CN105633256B - 一种光源色温可选配的远程荧光粉结构led灯 - Google Patents

一种光源色温可选配的远程荧光粉结构led灯 Download PDF

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CN105633256B
CN105633256B CN201610127500.0A CN201610127500A CN105633256B CN 105633256 B CN105633256 B CN 105633256B CN 201610127500 A CN201610127500 A CN 201610127500A CN 105633256 B CN105633256 B CN 105633256B
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lens
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led lamp
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CN105633256A (zh
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朱衡
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Hunan Photoelectric Technology Co., Ltd.
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Hunan Yuegang Mookray Industrial Co Ltd
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Priority to UAA201710278A priority patent/UA121495C2/uk
Priority to PCT/CN2017/083178 priority patent/WO2017152885A1/zh
Priority to RU2017136554A priority patent/RU2657864C1/ru
Priority to PCT/CN2017/083188 priority patent/WO2017152886A1/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

本发明涉及LED灯技术领域,具体涉及一种光源色温可选配的远程荧光粉结构LED灯。所述LED灯包括一灯珠,所述灯珠的发光方向上设置有一可替换的塑胶荧光透镜,所述塑胶荧光透镜由荧光粉及塑胶通过注塑工艺均匀融合为一体制备而成。本发明的有益效果为:本发明的远程荧光粉为可拆卸式结构,并所述芯片所发出的光通过圆环中部塑胶荧光透镜射出,并激发其中的荧光粉,发射出所需要的色温色谱的光;工艺结构简单,降低了成本,使远程荧光粉工艺迅速普及使用。

Description

一种光源色温可选配的远程荧光粉结构LED灯
技术领域
本发明涉及LED灯技术领域,具体涉及一种光源色温可选配的远程荧光粉结构LED灯。
背景技术
目前的LED远程荧光粉工艺,使荧光粉与芯片点胶封装脱离,既可以避免荧光粉的高温性能失效,也可以提高芯片出光效率,可以任意更换荧光面罩,使色温可变可调。但是由于荧光粉价格很高,使用大面积透镜外罩与荧光粉注塑融合,成本很高。现提出新的工艺结构设计,可以极大的降低成本,使远程荧光粉工艺可以迅速普及使用。
发明内容
为了有效解决上述问题,本发明提出一种光源色温可选配的远程荧光粉结构LED灯。
本发明的具体技术方案如下:一种光源色温可选配的远程荧光粉结构LED灯,所述LED灯包括一灯珠,所述灯珠的发光方向上设置有一可替换的塑胶荧光透镜,所述塑胶荧光透镜由荧光粉及塑胶通过注塑工艺均匀融合为一体制备而成。
进一步地,所述灯珠包括一芯片发光杯腔,所述芯片发光杯腔内表面上设置有一发光芯片;所述塑胶荧光透镜设置在所述发光芯片相反于芯片发光杯腔内表面的一侧。
进一步地,所述塑胶荧光透镜通过一圆环旋接在芯片发光杯腔。
进一步地,所述圆环中心具有一圆孔,所述圆孔直径与所述芯片发光杯腔外直径相同,所述塑胶荧光透镜通过注塑工艺固定在圆孔的上部,所述圆孔的下部内壁为螺母纹,所述螺母纹与所述芯片发光杯腔外螺纹对应旋接。
进一步地,所述塑胶荧光透镜与所述芯片之间涂有一层透明硅树脂胶。
进一步地,所述LED灯还包括一二次配光透镜,所述二次配光透镜与所述塑胶荧光透镜紧密对接,所述二次配光透镜的外壁内圈与灯珠通过旋接固定。
进一步地,所述芯片与电路正负极相连,通过点胶封装;所述芯片发光杯腔置于所述灯珠上表面中心处。
进一步地,所述塑胶荧光透镜为菲涅尔平面透镜或弧形透镜。
进一步地,所述灯珠为一体化灯珠。
进一步地,所述塑胶荧光透镜包括白光偏蓝镜片、正白光镜片及白光偏黄镜片,所述白光偏蓝镜片的配方为: 白光胶:固化剂:白光偏蓝荧光粉=1:1:(0.07~0.09);
所述正白光镜片的配方为:白光胶:固化剂:正白光荧光粉=1:1:(0.085~0.12);
所述白光偏黄镜片的配方为:白光水:B固化剂:白光偏黄荧光粉=1:1:(0.11~0.15)。
本发明的有益效果为:本发明的远程荧光粉为可拆卸式结构,并所述芯片所发出的光通过圆环中部塑胶荧光透镜射出,并激发其中的荧光粉,发射出所需要的色温色谱的光;工艺结构简单,降低了成本,使远程荧光粉工艺迅速普及使用。
附图说明
图1为本发明的结构示意图;
图2(a)为塑胶荧光透镜为弧形透镜的俯视图;图2(b)为塑胶荧光透镜为弧形透镜的侧视图;
图3(a)为塑胶荧光透镜为菲涅尔透镜的俯视图;图3(b)为塑胶荧光透镜为菲涅尔透镜的侧视图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细描述。应当理解,此处所描述的具体实施例仅仅用于解释本发明,并不用于限定本发明。
相反,本发明涵盖任何由权利要求定义的在本发明的精髓和范围上做的替代、修改、等效方法以及方案。进一步,为了使公众对本发明有更好的了解,在下文对本发明的细节描述中,详尽描述了一些特定的细节部分。对本领域技术人员来说没有这些细节部分的描述也可以完全理解本发明。
如图1所示,为本发明提出的第一实施例的结构示意图,该实施例提出一种光源色温可选配的远程荧光粉结构LED灯,所述LED灯包括一LED芯片散热器一体化灯珠2,所述一体化灯珠2上表面中心部位具有一芯片发光杯腔3,所述芯片发光杯腔3内金属表面上固定芯片1,所述芯片与电路正负极相连,并通过点胶封装,所述芯片发光杯腔3的杯腔壁为圆形塑胶件或金属件,所述芯片发光杯腔3的内壁为斜角、所述芯片发光杯腔3的外壁为直角螺纹状。
所述LED灯还包括一可与芯片发光杯腔3外壁通过旋接固定的可拆卸的圆环4,所述圆环4为金属或非透明性塑胶材质,圆环4中心为一圆孔,所述圆孔直径与所述芯片发光杯腔3外直径相同,所述圆孔上部安装有一塑胶透镜,参见附图2及图3所示,所述塑胶透镜为菲涅尔平面透镜或其他形式透镜,所述塑胶透镜为塑胶荧光透镜,所述透镜与荧光粉通过注塑工艺均匀融合一体,同时该透镜与所述圆环4也通过注塑工艺固定在圆孔的上半部。
所述圆环的下板部为螺母纹,所述螺母纹与所述杯腔外螺纹对应旋接,使得透镜与芯片发光杯腔3贴紧,在所述透镜与芯片封装胶层之间涂有一层透明硅树脂胶,可提高光效,同时也透镜与芯片发光杯腔3实现无缝贴合,芯片1所发光通过圆环4中部的透镜射出,并激发其中的荧光粉,发射出所需要的色温色谱的光。
所述LED灯还包括一二次配光透镜5,所述二次配光透镜5可以是包括任何形式的形状及发光角度,与圆环4中心的透镜紧密对接,其二次配光透镜5外壁内圈与一体化灯珠2通过旋接固定。

Claims (6)

1.一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述LED灯包括一灯珠,所述灯珠的发光方向上设置有能够替换的塑胶荧光透镜,所述塑胶荧光透镜由荧光粉及塑胶通过注塑工艺均匀融合为一体制备而成,所述灯珠包括一芯片发光杯腔,所述芯片发光杯腔内表面上设置有一发光芯片;所述塑胶荧光透镜设置在所述发光芯片相反于芯片发光杯腔内表面的一侧,所述LED灯还包括能够与芯片发光杯腔外壁通过旋接固定的可拆卸的圆环,所述圆环为金属或非透明性塑胶材质,所述圆环中心具有一圆孔,所述圆孔直径与所述芯片发光杯腔外直径相同,所述塑胶荧光透镜通过注塑工艺固定在圆孔的上部,所述圆孔的下部内壁为螺母纹,所述螺母纹与所述芯片发光杯腔外螺纹对应旋接。
2.根据权利要求1所述的一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述塑胶荧光透镜与所述芯片之间涂有一层透明硅树脂胶。
3.根据权利要求1所述的一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述LED灯还包括一二次配光透镜,所述二次配光透镜与所述塑胶荧光透镜紧密对接,所述二次配光透镜的外壁内圈与灯珠通过旋接固定。
4.根据权利要求1所述的一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述芯片与电路正负极相连,通过点胶封装;所述芯片发光杯腔置于所述灯珠上表面中心处。
5.根据权利要求1所述的一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述塑胶荧光透镜为菲涅尔平面透镜或弧形透镜。
6.根据权利要求1所述的一种光源色温可选配的远程荧光粉结构LED灯,其特征在于,所述灯珠为芯片散热器封装一体化灯珠。
CN201610127500.0A 2016-03-07 2016-03-07 一种光源色温可选配的远程荧光粉结构led灯 Active CN105633256B (zh)

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UAA201710278A UA121495C2 (uk) 2016-03-07 2017-05-05 Світлодіодний освітлювальний пристрій
PCT/CN2017/083178 WO2017152885A1 (zh) 2016-03-07 2017-05-05 Led照明装置
RU2017136554A RU2657864C1 (ru) 2016-03-07 2017-05-05 Светодиодное осветительное устройство
PCT/CN2017/083188 WO2017152886A1 (zh) 2016-03-07 2017-05-05 一种led灯及其构成的色温可选配的一体化光源与透镜结构
AU2017229070A AU2017229070B2 (en) 2016-03-07 2017-05-05 LED illumination device
US15/567,081 US10168005B2 (en) 2016-03-07 2017-05-05 LED illumination device with arbitrary bending and fixing connector module

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WO2017152886A1 (zh) * 2016-03-07 2017-09-14 湖南粤港模科实业有限公司 一种led灯及其构成的色温可选配的一体化光源与透镜结构
US10168005B2 (en) 2016-03-07 2019-01-01 Hunan Yuegang Mookray Industrial Co., Ltd. LED illumination device with arbitrary bending and fixing connector module
CN106015977A (zh) * 2016-06-24 2016-10-12 朱衡 一种led照明装置
CN106015965A (zh) * 2016-06-24 2016-10-12 朱衡 一种模块化灯具
WO2017167314A1 (zh) * 2016-03-30 2017-10-05 湖南粤港模科实业有限公司 一种模块化灯具
JP6498781B2 (ja) * 2016-06-24 2019-04-10 湖南粤港模科実業有限公司Hunan Yuegang Mookray Industrial Co.,Ltd. Led照明装置
CN110416385B (zh) * 2019-08-02 2021-01-12 厦门多彩光电子科技有限公司 一种led封装体以及封装方法

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