CN105584984B - Microelectromechanicdevices devices - Google Patents
Microelectromechanicdevices devices Download PDFInfo
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- CN105584984B CN105584984B CN201410557781.4A CN201410557781A CN105584984B CN 105584984 B CN105584984 B CN 105584984B CN 201410557781 A CN201410557781 A CN 201410557781A CN 105584984 B CN105584984 B CN 105584984B
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- mass
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- dimensional movement
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Abstract
The present invention provides a kind of microelectromechanicdevices devices, wherein including：One substrate；One mass, comprising at least two grooves, each groove has an inner space and an opening, and the inner space relatively opening is closer to the center section of the mass；At least two anchor points, in corresponding groove, with the substrate connection；At least two connecting rods, in corresponding groove, connected with corresponding anchor point；An and multi-dimensional movement elastic construction, to assist the mass to carry out multi-dimensional movement, the multi-dimensional movement elastic construction is located at the periphery of the mass, by at least two connecting rods and at least two anchor points and with the substrate connection, the multi-dimensional movement elastic construction includes multiple first springs and multiple second springs, to assist the mass in going out plane and coplanar direction is moved.
Description
Technical field
The present invention relates to a kind of microelectromechanicdevices devices, especially by a wherein mass and connection among mass
Anchor point multi-dimensional movement elastic construction, to provide and sense the microelectromechanicdevices devices of the multi-dimensional movement of mass.
Background technology
For microelectromechanicdevices devices in commonly used daily life, motion sensing is application common in microelectromechanicdevices devices.Fig. 1 shows
Show prior art (United States Patent (USP) number US 8,459, a 114) microelectromechanicdevices devices 10, its three mass 11,12,13 to
Correspond respectively to each motion sensing of three-dimensional.But the quality and size of mass 11,12,13 all differ, therefore three-dimensional motion
Sensing need to have the design of difference out of the ordinary to meet the needs of different quality and size.Mass 11,12,13 is connected end 14
Anchor point it is not all be arranged at centre, no matter the temperature difference of operating environment or manufacturing process, the design of both sides connection anchor point all may
Stress is deformed, and then influences the accuracy of sensing.
Fig. 2 shows another prior art (United States Patent (USP) number US 7,637, a 160) microelectromechanicdevices devices 20, its quality
Block 21 by the anchor point 22 of Y-direction both sides to be fixed on substrate 23, and its sense direction be with it is the one of substrate-parallel coplanar
Direction (in-plane, X, Y-direction, Fig. 2), can not have an ability of sensing three-dimensional motion, and its still have a torsional deformation can
Energy.
Fig. 3 shows a microelectromechanicdevices devices 30 of another prior art (United States Patent (USP) number US7,134,340), and it is microcomputer
(microelectromechanicdevices devices 30 are a symmetrical structure to the partial view of electric installation 30, and Fig. 3 shows the part of a quarter of microelectromechanicdevices devices 30
View), its mass 31 is connected to substrate (schema is not shown) by spring 33, connecting rod 32 and multiple anchor points 34, needs special
Notice that its connecting rod 32 is connected to substrate by multiple anchor points 34, to avoid it from deforming or distort, though part solves deformation or distortion
Problem, so this design limitation mass 31 motion (coplanar two dimensional motion) and increase manufacture complexity, make on the contrary
It is restricted into its application.
In a word, though the microelectromechanicdevices devices of prior art can not carry out three-dimensional sensing or can carry out three-dimensional sensing
Larger stress can not be born and be easily deformed and cause to offset (offset).Therefore, the present invention in view of the shortcomings of the prior art, carries
Go out a kind of microelectromechanicdevices devices that can be sensed multi-dimensional movement and there is low offset after meeting with stresses.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art and defect, proposes a kind of microelectromechanicdevices devices, and it can be sensed
Multi-dimensional movement simultaneously has low offset after meeting with stresses.
For the above-mentioned purpose, a kind of microelectromechanicdevices devices are provided with regard to one of viewpoint, the present invention, it is included：One substrate；One
Mass, comprising at least two grooves, each groove has an inner space and an opening, and the inner space relatively opening more connects
It is bordering on the center section of the mass；At least two anchor points, in corresponding groove, with the substrate connection；At least two connecting rods, position
In corresponding groove, connected with corresponding anchor point；And a multi-dimensional movement elastic construction, it is more to assist the mass to carry out
Maintenance and operation is moved, and the multi-dimensional movement elastic construction is located at the periphery of the mass, by least two connecting rods and at least two anchor points and
With the substrate connection, the multi-dimensional movement elastic construction includes multiple first springs, to connect the mass, and assists the mass
Go out in-plane in one to be moved；And multiple second springs, each second spring are directly or indirectly connected to a correspondence
Connecting rod and the first spring between, to assist the mass to be moved in together in-plane.
In one embodiment, at least two grooves, at least two connecting rods and at least two anchor points are all to set in a symmetrical.
In one embodiment, the plurality of first spring is connected to two relative edges of the mass, and at least two grooves are opened
Mouth is then connected to another two relative edge of the mass.
In one embodiment, the plurality of first spring is multiple torsional springs, to assist the mass to carry out a rotary motion.
In one embodiment, the plurality of torsional spring forms a rotation axis, and the quality of the mass non-is evenly distributed in
The rotation axis both sides, so that the rotary motion is eccentric motion.
In one embodiment, the plurality of first spring is multiple translation springs, to assist the mass to go out in-plane in one
Carry out translational motion.
In one embodiment, be provided with multiple anchor points in each groove, and each connecting rod with all anchor points in same groove all
Connection.
In one embodiment, the multi-dimensional movement elastic construction has a frame-type structure, and mass is located at the frame-type structure
In one inner space.
In one embodiment, the multi-dimensional movement elastic construction includes：One frame structure, there is an inner space in it, to hold
Put the mass；At least two inner supports, it is connected to corresponding at least two connecting rods；And aforesaid plurality of first spring and multiple second
Spring, the frame structure inwardly connects the inner support via the second spring, and inwardly connects the quality via first spring
A part for mass is not included between block, the wherein inner support and the frame structure.
Below by specific embodiment elaborate, when be easier to understand the purpose of the present invention, technology contents, feature and its
The effect of reached.
Brief description of the drawings
Fig. 1,2,3 show three microelectromechanicdevices devices of prior art；
Fig. 4 A, 4B show the schematic diagram of microelectromechanicdevices devices according to an embodiment of the invention and some of schematic diagrames；
Fig. 4 C show the schematic diagram of multi-dimensional movement elastic construction according to an embodiment of the invention；
Fig. 5,6 displays are according to the schematic diagrames of the microelectromechanicdevices devices of the multiple embodiments of the present invention.
Symbol description in figure
10 microelectromechanicdevices devices
11st, 12,13 mass
14 fixing ends
20 microelectromechanicdevices devices
21 masses
22 anchor points
23 substrates
31 masses
32 connecting rods
33 springs
34 anchor points
40 microelectromechanicdevices devices
41 substrates
42 masses
421 grooves
4211 inner spaces
4212 openings
43 multi-dimensional movement elastic constructions
431 inner spaces
432 inner supports
433 frame structures
44 connecting rods
45 anchor points
46 grooves
50 microelectromechanicdevices devices
51 multi-dimensional movement elastic constructions
52 masses
60 microelectromechanicdevices devices
61 connecting rods
AA ', BB ' axis
M1 turnable elastics move
M2, M3 translate elastic movement
The springs of S1 first
S2 second springs
X, Y, Z direction
Embodiment
For the present invention foregoing and other technology contents, feature and effects, coordinate following with reference to the one preferable of schema
In the detailed description of embodiment, can clearly it present.The direction term being previously mentioned in following examples, such as：Upper and lower, left,
It is right, front or rear etc., only it is the direction with reference to annexed drawings.Schema in the present invention belongs to signal, is mostly intended to represent each device
And the function relation between each component, as shape, thickness and width then and not according to ratio drafting.
Reference picture 4A-4C, the present invention provides a kind of microelectromechanicdevices devices 40, wherein including：One substrate 41；One mass 42,
Its inside includes at least two grooves 421, and there is each groove 421 inner space 4211 and an opening 4212 (Fig. 4 B are referred to, for figure
4A partial view), inner space 4211 is relatively open 4212 closer to the center section of mass 42, and is open 4212
It is connected to the edge of mass 42 and outwards opens；At least two connecting rods 44 and at least two anchor points 45, connecting rod 44 are located at anchor point 45
Connect in groove 421 and correspondingly；And one multi-dimensional movement elastic construction 43 (refer to Fig. 4 C, wherein bold portion shows more maintenance and operations
Dynamic elasticity structure 43, dotted portion show the other structures beyond multi-dimensional movement elastic construction 43), positioned at the outer of mass 42
Enclose, the multi-dimensional movement elastic construction 43 by least two connecting rods 44 and at least two anchor points 45 and be connected with substrate 41 (in Fig. 4 A
Multiple anchor points 45 are illustrated in each groove 421, connecting rod 44 can be, but not limited to all anchor points 45 in same groove 421 can all connect
Connect), multi-dimensional movement elastic construction 43, which includes, is connected to multiple first spring S1 of mass 42 to assist mass 42 to be gone out
Plane motion (such as：Turnable elastic moves M1 in Fig. 4 A).Multi-dimensional movement elastic construction 43 is in its internal structure comprising multiple
Second spring S2 with assist mass 42 carry out it is coplanar motion (such as：Elastic movement M2, M3 is translated in Fig. 4 A), the plurality of the
Two spring S2 are directly or indirectly connected between the spring S1 of connecting rod 44 and first.In a preferred embodiment, at least two grooves
421st, at least two connecting rods 44 and at least two anchor points 45 are all to set in a symmetrical.Also, in a preferred embodiment, the plurality of
One spring S1 is connected to two relative edges of mass 42, and the opening 4212 of groove 421 is then connected to the another two-phase of mass 42
Opposite side.
Mass 42 itself forms movable electrode, and microelectromechanicdevices devices 40 set fixed electricity in appropriate relative position
Pole.When mass 42 moves, the change of capacitance between movable electrode and fixed electrode is caused, it is possible thereby to sense micro electronmechanical
The motion of device 40.This point is well known to those skilled in the art, therefore is omitted the detailed description of correlation technique and omitted and illustrate
Fixed electrode；The position of fixed electrode can design placement according to need.
In one embodiment, the mass 42 that microelectromechanicdevices devices 40 are included is a single mass, but the invention is not restricted to
Mass 42, can also be split up at least two mass (not shown)s not being joined directly together, such as, but not limited to make this at least by this
Two masses sense to the motion of different directions respectively.
Reference picture 4A, in an embodiment, the multidimensional elastic movement of mass is an eccentric motion.Relative to the first spring S1
The axis AA ' formed, the quality of mass 42 are not evenly distributed in its both sides, therefore when mass 42 revolves around axis AA '
When turning, eccentric motion is produced.Make the non-mode being evenly distributed of the quality of mass 42, such as axis AA ' can be made not to be located at merely
The geometric center lines of mass 42.In another embodiment, groove 46 can be such as, but not limited to opened up in mass 42, also may be used
Reaching makes the non-effect being evenly distributed of the quality of mass 42.The groove 46 that Fig. 4 A are shown is only for example signal, the number of groove 46
Amount, shape or position can change.Because the quality of mass 42 is not evenly distributed in axis AA ' both sides, therefore work as quality
Block 42 can also form eccentric motion when X-Y plane carries out the coplanar motion of X-direction.
In addition, relative to axis BB ', can similarly design make mass 42 quality be not evenly distributed in its two
Side, also can be eccentric motion so when mass 42 carries out the coplanar motion of Y-direction in X-Y plane.
Above-described eccentric motion can promote the accuracy of sensing by differential mode, but the present invention is not limited thereto,
Mass 42 can not be eccentric motion in the motion of all dimensions and only be simple translational motion.
For example, Fig. 5 shows a kind of microelectromechanicdevices devices 50 of another embodiment, and wherein display quality block 52 can not edge
First spring S1 rotates, therefore the in-plane (Z-direction is to go out in-plane perpendicular to X-Y plane) that goes out of mass 52 moves
Only translational motion.To avoid thermal deformation from causing shape to make a variation, the position that each two the first spring S1 in left and right are set can be leaned on as far as possible
It is arranged in the range of the centre 1/3rd on the side of mass 52 or so, or works as in centre position, such as two the first spring S1
When thermal deformation conditions are more harsh, such as two the first spring S1 are arranged at the middle a quarter scope on the side of mass 52 or so
Interior, its ends of range is depending on design requirement, the limitation of the embodiment before being not only restricted to.
In foregoing embodiment, multidimensional elastic movement is not only restricted to three-dimensional so that three dimensional elasticity moves as an example when so implementing, can
For two dimension (such as structure is identical, but reduces motion of the fixed electrode in the one of direction of X, Y, Z without detecting the dimension) or
Being can more three-dimensional more multidimensional (such as increase detecting angular speed or gravity etc.).The number of dimensions of its multidimensional elastic movement, can be according to need
Want and change, be not required to be limited to foregoing implementation content.
The major function of multi-dimensional movement elastic construction 43 is that elastic connection mass 42 allows it to carry out multidimensional elasticity fortune
It is dynamic, and mass 42 is connected to the anchor point 45 in the internal groove 421 of mass 42.Only need to reach above-mentioned function, multidimensional
The topology layout of movement flexible structure 43 can be any suitable mode.Reference picture 4A, 4C, in a preferred embodiment, multidimensional
Movement flexible structure 43 has a frame-type structure, and mass 42 is located in an inner space 431 of frame-type structure.In detail,
Multi-dimensional movement elastic construction 43 includes：One frame structure 433, there is an inner space 431 in it, to house mass 42；Extremely
Few two inner supports 432, corresponding at least two connecting rods 44 are connected to, pass through corresponding at least two connecting rods 44 and corresponding at least two anchors
Point 45 is connected to a substrate 41 of microelectromechanicdevices devices 40, and anchor point 45 is located in the groove 421 of mass 42；And multiple first bullets
Spring S1 and second spring S2, frame structure 433 inwardly connect inner support 432 via second spring S2, and via the first spring S1
The mass 42 is inwardly connected, to assist mass 42 to carry out multidimensional elastic movement M1, M2, M3, inner support 432 and frame structure
A part for mass 42 is not included between 433.In this way, multi-dimensional movement elastic construction 43 has a frame-type structure, and mass 42
In an inner space 431 of frame-type structure.
In the embodiment shown by Fig. 4 A, 4C, 5, connecting rod 44 has the profile of rectangle or straight line.Fig. 6 microcomputer Denso
Putting 60 has the connecting rods 61 of another embodiment, shows that the embodiment of connecting rod is not limited to foregoing geometric shape, end regard anchor point with
Depending on the demand connected between multi-dimensional movement elastic construction.In addition, the shape of groove is also not necessarily limited to Fig. 4 A-4C, shown by 5.
Illustrate the present invention for preferred embodiment above, it is simply described above, only make those skilled in the art easy
In understanding present disclosure, not it is used for limiting the interest field of the present invention.For those skilled in the art, when can be in this hair
It is bright spirit in, immediately think and various equivalence changes.Therefore all concepts under this invention and spiritual equivalent change or modification for it,
It should be included in scope of the presently claimed invention.Any embodiment or claim of the present invention is not necessary to reach institute's public affairs of the invention
The whole purposes or advantage or feature opened.Summary part and title are intended merely to aid in patent document search to be used, and are not used for
Limit the interest field of the present invention.
Claims (9)
1. a kind of microelectromechanicdevices devices, it is characterised in that include：
One substrate；
One mass, comprising at least two grooves, each groove has an inner space and an opening, the inner space relatively this open
Mouthful closer to the center section of the mass；
At least two anchor points, in corresponding groove, and the substrate connection, wherein, anchor point is located in the inner space of groove,
Close to the center section of the mass；
At least two connecting rods, in corresponding groove, connected with corresponding anchor point；
One multi-dimensional movement elastic construction, to assist the mass to carry out multi-dimensional movement, the multi-dimensional movement elastic construction is located at should
The periphery of mass, by least two connecting rods and at least two anchor points and with the substrate connection, the multi-dimensional movement elastic construction
Comprising：
Multiple first springs, to connect the mass, and assist the mass to go out in-plane in one and moved；And
Multiple second springs, each second spring are directly or indirectly connected between a corresponding connecting rod and the first spring, with
The mass is assisted to be moved in together in-plane；
Wherein, the plurality of first spring is connected to two relative edges of the mass, and the opening of at least two grooves is then connected to
Another two relative edge of the mass；And
One frame structure, there is an inner space in it, to house the mass, the frame structure and first spring and the
Two springs are connected, and the second spring is connected via first spring with the frame structure.
2. microelectromechanicdevices devices as claimed in claim 1, wherein, at least two grooves, at least two connecting rods and at least two anchor points are all
It is to be set with mirror image.
3. microelectromechanicdevices devices as claimed in claim 1, wherein, the plurality of first spring is multiple torsional springs, to assist to be somebody's turn to do
Mass carries out a rotary motion.
4. microelectromechanicdevices devices as claimed in claim 3, wherein, the plurality of torsional spring forms a rotation axis, and the quality
The quality of block is non-to be evenly distributed in the rotation axis both sides, so that the rotary motion is eccentric motion.
5. microelectromechanicdevices devices as claimed in claim 1, wherein, the plurality of first spring is multiple translation springs, to assist to be somebody's turn to do
Mass goes out in-plane progress translational motion in this.
6. microelectromechanicdevices devices as claimed in claim 1, wherein, be provided with multiple anchor points in each groove, and each connecting rod with
All anchor points all connect in same groove.
7. microelectromechanicdevices devices as claimed in claim 1, wherein, the multi-dimensional movement is three-dimensional motion.
8. microelectromechanicdevices devices as claimed in claim 1, wherein, the multi-dimensional movement elastic construction has a frame-type structure, and matter
Gauge block is located in an inner space of the frame-type structure.
9. microelectromechanicdevices devices as claimed in claim 1, wherein, the multi-dimensional movement elastic construction includes：
At least two inner supports, it is connected to corresponding at least two connecting rods；And
Aforesaid plurality of first spring and multiple second springs, the frame structure inwardly connect the inner support via the second spring,
And the mass is inwardly connected via first spring, one of mass is not included wherein between the inner support and the frame structure
Point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557781.4A CN105584984B (en) | 2014-10-20 | 2014-10-20 | Microelectromechanicdevices devices |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410557781.4A CN105584984B (en) | 2014-10-20 | 2014-10-20 | Microelectromechanicdevices devices |
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| CN105584984A CN105584984A (en) | 2016-05-18 |
| CN105584984B true CN105584984B (en) | 2018-02-02 |
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| CN201410557781.4A Expired - Fee Related CN105584984B (en) | 2014-10-20 | 2014-10-20 | Microelectromechanicdevices devices |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11415595B2 (en) * | 2019-06-28 | 2022-08-16 | Analog Devices, Inc. | Multiple anchor high frequency accelerometer |
| US20210139314A1 (en) * | 2019-11-07 | 2021-05-13 | Innovative Interface Laboratory Corp. | Linear actuator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060207327A1 (en) * | 2005-03-16 | 2006-09-21 | Zarabadi Seyed R | Linear accelerometer |
| US7240552B2 (en) * | 2005-06-06 | 2007-07-10 | Bei Technologies, Inc. | Torsional rate sensor with momentum balance and mode decoupling |
| US8459111B1 (en) * | 2010-01-23 | 2013-06-11 | Minyao Mao | Angular rate sensor with suppressed linear acceleration response |
| US8555719B2 (en) * | 2011-01-24 | 2013-10-15 | Freescale Semiconductor, Inc. | MEMS sensor with folded torsion springs |
| US8689632B2 (en) * | 2012-01-17 | 2014-04-08 | Freescale Semiconductor, Inc. | Fully decoupled lateral axis gyroscope with thickness-insensitive Z-axis spring and symmetric teeter totter sensing element |
| DE102012219511A1 (en) * | 2012-10-25 | 2014-04-30 | Robert Bosch Gmbh | Micromechanical structure |
| CN103411595B (en) * | 2013-06-18 | 2016-12-28 | 深迪半导体(上海)有限公司 | A kind of gyroscope of single-shaft micro electro mechanical |
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