CN105575897A - Method of manufacturing frame unit - Google Patents
Method of manufacturing frame unit Download PDFInfo
- Publication number
- CN105575897A CN105575897A CN201510736995.2A CN201510736995A CN105575897A CN 105575897 A CN105575897 A CN 105575897A CN 201510736995 A CN201510736995 A CN 201510736995A CN 105575897 A CN105575897 A CN 105575897A
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- Prior art keywords
- cutting belt
- ring
- shaped frame
- plate object
- cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The invention provides a method for manufacturing a frame unit, and the method can prevent the peeling of a cutting belt. The method comprises the steps: the pasting operation of the cutting belt (17): pasting a plate-shaped object (11) on an adhesive surface of the cutting belt (17); the clamping: clamping a region, closer to the outside than the plate-shaped object (11), of the cutting belt (17) through clamping units (14, 24, 34, 44); the expanding: enabling the clamping units (14, 24, 34, 44) to move and expanding the cutting belt (17); the pasting of an annular frame: enabling an annular frame (21) with big and small opening parts which can store the plate-shaped object (11) to be pasted on the adhesive surface of the cutting belt (17) when the cutting belt (17) remains expanded, and storing the plate-shaped object (11) in the opening part of the annular frame (21); the heating of the cutting belt (17): heating the region where the annular frame (21) is located, and improving the sealing of the annular frame (21) and the cutting belt (17); and the cutting of the cutting belt (17): cutting the cutting belt (17) at a place which is corresponding to the annular frame (21), and completing the frame assembly.
Description
Technical field
The present invention relates to the manufacture method of the frame assembly of the plate object by ring-shaped frame support semi-conductor wafers etc.
Background technology
In order to the plate object taking semiconductor wafer as representative is divided into multiple chip, use cutting tool or laser beam etc. on plate object, form the starting point of segmentation, the processing method of this after-applied external force is able to practicality.In this processing method, such as, expand the cutting belt attached on plate object, thus apply the external force required for segmentation.
In addition, become large street in order to maintain by the expansion of cutting belt, sometimes the cutting belt after expansion is bonded on ring-shaped frame (hereinafter referred to as ring-shaped frame), and form the frame assembly (such as, patent documentation 1 reference) of supporting wafer.
By as above expansion after cutting belt be fixed on ring-shaped frame time, cutting belt can become be difficult to shrink, therefore chip interval can not in time through and diminish.Thus, by chip from the pickup etc. that cutting belt is taken off time, chip contact to each other can be prevented.
Patent documentation 1: Japanese Unexamined Patent Publication 2014-13807 publication
But, when having expanded cutting belt as mentioned above, the larger stress on shrinkage direction may be produced and suitably cannot form frame assembly.Such as, after fitting tightly on ring-shaped frame by cutting belt, be cut into circle, then cutting belt can be curling and peel off from ring-shaped frame in cutting part office.
Summary of the invention
The present invention has put in view of the above problems, its object is to provide a kind of manufacture method preventing the frame assembly of the stripping of cutting belt.
The invention provides a kind of manufacture method of frame assembly, this frame assembly is formed with the plate object splitting starting point or the plate object being split into each chip along many segmentation preset lines of intersecting by ring-shaped frame supporting along many segmentation preset lines of intersecting, the feature of this manufacture method is, comprise: cutting belt attaches step, and the adhesive surface of cutting belt being greater than plate object attaches plate object; Gripping step, after implementing this cutting belt attaching step, clamps the ratio plate object region in the outer part of this cutting belt by grip unit; Expansion step, after implementing this gripping step, mobile grip unit and expand this cutting belt; Ring-shaped frame attaches step, after implementing this expansion step, this cutting belt is remained the state of expansion, this ring-shaped frame of the peristome with the size of storage plate object is attached on this adhesive surface of this cutting belt simultaneously, and receives plate object in this peristome of this ring-shaped frame; Cutting belt heating steps, after implementing this ring-shaped frame attaching step, heats the region being pasted with this ring-shaped frame of this cutting belt, improves the adaptation between this ring-shaped frame and this cutting belt; And cutting belt cuts off step, after implementing this cutting belt heating steps, this cutting belt is cut off in the position corresponding with this ring-shaped frame, completes this frame assembly.
The present invention is preferably configured to, and after implementing this cutting belt heating steps, and cuts off before step in this cutting belt of enforcement, also has cutting belt cooling step, in this cutting belt cooling step, this cutting belt is cooled to room temperature by the region of heating.
The effect of invention
In the manufacture method of frame assembly of the present invention, cutting belt remained expansion state and after the ring-shaped frame be attached at by ring-shaped frame on the adhesive surface of cutting belt attaches step implementing, implement the region being pasted with ring-shaped frame of heating cutting belt to improve the cutting belt heating steps of the adaptation between ring-shaped frame and cutting belt, therefore by cutting belt correspond to ring-shaped frame position cut off time, cutting belt can be prevented to be stripped from ring-shaped frame.
Accompanying drawing explanation
Fig. 1 is the stereogram of the structure example schematically showing extension fixture.
Fig. 2 is the plane graph being schematically illustrated in the plate object that cutting belt attaches.
(A) of Fig. 3 is the cutaway view schematically showing gripping step, and (B) of Fig. 3 is the cutaway view schematically showing expansion step, and (C) of Fig. 3 schematically shows that ring-shaped frame attaches the cutaway view of step.
(A) of Fig. 4 is the cutaway view schematically showing cutting belt heating steps, and (B) of Fig. 4 is the cutaway view schematically showing cutting belt cooling step, and (C) of Fig. 4 schematically shows that cutting belt cuts off the cutaway view of step.
Label declaration
2: extension fixture, 4: base station, 4a: upper surface, 6: elevating mechanism, 8: workbench, move base station at 10: the first, 12: the first travel mechanisms (mobile unit), 14: the first clamp assemblies (grip unit), assembly on the upside of in the of 16: the first, arm on the upside of in the of 16a: the first, abutting part on the upside of in the of 16b: the first, elevating mechanism on the upside of in the of 16c: the first, assembly on the downside of in the of 18: the first, arm on the downside of in the of 18a: the first, abutting part on the downside of in the of 18b: the first, elevating mechanism on the downside of in the of 18c: the first, move base station at 20: the second, 22: the second travel mechanisms (mobile unit), 24: the second clamp assemblies (grip unit), assembly on the upside of in the of 26: the second, arm on the upside of in the of 26a: the second, abutting part on the upside of in the of 26b: the second, elevating mechanism on the upside of in the of 26c: the second, assembly on the downside of in the of 28: the second, arm on the downside of in the of 28a: the second, abutting part on the downside of in the of 28b: the second, elevating mechanism on the downside of in the of 28c: the second, 30: the three move base station, 32: the three travel mechanisms' (mobile unit), 34: the three clamp assemblies (grip unit), assembly on the upside of in the of 36: the three, arm on the upside of in the of 36a: the three, abutting part on the upside of in the of 36b: the three, elevating mechanism on the upside of in the of 36c: the three, assembly on the downside of in the of 38: the three, arm on the downside of in the of 38a: the three, abutting part on the downside of in the of 38b: the three, elevating mechanism on the downside of in the of 38c: the three, 40: the four move base station, 42: the four travel mechanisms' (mobile unit), 44: the four clamp assemblies (grip unit), assembly on the upside of in the of 46: the four, arm on the upside of in the of 46a: the four, abutting part on the upside of in the of 46b: the four, elevating mechanism on the upside of in the of 46c: the four, assembly on the downside of in the of 48: the four, arm on the downside of in the of 48a: the four, abutting part on the downside of in the of 48b: the four, 50: heater, 50a: heating part, 52: cooling device, 52a: cooling end, 54: cutter, 11: plate object, 11a: front (upper surface), 11b: the back side (lower surface), 13: segmentation preset lines (line of cut), 15: device, 17: cutting belt, 19: chip, 21: ring-shaped frame, D1: first direction, D2: second direction.
Embodiment
With reference to accompanying drawing, embodiments of the present invention are described.The manufacture method of the frame assembly of present embodiment comprises cutting belt and attaches step, gripping step, expansion step, ring-shaped frame attaching step, cutting belt heating steps, cutting belt cooling step and cutting belt cut-out step.
Attach in step in cutting belt, the adhesive surface of cutting belt attaches plate object.In gripping step, by the ratio plate object region in the outer part of the grip unit clamping cutting belt of extension fixture.In expansion step, mobile grip unit also expands cutting belt.Attach in step at ring-shaped frame, cutting belt is remained expansion state, ring-shaped frame is attached on the adhesive surface of cutting belt simultaneously.
In cutting belt heating steps, the region being pasted with ring-shaped frame of heating cutting belt, to improve the adaptation between ring-shaped frame and cutting belt.In cutting belt cooling step, cutting belt is cooled to room temperature by the region of heating.Cut off in step in cutting belt, cutting belt is cut off, to complete frame assembly in the position corresponding to ring-shaped frame.Below, the manufacture method of the frame assembly of present embodiment is described in detail.
Fig. 1 is the stereogram of the structure example being schematically illustrated in the extension fixture used in present embodiment.In addition, a part of structural element of extension fixture is eliminated in Fig. 1.As shown in Figure 1, extension fixture 2 has the base station 4 supporting each structure.
Be configured with elevating mechanism 6 in the centre of the upper surface 4a of base station 4, the upper end of this elevating mechanism 6 is fixed with the discoid workbench 8 for placing plate object 11 (with reference to Fig. 2 etc.).Workbench 8 is such as formed as the size with plate object 11 equal extent, and is moved at above-below direction by elevating mechanism 6.
Be configured with near workbench 8 and can move base station 10 relative to first of base station 4 movement.First moves base station 10 links with the first travel mechanism (mobile unit) 12 be arranged on base station 4, and moves on the first direction D1 of upper surface being roughly parallel to workbench 8.
The first clamp assemblies (grip unit) 14 that base station 10 is provided with the cutting belt 17 (with reference to Fig. 2 etc.) that clamping plate object 11 attaches is moved first.First clamp assemblies 14 is made up of assembly 18 on the downside of assembly on the upside of first 16 and first.
On the upside of in the of first assembly 16 comprise roughly L-shaped first on the upside of arm 16a.On the upside of in the of first the front of arm 16a be fixed be connected in cutting belt 17 first on the upside of abutting part 16b.
On the upside of in the of first, abutting part 16b is configured in when overlooking than workbench 8 region in the outer part.In addition, abutting part 16b is formed as being roughly parallel to the upper surface of workbench 8 and the linearity that the second direction D2 roughly orthogonal with first direction D1 extends on the upside of first.On the upside of in the of first the base end side of arm 16a link first move base station 10 is arranged first on the upside of elevating mechanism 16c.
Similarly, on the downside of first assembly 18 comprise roughly L-shaped first on the downside of arm 18a.On the downside of in the of first the front of arm 18a be fixed be connected in cutting belt 17 first on the downside of abutting part 18b.
On the downside of in the of first, abutting part 18b is configured at the position corresponding with abutting part 16b on the upside of in the of first of assembly on the upside of in the of first 16.That is, be configured at than workbench 8 position in the outer part when abutting part 18b overlooks on the downside of first.In addition, abutting part 18b is formed as the linearity extended in a second direction d 2 on the downside of first.On the downside of in the of first the base end side of arm 18a link first move base station 10 is arranged first on the downside of elevating mechanism 18c.
When clamping cutting belt 17 by the first clamp assemblies 14 as constructed as above, such as, on the upside of making first by elevating mechanism 16c on the upside of first, abutting part 16b declines, and makes it be connected to the upper surface of cutting belt 17.
In addition, on the downside of making first by elevating mechanism 18c on the downside of first, abutting part 18b rises, and makes it be connected to the lower surface of cutting belt 17.Thus, cutting belt 17 by extend in a second direction d 2 first on the upside of on the downside of abutting part 16b and first abutting part 18b be clamped in than in plate object 11 clamping zone in the outer part.
The position relative with the first clamp assemblies 14 across workbench 8 in the first direction dl, is configured with second clamp assemblies (grip unit) 24 of clamping cutting belt 17.The structure of the second clamp assemblies 24 is identical with the structure of the first clamp assemblies 14.
That is, the second clamp assemblies 24 is arranged at second and moves base station 20.This second is moved base station 20 and is moved in the first direction dl by the second travel mechanism (mobile unit) 22.In addition, the second clamp assemblies 24 is made up of assembly 28 on the downside of assembly on the upside of second 26 and second.
On the upside of in the of second assembly 26 comprise roughly L-shaped second on the upside of arm 26a.On the upside of second the front of arm 26a be fixed be connected in cutting belt 17 second on the upside of abutting part 26b.
Be configured in when on the upside of in the of second, abutting part 26b overlooks than in workbench 8 region in the outer part.In addition, abutting part 26b is formed as the linearity extended in a second direction d 2 on the upside of second.On the upside of second the base end side of arm 26a link second move base station 20 is arranged second on the upside of elevating mechanism 26c.
Similarly, on the downside of second assembly 28 comprise roughly L-shaped second on the downside of arm 28a.On the downside of in the of second the front of arm 28a be fixed be connected in cutting belt 17 second on the downside of abutting part 28b.
On the downside of in the of second, abutting part 28b is configured in the position corresponding with abutting part 26b on the upside of in the of second of assembly on the upside of in the of second 26.That is, abutting part 28b is configured in when overlooking than workbench 8 position in the outer part on the downside of second.In addition, abutting part 28b is formed as the linearity extended in a second direction d 2 on the downside of second.On the downside of in the of second the base end side of arm 28a link second move base station 20 is arranged second on the downside of elevating mechanism 28c.
When clamping cutting belt 17 by the second clamp assemblies 24, such as, on the upside of making second by elevating mechanism 26c on the upside of second, abutting part 26b declines, and makes it be connected to the upper surface of cutting belt 17.
In addition, on the downside of making second by elevating mechanism 28c on the downside of second, abutting part 28b rises, and makes it be connected to the lower surface of cutting belt 17.Thus, cutting belt 17 by extend in a second direction d 2 second on the upside of on the downside of abutting part 26b and second abutting part 28b be clamped in than in plate object 11 clamping zone in the outer part.
And then, if make to hold the first clamp assemblies 14 of cutting belt 17 by the first travel mechanism 12 and the second travel mechanism 22 and the second clamp assemblies 24 leaves in the first direction dl in the opposite directions to each other, then can expand cutting belt 17 in the first direction dl.
In the position adjacent with the second clamp assemblies 24 with the first clamp assemblies 14, be configured with the 3rd clamp assemblies (grip unit) 34 of clamping cutting belt 17.The similar of the 3rd clamp assemblies 34 is in the structure of the first clamp assemblies 14 and the second clamp assemblies 24.
3rd clamp assemblies 34 is arranged at the 3rd and moves base station 30.3rd moves base station 30 is moved in a second direction d 2 by the 3rd travel mechanism's (mobile unit) 32.In addition, the 3rd clamp assemblies 34 is consisted of assembly 38 on the downside of assembly 36 and the 3rd on the upside of the 3rd.
On the upside of in the of 3rd assembly 36 comprise linearity the 3rd on the upside of arm 36a.On the upside of the 3rd, the front of arm 36a is fixed with and is connected to abutting part 36b on the upside of the 3rd in cutting belt 17.
On the upside of in the of 3rd, abutting part 36b is configured in when overlooking than workbench 8 region in the outer part.In addition, abutting part 36b is formed as the linearity extended in the first direction dl on the upside of the 3rd.On the upside of the 3rd the base end side of arm 36a link the 3rd move base station 30 is arranged the 3rd on the upside of elevating mechanism 36c.
Similarly, on the downside of the 3rd assembly 38 comprise linearity the 3rd on the downside of arm 38a.On the downside of in the of 3rd, the front of arm 38a is fixed with and is connected to abutting part 38b on the downside of the 3rd in cutting belt 17.
On the downside of in the of 3rd, abutting part 38b is configured in the position corresponding with abutting part 36b on the upside of in the of the 3rd of assembly 36 on the upside of in the of the 3rd the.That is, abutting part 38b is configured in when overlooking than workbench 8 position in the outer part on the downside of the 3rd.In addition, abutting part 38b is formed as the linearity extended in the first direction dl on the downside of the 3rd.On the downside of the 3rd the base end side of arm 38a link the 3rd move base station 30 is arranged the 3rd on the downside of elevating mechanism 38c.
When clamping cutting belt 17 by the 3rd clamp assemblies 34, such as, on the upside of making the 3rd by elevating mechanism 36c on the upside of the 3rd, abutting part 36b declines, and makes it be connected to the upper surface of cutting belt 17.
In addition, on the downside of making the 3rd by elevating mechanism 38c on the downside of the 3rd, abutting part 38b rises, and makes it be connected to the lower surface of cutting belt 17.Thus, cutting belt 17 by extend in the first direction dl the 3rd on the upside of on the downside of abutting part 36b and the 3rd abutting part 38b be clamped in than in plate object 11 clamping zone in the outer part.
In a second direction d 2 across the position that workbench 8 is relative with the 3rd clamp assemblies 34, be configured with the 4th clamp assemblies (grip unit) 44 of clamping cutting belt 17.The structure of the 4th clamp assemblies 44 is identical with the structure of the 3rd clamp assemblies 34.
That is, the 4th clamp assemblies 44 is arranged at the 4th and moves base station 40.4th moves base station 40 is moved in a second direction d 2 by the 4th travel mechanism's (mobile unit) 42.In addition, the 4th clamp assemblies 44 is consisted of assembly 48 on the downside of assembly 46 and the 4th on the upside of the 4th.
On the upside of in the of 4th assembly 46 comprise linearity the 4th on the upside of arm 46a.On the upside of in the of 4th, the front of arm 46a is fixed with and is connected to abutting part 46b on the upside of the 4th in cutting belt 17.In addition, a part of abutting part 46b on the upside of in the of the 4th is eliminated in Fig. 1.
On the upside of in the of 4th, abutting part 46b is configured in when overlooking than workbench 8 region in the outer part.In addition, abutting part 46b is formed as the linearity extended in the first direction dl on the upside of the 4th.On the upside of in the of 4th the base end side of arm 46a link the 4th move base station 40 is arranged the 4th on the upside of elevating mechanism 46c.
Similarly, on the downside of the 4th assembly 48 comprise linearity the 4th on the downside of arm 48a.On the downside of the 4th, the front of arm 48a is fixed with and is connected to abutting part 48b on the downside of the 4th in cutting belt 17.
On the downside of in the of 4th, abutting part 48b is configured in the position corresponding with abutting part 46b on the upside of in the of the 4th of assembly 46 on the upside of in the of the 4th the.That is, abutting part 48b is configured in when overlooking than workbench 8 position in the outer part on the downside of the 4th.In addition, abutting part 48b is formed as the linearity extended in the first direction dl on the downside of the 4th.On the downside of the 4th the base end side of arm 48a link the 4th move base station 40 is arranged the 4th on the downside of elevating mechanism (not shown).
When clamping cutting belt 17 by the 4th clamp assemblies 44, such as, on the upside of making the 4th by elevating mechanism 46c on the upside of the 4th, abutting part 46b declines, and makes it be connected to the upper surface of cutting belt 17.
In addition, on the downside of making the 4th by elevating mechanism on the downside of the 4th, abutting part 48b rises, and makes it be connected to the lower surface of cutting belt 17.Thus, cutting belt 17 by extend in the first direction dl the 4th on the upside of on the downside of abutting part 46b and the 4th abutting part 48b be clamped in than in plate object 11 clamping zone in the outer part.
And then, if make to hold the 3rd clamp assemblies 34 of cutting belt 17 by the 3rd travel mechanism 32 and the 4th travel mechanism 42 and the 4th clamp assemblies 44 leaves in a second direction d 2 in the opposite directions to each other, then can expand cutting belt 17 in a second direction d 2.
In the manufacture method of the frame assembly of present embodiment, the cutting belt first implementing to attach plate object 11 on the adhesive surface of cutting belt 17 attaches step.Fig. 2 is the plane graph being schematically illustrated in the plate object 11 that cutting belt 17 attaches.
As shown in Figure 2, plate object 11 is such as the discoid wafer be made up of materials such as silicon, and its front (upper surface) 11a is divided into the device area of central authorities and surrounds the periphery remaining area of device area.
Device area is multiple region by segmentation preset lines (line of cut) 13 Further Division arranged in clathrate, and in each region, form the device 15 of IC etc.In addition, plate object 11 is formed with the upgrading layer of starting point (segmentation starting point) as segmentation or cutting slot along segmentation preset lines 13.
Upgrading layer is such as formed by the laser beam being difficult to the wavelength absorbed by plate object 11 is converged at the inside of plate object 11.On the other hand, cutting slot is such as formed by making cutting tool cut on plate object 11.
Cutting belt 17 is formed as the film member of the retractility being at least greater than plate object 11 and ring-shaped frame 21 (with reference to Fig. 3 (C) etc.) by materials such as resins.The upper surface of this cutting belt 17 becomes and shows close-burning adhesive surface.Adhesive surface is such as formed by the material of ultraviolet hardening resin etc.
Attach in step in cutting belt, make the back side of plate object 11 (lower surface) 11b contact the adhesive surface of above-mentioned cutting belt 17.Thereby, it is possible to attach plate object 11 in cutting belt 17.
Attach in step in this cutting belt, plate object 11 is attached to the clamping zone position in the inner part than being clamped by the first clamp assemblies 14, second clamp assemblies 24, the 3rd clamp assemblies 34 and the 4th clamp assemblies 44.That is, as shown in Figure 2, position in the inner part, the region that on the upside of abutting part 16b, second, on the upside of abutting part 26b, the 3rd, on the upside of abutting part 36b and the 4th, abutting part 46b abuts on the upside of than first attaches plate object 11.
After cutting belt attaches step, implement the gripping step being pasted with the cutting belt 17 of plate object 11 by the clamping of the first clamp assemblies 14, second clamp assemblies 24, the 3rd clamp assemblies 34 and the 4th clamp assemblies 44.Fig. 3 (A) is the cutaway view schematically showing gripping step.
In gripping step, first to make the mode exposed above surperficial 11a side direction, the plate object 11 that cutting belt 17 attaches is positioned on workbench 8.As mentioned above, in the first direction dl across workbench 8 toward each other, and the 3rd clamp assemblies 34 and the 4th clamp assemblies 44 are in a second direction d 2 across workbench 8 toward each other for the first clamp assemblies 14 and the second clamp assemblies 24.
Therefore, when plate object 11 placed by workbench 8, across plate object 11 toward each other, and the 3rd clamp assemblies 34 and the 4th clamp assemblies 44 are across plate object 11 toward each other for the first clamp assemblies 14 and the second clamp assemblies 24.
After plate object 11 is positioned over workbench 8, clamped the clamping zone of cutting belt 17 by the first clamp assemblies 14, second clamp assemblies 24, the 3rd clamp assemblies 34 and the 4th clamp assemblies 44.After having clamped cutting belt 17, workbench 8 is moved downwards.
After gripping step, implement the expansion step of expansion cutting belt 17.(B) of Fig. 3 is the cutaway view schematically showing expansion step.In expansion step, make to hold the first clamp assemblies 14 of cutting belt 17 by the first travel mechanism 12 and the second travel mechanism 22 and the second clamp assemblies 24 leaves in the first direction dl round about.
In addition, make to hold the 3rd clamp assemblies 34 of cutting belt 17 by the 3rd travel mechanism 32 and the 4th travel mechanism 42 and the 4th clamp assemblies 44 leaves in a second direction d 2 round about.Thereby, it is possible to expand cutting belt 17 on first direction D1 and second direction D2.
Described above expanded cutting belt 17 after, plate object 11 is applied in the external force corresponding with the dimension of cutting belt 17.In the present embodiment, along plate object 11 segmentation preset lines 13 and formed as splitting the upgrading layer of starting point or cutting slot, therefore plate object 11 is as shown in Fig. 3 (B), is divided into multiple chip 19 by institute's externally applied forces.
After expansion step, implement state cutting belt 17 being remained expansion, the ring-shaped frame be simultaneously attached at by ring-shaped frame 21 on the adhesive surface of cutting belt 17 attaches step.(C) of Fig. 3 schematically shows that ring-shaped frame attaches the cutaway view of step.
Attach in step at ring-shaped frame, as shown in (C) of Fig. 3, use the ring-shaped frame 21 with the peristome of the circular of the size can receiving plate object 11, make ring-shaped frame 21 contact the adhesive surface of cutting belt 17 in the mode of receiving plate object 11 in this peristome.
In addition, attach in step at this ring-shaped frame, when do not move the first clamp assemblies 14, second clamp assemblies 24, the 3rd clamp assemblies 34 and the 4th clamp assemblies 44, cutting belt 17 is remained expansion state.
After ring-shaped frame attaches step, implement the region being pasted with ring-shaped frame 21 of heating cutting belt 17, to improve the cutting belt heating steps of the adaptation between ring-shaped frame 21 and cutting belt 17.(A) of Fig. 4 is the cutaway view schematically showing cutting belt heating steps.
Cutting belt heating steps such as uses the heater 50 shown in (A) of Fig. 4 to implement.Heater 50 has the circular heating part 50a comprising the heating arrangements such as heater.This heating part 50a is formed as roughly the same with ring-shaped frame 21 diameter.
In cutting belt heating steps, such as, make heating part 50a rise to set point of temperature, and make it from the lower face side of cutting belt 17, contact the region being pasted with ring-shaped frame 21.Thus, cutting belt 17 is heated.
The temperature of heating part 50a can set according to the material of cutting belt 17 grade.Specifically, the such as preferred temperature by heating part 50a is set as, in cutting belt 17, temperature high as far as possible in melting, damaged scope (such as, less than 125 DEG C) to occur.
When heated cutting belt 17 as mentioned above, the mobility forming the binding agent of the adhesive surface of cutting belt 17 can rise, and the adaptation between cutting belt 17 and ring-shaped frame 21 improves.In addition, by this heating, the stress of the shrinkage direction occurred in cutting belt 17 due to expansion can be relaxed.
After cutting belt heating steps, implement the cutting belt cooling step being cooled to room temperature (situation of representative is 20 DEG C ~ 30 DEG C) by the region of heating of cutting belt.(B) of Fig. 4 is the cutaway view schematically showing cutting belt cooling step.
Cutting belt cooling step such as uses the cooling device 52 shown in (B) of Fig. 4 to implement.Cooling device 52 has the circular cooling end 52a comprising arbitrary cooling body.This cooling end 50a is formed as roughly the same with ring-shaped frame 21 diameter.
In cutting belt cooling step, such as, make the lower face side of cooling end 52a from cutting belt 17 of the temperature being cooled to below room temperature, contact by the region (being pasted with the region of ring-shaped frame 21) of heating.
Thus, cutting belt 17 be cooled to below room temperature by heating region.Like this, by cutting belt 17 is cooled to below room temperature, thus the mobility of the binding agent forming adhesive surface can be reduced and promote cohesive force.
After cutting belt cooling step, implement cutting belt and cut off step, cut off in step in this cutting belt, in the position corresponding with ring-shaped frame 21, cutting belt 17 is cut off, complete frame assembly.(C) of Fig. 4 schematically shows that cutting belt cuts off the cutaway view of step.
Cut off in step in cutting belt, by cutter 54 cutting belt 17 aimed at ring-shaped frame 21 and cut off.Thus, the frame assembly supporting plate object 11 by ring-shaped frame 21 across cutting belt 17 is accomplished.
As mentioned above, in the manufacture method of the frame assembly of present embodiment, cutting belt 17 remained expansion state and after the ring-shaped frame be attached at by ring-shaped frame 21 on the adhesive surface of cutting belt 17 attaches step implementing, implement the region being pasted with ring-shaped frame 21 of heating cutting belt 17 to improve the cutting belt heating steps of the adaptation between ring-shaped frame 21 and cutting belt 17, therefore by cutting belt 17 correspond to ring-shaped frame 21 position cut off time, cutting belt 17 can be prevented to be stripped from ring-shaped frame 21.
In addition, the invention is not restricted to the description of above-mentioned execution mode, can various change be carried out and implement.Such as, attaching in step in the cutting belt of above-mentioned execution mode, being attached in cutting belt 17 using being formed as the segmentation upgrading layer of starting point or the undivided plate object 11 of cutting slot, also the plate object after being split into multiple chip can be attached in cutting belt.
In addition, in the above-described embodiment, orthogonal first direction D1 and second direction D2 expands cutting belt 17, but the dimension of cutting belt is not particularly limited to.Such as, also can use the extension fixture being different from above-mentioned execution mode, radially expand cutting belt.
In addition, in the above-described embodiment, use the heater 50 possessing circular heating part 50a to implement cutting belt heating steps, and use the cooling device 52 possessing circular cooling end 52a to implement cutting belt cooling step, but the present invention is not limited thereto.Such as, the heater possessing the roll heating part that can rotate can be used to implement cutting belt heating steps, and use the cooling device possessing the roll cooling end that can rotate to implement cutting belt cooling step.
In addition, the cooling device 52 that non-essential use is above-mentioned forces cooling cutting belt 17.Such as, when can by spontaneous heat release cutting belt 17 is cooled to room temperature such as the following, above-mentioned cutting belt cooling step can be omitted.
And then, after implementing cutting belt heating steps (with cutting belt cooling step), to cutting belt 17 irradiating ultraviolet light, and the binding agent partially hardened (semi-harden) of formation adhesive surface can be made.Thereby, it is possible to promote cohesive force further.
In addition, about the structure, method etc. of above-mentioned execution mode, can suitably carry out changing and implementing in the scope not departing from the object of the invention.
Claims (2)
1. a manufacture method for frame assembly, this frame assembly is formed with the plate object splitting starting point or the plate object being split into each chip along many segmentation preset lines of intersecting by ring-shaped frame supporting along many segmentation preset lines of intersecting,
The feature of this manufacture method is, comprising:
Cutting belt attaches step, and the adhesive surface of cutting belt attaches plate object, and this cutting belt is greater than plate object;
Gripping step, after implementing this cutting belt attaching step, clamps the ratio plate object region in the outer part of this cutting belt by grip unit;
Expansion step, after implementing this gripping step, mobile grip unit and expand this cutting belt;
Ring-shaped frame attaches step, after implementing this expansion step, this cutting belt is remained the state of expansion, this ring-shaped frame with peristome is attached on this adhesive surface of this cutting belt simultaneously, and plate object is received in this peristome of this ring-shaped frame, wherein, this peristome has the size of storage plate object;
Cutting belt heating steps, after implementing this ring-shaped frame attaching step, heats the region being pasted with this ring-shaped frame of this cutting belt, improves the adaptation between this ring-shaped frame and this cutting belt; And
Cutting belt cuts off step, after implementing this cutting belt heating steps, this cutting belt is cut off in the position corresponding with this ring-shaped frame, completes this frame assembly.
2. the manufacture method of frame assembly according to claim 1, is characterized in that,
After implementing this cutting belt heating steps, and cut off before step in this cutting belt of enforcement, also comprise cutting belt cooling step, in this cutting belt cooling step, this cutting belt is cooled to room temperature by the region of heating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014224839A JP2016092207A (en) | 2014-11-05 | 2014-11-05 | Method of manufacturing frame unit |
| JP2014-224839 | 2014-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105575897A true CN105575897A (en) | 2016-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510736995.2A Pending CN105575897A (en) | 2014-11-05 | 2015-11-03 | Method of manufacturing frame unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2016092207A (en) |
| KR (1) | KR20160053800A (en) |
| CN (1) | CN105575897A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816412A (en) * | 2017-01-19 | 2017-06-09 | 吉林麦吉柯半导体有限公司 | The cutting technique of wafer and the production method of wafer |
| CN108695195A (en) * | 2017-04-11 | 2018-10-23 | 琳得科株式会社 | Separator and separation method |
| CN108735588A (en) * | 2017-04-13 | 2018-11-02 | 株式会社迪思科 | dividing method |
| CN108878356A (en) * | 2017-05-11 | 2018-11-23 | 株式会社迪思科 | sheet attaching method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6710457B2 (en) * | 2016-06-01 | 2020-06-17 | 株式会社ディスコ | Expanded sheet, method for manufacturing expanded sheet, and method for expanding expanded sheet |
| JP6880431B2 (en) * | 2017-04-11 | 2021-06-02 | リンテック株式会社 | Separation device and separation method |
| JP6951124B2 (en) * | 2017-05-23 | 2021-10-20 | 株式会社ディスコ | Processing method |
| JP6855127B2 (en) * | 2017-06-05 | 2021-04-07 | 株式会社ディスコ | Chip manufacturing method |
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| JPS5698837A (en) * | 1980-01-09 | 1981-08-08 | Nec Corp | Supporter for semiconductor pellet |
| CN101770980A (en) * | 2008-12-26 | 2010-07-07 | 株式会社迪思科 | Workpiece dividing method and strip expanding device |
| CN103681438A (en) * | 2012-09-20 | 2014-03-26 | 株式会社迪思科 | Processing method |
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| JPH0346253A (en) * | 1989-07-14 | 1991-02-27 | Fujitsu Ltd | Wafer extending device |
| JP4385705B2 (en) * | 2003-09-29 | 2009-12-16 | 株式会社東京精密 | Expanding method |
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2014
- 2014-11-05 JP JP2014224839A patent/JP2016092207A/en active Pending
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2015
- 2015-11-03 CN CN201510736995.2A patent/CN105575897A/en active Pending
- 2015-11-03 KR KR1020150153772A patent/KR20160053800A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5698837A (en) * | 1980-01-09 | 1981-08-08 | Nec Corp | Supporter for semiconductor pellet |
| CN101770980A (en) * | 2008-12-26 | 2010-07-07 | 株式会社迪思科 | Workpiece dividing method and strip expanding device |
| CN103681438A (en) * | 2012-09-20 | 2014-03-26 | 株式会社迪思科 | Processing method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816412A (en) * | 2017-01-19 | 2017-06-09 | 吉林麦吉柯半导体有限公司 | The cutting technique of wafer and the production method of wafer |
| CN108695195A (en) * | 2017-04-11 | 2018-10-23 | 琳得科株式会社 | Separator and separation method |
| CN108695195B (en) * | 2017-04-11 | 2023-06-13 | 琳得科株式会社 | Separation device and separation method |
| CN108735588A (en) * | 2017-04-13 | 2018-11-02 | 株式会社迪思科 | dividing method |
| CN108735588B (en) * | 2017-04-13 | 2024-02-20 | 株式会社迪思科 | Segmentation method |
| CN108878356A (en) * | 2017-05-11 | 2018-11-23 | 株式会社迪思科 | sheet attaching method |
| CN108878356B (en) * | 2017-05-11 | 2024-02-27 | 株式会社迪思科 | Sheet sticking method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160053800A (en) | 2016-05-13 |
| JP2016092207A (en) | 2016-05-23 |
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