CN105636400B - Display module radiator structure and its electronic device - Google Patents
Display module radiator structure and its electronic device Download PDFInfo
- Publication number
- CN105636400B CN105636400B CN201410582466.7A CN201410582466A CN105636400B CN 105636400 B CN105636400 B CN 105636400B CN 201410582466 A CN201410582466 A CN 201410582466A CN 105636400 B CN105636400 B CN 105636400B
- Authority
- CN
- China
- Prior art keywords
- backboard
- back side
- embedded
- touch
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of display module radiator structure is arranged in an electronic device comprising a touch-control display panel has the backboard that a touch-control shows side and an opposite touch-control display side.There is the backboard the opposite touch-control of a thermal transmission element and a back side to show side.The thermal transmission element is to be sticked or partly or entirely be embedded in the back side of the backboard, and level trims the back side when the thermal transmission element is embedded into overleaf, and the heat source in electronic device radiates to the position far from heat source by the thermal transmission element.
Description
Technical field
The present invention relates to a kind of display module more particularly to a kind of display modules and its electronic device of tool radiator structure.
Background technology
Existing hand-held device (such as tablet computer, smart mobile phone) with constantly being promoted in function and rate, due to
Hand-held device is towards light and short and functional promotion trend development so that section is disconnected increases for the heat generation density of hand-held device, also makes
Heat dissipation problem is obtained to be taken seriously.Other than heat dissipation problem, due to hand-held device using when need skin-proximal, human body is caused not
It is suitable, therefore the heat dissipation design of hand-held device has become important challenge.
Explained with smart mobile phone, the smart mobile phone of the prior art include a display module, a circuit board, a battery part and
One framework, the display module are sequentially installed in circuit board and battery part in the framework, and the circuit board is equipped with multiple electronics
Element (such as central processing unit (CPU), graphics processor (GPU), memory and other IC chips), and the display module is by one
Touch control display module and a backboard are constituted, and it is only the function being installed in the touch control display module that this backboard is all simple,
Have no other purposes.
So working as described electronic component (such as CPU, GPU；Or display module) generate heat source when, make electronic component (or display
Module) heat source that generates can not uniformly spread out in real time, and cause the electronic component to generate heat source and can continue to build up and (or store up
Product) at electronic component itself and its periphery, be easy to causeing the electronic component inside hand-held device can not also prolong outside normal operation
Another problem is stretched out, is exactly that user holds hand-held device progress in use, the hand skin of user can paste and contact the frame
External side, at this time because heat source can continue to build up (or hoarding) localized positions can not (i.e. at electronic component itself and its periphery)
Quick uniform is spread, and usually be easy to cause user using above there is the problem of discomfort.
Therefore, above-mentioned commonly using and missing, the as inventor of this case and the phase for being engaged in the industry how to be solved the problems, such as
Shutout quotient wants where the direction that research improves.
Invention content
Therefore, a kind of offer one kind that in order to effectively solve the above problems, the main object of the present invention is to provide will will be hot
The heat that source generates is conducted to the position far from heat source and is radiated, and reduces the display module radiator structure that heat is concentrated.
Another object of the present invention is dissipated in a kind of will conduct the heat that heat source generates to the position far from heat source of offer
Heat reduces the electronic device that heat is concentrated.
In order to achieve the above object, the present invention provides a kind of display module radiator structure, including：One touch-control display panel, has
One touch-control shows side and the opposite touch-control shows that the backboard of side, the backboard have the opposite touch-control of a thermal transmission element and a back side
Show side.
The thermal transmission element system is sticked on the back side.
There is thermal transmission element side to correspond to the backboard, and be sticked at the back side of the backboard, and the thermal transmission element has one
There is a first surface, the second part to have for the second part of first part and a connection first part, the first part
The back side of the opposite backboard of one second surface, the first surface and the second surface.
The thermal transmission element is embedded on the backboard.
The backboard has one to be embedded into position, which has the second of a first part and the connection first part
There is a first surface, the second part to have a second surface, the wherein first part and second for part, the first part
Point being embedded in this is embedded into position, and the first surface and the second surface level trim the back side.
The thermal transmission element system is locally embedded on the backboard, and part is sticked on the back side.
The backboard has one to be embedded into position, which has the second of a first part and the connection first part
There is a first surface, the second part there is a second surface, the wherein first part to be embedded in this for part, the first part
It is embedded into position, which trims the back side.
The second part of the thermal transmission element is sticked at the back side of the backboard, and the back side of the opposite backboard of the second surface.
There is a sloping portion, the back of the body of the sloping portion from the backboard between the first part and second part of thermal transmission element
What face was tilted into the backboard is embedded into position.
There is the sloping portion of the thermal transmission element one first bending side to be connected to the first part and one second bending side connection
The second part, the first bending side are located at this and are embedded into position, which, which is located at the back side of the backboard and tilts, prolongs
Extend to the first bending side.
A high low head has been defined between the first part and second part of the thermal transmission element.
It is a through-hole to be embedded into position.
Thermal transmission element, which is a thin type heat pipe, has a chamber, and a capillary structure and a working fluid are equipped in the chamber.
The touch-control shows the light transmission plate body that is sticked on side.
The present invention additionally provides a kind of electronic devices, including：One display module includes：One touch-control display panel has one
Touch-control shows side and the opposite touch-control shows that the backboard of side, the backboard have the opposite touch-control of a thermal transmission element and a back side aobvious
Show side；One electronic component group, the back side of the backboard of the corresponding touch-control display panel, and it corresponds to the side-line contact at the back side and is somebody's turn to do
Thermal transmission element；And a shell, there is an accommodating sky to ask to be installed with the display module and electronic component group.
The thermal transmission element is sticked on the back side.
There is the thermal transmission element side to correspond to the backboard, and be sticked at the back side of the backboard, and the thermal transmission element has
The second part of one first part and a connection first part, the first part have a first surface, second part tool
There is a second surface, the back side of the first surface and the opposite backboard of the second surface.
The thermal transmission element is embedded on the backboard.
The backboard has one to be embedded into position, which has the second of a first part and a connection first part
There is a first surface, the second part to have a second surface, the wherein first part and second for part, the first part
Point being embedded in this is embedded into position, and the first surface and the second surface level trim the back side.
The thermal transmission element is locally embedded on the backboard, and part is sticked on the back side, the non-bulging back side in part.
The backboard has one to be embedded into position, which has the second of a first part and a connection first part
There is a first surface, the second part there is a second surface, wherein system of the first part to be embedded in for part, the first part
This is embedded into position, which trims the back side.
The second part system of the thermal transmission element is sticked at the back side of the backboard, and the back of the body of the opposite backboard of the second surface
Face.
There is a sloping portion, the sloping portion is from the backboard between the first part and second part of the thermal transmission element
What the back side was tilted into the backboard is embedded into position.
There is the sloping portion of the thermal transmission element one first bending side to be connected to the first part and one second bending side connection
The second part, the first bending side are located at this and are embedded into position, which is located at the back side of the backboard and inclination is prolonged
Extend to the first bending side.
A high low head has been defined between the first part and second part of the thermal transmission element.
It is a through-hole that this, which is embedded into position,.
The thermal transmission element, which is a thin type heat pipe, has a chamber, and a capillary structure and a workflow are equipped in the chamber
Body.
The touch-control shows the light transmission plate body that is sticked on side.
Implement the thermal transmission element one to be sticked on the back side.
Implement the thermal transmission element one to be embedded on the backboard.
It is embedded into position with one in the implementation backboard, which there is a first part and a second part to be connected to
The first part, the first part have a first surface, the second part have a second surface, wherein the first part and
Second part is embedded in this and is embedded into position, and the first surface and the second surface level trim the back side.
It is locally embedded on the backboard in the implementation thermal transmission element system, and part is sticked on the back side.
It is embedded into position with one in the implementation backboard, which has a first part and a connection this first
There is a first surface, the second part to have a second surface, the wherein first part for the second part divided, the first part
It is embedded in this and is embedded into position, which trims the back side.
It is sticked at the back side of the backboard in another second part for implementing the thermal transmission element, and the opposite back of the body of the second surface
The back side of plate.
There is a sloping portion, the sloping portion between the another first part and second part for implementing the thermal transmission element
Be tilted into the backboard from the back side of the backboard is embedded into position.
In the sloping portion of the implementation thermal transmission element there is one first bending side to be connected to the first part and one second curved
Folding side is connected to the second part, which is located at this and is embedded into position, which is located at the back side of the backboard
And it tilts and extends to the first bending side.
A high low head has been defined between the first part and second part that one implements the thermal transmission element.
Implement this to be embedded into position to be a through-hole one.
Implement the thermal transmission element one has a chamber for a thin type heat pipe, and a capillary structure and one are equipped in the chamber
Working fluid.
Be sticked a light transmission plate body on an implementation touch-control display side.
Description of the drawings
Figure 1A is the perspective exploded view that display module first of the present invention is implemented；
Figure 1B is the Three-dimensional combination diagram that display module first of the present invention is implemented：
Fig. 1 C are the schematic diagram that the solid that display module first of the present invention is implemented combines another visual angle：
Fig. 1 D are the partial schematic sectional view of the 1d-1d hatching lines of Fig. 1 C：
Fig. 1 E are the partial schematic sectional view of the 1e-1e hatching lines of Fig. 1 C：
Fig. 2A is the perspective exploded view that display module second of the present invention is implemented；
Fig. 2 B are the Three-dimensional combination diagram that display module second of the present invention is implemented：
Fig. 2 C are the schematic diagram that the solid that display module second of the present invention is implemented combines another visual angle：
Fig. 2 D are the partial schematic sectional view of the 2d-2d hatching lines of Fig. 2 C：
Fig. 2 E are the partial schematic sectional view of the 2e-2e hatching lines of Fig. 2 C：
Fig. 3 A are the perspective exploded view that display module third of the present invention is implemented；
Fig. 3 B are the Three-dimensional combination diagram that display module third of the present invention is implemented：
Fig. 3 C are the schematic diagram that the solid that display module second of the present invention is implemented combines another visual angle：
Fig. 3 D are the partial schematic sectional view of the 3d-3d hatching lines of Fig. 3 C：
Fig. 3 E are the partial schematic sectional view of the 3e-3e hatching lines of Fig. 3 C：
Fig. 4 A practice the perspective exploded view in electronic device for the present invention first；
Fig. 4 B practice the Three-dimensional combination diagram in electronic device for the present invention first；
Fig. 4 C are the 3c-3c schematic cross-sectional views of Fig. 3 B；
Fig. 4 D are the 3d-3d schematic cross-sectional views of Fig. 3 B；
Fig. 5 A practice the perspective exploded view in electronic device for the present invention second；
Fig. 5 B practice the Three-dimensional combination diagram in electronic device for the present invention second；
Fig. 5 C are the 4c-4c schematic cross-sectional views of Fig. 4 B；
Fig. 5 D are the 4d-4d schematic cross-sectional views of Fig. 4 B；
Fig. 6 A are that third of the present invention practices the perspective exploded view in electronic device；
Fig. 6 B are that third of the present invention practices the Three-dimensional combination diagram in electronic device；
Fig. 6 C are the 6c-6c schematic cross-sectional views of Fig. 6 B；
Fig. 6 D are the 6d-6d schematic cross-sectional views of Fig. 6 B.
Symbol description
10 display modules
11 touch-control display panels
111 touch-controls show side
112,212,412 backboard
1121,2121,4121 back side
1122,2122 are embedded into position
116 light transmission plate bodys
12,22 thermal transmission element
121,221 first part
1211,2211 first surface
122,222 second part
1221,2221 second surface
123 chambers
124 capillary structures
125 working fluids
227 sloping portions
2271 first bending sides
2272 second bending sides
H high low heads
30 electronic devices
31 electronic component groups
311 electronic components
32 shells
321 front housings
322 dorsal shields
323 chambers
33 centers
34 batteries
Specific implementation mode
Below with reference to drawing, the embodiment of the present invention is explained in detail：
The above-mentioned purpose and its structure of the present invention and characteristic functionally will be said according to the preferred embodiment of institute's attached drawing
It is bright.
It is the schematic diagram that the present invention first is preferably implemented to please refer to Fig.1 A to Fig. 1 E, and a display module 10 as shown in the figure includes
One touch-control display panel 11 has the 112 1 light transmission plate body of backboard that a touch-control shows side 111 and the opposite touch-control shows side 111
116 are sticked shows that the light transmission plate body 116 is such as with transparent tripoli glass, polymethyl methacrylate 111 on side in the touch-control
(PMMA), the materials such as polycarbonate (PC), poly- second terephthalic acid (TPA) fat (PET) are made, and provide a touch surface come for using
Person carries out touch action with finger or stylus.There is the backboard 112 back side 1121 and one to be embedded into position 1122, the backboard
The opposite touch-control in 112 back side 1121 (such as Fig. 1 C) shows side 111.This is embedded into 1122 system of position and corresponds to one from the back side 1121
The position of pyrotoxin (such as an electronic components) extends to the position for not corresponding to pyrotoxin.It is one that this, which is embedded into position 1122,
Through-hole runs through the back side 1121.
There is one thermal transmission element 12 first part 121 and a second part 122 to be connected to the first part 121, this first
There is a first surface 1211 (such as Fig. 1 C), the second part 122 to have a second surface 1221 (such as Fig. 1 C) for part 121.
This implements 12 system of thermal transmission element and is all embedded in this to be embedded into position 1122, and such as 1C figures indicate first of the thermal transmission element 12
Points 121 and second part 122 be embedded in this in a manner of tight fit and be embedded into position 1122, the first surface of the first part 121
1211 and 1221 level of second surface of second part 122 trim the back side 1121.The first part 121 and second part 122
For any of which as heat absorbing end, another is then release end of heat.
Implement the region that the first part 121 is located at the not corresponding electronic component group in the back side 1121 of the backboard 112 at this,
It is used as release end of heat, which is located at the region that the back side 1121 by frame 112 corresponds to the electronic component group, makees
It is used for heat absorbing end, heat transfer electronic components generated by the second part 122 to 121 heat release of first part (or it is equal
Temperature).
Optionally, an electronic component group is corresponded at the back side 1121 that another implementation first part 121 is located at the backboard 112
Region, used as heat absorbing end, the back side 1121 which is located at the backboard 112 does not correspond to the electronic component group
Region, used as release end of heat, the heat transfer generated electronic components by the first part 121 to second part 122
Heat dissipation.
The thermal transmission element 12 for example but is not limited to a thin type heat pipe, has a chamber 123, is housed in the chamber 123
There are a capillary structure 124 and a working fluid 125.124 system of capillary structure is explained with being sintered body of powder, but is not limited to
This, which also may be selected to be groove or metal mesh or corpus fibrosum or conveyor screw.124 system of capillary structure is formed in the chamber
On 123 inner wall.The working fluid 125 such as pure water, pure water, inorganic compound, alcohols, ketone, liquid metal, cold coal have
Heat is transmitted to from heat absorbing end and is put by the effect of the steam-condensate circulating in thermal transmission element 12 of working fluid 144 by machine compound
Hot-side heat dissipation.
Backboard 112 is all embedded in by thermal transmission element 12 to conduct to far from electronics with the heat for generating electronic component group
The position of part group is radiated, and is reduced heat and is concentrated and be suitable for light and thin type electronic device.
Please refer to 2A to 2E figures be the second schematic diagram for preferably implementing of the present invention, generally preferably with described first
Implement it is identical, identical element use identical symbolic indication, this implementation difference is in be partially embedded into the thermal transmission element 22
This is embedded into position, is embodied as the backboard 212 and is embedded into position 2122 with a back side 2121 (such as Fig. 2 C) and one, the backboard
212 opposite touch-control in the back side 2121 shows side 111.This, which is embedded into position 2122 and is provided only on the back side 2121, does not correspond to a hair
The position of heat source (such as an electronic components).Optionally, in another implementation, this is embedded into position 2122 and can also be provided only on the back of the body
Face 2121 corresponds to the position of pyrotoxin.It is that a through-hole runs through the back side 2121 that this, which is embedded into position 2122, in all implementations.
There is the thermal transmission element 22 first part 221 and a second part 222 to be connected to the first part 221.This first
There is a first surface 2211 (such as Fig. 2 C), the second part 222 to have a second surface 2221 (such as Fig. 2 C) for part 221.One
Sloping portion 227 is located between the first part 221 and second part 222, which has one first bending side
2271 connection first parts 221 and one second bending side 2272 are connected to the second part 222 (such as Fig. 2 C).In this implementation table
Show that the first part 221 of the thermal transmission element 22 in a manner of close-fitting (or in the way of embedment is projected) is embedded and is embedded into position at this
2122, which trims the back side 2121.The second part 222 of the thermal transmission element 22 is sticked in the backboard
212 back side 2121, and the back side 2121 of the opposite backboard 212 of the second surface 2221.The sloping portion 227 is from the backboard
What 212 back side 2121 was tilted into the backboard 212 is embedded into position 2122, and the first bending side 2271 of the sloping portion 227
It is embedded into position 2122 positioned at this, the second bending side 2272 of the sloping portion 227 is located at the back side 2121 of the backboard 212 and inclines
Tiltedly extend to the first bending side 2271.By the sloping portion 227 make the thermal transmission element 22 first part 221 and second
There is a high low head h between dividing 222.
Backboard 212 is embedded in by 22 part of thermal transmission element to conduct to far from electricity with the heat for generating electronic component group
The position of sub- part group is radiated, and the problems in heat collection is reduced, and is enabled so of the invention that be suitable for light and thin type electronic device.
It please refers to Fig. 3 A to 3E and show the schematic diagram that third of the present invention is preferably implemented, generally with described first and
Two preferably implement it is identical, identical element use identical symbolic indication, this implementation difference is in includes in the display module 10
One touch-control display panel 11 has the backboard 412 that a touch-control shows side 111 and the opposite touch-control shows side 111.One light-transmitting plate
Body 116, which is sticked, to be shown in the touch-control 111 on side.There is the backboard 412 the opposite touch-control in a back side 4121 (such as Fig. 3 C) to show side
111, which is not provided with compared to the embodiment described is embedded into position, is a physical plane.
The side that the thermal transmission element 12 corresponds to the backboard 412 is sticked on the back side of the backboard 412 4121, the first part
The back side 4121 of 121 first surface 1211 and the opposite backboard 412 of the second surface 1221 of the second part 122.Because hot
It passes element 12 to be sticked at the back side of the backboard 412 4121, so that the thermal transmission element 12 is located at the lower section of the display module 10.
It is sticked at the back side of backboard 112 4121 by thermal transmission element 12, is able to paste the electronics for touching the corresponding back side 4121
Part group, and then the heat that electronic component group generates is conducted to the position far from electronic component group and is radiated, it reduces heat and concentrates.
It please refers to Fig. 4 A to 4D and show the first display module 10 for preferably implementing of the present invention and be applied to an electronic device 30
Schematic diagram, and please also refer to Figure 1A to 1E, explained with smartphone in the electronic device 30 that this is preferably implemented, but simultaneously
It is not limited to this, in other specific implementations, it also may be selected to be a tablet computer or wearing formula device.
Electronic device 30 includes a display module 10, an electronic component group 31 and a shell 32, the wherein display module 10
Its connection relationship of structure and its effect illustrate in first preferred embodiment, therefore do not repeat again herein.The shell 32
Including a front housing 321 and a dorsal shield 322, a chamber 323 has been defined by the front housing 321 and dorsal shield 322.The display module 10
Touch-control shows that side 111 corresponds to the front housing 321.The electronic component group 31 (such as circuit board) is arranged on a center 33, the electronics
The side of part group 31 corresponds to the back side 1121 of the backboard 112 of the display module 10 and is equipped with multiple electronic components 311, Gai Deng electricity
Subcomponent 311 includes central processing unit (Central Processor Unit, CPU), graphics processor (Graphic
Processing Unit, GPU), memory (such as flash memory) and other elements (such as capacitance, resistance, transistor or IC cores
The elements such as piece) etc..One battery 34 is arranged on the center 33 and adjoins the electronic component group 31.
The display module 10, electronic component group 31 and shell 32 are installed in center 33 in the chamber 323, and are embedded in the back of the body
The second part 122 of the thermal transmission element 12 for being embedded into position 1122 of plate 112 is in direct contact the electronic component in electronic component group 31
311, which, which is located at, does not contact the position of electronic component, when electronic device 30 when in use, electronic component 311 produces
Raw heat is transmitted to first part 121 from the second part 122 of thermal transmission element 12 and radiates, and can by the backboard (for aluminium sheet or
The plate of metal material) 112 progress temperature uniforming heat radiations.The heat that electronic component group 31 generates is conducted to far from electronic component whereby
The position heat dissipation of group 31, improves the problems in heat collection.Furthermore since what thermal transmission element 12 was embedded in backboard 112 is embedded into position
1122 so be useful in the electronic device 30 of slim chamber 323.
It please refers to Fig. 5 A to 5D and show the second display module 10 for preferably implementing of the present invention and be applied to an electronic device 30
Schematic diagram, and scheme please also refer to 2A to 2E, explained with smartphone in this preferably 30 system of electronic device of implementation,
However, it is not limited to this, in other specific implementations, also may be selected to be a tablet computer or wearing formula device.Electronic device 30 is
Through description preceding, display module 10, which has been described in described second, preferably to be implemented, and identical element is indicated using the same symbol,
This is not repeated hereby.
After display module 10, electronic component group 31 and shell 32 and center 33 are installed in the chamber 323, which passes member
The second part 222 of part 22 is sticked at the back side of the backboard 212 2121, and the contact of second surface 2221 of the second part 222 should
Electronic component 311 in electronic component group 31, what the first part 221 of the thermal transmission element 22 was embedded in backboard 112 is embedded into position
1122 are located at and do not contact the position of electronic component, when electronic device 30 when in use, the heat that electronic component 311 generates passes member from heat
The second part 222 of part 12 is transmitted to first part 221 via the sloping portion 227 and radiates.Electronic component group 31 is produced whereby
Raw heat is conducted to the position far from electronic component group 31 and is radiated, and improves the problems in heat collection.Furthermore due to thermal transmission element
What 12 first part was embedded in backboard 112 is embedded into position 1122, is useful in the electronic device 30 of slim chamber 323.
It please refers to Fig. 6 A to 6D and show display module 10 that third of the present invention is preferably implemented and be applied to an electronic device 30
Schematic diagram, and please also refer to Fig. 3 A to 3E, explained with smartphone in the electronic device 30 that this is preferably implemented, but simultaneously
It is not limited to this, in other specific implementations, it also may be selected to be a tablet computer or wearing formula device.Electronic device 30 has been retouched
It states preceding, display module 10, which has been described in the third, preferably to be implemented, and identical element is indicated using the same symbol, herein hereby
It does not repeat.
After display module 10, electronic component group 31 and shell 32 and center 33 are installed in the chamber 323, which passes member
The first part 121 of part 12 and second part 122 are sticked at the back side of the backboard 212 2121, and positioned at the display module 10
Lower section, the wherein second surface 1221 of the second part 122 contact the electronic component 311 in the electronic component group 31, this first
Partly 121 are located at and do not contact the position of the electronic component group 31, when electronic device 30 when in use, what electronic component 311 generated
Heat is transmitted to first part 121 from the second part 122 of thermal transmission element 12 and radiates.The heat that electronic component group 31 is generated whereby
It conducts to the position far from electronic component group 31 and radiates, improve the problems in heat collection.
Therefore, display module 10 through the invention is applied to the design on electronic device 30, the heat that can generate heat source
Amount conduction to the position far from heat source is radiated, and is reduced heat and is concentrated, furthermore thermal transmission element is partially or fully embedded in backboard with suitable
For in the electronic device of light and thin type.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (18)
1. a kind of display module radiator structure, including：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side,
Wherein, which be sticked on the back side, which there is side to correspond to the backboard, and be sticked in the back of the body
The back side of plate, and the thermal transmission element has the second part of a first part and a connection first part, the first part
With a first surface, which has the back of the body of a second surface, the first surface and the opposite backboard of the second surface
Face, the thermal transmission element correspond to a pyrotoxin,
There is a sloping portion, the sloping portion is from the back side of the backboard between the first part and second part of the thermal transmission element
Be tilted into the backboard is embedded into position.
2. a kind of display module radiator structure, including：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side,
Wherein, which is embedded on the backboard, which has one to be embedded into position, which has one first
Divide and there is a first surface, the second part to have one second for the second part of a connection first part, the first part
Surface, the wherein first part and second part are embedded in this and are embedded into position, and the first surface and the second surface level trim
The back side, it is a through-hole that this, which is embedded into position, this is embedded into position and corresponds to a pyrotoxin from the back side.
3. a kind of display module radiator structure, including：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side,
Wherein, which is locally embedded on the backboard, and part is sticked on the back side, which has one to be embedded into portion
Position, which has a first part and one is connected to the second part of the first part, which has one first
There is a second surface, the wherein first part to be embedded in this and be embedded into position for surface, the second part, the first surface horizontal cutting
The neat back side, it is a through-hole that this, which is embedded into position, this is embedded into position and corresponds to a pyrotoxin from the back side.
4. the second part of display module radiator structure as claimed in claim 3, the wherein thermal transmission element is sticked in the backboard
The back side, and the back side of the opposite backboard of the second surface.
5. display module radiator structure as claimed in claim 4 has between the first part and second part of the thermal transmission element
There is a sloping portion, what which was tilted into the backboard from the back side of the backboard is embedded into position.
6. display module radiator structure as claimed in claim 5, wherein the sloping portion of the thermal transmission element is curved with one first
Folding side is connected to the first part and one second bending side is connected to the second part, which is located at this and is embedded into position,
The second bending side is located at the back side of the backboard and inclination extends to the first bending side.
7. display module radiator structure as claimed in claim 6, wherein the first part of the thermal transmission element and second part it
Between defined a high low head.
8. display module radiator structure as described in any one of claims 1-3, which, which is a thin type heat pipe, has one
Chamber is equipped with a capillary structure and a working fluid in the chamber.
9. display module radiator structure as described in any one of claims 1-3, which shows the light transmission plate body that is sticked on side.
10. a kind of electronic device, including：
One display module includes：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side；
One electronic component group is the back side of the backboard of the corresponding touch-control display panel, and it corresponds to a side contacts at the back side and is somebody's turn to do
Thermal transmission element；And
One shell has an accommodating space to be installed with the display module and electronic component group,
Wherein, which is sticked on the back side, which there is side to correspond to the backboard, and be sticked in the backboard
The back side, and the thermal transmission element have a first part and one be connected to the first part second part, the first part tool
There is a first surface, which has the back side of a second surface, the first surface and the opposite backboard of the second surface,
The thermal transmission element corresponds to a pyrotoxin.
11. a kind of electronic device, including：
One display module includes：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side；
One electronic component group is the back side of the backboard of the corresponding touch-control display panel, and it corresponds to a side contacts at the back side and is somebody's turn to do
Thermal transmission element；And
One shell has an accommodating space to be installed with the display module and electronic component group,
Wherein, which is embedded on the backboard, which has one to be embedded into position, which has one first
Divide and there is a first surface, the second part to have one second for the second part of a connection first part, the first part
Surface, the wherein first part and second part are embedded in this and are embedded into position, and the first surface and the second surface level trim
The back side, it is a through-hole that this, which is embedded into position, this is embedded into position and corresponds to a pyrotoxin from the back side.
12. a kind of electronic device, including：
One display module includes：
One touch-control display panel shows that side and the opposite touch-control show that the backboard of side, the backboard have a heat with a touch-control
It passes the opposite touch-control of element and a back side and shows side；
One electronic component group is the back side of the backboard of the corresponding touch-control display panel, and it corresponds to a side contacts at the back side and is somebody's turn to do
Thermal transmission element；And
One shell has an accommodating space to be installed with the display module and electronic component group,
Wherein, which is locally embedded on the backboard, and part is sticked on the back side, the non-bulging back side in part,
The backboard has one to be embedded into position, which has the second part of a first part and a connection first part, should
There is a first surface, the second part there is a second surface, the wherein first part to be embedded in this and be embedded into portion for first part
Position, the first surface level trim the back side, and it is a through-hole that this, which is embedded into position, this is embedded into position and corresponds to a fever from the back side
Source.
13. electronic device as claimed in claim 12, wherein the second part system of the thermal transmission element is sticked in the back of the body of the backboard
Face, and the back side of the opposite backboard of the second surface.
14. electronic device as claimed in claim 13 has one to incline between the first part and second part of the thermal transmission element
Inclined portion point, what which was tilted into the backboard from the back side of the backboard is embedded into position.
15. electronic device as claimed in claim 14, wherein there is the sloping portion of the thermal transmission element one first bending side to connect
Lead to the first part and one second bending side is connected to the second part, which is located at this and is embedded into position, this second
Bending side is located at the back side of the backboard and inclination extends to the first bending side.
16. electronic device as claimed in claim 15, wherein defined between the first part and second part of the thermal transmission element
There is a high low head.
17. such as claim 10-12 any one of them electronic devices, which, which is a thin type heat pipe, has a chamber,
A capillary structure and a working fluid are equipped in the chamber.
18. such as claim 10-12 any one of them electronic devices, which shows the light transmission plate body that is sticked on side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410582466.7A CN105636400B (en) | 2014-10-27 | 2014-10-27 | Display module radiator structure and its electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410582466.7A CN105636400B (en) | 2014-10-27 | 2014-10-27 | Display module radiator structure and its electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105636400A CN105636400A (en) | 2016-06-01 |
| CN105636400B true CN105636400B (en) | 2018-08-10 |
Family
ID=56050724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410582466.7A Active CN105636400B (en) | 2014-10-27 | 2014-10-27 | Display module radiator structure and its electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105636400B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101198243A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Radiating module |
| CN203206599U (en) * | 2013-02-25 | 2013-09-18 | 讯凯国际股份有限公司 | Casing structure of hand-held device |
| CN203279449U (en) * | 2012-11-30 | 2013-11-06 | 应宏国际股份有限公司 | Electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4442304B2 (en) * | 2004-04-30 | 2010-03-31 | ソニー株式会社 | Light emitting unit heat dissipation device and backlight device |
| CN201926971U (en) * | 2011-02-25 | 2011-08-10 | 深圳市锦固鸿五金科技有限公司 | Radiator of tablet computer |
| CN203117610U (en) * | 2013-01-31 | 2013-08-07 | 广州创维平面显示科技有限公司 | Light-emitting diode (LED) backlit liquid crystal display device |
| CN203327471U (en) * | 2013-07-23 | 2013-12-04 | 奇鋐科技股份有限公司 | Heat radiation structure and hand-held electronic device with heat radiation structure |
| CN203884130U (en) * | 2014-06-17 | 2014-10-15 | 奇鋐科技股份有限公司 | Electronic substrate heat radiation structure |
| CN204217302U (en) * | 2014-10-27 | 2015-03-18 | 奇鋐科技股份有限公司 | Display module radiator structure and electronic installation thereof |
-
2014
- 2014-10-27 CN CN201410582466.7A patent/CN105636400B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101198243A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Radiating module |
| CN203279449U (en) * | 2012-11-30 | 2013-11-06 | 应宏国际股份有限公司 | Electronic device |
| CN203206599U (en) * | 2013-02-25 | 2013-09-18 | 讯凯国际股份有限公司 | Casing structure of hand-held device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105636400A (en) | 2016-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102483238B1 (en) | Heat dissipation apparatus and electronic device having the same | |
| CN108702858A (en) | Electronic equipment with thermal-arrest/radiator structure | |
| RU2012114578A (en) | ELECTRONIC DEVICE WITH ADVANCED FUNCTIONAL CAPABILITIES (OPTIONS) | |
| TWI439221B (en) | Motherboard | |
| CN105700649A (en) | Cooling system and electronic equipment | |
| CN105636400B (en) | Display module radiator structure and its electronic device | |
| CN204350527U (en) | There is display module and the hand-held device of radiator structure | |
| CN204217302U (en) | Display module radiator structure and electronic installation thereof | |
| CN106455422B (en) | Hand-held device radiator structure | |
| CN203606728U (en) | Flexible computer outer shell | |
| TWI546653B (en) | Heat dissipation structure of display module and electronic device therefor | |
| KR101235119B1 (en) | Portable computer mouse with integrated palm rest | |
| TWM495712U (en) | Heat dissipation structure of display module and electronic device thereof | |
| CN101681188A (en) | Transpiration cooling for passive cooled ultra mobile personal computer | |
| CN207584330U (en) | A kind of tablet computer of belt supporting frame | |
| CN207249628U (en) | A kind of collapsible mouse | |
| CN105658020B (en) | Has the wearable host apparatus of radiator structure | |
| CN215871479U (en) | Mobile phone motherboard support with heat conduction function | |
| CN105307451B (en) | Heat radiation module and electronic device with same | |
| CN213149636U (en) | Tablet computer protective housing convenient for power storage and energy saving | |
| CN206711083U (en) | A kind of calculator with illuminating lamp | |
| CN208013872U (en) | A kind of Intelligent flat mainboard F916 | |
| CN203366194U (en) | Novel integrated computer | |
| CN211653615U (en) | Novel multifunctional mouse | |
| CN203786879U (en) | Dustproof stopper with prompting function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |