CN105623540A - Epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition - Google Patents
Epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition Download PDFInfo
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- CN105623540A CN105623540A CN201410615082.0A CN201410615082A CN105623540A CN 105623540 A CN105623540 A CN 105623540A CN 201410615082 A CN201410615082 A CN 201410615082A CN 105623540 A CN105623540 A CN 105623540A
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- epoxy resin
- ultralow temperature
- resin heat
- polyetheramine
- virtual viscosity
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Abstract
The invention discloses an epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition. The epoxy resin heat-conducting adhesive comprises the following components by mass percentage: 4-15% of zinc oxide, 6-10% of alumina, 3-6% of silicon carbide, 3-7% of silica, 4-8% of nano silver powder, 6-10% of nano copper powder, 30-40% of modified epoxy resin, 10-15% of butyl acrylate, 2-3% of a silane coupling agent, 3-9% of dicyandiamide, 4-8% of a polyetheramine curing agent, and 1-2% of a curing accelerator. The epoxy resin heat-conducting adhesive can overcome the disadvantages that the current epoxy resin heat-conducting adhesives cannot be used under ultralow temperature environment, and the viscosity of the current epoxy resin heat-conducting adhesives is poor under the ultralow temperature; the nano-level metal powder having high heat conductivity is cooperated with the metal oxide powder, and good heat conductivity can be obtained based on guarantee of gluing performance.
Description
Technical field
The present invention relates to a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature.
Background technology
Heat-conducting glue is one-component, heat-conducting type, cold curing organosilicon joint sealant. Release low molecule by the moisture content generation condensation reaction in air and cause crosslinking curing, and be sulfided into high performance elastomer. Well viscous heat-conducting glue has the cold-and-heat resistent alternation performance of brilliance, ageing-resistant performance and electrical insulation capability. And there is the protection against the tide of excellence, antidetonation, Inverter fed motor, anti-electric creepage performance and chemical mediator-resitant property. Not swelling and most metals and nonmetallic materials are had good cementability.
In recent years, along with the development of Aero-Space, national defense industry and large-scale low-temperature engineering, the adhesive of ultralow temperature application there is new demand, it is desirable to there is heat conductivility under ultralow temperature, and keep viscosity and mechanical strength. Both at home and abroad heat conduction adhesive, ultralow temperature adhesive are had many research and application, but still can effectively not keep the heat-conducting glue of viscosity at ultra-low temperature surroundings.
Summary of the invention
It is an object of the invention to customer service prior art not enough, it is provided that a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature.
In order to reach above technique effect, technical scheme is as follows:
A kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature, its proportioning raw materials includes by mass percentage:
Zinc oxide 4%��15%;
Aluminium oxide 6%��10%;
Carborundum 3%��6%;
Silicon dioxide 3%��7%;
Nanometer silver powder 4%��8%;
Copper nanoparticle 6%��10%;
Modified epoxy 30��40%;
Butyl acrylate 10��15%;
Silane coupler 2��3%;
Dicyandiamide 3��9%;
Polyetheramine firming agent 4��8%;
Curing accelerator 1��2%.
Preferably, its proportioning raw materials includes by mass percentage:
Zinc oxide 7%;
Aluminium oxide 8%;
Carborundum 5%;
Silicon dioxide 5%;
Nanometer silver powder 6%;
Copper nanoparticle 8%;
Modified epoxy 35%;
Butyl acrylate 12%;
Silane coupler 2%;
Dicyandiamide 5%;
Polyetheramine firming agent 5.5%;
Curing accelerator 1.5%.
Further, described modified epoxy is the one in modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modified epoxy.
Further, described polyetheramine firming agent be polyetheramine D-230, polyetheramine D-400 or polyetheramine D-2000.
Further, curing accelerator is the one in 4,4 ' di-2-ethylhexylphosphine oxides (phenyl-Dimethylcarbamide), phenyl-Dimethylcarbamide or diethyl tetramethyl imidazoles.
The present invention compared with prior art has the advantages that:
The present invention provides a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature, it is possible to overcome existing heat-conducting glue to may not apply to the not enough and existing heat-conducting glue of ultra-low temperature surroundings shortcoming of viscosity difference under ultralow temperature; Present invention uses the nanometer metal powder complexed metal oxide powder with high thermal conductivity, the basis of guarantee gluing performance obtains excellent thermal conductivity.
Detailed description of the invention
Describing technical scheme in detail below in conjunction with specific embodiment, illustrative examples and explanation in this present invention are used for explaining technical scheme, but not as a limitation of the invention.
Embodiment 1:
A kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature, its proportioning raw materials includes by mass percentage:
Zinc oxide 7%;
Aluminium oxide 8%;
Carborundum 5%;
Silicon dioxide 5%;
Nanometer silver powder 6%;
Copper nanoparticle 8%;
Modified epoxy 35%;
Butyl acrylate 12%;
Silane coupler 2%;
Dicyandiamide 5%;
Polyetheramine firming agent 5.5%;
Curing accelerator 1.5%.
Described modified epoxy is modifying epoxy resin by organosilicon; Described polyetheramine firming agent is polyetheramine D-230; Described curing accelerator is 4,4 ' di-2-ethylhexylphosphine oxides (phenyl-Dimethylcarbamides).
The present invention provides a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature, it is possible to overcome existing heat-conducting glue to may not apply to the not enough and existing heat-conducting glue of ultra-low temperature surroundings shortcoming of viscosity difference under ultralow temperature; Present invention uses the nanometer metal powder complexed metal oxide powder with high thermal conductivity, the basis of guarantee gluing performance obtains excellent thermal conductivity.
The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. the epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature, it is characterised in that: its proportioning raw materials includes by mass percentage:
Zinc oxide 4%��15%;
Aluminium oxide 6%��10%;
Carborundum 3%��6%;
Silicon dioxide 3%��7%;
Nanometer silver powder 4%��8%;
Copper nanoparticle 6%��10%;
Modified epoxy 30��40%;
Butyl acrylate 10��15%;
Silane coupler 2��3%;
Dicyandiamide 3��9%;
Polyetheramine firming agent 4��8%;
Curing accelerator 1��2%.
2. a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature according to claim 1, it is characterised in that: its proportioning raw materials includes by mass percentage:
Zinc oxide 7%;
Aluminium oxide 8%;
Carborundum 5%;
Silicon dioxide 5%;
Nanometer silver powder 6%;
Copper nanoparticle 8%;
Modified epoxy 35%;
Butyl acrylate 12%;
Silane coupler 2%;
Dicyandiamide 5%;
Polyetheramine firming agent 5.5%;
Curing accelerator 1.5%.
3. a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature according to claim 1, it is characterised in that: described modified epoxy is the one in modifying epoxy resin by organosilicon, organic titanium modified epoxy and organic boron modified epoxy.
4. a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature according to claim 1, it is characterised in that: described polyetheramine firming agent is polyetheramine D-230, polyetheramine D-400 or polyetheramine D-2000.
5. a kind of epoxy resin heat-conducting glue that can keep virtual viscosity in condition of ultralow temperature according to claim 1, it is characterized in that: curing accelerator is the one in 4,4 ' di-2-ethylhexylphosphine oxides (phenyl-Dimethylcarbamide), phenyl-Dimethylcarbamide or diethyl tetramethyl imidazoles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410615082.0A CN105623540A (en) | 2014-11-05 | 2014-11-05 | Epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410615082.0A CN105623540A (en) | 2014-11-05 | 2014-11-05 | Epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105623540A true CN105623540A (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410615082.0A Pending CN105623540A (en) | 2014-11-05 | 2014-11-05 | Epoxy resin heat-conducting adhesive capable of keeping virtual viscosity under ultralow temperature condition |
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| CN (1) | CN105623540A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2690475C1 (en) * | 2018-10-04 | 2019-06-03 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Липецкий государственный технический университет" | Composition for gluing metal articles |
| CN112877039A (en) * | 2021-03-05 | 2021-06-01 | 江苏晶河电子科技有限公司 | High-performance single-component organic silicon modified epoxy heat conduction material and preparation method thereof |
-
2014
- 2014-11-05 CN CN201410615082.0A patent/CN105623540A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2690475C1 (en) * | 2018-10-04 | 2019-06-03 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Липецкий государственный технический университет" | Composition for gluing metal articles |
| CN112877039A (en) * | 2021-03-05 | 2021-06-01 | 江苏晶河电子科技有限公司 | High-performance single-component organic silicon modified epoxy heat conduction material and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |
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| WD01 | Invention patent application deemed withdrawn after publication |