CN105576046B - A kind of preparation method without main grid welding for solar cell - Google Patents
A kind of preparation method without main grid welding for solar cell Download PDFInfo
- Publication number
- CN105576046B CN105576046B CN201510933299.0A CN201510933299A CN105576046B CN 105576046 B CN105576046 B CN 105576046B CN 201510933299 A CN201510933299 A CN 201510933299A CN 105576046 B CN105576046 B CN 105576046B
- Authority
- CN
- China
- Prior art keywords
- pur
- diaphragm
- copper cash
- melt adhesive
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 56
- 239000004831 Hot glue Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000009739 binding Methods 0.000 claims abstract description 10
- 230000027455 binding Effects 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- 239000012528 membrane Substances 0.000 claims description 4
- 108010025899 gelatin film Proteins 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a kind of preparation method without main grid welding for solar cell, this method includes：Many copper cash are released by copper cash pay off rack to be transported in hot-press arrangement；First hot melt adhesive film and the second hot melt adhesive film are released by the first unreeling structure and the second unreeling structure respectively, first hot melt adhesive film, which is cut, forms multiple first PUR diaphragms, and second hot melt adhesive film is cut and forms multiple second PUR diaphragms；Wherein, the first PUR diaphragm and the second PUR diaphragm are transported in hot-press arrangement with alternateing successively respectively, and the first PUR diaphragm is located at the top of many copper cash, and the second PUR diaphragm is located at the lower section of many copper cash；The many copper cash and the first PUR diaphragm and the second PUR diaphragm are distinguished into hot binding by hot-press arrangement；Make winding action with many copper cash after the first PUR diaphragm and the second PUR diaphragm hot binding by rolling-up mechanism pair.
Description
Technical field
The present invention relates to technical field of solar cell manufacturing, and in particular to a kind of to be welded for solar cell without main grid
The preparation method of band.
Background technology
Crystal silicon solar batteries are a kind of solar energy can be transformed into the electronic component of electric energy.Crystal silicon solar
In the front electrode of battery, electrode structure generally includes crisscross main gate line and secondary grid line, and main gate line and secondary grid line are electrical
It is connected.When there is illumination, cell piece will produce electric current, and electric current flows to the secondary grid line of surface electrode by internal emitter, via
Secondary grid line is collected and then is flowed in battery main gate line and exported.Electric current can produce loss during secondary grid line is collected,
It is this that we are known as the power loss of resistance.Battery main gate line and secondary grid line are in the smooth surface of battery, will necessarily so hide
A part of light irradiation is kept off in battery surface, so as to reduce the effective area of shining light of battery, we term it light for this partial loss
Learn loss.Increase main gate line and the quantity of secondary grid line can improve the capacity gauge for solar cell formation electric current, improve electricity
The conversion efficiency in pond, but if grid line width is without reduction, eclipsing loss will be increased by accelerating.Therefore, electrode knot
The core of the grid line design of structure is between shading and conduction to obtain balance.
In manufacture of solar cells technical foundation now, manufacturer carries to further improve the photovoltaic efficiency of battery
The solution gone out is to increase the main grid quantity of front electrode, becomes many small from two or three thick main grids more than 2 mm wides
Arranged in the narrow line main grid of 1 mm wide, or even using two layers of silver grating line of overlapping printing, conductive effect must be improved.From the angle of technology
From the point of view of degree, these methods can somewhat lift photovoltaic efficiency.However, the ag material cost of required input is far above improved efficiency institute
The return that can be earned, has no to be benefited to industry.From the point of view of production cost, crystal silicon and silver paste are two kinds of most expensive materials,
Can realize improve battery efficiency and need not increase production cost, under being the narrow and small market environment of current profit margin, photovoltaic industry
Technical problem urgently to be resolved hurrily.
The content of the invention
In view of the deficiency that prior art is present, the invention provides a kind of system without main grid welding for solar cell
Preparation Method, the preparation method prepares no main grid welding by heat pressing process, is applied to using copper cash and hot melt adhesive film as material
In solar cell without main grid, can meet shading can meet the requirement of conduction again simultaneously less；The technique mistake of its preparation method
Journey is simple, meets the technical problem of reduction material cost, also simplify in manufacture of solar cells flow simultaneously in silicon chip surface
Realize the complicated technology of high photovoltaic efficient cell structure and the low shading electrode structure of high conductivity.
To achieve these goals, present invention employs following technical scheme：
A kind of preparation method without main grid welding for solar cell, this method includes：Released by copper cash pay off rack
Many copper cash are transported in hot-press arrangement, and many copper cash are located in the same horizontal plane and are arranged mutually parallel；Put by first
Volume mechanism and the second unreeling structure release the first hot melt adhesive film and the second hot melt adhesive film respectively, and first hot melt adhesive film is by first
Cutter device cuts to form multiple first PUR diaphragms, and second hot melt adhesive film is cut to form multiple by the second cutter device
Second PUR diaphragm；Wherein, the first PUR diaphragm and the second PUR diaphragm are respectively by second conveyer and
Two conveyers are transported in hot-press arrangement with alternateing successively, and the first PUR diaphragm is located at many copper cash
Top, the second PUR diaphragm is located at the lower section of many copper cash, also, the first PUR diaphragm and the second heat
Melten gel diaphragm has a spacing distance in the conveying direction；By hot-press arrangement by many copper cash and first hot melt adhesive film
Piece and the second PUR diaphragm difference hot binding；By rolling-up mechanism pair and the first PUR diaphragm and the second PUR diaphragm heat
The many copper cash with reference to after are pressed to make winding action.
Wherein, many copper cash are equally arranged mutually parallel, the spacing between adjacent two copper cash be 6~
10mm。
Wherein, the laying tension of each copper cash is individually adjusted by the copper cash pay off rack, and the scope of laying tension is 5
~50N.
Wherein, the mode that linear velocity constant is respectively adopted in first unreeling structure and the second unreeling structure releases the first heat
Melten gel film and the second hot melt adhesive film.
Wherein, the linear velocity scope that first unreeling structure releases the first hot melt adhesive film is 5~10m/min, described the
The linear velocity scope that two unreeling structures release the second hot melt adhesive film is 5~10m/min.
Wherein, first unreeling structure is identical with the linear velocity of second unreeling structure.
Wherein, the spacing distance of the first PUR diaphragm and the second PUR diaphragm in the conveying direction be 2~
3mm。
Wherein, the copper cash is tinned wird, and first hot melt adhesive film and the second hot melt adhesive film are respectively PO glued membranes.
Wherein, the line footpath of the copper cash is 0.2~0.3mm, the thickness of first hot melt adhesive film and the second hot melt adhesive film
Respectively 0.09~0.11mm.
Wherein, the length and width of the first PUR diaphragm is identical, the length and width of the second PUR diaphragm
Degree is identical.
A kind of preparation method without main grid welding for solar cell provided in an embodiment of the present invention, the preparation method
Using copper cash and hot melt adhesive film as material, no main grid welding is prepared by heat pressing process, applied to the solar-electricity without main grid
Chi Zhong, can meet shading can meet the requirement of conduction again simultaneously less；The technical process of its preparation method is simple, meets reduction material
Expect the technical problem of cost, also simplify in manufacture of solar cells flow while realizing high photovoltaic efficient cell in silicon chip surface
The complicated technology of structure and the low shading electrode structure of high conductivity.
Brief description of the drawings
Fig. 1 is the process chart of the preparation method provided in an embodiment of the present invention without main grid welding；
Fig. 2 is the graphical representation of exemplary of the process of the preparation method provided in an embodiment of the present invention without main grid welding；
Fig. 3 is the structural representation provided in an embodiment of the present invention without main grid welding.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawings to the specific reality of the present invention
The mode of applying is described in detail.The example of these preferred embodiments is illustrated in the accompanying drawings.Shown in accompanying drawing and according to
What the embodiments of the present invention of accompanying drawing description were merely exemplary, and the present invention is not limited to these embodiments.
Here, it should also be noted that, in order to avoid having obscured the present invention because of unnecessary details, in the accompanying drawings only
Show and according to the solution of the present invention closely related structure and/or process step, and eliminate little with relation of the present invention
Other details.
Present embodiments provide a kind of preparation method without main grid welding for solar cell.Refering to Fig. 1 and combine
Fig. 2 and Fig. 3, this method comprises the following steps：
S101, many copper cash are released by copper cash pay off rack be transported in hot-press arrangement, many copper cash are located at same water
Plane is interior and is arranged mutually parallel.Specifically, as shown in Fig. 2 copper cash pay off rack 1, which releases many copper cash 10, is transported to hot-press arrangement
In 2, the laying tension of each copper cash 10 can individually be adjusted by copper cash pay off rack 1, and the scope of laying tension can be 5~50N.
Normally, as shown in figure 3, many copper cash 10 are equally arranged mutually parallel, the spacing d1 between adjacent two copper cash 10 can
To select as 6~10mm.Spacing d1 is set as 8mm in the present embodiment.The quantity of copper cash 10 is main according to welding to be prepared
Width and spacing d1 are set.Line comb was provided with copper cash pay off rack 1, acquisition can be adjusted by adjusting line comb
Spacing d1 size.
S102, by the first unreeling structure and the second unreeling structure multiple first PUR diaphragms and multiple second are provided respectively
PUR diaphragm is transported in hot-press arrangement.Specifically, as shown in Figure 2 and refering to Fig. 3, first is released by the first unreeling structure 3a
Hot melt adhesive film 21, the first hot melt adhesive film 21 is cut to form multiple first PUR diaphragm 21a, Duo Ge by the first cutter device 4a
One PUR diaphragm 21a is fed sequentially into hot-press arrangement 2 by second conveyer 5a；Similarly, by the second unreeling structure 3b
The second hot melt adhesive film 22 is released, the second hot melt adhesive film 22 is cut to form multiple second PUR diaphragms by the second cutter device 4b
22a, multiple second PUR diaphragm 22a are fed sequentially into hot-press arrangement 2 by second conveyer 5b.Further, it is described
First PUR diaphragm 21a and the second PUR diaphragm 22a respectively by second conveyer 5a and second conveyer 5b successively
It is transported to alternateing in hot-press arrangement 2, the first PUR diaphragm 21a is transported to the upper of many copper cash 10
Side, the second PUR diaphragm 22a is transported to the lower section of many copper cash 10, also, the first PUR diaphragm
21a and the second PUR diaphragm 22a have a spacing distance d2 in the conveying direction.
S103, by hot-press arrangement many copper cash and the first PUR diaphragm and the second PUR diaphragm distinguished into hot pressing
With reference to.Specifically, refering to Fig. 2 and Fig. 3, copper cash 10, the first PUR diaphragm 21a and the second hot melt adhesive film 22a are conveyed respectively
To after hot-press arrangement 2, hot-press arrangement 2 by copper cash 10, the first PUR diaphragm 21a and the second hot melt adhesive film 22a hot bindings,
Welding is formed, Fig. 3 is that the part of dotted line in the structural representation without main grid welding that hot binding is obtained, figure represents the first hot melt
Glue film 21a is located at the top of copper cash 10.
S104, by rolling-up mechanism pair and described many after the first PUR diaphragm and the second PUR diaphragm hot binding
Copper cash makees winding action.Specifically, refering to Fig. 2 and Fig. 3, step S103 hot bindings obtain without main grid welding after, by
Rolling-up mechanism 6 makees winding action and reclaims finished product.
Wherein, in step S102, linear velocity constant is respectively adopted in the first unreeling structure 3a and the second unreeling structure 3b
Mode release the first hot melt adhesive film 21 and the second hot melt adhesive film 22.The first unreeling structure 3a releases the first hot melt adhesive film 21
Linear velocity scope can be 5~10m/min, the second unreeling structure 3b releases the linear velocity scope of the second hot melt adhesive film 22
Can be 5~10m/min.Preferably, the first unreeling structure 3a is identical with the linear velocity of the second unreeling structure 3b.
Wherein, refering to Fig. 2, the first PUR diaphragm 21a and the second PUR diaphragm 22a in the conveying direction between
Gauge can be 2~3mm from d2.As shown in figure 3, hot binding obtain without in main grid welding, the first PUR diaphragm 21a and
There is spacing distance d2 between second PUR diaphragm 22a, facilitate butt welding band to be cut when in use.
Wherein, the copper cash 10 used in the present embodiment is tinned wird, and line footpath can be 0.2~0.3mm.Described first
The hot melt adhesive film 22 of hot melt adhesive film 21 and second is respectively PO (polyolefin, polyolefin) glued membrane, first hot melt adhesive film 21
Thickness with the second hot melt adhesive film 22 is respectively 0.09~0.11mm.
In the present embodiment, refering to Fig. 3, the width of the first hot melt adhesive film 21 is D1, and the first hot melt adhesive film 21 is cut by first
Cut device 4a to cut to be formed after multiple first PUR diaphragm 21a, the first PUR diaphragm 21a width is also D1, and length is
L1.The width of second hot melt adhesive film 22 is D2, and the second hot melt adhesive film 22 is cut to form multiple second heat by the second cutter device 4b
After melten gel diaphragm 22a, the width after the second PUR diaphragm 22a is also D2, and length is L2.Normally D1=D2, and setting
L1=D1, L2=D2.
A kind of preparation method without main grid welding for solar cell provided in an embodiment of the present invention, the preparation method
Using copper cash and hot melt adhesive film as material, no main grid welding is prepared by heat pressing process, applied to the solar-electricity without main grid
Chi Zhong, can meet shading can meet the requirement of conduction again simultaneously less；The technical process of its preparation method is simple, meets reduction material
Expect the technical problem of cost, also simplify in manufacture of solar cells flow while realizing high photovoltaic efficient cell in silicon chip surface
The complicated technology of structure and the low shading electrode structure of high conductivity.Further, in the technique of this method, first is set to heat
Glue film and the second PUR diaphragm are located at the both sides of copper cash, and in being staggered, one side, Ke Yiyou are placed on compared to by glued membrane
Effect avoids copper cash broken string there is provided operating efficiency, reduces cost.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability is included, so that process, method, article or equipment including a series of key elements not only will including those
Element, but also other key elements including being not expressly set out, or also include being this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or equipment including the key element.
Described above is only the embodiment of the application, it is noted that for the ordinary skill people of the art
For member, on the premise of the application principle is not departed from, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (9)
1. a kind of preparation method without main grid welding for solar cell, it is characterised in that this method includes：
Many copper cash are released by copper cash pay off rack to be transported in hot-press arrangement, many copper cash are located in the same horizontal plane and phase
Mutual parallel arrangement；
First hot melt adhesive film and the second hot melt adhesive film, first heat are released by the first unreeling structure and the second unreeling structure respectively
Melten gel film is cut to form multiple first PUR diaphragms by the first cutter device, and second hot melt adhesive film is by the second cutter device
Cutting forms multiple second PUR diaphragms；Wherein, the first PUR diaphragm and the second PUR diaphragm are respectively by first
Conveyer and second conveyer are transported in hot-press arrangement with alternateing successively, and the first PUR diaphragm is located at institute
The top of many copper cash is stated, the second PUR diaphragm is located at the lower section of many copper cash, also, first PUR
Diaphragm and the second PUR diaphragm have a spacing distance in the conveying direction；First unreeling structure and the second unreeling structure
The mode that linear velocity constant is respectively adopted releases the first hot melt adhesive film and the second hot melt adhesive film；
The many copper cash and the first PUR diaphragm and the second PUR diaphragm are distinguished into hot binding by hot-press arrangement；
Received by rolling-up mechanism pair with many copper cash after the first PUR diaphragm and the second PUR diaphragm hot binding
Scrolling is made.
2. the preparation method without main grid welding according to claim 1 for solar cell, it is characterised in that described
Many copper cash are equally arranged mutually parallel, and the spacing between adjacent two copper cash is 6~10mm.
3. the preparation method without main grid welding according to claim 2 for solar cell, it is characterised in that each
The laying tension of the copper cash is individually adjusted by the copper cash pay off rack, and the scope of laying tension is 5~50N.
4. the preparation method without main grid welding according to claim 1 for solar cell, it is characterised in that described
The linear velocity scope that first unreeling structure releases the first hot melt adhesive film is 5~10m/min, and second unreeling structure releases second
The linear velocity scope of hot melt adhesive film is 5~10m/min.
5. the preparation method without main grid welding according to claim 4 for solar cell, it is characterised in that described
First unreeling structure is identical with the linear velocity of second unreeling structure.
6. according to any described preparation methods without main grid welding for solar cell of claim 1-5, its feature exists
In the spacing distance of the first PUR diaphragm and the second PUR diaphragm in the conveying direction is 2~3mm.
7. the preparation method without main grid welding according to claim 6 for solar cell, it is characterised in that described
Copper cash is tinned wird, and first hot melt adhesive film and the second hot melt adhesive film are respectively PO glued membranes.
8. the preparation method without main grid welding according to claim 6 for solar cell, it is characterised in that described
The line footpath of copper cash is 0.2~0.3mm, the thickness of first hot melt adhesive film and the second hot melt adhesive film is respectively 0.09~
0.11mm。
9. the preparation method without main grid welding according to claim 6 for solar cell, it is characterised in that described
The length and width of first PUR diaphragm is identical, and the length and width of the second PUR diaphragm is identical.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933299.0A CN105576046B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method without main grid welding for solar cell |
| PCT/CN2016/089966 WO2017101435A1 (en) | 2015-12-15 | 2016-07-14 | Method for making main-grid-free welding strip for solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933299.0A CN105576046B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method without main grid welding for solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105576046A CN105576046A (en) | 2016-05-11 |
| CN105576046B true CN105576046B (en) | 2017-08-11 |
Family
ID=55885975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510933299.0A Active CN105576046B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method without main grid welding for solar cell |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105576046B (en) |
| WO (1) | WO2017101435A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576046B (en) * | 2015-12-15 | 2017-08-11 | 黄河水电光伏产业技术有限公司 | A kind of preparation method without main grid welding for solar cell |
| CN106393815B (en) * | 2016-08-31 | 2018-04-06 | 西安泰力松新材料股份有限公司 | A kind of wire/film compounding machine and its control device and method |
| CN107887476B (en) * | 2017-12-08 | 2024-03-01 | 无锡奥特维科技股份有限公司 | Battery piece series welding machine and battery piece series welding method |
| CN107887477B (en) * | 2017-12-11 | 2024-03-01 | 无锡奥特维科技股份有限公司 | Battery piece serial welding machine and battery piece serial welding method |
| CN108183148B (en) * | 2017-12-25 | 2024-03-01 | 无锡奥特维科技股份有限公司 | Membrane tape separating mechanism and welding tape processing device |
| CN109755345A (en) * | 2018-11-28 | 2019-05-14 | 米亚索能光伏科技有限公司 | A kind of solar panel and preparation method thereof |
| CN110165022A (en) * | 2019-06-06 | 2019-08-23 | 苏州迈展自动化科技有限公司 | A kind of Preparation equipment of solar battery metal wire film |
| CN110277474B (en) * | 2019-06-06 | 2021-12-07 | 苏州迈展自动化科技有限公司 | Preparation method of metal wire film of solar cell |
| CN110246929B (en) * | 2019-06-06 | 2021-12-07 | 苏州迈展自动化科技有限公司 | Solar photovoltaic module hot link process method |
| CN112349805B (en) * | 2019-08-08 | 2022-09-13 | 苏州阿特斯阳光电力科技有限公司 | Photovoltaic module preparation method |
| CN112226177B (en) * | 2020-09-18 | 2022-08-16 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, solder strip composite and battery piece composite |
| CN112226169B (en) * | 2020-09-25 | 2022-11-18 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body |
| CN112289889A (en) * | 2020-10-20 | 2021-01-29 | 无锡奥特维科技股份有限公司 | Battery string production method |
| CN112786727B (en) * | 2021-02-01 | 2022-11-22 | 无锡市联鹏新能源装备有限公司 | Composite membrane for mutual combination of main-grid-free heterojunction solar cell modules and preparation method thereof |
| CN114283998B (en) * | 2021-12-28 | 2024-04-12 | 苏州光汇新能源科技有限公司 | Wire mesh production device, solar cell interconnection system and method thereof |
| CN115224158A (en) * | 2022-06-30 | 2022-10-21 | 无锡奥特维科技股份有限公司 | Battery string film pasting device and film pasting method |
| CN115352939A (en) * | 2022-10-19 | 2022-11-18 | 常州盛沅新材料科技有限公司 | Packaging film winding and unwinding device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10239845C1 (en) * | 2002-08-29 | 2003-12-24 | Day4 Energy Inc | Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| JP2008288278A (en) * | 2007-05-15 | 2008-11-27 | Sharp Corp | Manufacturing process of solar cell module |
| WO2009076740A1 (en) * | 2007-12-18 | 2009-06-25 | Day4 Energy Inc. | Photovoltaic module with edge access to pv strings, interconnection method, apparatus, and system |
| CN201362018Y (en) * | 2009-03-13 | 2009-12-16 | 无锡朗盛线缆材料有限公司 | Metallic foil tape tectorial membrane secondary heat pressing technology device |
| CN103325848A (en) * | 2013-06-22 | 2013-09-25 | 深圳市华光达科技有限公司 | Laminated solder strip and manufacturing method thereof |
| CN103325875A (en) * | 2013-06-23 | 2013-09-25 | 深圳市华光达科技有限公司 | Current collecting device of novel solar cell and manufacturing technology of current collecting device |
| CN105576046B (en) * | 2015-12-15 | 2017-08-11 | 黄河水电光伏产业技术有限公司 | A kind of preparation method without main grid welding for solar cell |
-
2015
- 2015-12-15 CN CN201510933299.0A patent/CN105576046B/en active Active
-
2016
- 2016-07-14 WO PCT/CN2016/089966 patent/WO2017101435A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017101435A1 (en) | 2017-06-22 |
| CN105576046A (en) | 2016-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105576046B (en) | A kind of preparation method without main grid welding for solar cell | |
| CN100431175C (en) | Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module | |
| CN102473794B (en) | Method for producing a foil-like electrical connector for solar cells, connecting element produced according to said method, and method for electrically connecting at least two solar cells to form a solar module | |
| US20180138342A1 (en) | Solar cell piece, solar cell module, solar piece unit and preparation method therefor | |
| CN106206817B (en) | Solar cell module and preparation method thereof | |
| JP6196231B2 (en) | Interconnection utilizing automated flexible solar cell manufacturing and expanded metal mesh rolls | |
| CN102694037B (en) | Connector electrode, solar cell module and method for electrically connecting solar cells | |
| CN104137271A (en) | Method and device for producing a solar module and a solar module having flexible thin-film solar cells | |
| US20220173261A1 (en) | Photovoltaic cell and string and associated methods | |
| CN108574025B (en) | Method for manufacturing laminated tile assembly | |
| CN103022201A (en) | Crystal silicon solar battery module and manufacturing method thereof | |
| JP6045878B2 (en) | Solar cell module | |
| EP3046151A1 (en) | Method and apparatus of fabricating an interconnector assembly | |
| CN102751361A (en) | Back-contact solar battery string and production method thereof | |
| CN103066151A (en) | Manufacturing method of back-contacted solar cell bunches | |
| CN108340037A (en) | A kind of shaping of reflective solder strip and welding method | |
| CN115911162A (en) | Back contact photovoltaic module and preparation method thereof | |
| JP4085304B2 (en) | Manufacturing method of solar cell module | |
| CN115241294A (en) | Photovoltaic laminated tile assembly and preparation method thereof | |
| JP2004153137A (en) | Method and apparatus for manufacturing solar cell module | |
| CN202749390U (en) | Back contact solar battery string | |
| JP2011044751A (en) | Solar cell module | |
| SE1430133A1 (en) | Method of Interconnecting Single Solar Cells into Solar CellModules | |
| CN202598659U (en) | Floor heating device of electrical heating unit | |
| CN220491897U (en) | Composite brazing strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220818 Address after: No. 43, Wusi West Road, Chengxi District, Xining City, Qinghai Province 810007 Patentee after: QINGHAI HUANGHE HYDROPOWER DEVELOPMENT Co.,Ltd. Patentee after: State Power Investment Group Qinghai Photovoltaic Industry Innovation Center Co.,Ltd. Patentee after: YELLOW RIVER HYDROPOWER PHOTOVOLTAIC INDUSTRY TECHNOLOGY Co.,Ltd. Address before: 810007 No. 20, Kunlun East Road, Xining City, Qinghai Province Patentee before: YELLOW RIVER HYDROPOWER PHOTOVOLTAIC INDUSTRY TECHNOLOGY Co.,Ltd. |