the 380��780nm calculated according to JISZ8722 is preferably more than 80%, is more preferably more than 82%, more preferably more than 84%, be further preferably more than 86%, be especially more preferably more than 88%, be particularly preferably more than 90%.
The resistance to poisture-penetrability of the solidfied material of the resin combination of the present invention can be measured (condition determination: temperature 40 DEG C, relative humidity 90%) by the differential pressure method of JISK-7129A. From the viewpoint of moisture permeability is more low more can postpone moisture and penetrates into from the external world to EL element, 40 DEG C, 90%RH when the resin composition layer of thickness 50 ��m is measured time value be preferably 40g/m2Below it, it is more preferably 20g/m2It is following, more preferably 10/m2Below it. On the other hand, although moisture permeability is more low more good, but practical upper preferably 0.1g/m2More than it.
The purposes of the resin combination of the present invention is not particularly limited, it is possible to for the encapsulant of the various devices such as quasiconductor, solaode, high-brightness LED, LCD, organic EL, particularly can be suitable for organic EL device.
Both sheets of the layer of sheet that the resin composition sheet of the present invention includes the resin combination of the present invention itself is made sheet and the resin combination that forms the present invention on supporter. When being applied to various device, it is possible to be carried out as follows: form the layer of the resin combination of the present invention on supporter, obtained resin composition sheet is laminated to the necessary position of application thing, thus being transferred on application thing by this resin composition layer.
The resin composition sheet that will form the layer of the resin combination of the present invention on supporter and obtain is applied to organic EL device, by making it solidify before the sealing process of organic EL element in advance, without being heating and curing after the sealing process of organic EL element, it is possible to the heat deterioration of organic EL element is greatly reduced. The industrial method that this resin composition sheet is preferably used.
The resin composition sheet with supporter can use the method for well known to a person skilled in the art, die coating, spin coating, scraper for coating, rolling process, extrusion molding etc. to implement. For example, it is possible to prepare, resin combination is dissolved varnish in organic solvent, supporter is coated with varnish, and then makes organic solvent dry by heat or hot blast winding-up etc. and manufacture.
As organic solvent, it is possible to enumerate such as: ester ring type hydro carbons, toluene, the dimethylbenzene etc. such as the aliphatic hydrocarbons such as hexane, heptane, octane, hexamethylene, hexahydrotoluene are aromatic hydrocarbon based. From the view point of the shelf life of resin composition sheet (up time), it is preferable that lower boiling organic solvent, it is possible to use a kind of or combination uses two or more.
The drying condition of the resin composition sheet of the present invention is not particularly limited, it is preferable that dry 3��20 minutes at 50��140 DEG C. When lower than 50 DEG C, there is the tendency that in resin composition layer, the quantity of solvent of residual increases. When higher than 140 DEG C, when supporter is formed the layer of resin combination of the present invention, there is the tendency that supporter deforms because of heat.
The resin composition sheet of the present invention can carry out in advance for making the heating of (B) composition, (D) composition and the reaction of (E) composition make it solidify in advance before sealing process. By this solidification, it is possible to the resin composition sheet better as cohesiveness, cementability and operability uses. Condition of cure is not particularly limited, and solidification temperature is preferably 20��50 DEG C, is more preferably 30��40 DEG C. It addition, be preferably 1��10 day hardening time, be more preferably 3��7 days.
The thickness of the resin composition sheet after this solidification is preferably 3 ��m��200 ��m, is more preferably 10 ��m��and 100 ��m, more preferably 20 ��m��80 ��m.
Resin composition sheet after this solidification is preferably in being less than 0.1% by this sheet resin composition weight minimizing amount (residual solvent amount) in 130 DEG C dry 15 minutes time. By for less than 0.1%, the reducing effect of element infringement being improved after organic EL device is carried out sealing process.
As the supporter used in resin composition sheet, it is preferred to use have the supporter of moisture resistance, i.e. sealing substrate. As sealing substrate, it is possible to enumerate the plastic foil with moisture resistance or the metal forming such as Copper Foil, aluminium foil etc. As the plastic foil with moisture resistance, it is possible to enumerate the plastic foil etc. being deposited with the inorganic matters such as silica (silicon dioxide), silicon nitride, SiON, SiCN, non-crystalline silicon on surface. As plastic foil, it is possible to use the such as plastic foil of the polyester such as the polyolefin such as polyethylene, polypropylene, polrvinyl chloride, polyethylene terephthalate (being hereinafter, sometimes referred to simply as " PET "), PEN, Merlon, polyimides, cyclic olefin polymer (being hereinafter, sometimes referred to simply as " COP ") etc. As plastic foil, it is particularly preferred to COP. Example as the commercially available plastic foil with moisture resistance, it is possible to enumerate TechbarrierHX, AX, LX, L series (Rhizoma Sparganii Resins Corporation system), further increase the X-BARRIER (Rhizoma Sparganii Resins Corporation system) etc. of damp proof effect. As sealing substrate, it is possible to use have the material of the multiple structure of more than 2 layers. It addition, by bonding agent in order to improve operability the supporter of above-mentioned plastic foil with the type of above-mentioned metal forming laminating is also cheap and is industrially suitable for. It should be noted that plastic foil without moisture resistance etc. can also be used as supporter, it is possible to use resin combination surface is protected by the means such as release liner. In this case, it is preferable that after forming resin composition sheet on the substrate define organic EL element, supporter is peeled off, then, other stacking sealing substrate in resin composition sheet.
The resin combination of the present invention can with variously-shaped offer. Such as, when the resin composition for encapsulating of the present invention uses as the sealant of electronic equipment, the resin combination of the present invention sheet formed can combine use with the element of electronic equipment.
Such as, above-mentioned resin combination the sheet formed can also by using with colored filter or the combination of optical films such as polaroid, phase difference film.
Embodiment
Hereinafter, by embodiment, more specifically the present invention will be described, but the present invention is not limited to these embodiments. It should be noted that in following record, as long as no special declaration, " part " refers to " mass parts ", and " % " refers to " quality % ".
[use material]
The material used in experiment is as described below.
Polyisobutylene resin (A)
Polyisobutylene (isobutene. system weighing body) (OPPANOLB80, viscosity-average molecular weight 800000, BASF AG's system)
Polyisobutylene (isobutene. system weighing body) (B50SF, viscosity-average molecular weight 400000, BASF AG's system)
Modified polyolefin resin (B)
SafurenP-1000 (20% solution of special polyolefin-based resins acid modifier (number-average molecular weight 70000), acid number 13��16mgKOH/g, Mitsubishi Chemical Ind's system)
Tackifying resin (C)
Aromatic modified terpene resin (YSResinTO125, softening point 125 DEG C, YasuharaChemical company system)
There is the functional group that can react with NCO, liquid polybutadiene and/or liquid polyisoprene (D)
Liquid polybutadiene (NIISO-PBG series, GI Cao Da company serial, Japanese system)
Liquid polyisoprene (Epol, Chu Guangxingchan company system)
Firming agent (E)
Having can with the isocyanates based compound of liquid polyisobutylene and/or the functional group of the functional group reactions of liquid polyisoprene butylene.
Isocyanates based compound (DURANATETPA-100, chemical company of Asahi Chemical Industry system)
Other
Isocyanate reaction catalyst: dibutyl tin laurate
Solvent: toluene
[assay method, evaluation methodology]
Various assay methods, evaluation methodology are illustrated.
<mensuration of the transparency and evaluation>
Use the resin composition sheet of thickness 50 ��m, utilize the spectrophotometric UV-3600 that Shimadzu Corporation manufactures to measure the spectrophotometric spectra from 380nm to 780nm, calculate transmission of visible light according to JISZ8722.
<evaluation of mist degree>
Use haze meter (TC-HIIIDPK that Tokyo electricity Se company manufactures), measure the haze value of obtained bonding sheet according to JISK6714.
<evaluation to glass retentivity>
As on the glass plate of adherend with each bonding sheet of bond area lamination of 25mm �� 25mm, 50 DEG C, crimping 30 minutes under 0.5Pa, then glass plate is hung down, in the uniform load of the free terminal load 1000g of adhesive tape, measure at 80 DEG C the length of the adhesive tape skew after 1 hour.
<to glass peeling adhesion force>
At each adhesive tape as the size cutting into 25mm �� 200mm on the glass plate of adherend with the bond area lamination of 25 �� 80mm, 50 DEG C, crimping 30 minutes under 0.5Pa, at 23 DEG C after 20 minutes, measure it and peel off required power (under 180 degree of strippings, draw speed 300mm/ minute, 23 DEG C, 65%RH atmosphere).
<evaluation of resistance to poisture-penetrability>
For the resin composition sheet of thickness 50 ��m, the water vapo(u)r transmission evaluating apparatus DELTAPARMDP-ST of Technolox company is used to be measured (according to JISK-7129A, condition determination: temperature 40 DEG C, relative humidity 90%) by differential pressure method.
<evaluation of thermostability>
Binding agent is coated on stripping film in the mode that dried thickness is 50 ��m and dried, fits with the anti-wet process layer side of the COP with moisture resistance, produce the lamination sheets possessing moistureproof film and binding agent. The stripping film of this lamination sheets is peeled off; laminating is on a glass; utilizing roller to be combined on the moisture resistance face of the lamination sheets possessing moistureproof film and binding agent by polaroid pressing paster, this polaroid is the polaroid in the tri cellulose acetate membrane side of the polyethenol series polaroid (average degree of polymerization 1700 of polyethenol series polarity film, 99.5 moles of % of mean saponification degree, 5 times of stretchings) using tri cellulose acetate membrane as protective layer with adhesive layer. These laminating product are carried out endurancing (placing 500 hours for 80 DEG C), observes foamed state, peel off state, deterioration state. Show the result in table 1.
(embodiment 1)
Mixed and modified vistanex (SafurenP-1000: 20% solution of special polyolefin-based resins acid modifier) 5 parts, aromatic modified terpene resin solution (50% toluene solution of YSResinTO-125) 2 parts in polyisobutylene (12.5% toluene solution of OppanolB80) 40 parts and polyisobutylene (12.5% toluene solution of B50SF) 40 parts, utilize mixer disperses uniform, obtain varnish.
On the release treatment face of the PET film (thickness 38 ��m) after utilizing alkyd system antitack agent to process, comma coater is utilized to be coated with obtained varnish equably, the thickness making dried resin composition layer is 50 ��m, dry 10 minutes at 110 DEG C, resulting in resin composition sheet.
(embodiment 2)
Except further mixes liquid polyisoprene (50% toluene solution of EPOL) 1 part, isocyanates based compound (50% toluene solution of DURANATETPA-100) 0.3 part and tin catalyst (0.1% toluene solution of dibutyl tin laurate) 0.67 part, carry out similarly to Example 1, obtain varnish according to the cooperation table of table 1 below. Use obtained varnish, with embodiment 1 completely in the same manner as obtain resin composition sheet. Obtained resin composition sheet is aging 3 days at 35 DEG C.
(embodiment 3)
Replace beyond liquid polyisoprene (50% toluene solution of EPOL) except with liquid polybutadiene (50% toluene solution of NIISO-PBGI3000), carry out similarly to Example 2, obtain varnish according to the cooperation table of table 1 below. Use obtained varnish, with embodiment 2 completely in the same manner as obtain resin composition sheet. Obtained resin composition sheet is aging 3 days at 35 DEG C.
(comparative example 1)
Except not using modified polyolefin resin (SafurenP-1000), carry out similarly to Example 1, obtain varnish according to the cooperation table of table 1 below. Use obtained varnish, with embodiment 1 completely in the same manner as obtain resin composition sheet.
(comparative example 2)
Except not using modified polyolefin resin (SafurenP-1000), carry out similarly to Example 2, obtain varnish according to the cooperation table of table 1 below. Use obtained varnish, with embodiment 1 completely in the same manner as obtain resin composition sheet. Obtained resin composition sheet is aging 3 days at 35 DEG C.
(comparative example 3)
Except not using modified polyolefin resin (SafurenP-1000), carry out similarly to Example 3, obtain varnish according to the cooperation table of table 1 below. Use obtained varnish, with embodiment 1 completely in the same manner as obtain resin composition sheet. Obtained resin composition sheet is aging 3 days at 35 DEG C.
Show the result in table 1.
[table 1]
From embodiment 1��3, the resin composition sheet obtained by the resin combination of the present invention without carrying out 80 DEG C of such high-temperature heatings in order to solidify, and when lamination without being heated solidifying, just can be bonding with sufficiently high bonding force by 50 DEG C of such low-temperature heats, place the outward appearance also being able to maintain good in high temperature environments afterwards after being laminated to polaroid, and there is the good transparency, good resistance to poisture-penetrability. Therefore, according to the present invention, for easily because the organic EL element of deterioration occurs for moisture or heat, the deterioration of organic EL element will not be produced, can obtain becoming resin combination and the resin composition sheet of the encapsulant of the sealing structure that can form high reliability, it is possible to the organic EL device providing reliability high.
On the other hand, in comparative example 1,2 and 3, it does not have use (B) modified polyolefin resin (SafurenP-1000), it does not have play effect of the present invention. Namely it can be seen that mixing (B) composition is critically important.
Industrial applicibility
The present invention can provide a kind of resin combination and the resin composition sheet thus obtained, the resin combination of the present invention is by containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C), varnish coating can be carried out, sheet can be made easily, without the operation that is heating and curing, the heat deterioration of organic EL element can be greatly reduced, productivity ratio moreover can also be greatly improved, it is possible to realize having concurrently the sheet of good resistance to poisture-penetrability, adhesive strength, the transparency, thermostability.
Claims (17)
1. a resin composition for encapsulating, it is characterised in that containing polyisobutylene resin (A), modified polyolefin resin (B) and tackifying resin (C).
2. resin composition for encapsulating as claimed in claim 1, it is characterised in that relative to the nonvolatile component 100 mass % in described resin combination, the described polyisobutylene resin (A) containing 35 mass %��95 mass %.
3. resin composition for encapsulating as claimed in claim 1 or 2, it is characterised in that described modified polyolefin resin (B) is containing copolymer as monomer component of alkene and styrene.
4. resin composition for encapsulating as claimed in claim 3, it is characterised in that described alkene is ethylene and/or 1-butylene, and described copolymer is the copolymer with functional group.
5. the resin composition for encapsulating as according to any one of Claims 1 to 4, it is characterised in that described modified polyolefin resin (B) has anhydride group as functional group.
6. the resin composition for encapsulating as according to any one of Claims 1 to 5, it is characterised in that relative to the nonvolatile component 100 mass % in described resin combination, the described modified polyolefin resin (B) containing 1 mass %��40 mass %.
7. the resin composition for encapsulating as according to any one of claim 1��6, it is characterised in that described tackifying resin (C) is terpene resin.
8. the resin composition for encapsulating as according to any one of claim 1��7, it is characterised in that described tackifying resin (C) is aromatic modified terpene resin.
9. the resin composition for encapsulating as according to any one of claim 1��8, it is characterised in that relative to the nonvolatile component 100 mass % in described resin combination, the described tackifying resin (C) containing 1 mass %��40 mass %.
10. a solidfied material, the solidfied material of its resin composition for encapsulating according to any one of claim 1��9.
11. solidfied material as claimed in claim 10, it is characterised in that the transmission of visible light from 380nm to 780nm is 80%��100%.
12. the solidfied material as described in claim 10 or 11, it is characterised in that moisture permeability is 0.1g/m2My god��40g/m2My god.
13. a resin composition for encapsulating sheet, it is characterised in that comprise the resin composition for encapsulating according to any one of claim 1��9.
14. resin composition for encapsulating sheet as claimed in claim 13, it is for the sealing of organic EL element.
15. an organic EL device, it is characterised in that comprise the resin composition for encapsulating according to any one of claim 1��9.
16. the resin composition for encapsulating as according to any one of claim 1��9, it is characterised in that contain inorganic filling material (F) further.
17. the resin composition for encapsulating as according to any one of claim 1��9, it is characterised in that contain hygroscopicity metal-oxide (G) further.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013231756 | 2013-11-08 | ||
| JP2013-231756 | 2013-11-08 | ||
| PCT/JP2014/079588 WO2015068805A1 (en) | 2013-11-08 | 2014-11-07 | Sealing resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105637029A true CN105637029A (en) | 2016-06-01 |
Family
ID=53041580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480056892.5A Pending CN105637029A (en) | 2013-11-08 | 2014-11-07 | Sealing resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2015068805A1 (en) |
| KR (1) | KR20160086317A (en) |
| CN (1) | CN105637029A (en) |
| TW (1) | TW201522592A (en) |
| WO (1) | WO2015068805A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111373012A (en) * | 2017-10-27 | 2020-07-03 | 株式会社Moresco | Sealing material for flexible organic devices and use thereof |
| CN111727231A (en) * | 2018-02-16 | 2020-09-29 | 三井化学株式会社 | Image display device sealing material and image display device sealing sheet |
| CN111757910A (en) * | 2018-02-27 | 2020-10-09 | 味之素株式会社 | Sealing resin composition |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6725373B2 (en) * | 2015-09-16 | 2020-07-15 | 日東電工株式会社 | Adhesive composition, adhesive layer, optical film with adhesive layer, optical member, and image display device |
| JP6852967B2 (en) * | 2015-09-16 | 2021-03-31 | 日東電工株式会社 | Polarizing film with adhesive layer, optical members, and image display device |
| WO2017218500A1 (en) * | 2016-06-16 | 2017-12-21 | 3M Innovative Properties Company | Nanoparticle filled barrier adhesive compositions |
| WO2018092800A1 (en) * | 2016-11-18 | 2018-05-24 | リンテック株式会社 | Adhesive composition, sealing sheet and sealed body |
| JP6294522B1 (en) * | 2017-02-14 | 2018-03-14 | 積水化学工業株式会社 | Sealant for organic EL display element and organic EL display element |
| TWI794234B (en) * | 2017-05-31 | 2023-03-01 | 日商琳得科股份有限公司 | Adhesive composition, adhesive sheet and sealing body |
| JP7318462B2 (en) * | 2019-09-30 | 2023-08-01 | 味の素株式会社 | Sealing resin composition |
| KR20220022876A (en) * | 2020-08-19 | 2022-02-28 | 주식회사 엘지화학 | Thermosettimg resin composition, and encapsulation film using the same |
| KR20240128122A (en) * | 2022-03-30 | 2024-08-23 | 미쓰이 가가쿠 가부시키가이샤 | Epoxy resin composition, encapsulant and image display device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4456460B2 (en) * | 2004-10-20 | 2010-04-28 | 電気化学工業株式会社 | Sealing material using polyisobutylene |
| JP2007197517A (en) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | Adhesive sealing composition, sealing film and organic el element |
| JP2008248055A (en) | 2007-03-30 | 2008-10-16 | Kaneka Corp | Composition for sealing material, and sealing material |
| WO2011062167A1 (en) | 2009-11-18 | 2011-05-26 | 味の素株式会社 | Resin composition |
| JP5719647B2 (en) * | 2010-04-09 | 2015-05-20 | 日東電工株式会社 | Sealing composition, double glazing and solar cell panel |
| WO2013108731A1 (en) | 2012-01-16 | 2013-07-25 | 味の素株式会社 | Resin composition for sealing |
-
2014
- 2014-11-07 KR KR1020167002194A patent/KR20160086317A/en not_active Application Discontinuation
- 2014-11-07 CN CN201480056892.5A patent/CN105637029A/en active Pending
- 2014-11-07 TW TW103138825A patent/TW201522592A/en unknown
- 2014-11-07 WO PCT/JP2014/079588 patent/WO2015068805A1/en active Application Filing
- 2014-11-07 JP JP2015546698A patent/JPWO2015068805A1/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111373012A (en) * | 2017-10-27 | 2020-07-03 | 株式会社Moresco | Sealing material for flexible organic devices and use thereof |
| CN111373012B (en) * | 2017-10-27 | 2023-04-04 | 株式会社Moresco | Sealing material for flexible organic devices and use thereof |
| CN111727231A (en) * | 2018-02-16 | 2020-09-29 | 三井化学株式会社 | Image display device sealing material and image display device sealing sheet |
| CN111727231B (en) * | 2018-02-16 | 2023-07-04 | 三井化学株式会社 | Sealing material for image display device and sealing sheet for image display device |
| CN111757910A (en) * | 2018-02-27 | 2020-10-09 | 味之素株式会社 | Sealing resin composition |
| CN111757910B (en) * | 2018-02-27 | 2022-06-24 | 味之素株式会社 | Sealing resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015068805A1 (en) | 2015-05-14 |
| JPWO2015068805A1 (en) | 2017-03-09 |
| TW201522592A (en) | 2015-06-16 |
| KR20160086317A (en) | 2016-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105637029A (en) | Sealing resin composition | |
| JP5768718B2 (en) | Resin composition | |
| KR102612145B1 (en) | Resin composition for sealing | |
| JP6680295B2 (en) | Sealing resin composition | |
| CN101677072B (en) | Method for encapsulation of an electronic assembly | |
| CN101752276B (en) | Method for encapsulating electronic device | |
| CN103347970B (en) | Adhesive compound and method for encapsulating electronic assembly | |
| CN102576822B (en) | The method of encapsulating electronic device | |
| JP2018199821A (en) | Adhesive tape for encapsulating organic electronic arrangement | |
| CN109312206A (en) | The method for making silicone based material adhere to substrate | |
| CN104737623B (en) | Sealant composition and sealing sheet obtained from said composition | |
| KR20130077869A (en) | Base material for solar cell module and method for producing same | |
| WO2015098852A1 (en) | Electronic component device production method and electronic component sealing sheet | |
| WO2015178474A1 (en) | Resin composition | |
| WO2015033867A1 (en) | Method for manufacturing semiconductor device | |
| JP2017122136A (en) | Resin composition | |
| TWI794234B (en) | Adhesive composition, adhesive sheet and sealing body | |
| JP7248572B2 (en) | Adhesive composition, adhesive sheet, and sealing body | |
| JPWO2018020939A1 (en) | Pressure sensitive adhesive | |
| JP7099441B2 (en) | Sealing sheet | |
| JP2017122135A (en) | Resin composition for sealing | |
| KR102108557B1 (en) | Dispersion solution | |
| TWI757498B (en) | Adhesive sheets and seals | |
| WO2015053081A1 (en) | Method for manufacturing semiconductor device | |
| CN108610842A (en) | Colorable priming paint |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |