CN105578844A - Automobile electronic heat radiation device and heat radiation realization method - Google Patents

Automobile electronic heat radiation device and heat radiation realization method Download PDF

Info

Publication number
CN105578844A
CN105578844A CN201510969105.2A CN201510969105A CN105578844A CN 105578844 A CN105578844 A CN 105578844A CN 201510969105 A CN201510969105 A CN 201510969105A CN 105578844 A CN105578844 A CN 105578844A
Authority
CN
China
Prior art keywords
heat
heat radiation
cavity
thermal conductive
conducting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510969105.2A
Other languages
Chinese (zh)
Inventor
罗德祥
杨晓冬
徐胜杰
马伟
张新锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Mobile Car Link Technology Co Ltd
Original Assignee
Shenzhen Mobile Car Link Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Mobile Car Link Technology Co Ltd filed Critical Shenzhen Mobile Car Link Technology Co Ltd
Priority to CN201510969105.2A priority Critical patent/CN105578844A/en
Publication of CN105578844A publication Critical patent/CN105578844A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20372Cryogenic cooling; Nitrogen liquid cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides an automobile electronic heat radiation device and a heat radiation realization method. The heat radiation device comprises a heat conduction board/ a heat conduction cavity which is installed at a heat radiation source of a vehicle-mounted rearview mirror for collecting the heat at the heat radiation source, an electric pump which is connected to a heat conduction plate/ a heat conduction cavity for accelerating the heat flow, and a heat radiation plate/ a heat radiation cavity which is connected to an electric pump for cooling the heat, wherein the heat conduction plate/ the heat conduction cavity, the electric pump and the heat radiation plate/ the heat radiation cavity are connected through the heat radiation pipes. The invention provides a heat radiation device suitable to the rearview mirror navigator, improves the heat radiation efficiency, prolongs the usage efficiency of the product and brings the great convenience to the user. Besides, the automobile electronic heat radiation device is safe, stable, small in vibration and low in noise.

Description

A kind of automotive electronics heat abstractor and heat radiation implementation method thereof
Technical field
The present invention relates to vehicular rear mirror technical field, particularly relate to a kind of automotive electronics heat abstractor and heat radiation implementation method thereof.
Background technology
Rearview mirror navigator is the combination that vehicle mounted guidance follows rearview mirror, the functions such as it integrates artificial background service, set up defences in location, online real-time road, voice assistant, Online Music, car phone, vehicle-mounted WIFI, ANTENN AUDIO, anti-dazzle blue mirror, cyberdog, driving recording, wheelpath, weather forecast, reverse image.After all functions are all run, the temperature of onboard system CPU can rising sharply, so inherently impacts whole hardware system performance.Such as processing speed is slow, or more serious meeting causes system in case of system halt etc., affects the normal use of user.
It can thus be appreciated that prior art has yet to be improved and developed.
Summary of the invention
The technical problem to be solved in the present invention is, for the above-mentioned defect of prior art, a kind of automotive electronics heat abstractor and heat radiation implementation method thereof are provided, be intended to find a kind of heat abstractor being applicable to rearview mirror navigator by the present invention, improve radiating efficiency, extend the utilization rate of product, for user offers convenience.
The technical scheme that technical solution problem of the present invention adopts is as follows:
A kind of automotive electronics heat abstractor, wherein, comprising:
Be placed in the pyrotoxin place of vehicular rear mirror for collecting the heat-conducting plate/thermal conductive cavity of described pyrotoxin place heat;
Be connected with described heat-conducting plate/thermal conductive cavity the electrodynamic pump circulated for accelerated heat;
Be connected with described electrodynamic pump for heating panel/heat dissipation cavity that described heat is carried out cooling;
Described heat-conducting plate/thermal conductive cavity, electrodynamic pump and heating panel/heat dissipation cavity are all connected by radiating tube.
Described automotive electronics heat abstractor, wherein, is provided with thermal conductive silicon glue-line between described heat-conducting plate/thermal conductive cavity and described pyrotoxin.
Described automotive electronics heat abstractor, wherein, is provided with liquid nitrogen in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
A kind of automotive electronics heat abstractor heat radiation implementation method, wherein, comprises step:
A, heat-conducting plate/thermal conductive cavity is placed on pyrotoxin place near vehicular rear mirror;
B, described heat-conducting plate/thermal conductive cavity collect the heat at described pyrotoxin place, simultaneously electrodynamic pump by radiating tube by described heat delivery to heating panel/heat dissipation cavity;
Described heat cools by C, described heating panel/heat dissipation cavity.
Described automotive electronics heat abstractor heat radiation implementation method, wherein, is provided with thermal conductive silicon glue-line between described heat-conducting plate/thermal conductive cavity and described pyrotoxin.
Described automotive electronics heat abstractor heat radiation implementation method, wherein, is provided with liquid nitrogen in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
A kind of automotive electronics heat abstractor provided by the present invention and heat radiation implementation method thereof, described heat abstractor specifically comprises: be placed in the pyrotoxin place of vehicular rear mirror for collecting the heat-conducting plate/thermal conductive cavity of described pyrotoxin place heat; Be connected with described heat-conducting plate/thermal conductive cavity the electrodynamic pump circulated for accelerated heat; Be connected with described electrodynamic pump for heating panel/heat dissipation cavity that described heat is carried out cooling; Described heat-conducting plate/thermal conductive cavity, electrodynamic pump and heating panel/heat dissipation cavity are all connected by radiating tube.The present invention proposes a kind of heat abstractor being applicable to rearview mirror navigator newly, improve radiating efficiency, and safety, steadily, vibrate little, noise is low, extends the utilization rate of product, for user brings great convenience.
Accompanying drawing explanation
Fig. 1 is the functional block diagram of automotive electronics heat abstractor of the present invention.
Fig. 2 is the Application Example schematic diagram of automotive electronics heat abstractor of the present invention.
Fig. 3 is the preferred embodiment flow chart of automotive electronics heat abstractor of the present invention heat radiation implementation method.
Embodiment
The invention discloses a kind of automotive electronics heat abstractor and heat radiation implementation method thereof, for making object of the present invention, technical scheme and advantage clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
With regard to heat radiation material, often kind of its heat conductivility of material is different, arranges from high to low by heat conductivility, is silver respectively, copper, aluminium, steel.Can be too expensive if but make fin with silver, therefore best scheme is copper for adopting.Although aluminium considerably cheaper, obviously thermal conductivity is just not as copper good (approximately only having about 50% of copper).
Heat radiation material conventional is at present copper and aluminium alloy, and the two respectively has its pluses and minuses.The thermal conductivity of copper is good, but price is more expensive, and difficulty of processing is higher, and weight excessive (a lot of fine copper radiator has all exceeded the quantitative limitation of CPU counterweight), thermal capacity is less, and is easily oxidized.And fine aluminium is too soft, can not directly use, be all that the aluminium alloy used just can provide enough hardness, the advantage of aluminium alloy is cheap, lightweight, but thermal conductivity will be far short of what is expected than copper.Some radiator just respectively gets the chief, and aluminium alloy heat radiator base embeds a slice copper coin.
Any device operationally has certain loss, and most loss becomes heat.Low-power device loss is little, without the need to heat abstractor.And high power device loss is large, if do not take cooling measure, then the temperature of tube core can meet or exceed the junction temperature of permission, and device will be damaged.Therefore must add heat abstractor, the most frequently used is exactly installed on a heat sink by power device, utilizes radiator to fall apart to surrounding space by heat, adds radiator fan if desired, strengthen cooling heat dissipation with certain wind speed.The power device of some main equipment also adopts flowing cool water coldplate, and it has better radiating effect.Heat radiation calculating is exactly under certain operating conditions, determines suitable cooling measure and radiator by calculating.Power device is installed on a heat sink.Its major heat flow direction is the bottom being passed to device by tube core, falls apart heat to surrounding space through radiator.If do not have fan to cool with certain wind speed, this is called nature cooling or Natural Heat Convection.
Heat has certain thermal resistance at transmittance process.The thermal resistance being passed to bottom device by component pipe core is RJC, and the thermal resistance between bottom device and radiator is RCS, and the thermal resistance that heat falls apart to surrounding space by radiator is RSA, then total thermal resistance is: RJA=RJC+RCS+RSA.If the maximum power loss of device is PD, and the junction temperature that known device allows be TJ, ambient temperature is TA, can obtain the entire thermal resistance RJA of permission by following formula:
RJA≤(TJ-TA)/PD,
The radiator then calculating maximum permission to the thermal resistance RSA of ambient temperature is:
RSA≤({T_{J}-T_{A}}\over{P_{D}})-(RJC+RCS)。
For for designing the consideration of allowing some leeway, generally set TJ as 125 DEG C.Ambient temperature also will consider worse situation, generally establishes TA=40 DEG C ~ 60 DEG C.The size of RJC is relevant with the size packaging structure of tube core, generally can find from the data information of device.The size of RCS is relevant with the encapsulation of mounting technique and device.If after device adopts thermally conductive grease or heat conductive pad, then installed with radiator, its RCS representative value is 0.10.2 DEG C/W; If device bottom surface is on-insulated, need to add mica-sheet insulation in addition, then its RCS can reach 1 DEG C/W.PD is actual maximum loss power, can calculate according to the condition of work of different components and obtain.Like this, RSA can calculate, according to the optional suitable radiator of RSA value calculated.
Radiator (or claim fin) is made up through Sheet Metal Forming Technology and surface treatment of alloy plate material, and big heat sink is by the aluminium alloy extruded section bar that formed, more machined and surface treatment is made.They have various shape and size to install for different components and the device of different power consumption is selected.Radiator is generally standard component, also can provide section bar, cuts into certain length as requested and make off-gauge radiator by user.The surface treatment of radiator has electrophoretic coating or black oxygen polarization process, its objective is and improves radiating efficiency and insulation property.Can improve 10 ~ 15% under naturally cooling, can improve 3% under ventilating and cooling, electrophoretic coating can withstand voltage 500 ~ 800V.
Consider the defect of above various radiating mode, the present invention proposes the radiator of one kind of multiple Combined design: the passive heat radiation+heat pipe heat radiation of fin+liquid nitrogen heat radiation+flowing heat radiation, a set of perfect cooling system is combined in this several mode, thus reach safe and reliable, steady, shake little, noise is lower, effect of rapid heat dissipation.
Specifically refer to Fig. 1, Fig. 1 is the functional block diagram of the preferred embodiment of automotive electronics heat abstractor of the present invention.Automotive electronics heat abstractor shown in Fig. 1, comprising: be placed in the pyrotoxin place of vehicular rear mirror for collecting the heat-conducting plate/thermal conductive cavity 100 of described pyrotoxin place heat; Be connected with described heat-conducting plate/thermal conductive cavity 100 electrodynamic pump 200 circulated for accelerated heat; Be connected with described electrodynamic pump 200 for heating panel/heat dissipation cavity 300 that described heat is carried out cooling; Described heat-conducting plate/thermal conductive cavity 100, electrodynamic pump 200 and heating panel/heat dissipation cavity 300 are all connected by radiating tube.
Further, thermal conductive silicon glue-line is provided with between described heat-conducting plate/thermal conductive cavity and described pyrotoxin.
Further, liquid nitrogen is provided with in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
Wherein, electrodynamic pump Main Function is the circulation playing accelerated heat, allows heat pass to heating panel/heat dissipation cavity by heat-conducting plate/thermal conductive cavity as early as possible and gets on, thus reach the object of fast cooling.Be filled with liquid nitrogen in the entire system, liquid nitrogen has the effect of refrigeration simultaneously.In whole heat abstractor, controlled the flow direction of heat by electrodynamic pump, ensure that heat energy can dissipate fast.
Please refer to Fig. 2 during actual use, Fig. 2 is the Application Example schematic diagram of automotive electronics heat abstractor of the present invention.As shown in Figure 2, first heat-conducting plate/thermal conductive cavity 21, mainly at CPU place, is therefore tightly placed on pyrotoxin place by the heat radiation point of rearview mirror navigator product, increases one deck heat conductive silica gel between pyrotoxin place and heat-conducting plate/thermal conductive cavity 21 simultaneously.Secondly, flow toward heating panel/heat dissipation cavity 23 direction after heat-conducting plate/thermal conductive cavity 21 gets up heat collection.Preferably, at increase electrodynamic pump 22 between described heat-conducting plate/thermal conductive cavity 21 and described heating panel/heat dissipation cavity 23, electrodynamic pump 22 Main Function is the circulation playing accelerated heat, allows heat pass to heating panel by heat-conducting plate as early as possible and gets on, thus reach the object of cooling.Be filled with liquid nitrogen in the entire system, liquid nitrogen has the effect of refrigeration simultaneously.In the entire system by the flow direction of pump gate control heat, ensure that heat energy can dissipate fast.
Further, described heat-conducting plate/thermal conductive cavity 21, electrodynamic pump 22 and heating panel/heat dissipation cavity 23 are all connected by radiating tube 24.
Therefore, the present invention proposes a kind of heat abstractor being applicable to rearview mirror navigator newly, improve radiating efficiency, and safety, steadily, vibrate little, noise is low, extends the utilization rate of product, for user brings great convenience.
Based on above-described embodiment, the present invention also provides a kind of automotive electronics heat abstractor heat radiation implementation method, as shown in Figure 3, comprising:
S101, heat-conducting plate/thermal conductive cavity is placed on pyrotoxin place near vehicular rear mirror;
S102, described heat-conducting plate/thermal conductive cavity collect the heat at described pyrotoxin place, simultaneously electrodynamic pump by radiating tube by described heat delivery to heating panel/heat dissipation cavity;
Described heat cools by S103, described heating panel/heat dissipation cavity.
Further, thermal conductive silicon glue-line is provided with between described heat-conducting plate/thermal conductive cavity and described pyrotoxin.
Further, liquid nitrogen is provided with in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
In sum, a kind of automotive electronics heat abstractor provided by the present invention and heat radiation implementation method thereof, described heat abstractor specifically comprises: be placed in the pyrotoxin place of vehicular rear mirror for collecting the heat-conducting plate/thermal conductive cavity of described pyrotoxin place heat; Be connected with described heat-conducting plate/thermal conductive cavity the electrodynamic pump circulated for accelerated heat; Be connected with described electrodynamic pump for heating panel/heat dissipation cavity that described heat is carried out cooling; Described heat-conducting plate/thermal conductive cavity, electrodynamic pump and heating panel/heat dissipation cavity are all connected by radiating tube.The present invention proposes a kind of heat abstractor being applicable to rearview mirror navigator newly, improve radiating efficiency, and safety, steadily, vibrate little, noise is low, extends the utilization rate of product, for user brings great convenience.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.

Claims (6)

1. an automotive electronics heat abstractor, is characterized in that, comprising:
Be placed in the pyrotoxin place of vehicular rear mirror for collecting the heat-conducting plate/thermal conductive cavity of described pyrotoxin place heat;
Be connected with described heat-conducting plate/thermal conductive cavity the electrodynamic pump circulated for accelerated heat;
Be connected with described electrodynamic pump for heating panel/heat dissipation cavity that described heat is carried out cooling;
Described heat-conducting plate/thermal conductive cavity, electrodynamic pump and heating panel/heat dissipation cavity are all connected by radiating tube.
2. automotive electronics heat abstractor according to claim 1, is characterized in that, is provided with thermal conductive silicon glue-line between described heat-conducting plate/thermal conductive cavity and described pyrotoxin.
3. automotive electronics heat abstractor according to claim 1, is characterized in that, is provided with liquid nitrogen in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
4. an automotive electronics heat abstractor heat radiation implementation method, is characterized in that, comprise step:
A, heat-conducting plate/thermal conductive cavity is placed on pyrotoxin place near vehicular rear mirror;
B, described heat-conducting plate/thermal conductive cavity collect the heat at described pyrotoxin place, simultaneously electrodynamic pump by radiating tube by described heat delivery to heating panel/heat dissipation cavity;
Described heat cools by C, described heating panel/heat dissipation cavity.
5. automotive electronics heat abstractor heat radiation implementation method according to claim 4, is characterized in that, be provided with thermal conductive silicon glue-line between heat-conducting plate/thermal conductive cavity and described pyrotoxin.
6. automotive electronics heat abstractor heat radiation implementation method according to claim 4, is characterized in that, be provided with liquid nitrogen in described heat-conducting plate/thermal conductive cavity, radiating tube, heating panel/heat dissipation cavity.
CN201510969105.2A 2015-12-22 2015-12-22 Automobile electronic heat radiation device and heat radiation realization method Pending CN105578844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510969105.2A CN105578844A (en) 2015-12-22 2015-12-22 Automobile electronic heat radiation device and heat radiation realization method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510969105.2A CN105578844A (en) 2015-12-22 2015-12-22 Automobile electronic heat radiation device and heat radiation realization method

Publications (1)

Publication Number Publication Date
CN105578844A true CN105578844A (en) 2016-05-11

Family

ID=55888332

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510969105.2A Pending CN105578844A (en) 2015-12-22 2015-12-22 Automobile electronic heat radiation device and heat radiation realization method

Country Status (1)

Country Link
CN (1) CN105578844A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304791A (en) * 2016-08-30 2017-01-04 法乐第(北京)网络科技有限公司 A kind of car-mounted computer with cooling system and vehicle

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174735A1 (en) * 2003-08-26 2005-08-11 Nagui Mankaruse High performance cooling systems
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
CN102267517A (en) * 2010-06-01 2011-12-07 光阳工业股份有限公司 Rearview mirror with turn light
CN204390153U (en) * 2015-01-07 2015-06-10 南京工程学院 A kind of liquid cooling system and liquid nitrogen of utilizing carries out the computer radiator dispelled the heat
CN104736392A (en) * 2012-04-24 2015-06-24 金泰克斯公司 Display mirror assembly
CN204829809U (en) * 2015-08-27 2015-12-02 中山市康盟照明科技有限公司 Be applied to radiating piece of miner's lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174735A1 (en) * 2003-08-26 2005-08-11 Nagui Mankaruse High performance cooling systems
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
CN102267517A (en) * 2010-06-01 2011-12-07 光阳工业股份有限公司 Rearview mirror with turn light
CN104736392A (en) * 2012-04-24 2015-06-24 金泰克斯公司 Display mirror assembly
CN204390153U (en) * 2015-01-07 2015-06-10 南京工程学院 A kind of liquid cooling system and liquid nitrogen of utilizing carries out the computer radiator dispelled the heat
CN204829809U (en) * 2015-08-27 2015-12-02 中山市康盟照明科技有限公司 Be applied to radiating piece of miner's lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304791A (en) * 2016-08-30 2017-01-04 法乐第(北京)网络科技有限公司 A kind of car-mounted computer with cooling system and vehicle

Similar Documents

Publication Publication Date Title
US9622386B2 (en) Graphics card cooler
JP2006032798A (en) Heat pipe heatsink
CN108807313B (en) Microelectronic device heat dissipation device
JP2008098432A (en) Heat-dissipating device of electronic component
CN101018471A (en) No-noise liquid cooling method
CN105578844A (en) Automobile electronic heat radiation device and heat radiation realization method
Nafis et al. System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
TW201212802A (en) Heat dissipation apparatus
CN107172854B (en) Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator
JP2005136211A (en) Cooling device
CN105370599A (en) Cooling device
CN204145276U (en) A kind of radiating structure of frequency converter
CN201035493Y (en) Non-noise liquid cooling computer cabinet
CN207249255U (en) Automobile-used HUD device and vehicle
WO2005015111A1 (en) Radiation member and apparatus, cage and computer support including the radiation member
JP2002372360A (en) Cooling method
CN104898813B (en) Radiator and server
GB2405033A (en) Cooling computer components
CN205726837U (en) Automotive electronics components and parts radiator
CN205375356U (en) Radiator unit of computer
Dong et al. Feasibility verification of reducing the total sound pressure level of multiple cooling fans for fuel cell vehicle
WO2022016339A1 (en) Vehicle, and control system for vehicle
CN210924459U (en) Instruction accelerator card based on cloud computing basic platform
CN106356585A (en) Temperature homogenizing structure of automotive chassis
CN208300186U (en) Air-cooled/water cooling two uses radiator

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20160511