CN105590902A - 天线封装模块及其制造方法 - Google Patents
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Abstract
一种天线封装模块及其制造方法。天线封装模块包括一封装基板、一天线基板与一波导结构。波导结构配置在封装基板与天线基板之间。波导结构具有一空腔。
Description
本申请是申请人于2013年2月8日提交的、申请号为“201310050856.5”的、发明名称为“天线封装模块及其制造方法”的发明专利申请的分案申请。
技术领域
本发明是有关于一种天线封装模块及其制造方法。
背景技术
在一些电子装置中,例如高电子迁移率晶体管(HEMTS)与异双极性晶体管(HBTS)等高速半导体元件的MMIC,须处理高频信号,必须使用高频波导管作为一接线线。
在一般技术中,乃对配置于封装基板上的塑模材料中进行鑚孔,然后以导电材料填充塑模材料的孔洞来形成波导管。然而,以这种方式形成的波导管品质不稳定,传送/接收高频信号会造成阻抗匹配不佳,降低传送至天线的功率,导致系统效率变差,发射功率降低,无法达到需求的通信效果。再者,钻孔与填充导电材料的工艺复杂且昂贵,导致产品生产良率与产能的降低。
发明内容
本发明有关于一种天线封装模块及其制造方法。制造方法简单、成本低。
根据本发明的一方案,提出一种天线封装模块,包括一封装基板、一天线基板与一波导结构。波导结构配置在封装基板与天线基板之间。波导结构具有一空腔。
根据本发明的一另方案,提出一种天线封装模块的制造方法,包括以下步骤。于一封装基板上配置一波导结构。然后,利用一塑模材料将波导结构封装在封装基板与一天线基板之间。
为了对本发明的上述及其他方面有更佳的了解,下文特举较佳实施例,并配合附图,作详细说明如下:
附图说明
图1A绘示根据一实施例中天线封装模块的示意图。
图1B绘示图1A的部分上视图。
图2绘示根据一实施例中波导结构的横截面图。
图3绘示根据一实施例中波导结构的横截面图。
图4绘示根据一实施例中波导结构的横截面图。
图5A至图5E绘示根据一实施例中天线封装模块的制造方法。
符号说明:
102:封装基板;
104:介电膜;
106、108:接合垫;
110:导电膜;
112:晶粒;
114:黏着层;
116:焊线;
118:被动元件;
119:狭缝;
120、220、320、420:波导结构;
122、222、322、422:介电层;
124、224、324、424:导电层;
126、226、326:空腔;
128:塑模材料;
130:天线基板;
132:介电膜;
134:天线元件;
136:反射层;
140:黏着层;
142:模板;
144:黏着层;
146:模板;
338、438:穿孔。
具体实施方式
请参照图1A所示,图1A绘示根据一实施例中天线封装模块的示意图。本发明所揭示的天线封装模块包括一封装基板102、一波导结构120与一天线基板130。
封装基板102可包括配置在介电膜104上的接合垫106、108与导电膜110例如电路层。封装基板102可通过接合垫106、108耦接至接地信号,接合垫108之间形成一狭缝119,且狭缝119与波导结构120相对应设置。晶粒112可利用黏着层114贴附在封装基板102的上表面上,并利用焊线116电性连接至封装基板102的上表面上的接合垫108。被动元件118配置在封装基板102上并电性连接至接合垫108。
请参照图1A,波导结构120配置在封装基板102上。波导结构120可具有由介电层122或导电层124定义出的空腔126,较佳地,狭缝119对应于空腔126的中央位置,而设置于封装基板102的上表面。空腔126可以气体或真空填充。气体可包括空气等。如此,无线高频信号便可以经由狭缝119进行信号模态的转换,亦即信号电场方向的转换。
请参照图1A,可利用塑模材料128将波导结构120、晶粒112与被动元件118封装在封装基板102与天线基板130之间。天线基板130可包括配置在介电膜132上的天线元件134与反射层136,或其他适合的导线。天线元件134可包括例如天线阵列。反射层136的材质可包括金属。天线基板130可耦接至接地信号,而天线基板130的反射层136电性连接于导波结构120的导电层124。
请参照图1B,其绘示图1A中波导结构120部分的上视图。封装基板102上的狭缝119设置于导波结构120的空腔126内,且狭缝119与导电膜110从上视方向观之为正交。无线高频信号完成信号模态转换后,便可以经由天线基板130传送,而接收无线高频信号时,信号则是由天线基板130至狭缝119。
图2绘示根据一实施例中波导结构220的横截面图。波导结构220可具有一环形状的介电层222与一环形状的导电层224。导电层224配置在介电层222的一内侧壁上。导电层224的一内侧壁则定义出一空腔226。举例来说,空腔226可以切割、激光或其他合适的方式形成。导电层224可以电镀、溅镀或其他合适的方式形成,例如利用贴合导电薄膜的方式形成。
请参考图3,其绘示根据本发明一实施例中波导结构320的横截面图。图3的波导结构320与图2的波导结构220的差异在于,环形状的介电层322具有数个穿孔338于其中。此外,导电层324是填充在介电层322的穿孔338中。介电层322的内侧壁则定义出空腔326。举例来说,空腔326与穿孔338可以切割、激光或其他合适的方式形成。导电层324可以电镀、溅镀或其他合适的方式形成。
请参考图4,其绘示根据本发明一实施例中波导结构420的横截面图。图4的波导结构420不具有空腔,介电层422具有数个穿孔438于其中。此外,导电层424是填充在介电层422的穿孔438中。举例来说,穿孔438可以切割、激光或其他合适的方式形成。导电层424可以电镀、溅镀或其他合适的方式形成。
各种波导结构可根据实施需求任意地搭配组合。于一实施例中,举例来说,波导结构可组合如图3与图4所示的波导结构320与波导结构420而构成。例如波导结构的下部分可具有如图3所示的横截面结构,亦即,介电层的下部分是介电环部分(例如图3的标号322),而配置在下部分上的上部分(介电盖部分)可具有如图4所示的横截面结构,穿孔(例如图3的标号324与图4的标号424)是形成在介电环部分(例如图3的标号322)与介电盖部分(例如图4的标号422)中,此外,波导结构的下部分是具有空腔(例如图3的标号326)。空腔可以气体或真空填充。气体可包括空气等。
在实施例中,波导结构可利用半导体工艺来制造。制造方法简单且成本低,能够提高产品生产良率与产能。再者,波导结构的品质稳定,因此产品可具有较佳的效能。波导结构各元件的尺寸能够轻易地控制而具有预期的尺寸,因此波导结构的特性例如传导的频宽、截止频率、传导的损失、相位的差异、阻抗匹配等皆能良好地控制。举例来说,通过模拟软件的测试,得到实施例的波导结构造成的损失(0.125dB)比比较例(利用一般技术制得)的波导结构造成的损失(3~6dB)减少了2~4倍。因此相较于比较例,使用实施例的波导结构可降低高频信号经过转换(transition)的插入损失(insertionloss),能提升系统的效能。
图5A至图5E绘示根据一实施例中天线封装模块的制造方法。
请参照图5A,在封装基板102上配置波导结构120。波导结构120可利用半导体工艺来制造。制造方法简单且成本低,能够提高产品生产良率与产能。于一实施例中,是以压合的方式将波导结构120配置在封装基板102上,配置的方法简单并且成本低。
请参照图5B,可利用表面黏着的方式,将配置晶粒112与被动元件118在封装基板102上。晶粒112可经由焊线116将信号电性连接至接合垫108。
请参照图5C,利用黏着层140将封装基板102贴附至模板142。在封装基板102上配置塑模材料128。举例来说,塑模材料128可包括环氧树脂粉末,其可利用烘烤的方式固化定形。将黏着层144配置在天线基板130上。在实施例中,天线基板130可利用半导体工艺来制造。制造方法简单且成本低,能够提高产品生产良率与产能。将模板146推向模板142,以压合天线基板130与封装基板102之间的塑模材料128,并将波导结构120、晶粒112与被动元件118封装在封装基板102与天线基板130之间,如图5D所示。
请参照图5E,将模板146与黏着层144移离天线基板130。此外,将模板142与黏着层140移离封装基板102。
综上所述,虽然本发明已以较佳实施例揭露如上,然其并非用以限定本发明。本发明所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作各种的更动与润饰。因此,本发明的保护范围当视权利要求书所界定者为准。
Claims (10)
1.一种天线封装模块,其特征在于,包括:
一载体;
一天线结构;
一波导结构,配置在所述载体与所述天线结构之间;以及
一狭缝,设置于所述载体所配置的接合垫之间且与所述波导结构相对应设置。
2.如权利要求1所述的天线封装模块,其特征在于,所述波导结构包括:
一介电层,具有环形状;以及
一导电层,具有环形状,并配置在所述介电层的一内侧壁上,其中所述导电层的一内侧壁定义出一空腔。
3.如权利要求1所述的天线封装模块,其特征在于,所述波导结构包括:
一介电层,具有至少一穿孔于其中,其中所述介电层的一内侧壁是定义出一空腔;以及
一导电层,填充在所述介电层的所述至少一穿孔中。
4.如权利要求3所述的天线封装模块,其特征在于,所述介电层包括:
一介电环部分,其中是所述介电环部分的一内侧壁定义出所述空腔;以及
一介电盖部分,配置在所述介电环部分上,其中所述至少一穿孔是形成在所述介电环部分与所述介电盖部分中。
5.如权利要求1所述的天线封装模块,其特征在于,所述天线结构包括配置在一介电膜上的一天线元件与一反射层,所述反射层电性连接所述波导结构的一导电层。
6.如权利要求1所述的天线封装模块,其特征在于,所述天线结构耦接至一接地信号。
7.如权利要求1所述的天线封装模块,其特征在于,所述载体,具有一導電膜,且所述狭缝与所述导电膜为正交。
8.一种天线封装模块,其特征在于,包括:
一载体,具有一導電膜;
一天线结构;
一波导结构,配置在所述载体与所述天线结构之间;以及
一狭缝,设置于所述载体上且与所述波导结构相对应设置,
其中,所述狭缝与所述导电膜为正交。
9.如权利要求8所述的天线封装模块,其特征在于,所述天线结构包括配置在一介电膜上的一天线元件与一反射层,所述反射层电性连接所述波导结构的一导电层。
10.如权利要求8所述的天线封装模块,其特征在于,所述天线结构耦接至一接地信号。
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