CN105578752A - Soft and rigid combination plate and mobile terminal - Google Patents
Soft and rigid combination plate and mobile terminal Download PDFInfo
- Publication number
- CN105578752A CN105578752A CN201610105192.1A CN201610105192A CN105578752A CN 105578752 A CN105578752 A CN 105578752A CN 201610105192 A CN201610105192 A CN 201610105192A CN 105578752 A CN105578752 A CN 105578752A
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- Prior art keywords
- copper foil
- layer
- foil layer
- rigid flex
- rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 123
- 239000011889 copper foil Substances 0.000 claims abstract description 122
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000002787 reinforcement Effects 0.000 claims description 17
- 239000004744 fabric Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 abstract 5
- 239000000463 material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a soft and rigid combination plate and a mobile terminal. The soft and rigid combination plate comprises a first flexible substrate layer, a first copper foil layer, a rigid layer and a second copper foil layer, wherein the first copper foil layer is laminated on the first flexible substrate layer; the first copper foil layer comprises a reinforcing region and a connection region which is separated from the reinforcing region; the ridged layer covers the reinforcing region; the second copper foil layer is laminated on the connection region; and the second copper foil layer extends along the direction far away from the rigid layer. According to the soft and rigid combination plate and the mobile terminal, provided by the invention, the first copper foil layer comprises the reinforcing region and the connection region, and the reinforcing region and the connection region are connected with the rigid layer and the second copper foil layer respectively. With the adoption of the manner, the second copper foil layer is laminated on the connection region of the first copper foil layer, so that the first copper foil layer and the second copper foil layer can be subjected to wire arrangement, and furthermore, a wire arrangement space of a soft plate part of the soft and rigid combination plate can be increased and wire arrangement requirements on different electronic components by the soft and rigid combination plate are met.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of Rigid Flex and mobile terminal.
Background technology
Rigid Flex be exactly flexible circuit board and rigid wiring board through operations such as pressings, combine by related process requirement, the wiring board with flexible circuit board characteristic and rigid wiring board characteristic of formation.
At present when producing Rigid Flex, usually need the sheet material and the equipment that configure the rigid wiring board of production and flexible circuit board simultaneously, then, after flexible circuit board and rigid wiring board having been produced respectively, the machine such as pressing machine or laminating machine is adopted to press together.
But adopt aforesaid way, flexible circuit board must be consistent with the number of plies that rigid wiring board adopts, to ensure the connection of the Rigid Flex after pressing.And when there being more electronic devices and components to need to be arranged in flexible circuit board, often easily cannot meet because the wiring space of flexible circuit board is not enough.
Summary of the invention
In view of the above-mentioned problems in the prior art, technical problem to be solved by this invention is, provides a kind of Rigid Flex and the mobile terminal that can increase the wiring space of flexible circuit board.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the invention provides a kind of Rigid Flex, described Rigid Flex comprises the first flexible substrate layer, the first copper foil layer, hard layer and the second copper foil layer, described first copper foil layer is laminated in described first flexible substrate layer, described first copper foil layer comprise reinforcement district and with spaced bonding pad, described reinforcement district, described hard layer is covered in described reinforcement district, described second copper foil layer is stacked at described bonding pad, and described second copper foil layer is extended along the direction away from described hard layer.
Wherein, described second copper foil layer is welded on described bonding pad.
Wherein, described second copper foil layer is pressed on described bonding pad by conducting resinl.
Wherein, described Rigid Flex also comprises the first coverlay, and described first copper foil layer also comprises the cloth member district between described reinforcement district and described bonding pad, and described first coverlay is attached in described cloth member district.
Wherein, described Rigid Flex also comprises the second coverlay, is laminated in the second flexible substrate layer on described second copper foil layer and is laminated in the 3rd copper foil layer in described second flexible substrate layer, and described second coverlay is attached on described 3rd copper foil layer.
Wherein, described Rigid Flex also comprises stiffening plate, and described stiffening plate is fixed on described second coverlay and deviates from described 3rd copper foil layer side.
Wherein, described Rigid Flex also comprises line layer and anti-solder ink layer, and described line layer is laminated in the side that described hard layer deviates from described first copper foil layer, and described anti-solder ink layer covers described line layer.
Wherein, described line layer is provided with the through through hole to described first copper foil layer, is provided with the electric conductor connecting described line layer and described first copper foil layer in described through hole.
Wherein, described anti-solder ink layer is provided with welding hole, is provided with the electric component being welded in described line layer in described welding hole.
Second aspect, present invention also offers a kind of mobile terminal, described mobile terminal comprises body, is located at the mainboard of described body interior and the Rigid Flex as described in above-mentioned first aspect, and described Rigid Flex is located on described mainboard, and is electrically connected with described mainboard.
Rigid Flex provided by the invention and mobile terminal, by being laminated in the first flexible substrate layer by the first copper foil layer, then arranging the first copper foil layer and comprise reinforcement district and bonding pad, be connected hard layer and the second copper foil layer respectively in reinforcement district with bonding pad.Adopt aforesaid way, because the second copper foil layer is superimposed upon on the bonding pad of the first copper foil layer, therefore, first copper foil layer and the second copper foil layer all can connect up, thus the wiring space of the soft board part of Rigid Flex can be increased, meet the cabling requirement of Rigid Flex for different electronic devices and components.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the Rigid Flex that the embodiment of the present invention provides;
Fig. 2 is the schematic top plan view of the Rigid Flex that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.Specification subsequent descriptions is for implementing better embodiment of the present invention, and right described description is to illustrate for the purpose of rule of the present invention, and is not used to limit scope of the present invention.Protection scope of the present invention is when being as the criterion depending on the claims person of defining.
See also Fig. 1 and Fig. 2, a kind of Rigid Flex 100 provided by the invention, described Rigid Flex 100 comprises the first flexible substrate layer 10, first copper foil layer 20, hard layer 30 and the second copper foil layer 40.Described first copper foil layer 20 is laminated in described first flexible substrate layer 10, and described first copper foil layer 20 comprises reinforcement district 21 and bonding pad 22 spaced with described reinforcement district 21.Described hard layer 30 is covered in described reinforcement district 21, described second copper foil layer 40 is stacked at described bonding pad 22, described second copper foil layer 40 is extended along the direction away from described hard layer 30, and the area of described second copper foil layer 40 is greater than the area of described first copper foil layer 20.Be understandable that, described Rigid Flex 100 is applied in mobile terminal, and this mobile terminal can be mobile phone, panel computer, notebook computer etc., and described Rigid Flex 100 is responsible for the conduction between the electronic component in mobile terminal.
By connecting described hard layer 30 and described second copper foil layer 40 respectively in the reinforcement district 21 and bonding pad 22 of described first copper foil layer 20, thus make described second copper foil layer 40 and described first copper foil layer 20 all in order to wiring, the wiring space of the soft board part of described Rigid Flex 100 can be added.
In present embodiment, described first flexible substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described first copper foil layer 20 in described first flexible substrate layer 10, and described first flexible substrate layer 10 can provide insulation environment for described first copper foil layer 20 so that on described first copper foil layer 20 etching signal cabling and ground connection cabling.Preferably, the thickness of described first flexible substrate layer 10 can be 20 μm.Described first flexible substrate layer 10 can arrange flex area and non-flex area, described flex area is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described Rigid Flex 100 to connect external device, hard plate can be fixed in described non-flex area, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in mobile terminal.
In present embodiment, described first copper foil layer 20 is plate film being arranged Copper Foil, and the ground connection cabling on described first copper foil layer 20 and signal lead are Copper Foil and form through etching technics according to prescribed route structure.Ground connection cabling on described first copper foil layer 20 and signal lead can be wholely set, and the signal lead on described first copper foil layer 20 realizes the conduction between electric elements, and the ground connection cabling on described first copper foil layer 20 carries out ground connection.
In present embodiment, described hard layer 30 adopts high polymer polypropylene material, and described hard layer 30 has insulating properties characteristic, so that can insulate with described first copper foil layer 20 when arranging devices or All other routes layer on described hard layer 30.Described hard layer 30 correspondence is arranged at the non-flex area of described first flexible substrate layer 10, thus the rigidity of described hard layer 30 can be utilized, the intensity of described Rigid Flex 100 on described non-flex area is increased, makes described Rigid Flex 100 in the not easily bending of described non-flex area.Meanwhile, described hard layer 30 can be protected the circuit of described first copper foil layer 20 at described non-flex area place, increases the structural soundness of described Rigid Flex 100.
In present embodiment, described second copper foil layer 40 is plate film being arranged Copper Foil, and described second copper foil layer 40 etching signal cabling or ground connection cabling can realize signal and connect or grounding connection.The area of described second copper foil layer 40 is greater than the area of described first copper foil layer 20, and preferably, the area of described second copper foil layer 40 can be 5 ~ 10 times of the area of described first copper foil layer 20, so that described second copper foil layer 40 is connected with the bonding pad 22 of described first copper foil layer 20, form the flexible board of one piece of larger area.Adopt aforesaid way, under the production cost of the Rigid Flex of same homalographic, which is lower than the production cost of traditional Rigid Flex, so be conducive to the production cost controlling Rigid Flex.Simultaneously, because described second copper foil layer 40 and the bonding pad 22 of described first copper foil layer 20 are connected to form the flexible board of one piece of larger area, therefore, compared to described Rigid Flex 100, the wiring area of its soft board part increases, so be conducive to meeting the part requirement of described Rigid Flex for different electronic devices and components.
Further, described second copper foil layer 40 is welded on described bonding pad 22.Particularly, described second copper foil layer 40 can adopt the mode of manual welding or thermocompression bonding to be welded on described bonding pad 22, to ensure described second copper foil layer 40 and the connection compactness of described bonding pad 22, in use described second copper foil layer 40 is prevented to be separated with described bonding pad 22.Meanwhile, adopt the mode of welding, described second copper foil layer 40 can be convenient to and be connected with the conduction on described bonding pad 22.Preferably, when described second copper foil layer 40 is welded on described bonding pad 22, tin cream can be adopted to weld as material, thus the welding stability of described second copper foil layer 40 and described bonding pad 22 can be ensured.
Be understandable that, as other execution mode, described second copper foil layer 40 is also pressed on described bonding pad 22 by conducting resinl.Particularly, described conducting resinl can be anisotropy (ACF) conducting resinl.Conducting resinl is adopted to carry out the mode of pressing, while described second copper foil layer 40 can being fitted with described first copper foil layer 20, also can utilize the conductive characteristic of described conducting resinl, thus make to realize conducting electricity between described second copper foil layer 40 with described first copper foil layer 20 to be connected.
Described Rigid Flex 100 also comprises the first coverlay 51, and described first copper foil layer 20 also comprises the cloth member district 23 between described reinforcement district 21 and described bonding pad 22, and described first coverlay 51 is attached in described cloth member district 23.In present embodiment, the flex area of corresponding described first flexible substrate layer 10 in described cloth member district 23 is arranged, so that bending.It is hot-forming that described first coverlay 51 can adopt polyester material to carry out.Described first coverlay 51 by paste adhesive in described cloth member district 23; do not lost to protect the signal lead in described cloth member district 23 and ground connection cabling or damaged; simultaneously; adopt the mode of paste adhesive; also described first coverlay 51 can be made tightr with the connection in described cloth member district 23, prevent described first coverlay 51 be shifted and cannot protect the part cabling exposing described first coverlay 51.
Further, described Rigid Flex 100 also comprises the second flexible substrate layer 61 be laminated on described second copper foil layer 40 and the 3rd copper foil layer 62 be laminated in described second flexible substrate layer 61.Described second substrate layer 61 and described first flexible substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that the setting of described 3rd copper foil layer 62.Material and the structure of described 3rd copper foil layer 62 and described second copper foil layer 40 are consistent, thus the flexible board part making the final described Rigid Flex 100 formed is multi-layer sheet, is convenient to the connection of circuit.
Described Rigid Flex 100 also comprises the second coverlay 52, and described second coverlay 52 is attached on described 3rd copper foil layer 62.In present embodiment, it is hot-forming that described second coverlay 52 can adopt polyester material to carry out.Described second coverlay 52 by paste adhesive, is not lost to protect the signal lead on described 3rd copper foil layer 62 and ground connection cabling or is damaged on described 3rd copper foil layer 62.
In order to ensure the intensity of described 3rd copper foil layer 62 further, described Rigid Flex 100 also comprises stiffening plate 70, and described stiffening plate 70 is fixed on the side that described second coverlay 52 deviates from described 3rd copper foil layer 62.In the present embodiment, described stiffening plate 70 can adopt steel plate or glass-epoxy copper-clad plate (FR4).Described stiffening plate 70 can adopt etch process to fit on described second coverlay 52, to improve the technique of described stiffening plate 70, prevents from puncturing described second coverlay 52.
Further, described Rigid Flex 100 also comprises line layer 80 and anti-solder ink layer 90, and described line layer 80 is laminated in described hard layer 30 and deviates from described first copper foil layer 20 side, and described anti-solder ink layer 90 covers described line layer 80.
In present embodiment, described line layer 80 also can be that Copper Foil is shaping through etch process.When described hard layer 30 is two-layer, the number of plies of described line layer 80 is also two-layer, and two-layer described line layer 80 fits on two-layer described hard layer 30 respectively.Two-layer described line layer 80 can be all arrange circuit, thus increases the circuit configuration of described Rigid Flex 100.
In present embodiment, described anti-solder ink layer 90 is protected the circuit on described line layer 80, prevents the line short on described line layer 80.
Further, described line layer 80 is provided with the through through hole 81 to described first copper foil layer 20, is provided with the electric conductor 82 connecting described line layer 80 and described first copper foil layer 20 in described through hole 81.Described through hole 81 is through described hard layer 30.Utilize line layer 80 described in the conducting of described electric conductor 82 and described first copper foil layer 20, thus conveniently for the circuit on described line layer 80 carries out ground connection, thus make described Rigid Flex 100 structure simple, improve electric conductivity.Described electric conductor 82 can be the copper post through described through hole 80.In other embodiments, the number of described through hole 81 can be multiple, thus realizes described line layer 80 and the conducting of described copper foil layer 50 various ways.
Further, described anti-solder ink layer 90 is provided with welding hole 91, is provided with the electric component 92 being welded in described line layer 80 in described welding hole 91.Described electric component 92 can be the electronic components such as resistance, electric capacity, diode, also can be the devices such as connector, chip or pad.Fill scolding tin in described welding hole 91, to be welded on the circuit of described line layer 80 by described electric component 92, thus realize the function that described Rigid Flex 100 possesses printed circuit board (PCB).
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprises body (not shown), is located at the mainboard (not shown) of described body interior and described Rigid Flex 100, described Rigid Flex 100 is located at described body interior, and is electrically connected with described mainboard.Described mobile terminal can be mobile phone, computer, flat board, handheld device or media player etc.
Rigid Flex provided by the invention and mobile terminal, by being laminated in the first flexible substrate layer by the first copper foil layer, then arranging the first copper foil layer and comprise reinforcement district and bonding pad, be connected hard layer and the second copper foil layer respectively in reinforcement district with bonding pad.Adopt aforesaid way, because the second copper foil layer is superimposed upon on the bonding pad of the first copper foil layer, therefore, first copper foil layer and the second copper foil layer all can connect up, thus the wiring space of the soft board part of Rigid Flex can be increased, meet the cabling requirement of Rigid Flex for different electronic devices and components.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " the first embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a Rigid Flex, it is characterized in that, it comprises the first flexible substrate layer, the first copper foil layer, hard layer and the second copper foil layer, described first copper foil layer is laminated in described first flexible substrate layer, described first copper foil layer comprise reinforcement district and with spaced bonding pad, described reinforcement district, described hard layer is covered in described reinforcement district, and described second copper foil layer is stacked at described bonding pad, and described second copper foil layer is extended along the direction away from described hard layer.
2. Rigid Flex as claimed in claim 1, it is characterized in that, described second copper foil layer is welded on described bonding pad.
3. Rigid Flex as claimed in claim 1, it is characterized in that, described second copper foil layer is pressed on described bonding pad by conducting resinl.
4. Rigid Flex as claimed in claim 1, it is characterized in that, described Rigid Flex also comprises the first coverlay, and described first copper foil layer also comprises the cloth member district between described reinforcement district and described bonding pad, and described first coverlay is attached in described cloth member district.
5. Rigid Flex as claimed in claim 1, it is characterized in that, described Rigid Flex also comprises the second coverlay, is laminated in the second flexible substrate layer on described second copper foil layer and is laminated in the 3rd copper foil layer in described second flexible substrate layer, and described second coverlay is attached on described 3rd copper foil layer.
6. Rigid Flex as claimed in claim 5, it is characterized in that, described Rigid Flex also comprises stiffening plate, and described stiffening plate is fixed on described second coverlay and deviates from described 3rd copper foil layer side.
7. Rigid Flex as claimed in claim 1, it is characterized in that, described Rigid Flex also comprises line layer and anti-solder ink layer, and described line layer is laminated in the side that described hard layer deviates from described first copper foil layer, and described anti-solder ink layer covers described line layer.
8. Rigid Flex as claimed in claim 7, is characterized in that, described line layer is provided with the through through hole to described first copper foil layer, is provided with the electric conductor connecting described line layer and described first copper foil layer in described through hole.
9. Rigid Flex according to claim 7, is characterized in that, described anti-solder ink layer is provided with welding hole, is provided with the electric component being welded in described line layer in described welding hole.
10. a mobile terminal, it is characterized in that, described mobile terminal comprises body, is located at the mainboard of described body interior and Rigid Flex as described in claim 1 to 9 any one, and described Rigid Flex is located on described mainboard, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105192.1A CN105578752B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105192.1A CN105578752B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578752A true CN105578752A (en) | 2016-05-11 |
| CN105578752B CN105578752B (en) | 2019-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105192.1A Expired - Fee Related CN105578752B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578752B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (en) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | Board piece, composite wiring board using the board piece, and openable/closable device |
| CN104768335A (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | Manufacturing method of flexible-rigid board |
| CN105228343A (en) * | 2015-09-22 | 2016-01-06 | 广东欧珀移动通信有限公司 | A kind of Rigid Flex and preparation method thereof |
-
2016
- 2016-02-25 CN CN201610105192.1A patent/CN105578752B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (en) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | Board piece, composite wiring board using the board piece, and openable/closable device |
| CN104768335A (en) * | 2015-04-15 | 2015-07-08 | 深圳市爱升精密电路科技有限公司 | Manufacturing method of flexible-rigid board |
| CN105228343A (en) * | 2015-09-22 | 2016-01-06 | 广东欧珀移动通信有限公司 | A kind of Rigid Flex and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578752B (en) | 2019-02-22 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20190222 |